CN106216417A - The copper aluminum composite material that a kind of processing characteristics is excellent - Google Patents
The copper aluminum composite material that a kind of processing characteristics is excellent Download PDFInfo
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- CN106216417A CN106216417A CN201610603632.6A CN201610603632A CN106216417A CN 106216417 A CN106216417 A CN 106216417A CN 201610603632 A CN201610603632 A CN 201610603632A CN 106216417 A CN106216417 A CN 106216417A
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- composite material
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- copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/22—Making metal-coated products; Making products from two or more metals
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- Extrusion Of Metal (AREA)
Abstract
The invention discloses the copper aluminum composite material that a kind of processing characteristics is excellent, for by the copper after peeling, aluminum blank carries out extrusion cladding, obtain basic composite material, basic composite material is incubated at 500 ~ 600 DEG C 5 ~ 10min, thereafter it is cooled to 400 ~ 500 DEG C with the speed of 5 ~ 10 DEG C/min, insulation 15 ~ 20min, thereafter it is cooled to 200 ~ 400 DEG C with the speed of 20 ~ 30 DEG C/min, insulation 30 ~ 60min, thereafter it is down to room temperature with the speed of 5 ~ 10 DEG C/min, i.e. obtain the copper aluminum composite material that described processing characteristics is excellent, its compound interface average thickness is 15 ~ 30 μm, interface maximum gauge and minimum thickness difference are 3 ~ 20 μm, interface main compound is CuAl2、Cu3Al4、Cu3Al2、Cu5Al7、Cu9Al4.Its composite bed bond strength of the copper aluminum composite material of the present invention is big, and composite bed obscures with the interface edge of blank, and composite bed more penetrates in blank；Described copper aluminum composite material ductility is good, and percentage elongation is high, it is easy to cutting, holes, bend, and is difficult to ripple occur, ftracture and deform in the course of processing.
Description
Technical field
The present invention relates to the technical field of copper aluminum composite material, particularly to the technology neck of the heat treatment of copper aluminum composite material
Territory.
Background technology
Copper aluminum composite material is a kind of advanced composite material (ACM), and it has been concentrated copper, the characteristic of aluminum bi-material, has had electric conductivity
Good, lightweight, good corrosion resistance, the multiple excellent properties such as the most cheap.The most copper aluminum composite material of application is at present
Stratiform copper aluminum composite material, its common preparation method includes rolling, squeezing and pressing method, explosion method.Copper-Aluminum compound rod, recombination line
Material, and simple edge profile generally uses squeezing and pressing method, extend in the interface produced during by extruding and high temperature, high pressure promote copper,
Aluminum is combined, and mechanics, electrical properties and the processing characteristics of the character of the compound interface material to finally giving have significant impact.
Summary of the invention
It is an object of the invention to propose the copper aluminum composite material that a kind of processing characteristics is excellent.
Technical scheme is as follows:
The copper aluminum composite material that a kind of processing characteristics is excellent, for the copper after peeling, aluminum blank are carried out extrusion cladding, obtains basis
Composite, is incubated basic composite material 5 ~ 10min at 500 ~ 600 DEG C, is cooled to the speed of 5 ~ 10 DEG C/min thereafter
400 ~ 500 DEG C, it is incubated 15 ~ 20min, is cooled to 200 ~ 400 DEG C with the speed of 20 ~ 30 DEG C/min thereafter, be incubated 30 ~ 60min, its
After be down to room temperature with the speed of 5 ~ 10 DEG C/min, i.e. obtain the copper aluminum composite material that described processing characteristics is excellent, its compound interface
Average thickness is 15 ~ 30 μm, and interface maximum gauge and minimum thickness difference are 3 ~ 20 μm.
Preferably: described basic composite material is incubated 10min at 500 DEG C, is cooled to 400 DEG C with 5 DEG C/min thereafter,
Insulation 20min, is cooled to 300 DEG C with 25 DEG C/min thereafter, is incubated 60min, is down to room temperature with 10 DEG C/min thereafter, obtains described
The copper aluminum composite material that processing characteristics is excellent.
It is also preferred that: described basic composite material is incubated 5min at 600 DEG C, is cooled to 10 DEG C/min thereafter
400 DEG C, it is incubated 15min, is cooled to 350 DEG C with 20 DEG C/min thereafter, be incubated 50min, be down to room temperature with 5 DEG C/min thereafter,
To the copper aluminum composite material that described processing characteristics is excellent.
Its composite bed bond strength of the copper aluminum composite material of the present invention is big, and composite bed obscures with the interface edge of blank, multiple
Close layer more to penetrate in blank；Described copper aluminum composite material ductility is good, and percentage elongation is high, it is easy to cutting, holes, bend, and adds
It is difficult to during work ripple to occur, ftractures and deform.
