CN106220851B - A kind of siliceous epoxy acid imide matrix resin of YASI types and preparation method thereof - Google Patents
A kind of siliceous epoxy acid imide matrix resin of YASI types and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
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Abstract
The present invention relates to siliceous epoxy acid imide matrix resin of a kind of YASI types and preparation method thereof, which is made of bis- (γ-aminopropyl) polydimethylsiloxones (YASI), epoxy resin, 3- aminopropyltrialkoxysilanes, imide oligomer object and curing agent.Preparation method includes the following steps：(1) imide oligomer object is prepared；(2) will be bis- (γ-aminopropyl) polydimethylsiloxone, epoxy resin be put into reaction kettle, after being stirred reaction, imide oligomer object is added to continue to be stirred to react, 3- aminopropyltrialkoxysilanes are then added to be stirred to react, curing agent is added to be uniformly mixed, you can.The bonding between the base materials such as the metals such as steel, copper, aluminium and ceramics, glass, polymer matrix composites and the preparation of glass fibre, aramid fiber, carbon fibre reinforced composite are the composite can be widely applied to, there is good industrialization prospect.
Description
Technical field
The invention belongs to macromolecule matrix resin and its preparation field, more particularly to a kind of siliceous epoxy acid imide of YASI types
Matrix resin and preparation method thereof.
Background technology
It is well known that epoxy resin has many excellent performances：(1) good adhesive property：Adhesive strength is high, bonding
Wide, (such as glass, ceramics, resin base are multiple for it and many metals (such as iron, steel, copper, aluminium, metal alloy) or nonmetallic materials
Condensation material, timber, plastics etc.) adhesive strength it is very high, some, which is even more than, is glued the intensity of material itself, therefore can be used for
It is one of main component of structural adhesive in many stress members；(2) good processing performance：Formulaion of epoxy resin
Flexibility, processing technology and product properties diversity be the most outstanding in high molecular material；(3) good stability
Energy：The solidification of epoxy resin does not generate low-molecular material mainly by the ring opening polyaddition of epoxy group in solidification process,
Its cure shrinkage is one of kind minimum in thermosetting resin, generally 1%-2%, if selecting filler appropriate that can make
Shrinking percentage is down to 0.2% or so；Epoxy main chains after solidification are ehter bond, phenyl ring, three-dimensional crosslinking structure, therefore with excellent
Resistance to acid and alkali.
Therefore, epoxy resin is widely used in the every field of national economy：Either high-technology field is still
Its trace can be seen in field of general technology, either defence and military or civilian industry or even daily life.
Currently, there is also some problems for epoxy-resin systems, if heat resistance is relatively low, much not as good as heteroaromatic Type of Collective object
It is (such as polyimides, polybenzimidazoles, polybenzoxazole, polyphenyl based quinoxaline, polybenzothiozole).
Polyimides is developed in the sixties, and most common one is by pyromellitic acid anhydride and aromatic diamine system
.Contain multiple aromatic heterocycle structural unit in polyimide molecule, therefore polyimide resin is that have extremely superior heat resistance
A kind of high molecular material of property.Conventional polyimide structures, heat decomposition temperature also have generally at 500 DEG C or more
There is obdurability.Therefore, it is also frequently utilized for thermosetting resin, such as the heat-resisting toughening of epoxy resin, bimaleimide resin changes
Property agent.
Chinese invention patent CN103146330A discloses a kind of bis- [ of 2,2-;4- (2,4- diamino phenoxies) Ben Ji ]Six
Fluoro-propane type high temperature resistant epoxy adhesive and preparation method thereof is 1 by mass ratio:The component A and B component of 1-2 forms, wherein A
Component is by the bis- [ of 2,2-;4- (2,4- diamino phenoxies) Ben Ji ]Copolymer made of hexafluoropropane is reacted with epoxy resin；B
Component is by the bis- [ of 2,2-;4- (2,4- diamino phenoxies) Ben Ji ]Hexafluoropropane is with aromatic dicarboxylic anhydride in highly polar non-matter
Solid content made of being reacted in sub- organic solvent and toluene is the homogeneous phase transparent solution of 15%-30%.Preparation method includes：Room temperature
Under, by A, B component in mass ratio 1:1-2 is uniformly mixed.
Chinese invention patent CN103131369A discloses a kind of 4,4'Bis- (2,4- diamino phenoxies) diphenyl sulphone (DPS) types are resistance to
High-temp epoxy adhesive and preparation method thereof is 1 by mass ratio:The component A and B component of 1-2 form, wherein component A be by 4,
Copolymer made of 4 '-bis- (2,4- diamino phenoxies) diphenyl sulphone (DPS)s are reacted with epoxy resin；B component is by 4,4 '-bis- (2,4-
Diamino phenoxy) diphenyl sulphone (DPS) is solid made of being reacted in highly polar aprotic organic solvent and toluene with aromatic dicarboxylic anhydride
Content is the homogeneous phase transparent solution of 15%-30%.Preparation method includes：At room temperature, by A, B component in mass ratio 1:1-2 is stirred
It is uniformly mixed.
Chinese invention patent CN103146331A discloses a kind of 4,4'The resistance to height of bis- (2,4- diamino phenoxies) biphenyl types
Temperature epoxy adhesive and preparation method thereof is 1 by mass ratio:The component A and B component of 1-2 forms, and wherein component A is by 4,4 '-
Copolymer made of bis- (2,4- diamino phenoxies) biphenyl are reacted with epoxy resin；B component is by 4,4 '-bis- (2,4- diaminos
Phenoxyl) solid content made of biphenyl is reacted with aromatic dicarboxylic anhydride in highly polar aprotic organic solvent and toluene is
The homogeneous phase transparent solution of 15%-30%.Preparation method includes：At room temperature, by A, B component in mass ratio 1:1-2 is stirred
It is even.
Yan Rui, Yu Xinhai et al.【The preparation of novel epoxy adhesive and performance study, insulating materials, 2012,45 (2)：
12-14,18】A kind of neo-epoxy resin adhesive and preparation method thereof is disclosed, and systematic research has been carried out to its performance.
Seas Yu Xin et al.【The preparation of organosilicon epoxy system adhesive and performance study, insulating materials, 2012,45 (2)：
1-3,11】A kind of adhesive composition of organic siliconresin modified epoxy is disclosed, and its performance is studied, simultaneously
The superior adhesive of comprehensive performance is obtained.
Chinese invention patent CN102220102A has been applied in seas Yu Xin et al., discloses a kind of high-temperature-resistant adhesive and its system
Preparation Method.
Chinese invention patent CN102260480A discloses a kind of high-temperature-resistant modified epoxy resin adhesive and its preparation side
Method.
Chinese invention patent CN102181251A discloses a kind of epoxyn that unsaturated polyimides are modified
And preparation method thereof.
Chinese invention patent CN102031082A discloses a kind of benzimidazole diamine curing type epoxy adhesive and its system
Preparation Method.
Chinese invention patent CN101649174A discloses a kind of high temperature resistant one-component solvent-free epoxy adhesive and its system
Preparation Method.
Chinese invention patent CN101544879A discloses a kind of preparation method of high strength solventless epoxy adhesive.
Wu Min et al.【The development of novel high-strength one-component epoxy resin adhesive, bonding, 2009,30 (9)：54-57】
A kind of epoxy binder in monocomponent in is disclosed, excellent combination property especially has very high tensile shear strength.
Chen Hongjiang et al.【The cure kinetics research of neo-epoxy resin adhesive system, bonding, 2009,30 (8)：43-
45】A kind of epoxyn system is disclosed, and its cure kinetics is studied.
Perhaps plum virtue et al.【The cure kinetics research of polyimide-epoxy resin adhesive, chemistry and bonding, 2011,33
(2)：17-20】A kind of polyimide-epoxy resin adhesive is disclosed, and cure kinetics research has been carried out to it.
Chinese invention patent CN101148656A discloses a kind of preparation method of heat-resistant solvent-free epoxy adhesive,
It is characterized mainly in that：TGDDM epoxy resin, toughener, hydrogenated bisphenol A, curing agent, accelerating agent are uniformly mixed, and resistance to height has been made
Warm non-solvent epoxy adhesive.But its high temperature resistance still has larger limitation, fails to meet under many hot environments
Practical application.
Chinese invention patent CN101397486A discloses a kind of preparation side of bi-component solvent-free epoxy resin adhesive
Method is primarily characterized in that：It includes component A and B component, and wherein component A contains novolac epoxy resin, alicyclic type epoxy resin
And nbr carboxyl terminal；B component is bis- (2,4- diamino phenoxies) the benzene aromatic polyvalent amine hardeners of 1,3-.Alicyclic ring type ring
The additive amount of oxygen resin and nbr carboxyl terminal is respectively the 20-35% and 12% (mass percent) of novolac epoxy resin.
The additive amount of bis- (2,4- diamino phenoxies) the benzene aromatic polyvalent amine hardeners of 1,3- is the 15-20% of novolac epoxy resin
(mass percent), gained adhesive system good manufacturability.But its heat resistance is ideal not enough.
Chinese invention patent CN1927908A discloses a kind of preparation method of phenolic hydroxyl group containing polyimide powder, due to
The presence of phenolic hydroxyl group, polyimide powder can form covalent bond with epoxy reaction, sub- so as to improve thermoplasticity polyamides
The compatibility of polyimide resin and epoxy resin, and so that epoxy-resin systems is reached good toughening effect.
Seas Yu Xin et al.【The [ of high-temperature resistant single-component epoxy adhesive;J]It is bonded, 2008,29 (12)：16-19】It is public
A kind of preparation method of high-temperature resistant single-component epoxy adhesive has been opened, has been primarily characterized in that：It is sealing end with maleic anhydride (MA)
Agent, with bis- (3- amino-4-hydroxylphenyls) hexafluoropropane (BAHPFP) of 2,2-, the bis- [ of 2,2-;4- (4- amino-benzene oxygens) Ben Ji ]Third
Alkane (BAPOPP), the bis- [ of 2,2-;4- (3,4- di carboxyl phenyloxies) Ben Ji ]Propane dianhydride (BPADA) is that main Material synthesis obtains
Phenolic hydroxy group polyetherimide resin (HPEI)；With synthesized obtained HPEI for resistant, toughened dose, with N, N, N',N'- four
Glycidyl -4,4'Diaminodiphenylmethane (TGDDM), hydrogenated bisphenol A epoxy resin (HBPAE), latent curing agent
Deng, preparation obtained the high-temperature resistant single-component epoxy adhesive of excellent combination property.
Invention content
Technical problem to be solved by the invention is to provide a kind of siliceous epoxy acid imide matrix resin of YASI types and its systems
Preparation Method, preparation process of the present invention is simple, environmental-friendly, excellent combination property, can be widely applied to the metals such as steel, copper, aluminium with
And bonding between the base materials such as ceramics, glass, polymer matrix composites and glass fibre, aramid fiber, fibre reinforced it is multiple
The preparation of condensation material has good industrialization prospect.
A kind of siliceous epoxy acid imide matrix resin of YASI types of the present invention is 1-5 by mass ratio:100:2-8:1-5:
Bis- (γ-aminopropyl) polydimethylsiloxones (YASI), epoxy resin, 3- aminopropyltrialkoxysilanes, the acyl of 30-50 is sub-
Amine oligomer and curing agent composition；Wherein, it is 2 that imide oligomer object, which is by molar ratio,:1:2 bis- (the 3- amino-4-hydroxies of 2,2-
Phenyl) hexafluoropropane, the bis- [ of 2,2-;4- (3,4- di carboxyl phenyloxies) Ben Ji ]Propane dianhydride and maleic anhydride are reacted and are obtained；It is double
The structural formula of (γ-aminopropyl) polydimethylsiloxone YASI is：
N is the natural number no more than 20.
The 3- aminopropyltrialkoxysilanes are selected from 3- aminopropyl trimethoxysilanes, 3- aminopropyl triethoxysilanes
One or both of mixture.
The epoxy resin is selected from E-51 epoxy resin, E-44 epoxy resin, ES216 epoxy resin, ECC202 asphalt mixtures modified by epoxy resin
Fat, CE793 epoxy resin, glycidyl amine type epoxy resin, diglycidyl ether type epoxy resin, alicyclic type epoxy resin, phenol
One or more of aldehyde type epoxy resin, glycidyl ester type epoxy resin.
The glycidyl amine type epoxy resin is selected from N, N, N ', N '-four glycidyl groups -4,4 '-diamino hexichol first
Alkane epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-dimethyl -4,4 '-diaminodiphenylmethane epoxy resin, N,
N, N ', N '-four glycidyl groups -3,3 '-diethyl -4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four shrinks
The chloro- 4,4 '-diaminodiphenylmethane epoxy resin of glyceryl -3,3 '-two, N, N, N ', N '-four glycidyl groups -4,4 '-diamino
Yl diphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylsulfone epoxy resin, N, N, N ', N ' -
Four glycidyl group -3,4 '-diaminodiphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-diamino hexichol
Sulfone epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-benzidine epoxy resin, N, N, N ', N '-four shrinks sweet
Oil base p-phenylenediamine epoxy resin, N, N, N ', N '-four glycidyl group m-phenylene diamine (MPD)s epoxy resin, N, N, N ', N '-four shrinks
Bis- (4- amino-benzene oxygens) the benzene epoxy resin of glyceryl -1,4-, N, N, N ', bis- (the 3- aminobenzenes of N '-four glycidyl groups -1,4-
Oxygroup) benzene epoxy resin, N, N, N ', bis- (4- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,3-, N, N, N ',
Bis- (3- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,3-, N, N, N ', N '-four glycidyl groups -1,4- is double
(2- trifluoromethyl-4-aminophenoxyls) benzene epoxy resin, N, N, N ', bis- (the 2- trifluoromethyls-of N '-four glycidyl groups -1,3-
4- amino-benzene oxygens) benzene epoxy resin, N, N, N ', N ', O- five glycidyls -4,4 '-diamino -4 "-hydroxyl triphenylmenthane
Epoxy resin, N, N, N ', the double [ of N '-four glycidyl groups -2,2-;4- (4- amino-benzene oxygens) Ben Ji ]Propane epoxy resin, N, N,
N ', N ' the double [ of-four glycidyl group -2,2-;4- (4- amino-benzene oxygens) Ben Ji ]Hexafluoropropane epoxy resin, N, N, N ', N '-four
The double [ of glycidyl -2,2-;4- (3- amino-benzene oxygens) Ben Ji ]Propane epoxy resin, N, N, N ', four glycidyl group -2 N ' -,
The bis- [ of 2-;4- (2- trifluoromethyl-4-aminophenoxyls) Ben Ji ]Propane epoxy resin, N, N, N ', N '-four glycidyl groups -2,2-
Shuan [4- (3- amino-benzene oxygens) Ben Ji ]Hexafluoropropane epoxy resin, N, N, N ', the double [ of N '-four glycidyl groups -2,2-;4-(2-
Trifluoromethyl-4-aminophenoxyl) Ben Ji ]Hexafluoropropane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4-
Amino-benzene oxygen) diphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl -4- aminobenzenes
Oxygroup) diphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) diphenyl sulphone (DPS) asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) diphenyl sulphone (DPS) epoxy resin, N, N,
Bis- (4- amino-benzene oxygens) the diphenyl sulfide epoxy resin of N ', N '-four glycidyl group -4,4 ' -, N, N, N ',-four glycidols of N '
Bis- (2- trifluoromethyl-4-aminophenoxyls) the diphenyl sulfide epoxy resin of base -4,4 ' -, N, N, N ', four glycidyl group -4 N ' -,
4 '-bis- (4- amino-benzene oxygens) diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- fluoroforms
Base -4- amino-benzene oxygens) diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens)
Benzophenone epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) hexichol
Ketone epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) biphenyl epoxy resin, N, N, N ',
N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) biphenyl epoxy resin, N, N, N ', N ', O, O ' -
Bis- (3- amino-4-hydroxylphenyls) the hexafluoropropane epoxy resin of six glycidyl -2,2-, N, N, O-triglycidyl group is to ammonia
Base phenol epoxy resin, N, one or more of N, O-triglycidyl meta-aminophenol epoxy resin.
The diglycidyl ether type epoxy resin is selected from 1,3- diglycidyls resorcinol, 1,4- diglycidyls
Bis- (4- glycidyl phenyls) hexafluoropropane of hydroquinone, 4,4 '-diglycidyl bisphenol Ss, 2,2-, 2,2- are bis-, and (4- contracts
Water glycerine butylcyclohexyl) propane, Bisphenol F diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol-A 2-glycidyl
One or more of ether, fatty alcohol polyglycidyl ether.
The alicyclic type epoxy resin is selected from sour -3 ', the 4 '-epoxycyclohexyethylSiOi methyl esters of 3,4- epoxycyclohexyethylSiOis, 3,4- epoxies
One or more of sour -3 ', 4 '-epoxy groups-the 6 '-methyl cyclohexane methyl esters of base -6- methyl cyclohexanes, Dipentenedioxide.
The phenol aldehyde type epoxy resin is selected from phenol-formaldehyde phenolic resin type epoxy resin, o-cresol-formaldehyde novolac tree
Epoxy-type epoxy resin, resorcinol-formaldehyde phenolic resin type epoxy resin, m-cresol-formaldehyde phenolic resin type epoxy resin,
Catechol-formaldehyde phenolic resin type epoxy resin, bisphenol A-formaldehyde phenolic resin type epoxy resin, bisphenol S-formaldehyde novolac tree
Epoxy-type epoxy resin, bisphenol AF-formaldehyde phenolic resin type epoxy resin, '-biphenyl diphenol-formaldehyde phenolic resin type epoxy resin, neighbour
One or more of phenylphenol-formaldehyde phenolic resin type epoxy resin, naphthols-formaldehyde phenolic resin type epoxy resin.
The glycidyl ester type epoxy resin is selected from terephthalic acid diglycidyl ester epoxy resin, M-phthalic acid
2-glycidyl ester epoxy resin, o-phthalic acid diglycidyl ester epoxy resin, interior methine tetrahydrophthalic acid two
Ethylene oxidic ester epoxy resin, 4,5- 7-oxa-bicyclo[4.1.0-1,2- dicarboxylic acid diglycidyl esters epoxy resin, two octanoic acid two of adjacent benzene
One or more of polyglycidyl epoxy resin.
The curing agent is selected from hexahydrophthalic anhydride, K-12 curing agent, tetrahydrophthalic anhydride, methyl tetrahydro phthalic anhydride, dodecenyl succinate
Acid anhydrides, methyl hexahydrophthalic anhydride, tung oil acid anhydride, with 80 acid anhydrides made of dicyclopentadiene and maleic acid anhydride reactant, with terpene two
Acid anhydrides made of alkene and maleic acid anhydride reactant, with liquid acid anhydrides, N, N- made of turpentine oil and maleic acid anhydride reactant
Dimethylaniline, N, N- dimethyl open-chain crown ether, N, N- dimethyl benzylamines, 2-ethyl-4-methylimidazole, imidazoles, 2,4,6-
Three (dimethylamino methyl) phenol, 1,8- diazas-Shuan Huan [5.4.0]One or more of hendecene -7.
A kind of preparation method of the siliceous epoxy acid imide matrix resin of YASI types of the present invention, includes the following steps：
(1) by bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2-, o-cresol, the bis- [ of 2,2-;4- (3,4- dicarboxyl benzene
Oxygroup) Ben Ji ]Propane dianhydride and maleic anhydride are put into reaction kettle, are passed through nitrogen, and stirring is heated to 80 DEG C, is added dropwise different
Quinoline is heated to 100 DEG C -110 DEG C, after being stirred to react 5-12 hours, is cooled to 60 DEG C, reactant is poured into and fills precipitating agent
In precipitating kettle, solids is precipitated in high-speed stirred, and filtering, 80 DEG C are dried in vacuo 10 hours, obtain imide oligomer object；
(2) will be bis- (γ-aminopropyl) polydimethylsiloxone (YASI), epoxy resin be put into reaction kettle, in 80 DEG C-
After 100 DEG C are stirred reaction 0.5-1 hours, imide oligomer object is added and continues to be stirred to react 1-2 hours, 3- ammonia is then added
Propyl trialkoxy silane is stirred to react 5-15 minutes, is cooled to room temperature, is added curing agent, is uniformly mixed.
The mass ratio of isoquinolin and bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2- described in step (1) is 1-
4:20。
Precipitating agent described in step (1) is selected from methanol, ethyl alcohol, propyl alcohol, isopropanol, ethylene glycol, glycol monoethyl ether, second
One or more of glycol dimethyl ether, ethylene glycol monoethyl ether, ethylene glycol diethyl ether, acetone, butanone；Wherein, precipitating agent and 2,
The mass ratio of bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2- is 20-40:1.
The mass ratio of o-cresol and bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2- described in step (1) is 10-
20:1。
Advantageous effect
(1) viscosity controllability of the present invention is good, can be adjusted in broader range, preparation process is simple, environmental-friendly, comprehensive
Conjunction is had excellent performance, and can be widely applied between the base materials such as the metals such as steel, copper, aluminium and ceramics, glass, polymer matrix composites
Bonding and the preparation of glass fibre, aramid fiber, carbon fibre reinforced composite, have good industrialization prospect；
(2) present invention can complete preparation process in common apparatus, be advantageously implemented industrialized production.
Specific implementation mode
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, people in the art
Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited
Range.
Embodiment 1
By bis- (3- amino-4-hydroxylphenyls) hexafluoropropane (BAHPFP, 366g/mol) of 73.2 grams of (0.2 mole) 2,2-,
735.0 grams of o-cresols, 52.0 grams of bis- [ of (0.1 mole) 2,2-;4- (3,4- di carboxyl phenyloxies) Ben Ji ]Propane dianhydride (BPADA,
It 520g/mol) is put into reaction kettle with 19.6 grams of (0.2 mole) maleic anhydrides (MA, 98g/mol), is passed through nitrogen, stirred, heating
80 DEG C are warming up to, 3.8 grams of isoquinolin are added dropwise, is heated to 100 DEG C, after being stirred to react 5 hours, is cooled to 60 DEG C, reactant is fallen
In the precipitating kettle for entering to fill 1500 grams of methanol, solids is precipitated in high-speed stirred, and filtering, 80 DEG C are dried in vacuo 10 hours, obtain
308.3 grams of imide oligomer object (theoretical yields：314.0 grams), yield 98.2% is denoted as BBMO-1.
Embodiment 2
By bis- (3- amino-4-hydroxylphenyls) hexafluoropropane (BAHPFP, 366g/mol) of 73.2 grams of (0.2 mole) 2,2-,
1460 grams of o-cresols, 52.0 grams of bis- [ of (0.1 mole) 2,2-;4- (3,4- di carboxyl phenyloxies) Ben Ji ]Propane dianhydride (BPADA,
It 520g/mol) is put into reaction kettle with 19.6 grams of (0.2 mole) maleic anhydrides (MA, 98g/mol), is passed through nitrogen, stirred, heating
80 DEG C are warming up to, 14.0 grams of isoquinolin are added dropwise, is heated to 110 DEG C, after being stirred to react 12 hours, 60 DEG C is cooled to, by reactant
It pours into the precipitating kettle for filling 2000 grams of ethyl alcohol and 920 grams of glycol monoethyl ethers, high-speed stirred, solids is precipitated, filter, 80 DEG C
Vacuum drying 10 hours, obtains 313.4 grams of imide oligomer object (theoretical yields：314.0 grams), yield 99.8% is denoted as BBMO-
2。
Embodiment 3
By 1.0 grams of bis- (γ-aminopropyl) polydimethylsiloxones (YASI), 20.0 grams of N, N, between O-triglycidyl group
Amino-phenol epoxy resin, 30.0 grams of 4,5- 7-oxa-bicyclo[4.1.0-1,2- dicarboxylic acid diglycidyl esters epoxy resin, 20.0 grams
CE793 epoxy resin and 30.0 grams of N, N, N ', the double [ of N '-four glycidyl groups -2,2-;4- (4- amino-benzene oxygens) Ben Ji ]Hexafluoro
Propane epoxy resin is put into reaction kettle, and after 100 DEG C are stirred reaction 0.5 hour, it is neat that 2.0 grams of BBMO-2 acid imides are added
Polymers continues to be stirred to react 1 hour, and 3.0 grams of 3- aminopropyl trimethoxysilanes are then added and are stirred to react 5 minutes, are cooled to room
Temperature adds 10.0 grams of 1,8- diazas-Shuan Huan [5.4.0]Hendecene -7,5.0 grams of N, N- dimethyl open-chain crown ether and 35.0
Gram methyl tetrahydro phthalic anhydride, is uniformly mixed, obtains the siliceous epoxy acid imide matrix resin of 156.0 grams of YASI types, be denoted as M-1.
Embodiment 4
By 3.0 grams of bis- (γ-aminopropyl) polydimethylsiloxones (YASI), 10.0 grams of N, N, between O-triglycidyl group
Amino-phenol epoxy resin, 10.0 grams of N, N, N ', bis- (4- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,4-,
10.0 grams of Diglycidyl M-phthalate epoxy resin, 15.0 grams of ES216 epoxy resin and 55.0 grams of N, N, N ', N '-four
4,4 '-diaminodiphenylmethane epoxy resin of glycidyl-is put into reaction kettle, after 80 DEG C are stirred reaction 1 hour,
The imide oligomer object that 3.5 grams of BBMO-1 and 1.5 gram of BBMO-2 are added continues to be stirred to react 2 hours, and 3.0 grams of 3- ammonia are then added
Propyl trimethoxy silicane and 5.0 grams of 3- aminopropyl triethoxysilanes are stirred to react 5 minutes, are cooled to room temperature, are added
20.0 grams of 2-ethyl-4-methylimidazoles and 10.0 gram 2,4,6- tri- (dimethylamino methyl) phenol are uniformly mixed, obtain
The siliceous epoxy acid imide matrix resin of 146.0 grams of YASI types, is denoted as M-2.
Embodiment 5
By 5.0 grams of bis- (γ-aminopropyl) polydimethylsiloxones (YASI), 20.0 grams of N, N, between O-triglycidyl group
Amino-phenol epoxy resin, 10.0 grams of 4,5- 7-oxa-bicyclo[4.1.0-1,2- dicarboxylic acid diglycidyl esters epoxy resin, 20.0 grams of neighbours
Cresols-formaldehyde phenolic resin type epoxy resin, 10.0 grams of hydrogenated bisphenol A diglycidyl ethers and 40.0 grams of N, N, N ', N '-four
4,4 '-benzidine epoxy resin of glycidyl-is put into reaction kettle, after 80 DEG C are stirred reaction 1 hour, is added
The imide oligomer object of 3.0 grams of BBMO-2 continues to be stirred to react 2 hours, and 2.0 grams of 3- aminopropyl triethoxysilanes are then added
It is stirred to react 15 minutes, is cooled to room temperature, add 40.0 grams of 2-ethyl-4-methylimidazoles and 5.0 grams of tung oil acid anhydrides, stirring is mixed
It closes uniformly, obtains the siliceous epoxy acid imide matrix resin of 155.0 grams of YASI types, be denoted as M-3.
Embodiment 6
The siliceous epoxy acid imide matrix resin of the YASI types of suitable 3~embodiment of embodiment 5, i.e. M-1~M- are taken respectively
3, and be uniformly applied to respectively in standard stainless steel test piece, it overlaps, clamps, be put into convection oven and cured：From room temperature
It starts to warm up to 80 DEG C, after being kept for 2 hours, is continuously heating to 120 DEG C, after being kept for 1 hour, be continuously heating to 150 DEG C, keep
After 0.5 hour, cooled to room temperature.Using electronic tensile machine, room temperature (25 DEG C) and high temperature (180 DEG C) item are carried out to it respectively
Tensile shear strength test under part, the results are shown in Table 1.
The siliceous epoxy acid imide matrix resin of the YASI types of suitable 3~embodiment of embodiment 5, i.e. M-1~M- are taken respectively
3, and be uniformly applied to respectively in plate glass test piece, it overlaps, clamps, be put into convection oven and cured：It is opened from room temperature
Beginning is warming up to 80 DEG C, after being kept for 2 hours, is continuously heating to 120 DEG C, after being kept for 1 hour, is continuously heating to 150 DEG C, keeps 0.5
After hour, cooled to room temperature.Using electronic tensile machine, room temperature (25 DEG C) and high temperature (180 DEG C) condition are carried out to it respectively
Under tensile shear strength test, the results are shown in Table 1.
The siliceous epoxy acid imide matrix resin of the YASI types of suitable 3~embodiment of embodiment 5, i.e. M-1~M- are taken respectively
3, and be equably impregnated with respectively on glass cloth, it is overlapped and is clamped with standard stainless steel test piece, be put into convection oven and cured：
It is started to warm up from room temperature to 80 DEG C, after being kept for 2 hours, is continuously heating to 120 DEG C, after being kept for 1 hour, is continuously heating to 150 DEG C,
After being kept for 0.5 hour, cooled to room temperature.Using electronic tensile machine, room temperature (25 DEG C) and high temperature (180 are carried out to it respectively
DEG C) under the conditions of tensile shear strength test, the results are shown in Table 1.
1 tensile shear strength of table, unit：MPa
Claims (10)
1. a kind of siliceous epoxy acid imide matrix resin of YASI types, it is characterised in that：It is 1-5 by mass ratio:100:2-8:1-5:
Bis- (γ-aminopropyl) polydimethylsiloxone YASI, epoxy resin, 3- aminopropyltrialkoxysilanes, the acid imide of 30-50
Oligomer and curing agent composition；Wherein, it is 2 that imide oligomer object, which is by molar ratio,:1:2 bis- (the 3- amino-4-hydroxy benzene of 2,2-
Base) hexafluoropropane, the bis- [ of 2,2-;4- (3,4- di carboxyl phenyloxies) Ben Ji ]Propane dianhydride and maleic anhydride are reacted and are obtained；Bis- (γ-
Aminopropyl) structural formula of polydimethylsiloxone YASI is：
N is the natural number no more than 20.
2. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 1, it is characterised in that：The 3- ammonia
Propyl trialkoxy silane is selected from one or both of 3- aminopropyl trimethoxysilanes, 3- aminopropyl triethoxysilanes
Mixture.
3. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 1, it is characterised in that：The epoxy
Resin be selected from E-51 epoxy resin, E-44 epoxy resin, ES216 epoxy resin, ECC202 epoxy resin, CE793 epoxy resin,
Glycidyl amine type epoxy resin, diglycidyl ether type epoxy resin, alicyclic type epoxy resin, phenol aldehyde type epoxy resin, shrink
One or more of glycerine ester type epoxy resin.
4. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 3, it is characterised in that：The shrink
Glyceramine type epoxy resin is selected from N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylmethane epoxy resin, N, N,
N ', N '-four glycidyl group -3,3 '-dimethyl -4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four shrinks sweet
Oil base -3,3 '-diethyl -4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-two
Chloro- 4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenyl ether asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylsulfone epoxy resin, N, N, N ', four glycidyl group -3 N ' -,
4 '-diaminodiphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-diaminodiphenylsulfone epoxy resin, N, N,
N ', N '-four glycidyl group -4,4 '-benzidine epoxy resin, N, N, N ', N '-four glycidyl group p-phenylenediamine epoxies
Resin, N, N, N ', N '-four glycidyl group m-phenylene diamine (MPD)s epoxy resin, N, N, N ', the bis- (4- of N '-four glycidyl groups -1,4-
Amino-benzene oxygen) benzene epoxy resin, N, N, N ', bis- (3- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,4-,
N, N, N ', bis- (4- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,3-, N, N, N ', N '-four glycidyl groups -
Bis- (3- amino-benzene oxygens) the benzene epoxy resin of 1,3-, N, N, N ', the bis- (2- trifluoromethyl -4- ammonia of N '-four glycidyl groups -1,4-
Phenoxyl) benzene epoxy resin, N, N, N ', bis- (2- trifluoromethyl-4-aminophenoxyls) benzene of N '-four glycidyl groups -1,3-
Epoxy resin, N, N, N ', N ', O- five glycidyls -4,4 '-diamino -4 "-hydroxyl triphenylmenthane epoxy resin, N, N, N ',
The double [ of N '-four glycidyl groups -2,2-;4- (4- amino-benzene oxygens) Ben Ji ]Propane epoxy resin, N, N, N ' ,-four glycidols of N '
The double [ of base -2,2-;4- (4- amino-benzene oxygens) Ben Ji ]Hexafluoropropane epoxy resin, N, N, N ', N '-four glycidyl groups -2,2- is double
[4- (3- amino-benzene oxygens) Ben Ji ]Propane epoxy resin, N, N, N ', the double [ of N '-four glycidyl groups -2,2-;4- (2- fluoroforms
Base -4- amino-benzene oxygens) Ben Ji ]Propane epoxy resin, N, N, N ', the double [ of N '-four glycidyl groups -2,2-;4- (3- aminobenzene oxygen
Base) Ben Ji ]Hexafluoropropane epoxy resin, N, N, N ', the double [ of N '-four glycidyl groups -2,2-;4- (2- trifluoromethyl -4- aminobenzenes
Oxygroup) Ben Ji ]Hexafluoropropane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) diphenyl ether
Epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) diphenyl ether asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) diphenyl sulphone (DPS) epoxy resin, N, N, N ', N '-four contracts
Water glyceryl -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) diphenyl sulphone (DPS) epoxy resin, N, N, N ',-four glycidols of N '
Bis- (4- amino-benzene oxygens) the diphenyl sulfide epoxy resin of base -4,4 ' -, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- tri-
Methyl fluoride -4- amino-benzene oxygens) diphenyl sulfide epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- aminobenzenes
Oxygroup) diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls)
Diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) benzophenone asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) benzophenone epoxy resin, N,
N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) biphenyl epoxy resin, N, N, N ',-four glycidols of N '
Bis- (2- trifluoromethyl-4-aminophenoxyls) biphenyl epoxy resins of base -4,4 ' -, N, N, N ', N ', O, O '-six glycidyl -
Bis- (3- amino-4-hydroxylphenyls) the hexafluoropropane epoxy resin of 2,2-, N, N, O-triglycidyl group para-aminophenol asphalt mixtures modified by epoxy resin
Fat, N, one or more of N, O-triglycidyl meta-aminophenol epoxy resin.
5. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 3, it is characterised in that：The shrink
Ethoxylated glycerol type epoxy resin is selected from 1,3- resorcinol diglycidyl ethers, 1,4- resorcinol diglycidyl ethers, 4,4 '-bisphenol Ss
Bis- (the 4- glycidyl ethers phenyl) hexafluoropropane of diglycidyl ether, 2,2-, 2,2- bis- (4- glycidol ethers butylcyclohexyls)
Propane, Bisphenol F diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol A diglycidyl ether, fatty alcohol shrink sweet more
One or more of oily ether.
6. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 3, it is characterised in that：The alicyclic ring
Type epoxy resin is selected from sour -3 ', the 4 '-epoxycyclohexyethylSiOi methyl esters of 3,4- epoxycyclohexyethylSiOis, 3,4- epoxy group -6- methyl cyclohexanes acid -
One or more of 3 ', 4 '-epoxy groups -6 '-methyl cyclohexane methyl esters, Dipentenedioxide.
7. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 3, it is characterised in that：The phenolic aldehyde
Type epoxy resin be selected from phenol-formaldehyde phenolic resin type epoxy resin, o-cresol-formaldehyde phenolic resin type epoxy resin,
Benzenediol-formaldehyde phenolic resin type epoxy resin, m-cresol-formaldehyde phenolic resin type epoxy resin, catechol-formaldehyde phenol
It is urea formaldehyde type epoxy resin, bisphenol A-formaldehyde phenolic resin type epoxy resin, bisphenol S-formaldehyde phenolic resin type epoxy resin, double
Phenol AF- formaldehyde phenolic resin types epoxy resin, '-biphenyl diphenol-formaldehyde phenolic resin type epoxy resin, o-phenyl phenol-formaldehyde phenol
One or more of urea formaldehyde type epoxy resin, naphthols-formaldehyde phenolic resin type epoxy resin.
8. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 3, it is characterised in that：The shrink
Glycerine ester type epoxy resin is selected from terephthalic acid diglycidyl ester epoxy resin, Diglycidyl M-phthalate epoxy
Resin, o-phthalic acid diglycidyl ester epoxy resin, interior methine tetrahydrophthalic acid 2-glycidyl ester asphalt mixtures modified by epoxy resin
Fat, 4,5- 7-oxa-bicyclo[4.1.0-1,2- dicarboxylic acid diglycidyl esters epoxy resin, two sad diglycidyl ether epoxy resin of adjacent benzene
One or more of.
9. the siliceous epoxy acid imide matrix resin of a kind of YASI types according to claim 1, it is characterised in that：The solidification
Agent be selected from hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl tetrahydro phthalic anhydride, dodecenylsuccinic anhydride, methyl hexahydrophthalic anhydride, tung oil acid anhydride,
With 80 acid anhydrides made of dicyclopentadiene and maleic acid anhydride reactant, with sour made of limonene and maleic acid anhydride reactant
Acid anhydride, with liquid acid anhydrides, N made of turpentine oil and maleic acid anhydride reactant, accelerine, N, N- dimethyl is to methylbenzene
Amine, N, N- dimethyl benzylamines, 2-ethyl-4-methylimidazole, imidazoles, 2,4,6- tri- (dimethylamino methyl) phenol, 1,8- phenodiazines
Miscellaneous-Shuan Huan [5.4.0]One or more of hendecene -7.
10. a kind of preparation method of the siliceous epoxy acid imide matrix resin of YASI types as described in claim 1, including walk as follows
Suddenly：
(1) by bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2-, o-cresol, the bis- [ of 2,2-;4- (3,4- di carboxyl phenyloxies)
Ben Ji ]Propane dianhydride and maleic anhydride are put into reaction kettle, are passed through nitrogen, and stirring is heated to 80 DEG C, and isoquinolin is added dropwise,
100 DEG C -110 DEG C are heated to, after being stirred to react 5-12 hours, 60 DEG C is cooled to, reactant is poured into the precipitating for filling precipitating agent
In kettle, solids is precipitated in stirring, filters, and vacuum drying obtains imide oligomer object；
(2) will be bis- (γ-aminopropyl) polydimethylsiloxone YASI, epoxy resin be put into reaction kettle, in 80 DEG C -100 DEG C
After being stirred reaction 0.5-1 hours, imide oligomer object is added and continues to be stirred to react 1-2 hours, 3- aminopropyls are then added
Trialkoxy silane is stirred to react 5-15 minutes, is cooled to room temperature, is added curing agent, is uniformly mixed.
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