Detailed description of the invention
Embodiment 1
Copper after peeling, aluminum blank are carried out extrusion cladding, obtains basic composite material, by basic composite material at 500 DEG C
Insulation 10min, is cooled to 400 DEG C with the speed of 5 DEG C/min thereafter, is incubated 20min, is cooled to the speed of 30 DEG C/min thereafter
200 DEG C, it is incubated 60min, is down to room temperature with the speed of 10 DEG C/min thereafter, i.e. obtain the Copper-Aluminum compound that described processing characteristics is excellent
Material, its compound interface average thickness is 15 ~ 20 μm, and interface maximum gauge and minimum thickness difference are 5 ~ 15 μm, and interface is mainly changed
Compound is CuAl2、Cu3Al4、Cu3Al2、Cu5Al7 、Cu9Al4。
Embodiment 2
Copper after peeling, aluminum blank are carried out extrusion cladding, obtains basic composite material, by basic composite material at 500 DEG C
Insulation 10min, is cooled to 400 DEG C with 5 DEG C/min thereafter, is incubated 20min, is cooled to 300 DEG C with 25 DEG C/min thereafter, insulation
60min, is down to room temperature with 10 DEG C/min thereafter, obtains the copper aluminum composite material that described processing characteristics is excellent, and its compound interface is put down
All thickness is 20 ~ 30 μm, and interface maximum gauge and minimum thickness difference are 3 ~ 20 μm, and interface main compound is CuAl2、Cu3Al4、
Cu3Al2、Cu5Al7 、Cu9Al4。
Embodiment 3
Copper after peeling, aluminum blank are carried out extrusion cladding, obtains basic composite material, by basic composite material at 600 DEG C
Insulation 5min, is cooled to 400 DEG C with 10 DEG C/min thereafter, is incubated 15min, is cooled to 350 DEG C with 20 DEG C/min thereafter, insulation
50min, is down to room temperature with 5 DEG C/min thereafter, obtains the copper aluminum composite material that described processing characteristics is excellent, and its compound interface is average
Thickness is 15 ~ 30 μm, and interface maximum gauge and minimum thickness difference are 3 ~ 20 μm, and interface main compound is CuAl2、Cu3Al4、
Cu3Al2、Cu5Al7 、Cu9Al4。
Claims (3)
1. the copper aluminum composite material that a processing characteristics is excellent, it is characterised in that: the copper after peeling, aluminum blank are extruded
Compound, obtain basic composite material, basic composite material is incubated at 500 ~ 600 DEG C 5 ~ 10min, thereafter with 5 ~ 10 DEG C/min
Speed be cooled to 400 ~ 500 DEG C, be incubated 15 ~ 20min, be cooled to 200 ~ 400 DEG C with the speed of 20 ~ 30 DEG C/min thereafter, protect
Temperature 30 ~ 60min, is down to room temperature with the speed of 5 ~ 10 DEG C/min thereafter, i.e. obtains the Copper-Aluminum compound material that described processing characteristics is excellent
Material, its compound interface average thickness is 15 ~ 30 μm, and interface maximum gauge and minimum thickness difference are 3 ~ 20 μm, the main chemical combination in interface
Thing is CuAl2、Cu3Al4、Cu3Al2、Cu5Al7 、Cu9Al4。
The copper aluminum composite material that processing characteristics the most according to claim 1 is excellent, it is characterised in that: described basis composite wood
Material is incubated 10min at 500 DEG C, is cooled to 400 DEG C with 5 DEG C/min thereafter, is incubated 20min, is cooled to 25 DEG C/min thereafter
300 DEG C, it is incubated 60min, is down to room temperature with 10 DEG C/min thereafter, obtain the copper aluminum composite material that described processing characteristics is excellent.
The copper aluminum composite material that processing characteristics the most according to claim 1 is excellent, it is characterised in that: described basis composite wood
Material is incubated 5min at 600 DEG C, is cooled to 400 DEG C with 10 DEG C/min thereafter, is incubated 15min, is cooled to 20 DEG C/min thereafter
350 DEG C, it is incubated 50min, is down to room temperature with 5 DEG C/min thereafter, obtain the copper aluminum composite material that described processing characteristics is excellent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610603632.6A CN106216417A (en) | 2016-07-28 | 2016-07-28 | The copper aluminum composite material that a kind of processing characteristics is excellent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610603632.6A CN106216417A (en) | 2016-07-28 | 2016-07-28 | The copper aluminum composite material that a kind of processing characteristics is excellent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106216417A true CN106216417A (en) | 2016-12-14 |
Family
ID=57533832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610603632.6A Pending CN106216417A (en) | 2016-07-28 | 2016-07-28 | The copper aluminum composite material that a kind of processing characteristics is excellent |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4537642A (en) * | 1983-01-19 | 1985-08-27 | Sumitomo Electric Industries, Ltd. | Method of manufacturing Al-stabilized superconductor |
| CN1230754A (en) * | 1998-03-26 | 1999-10-06 | 彭星魁 | Compound copper-aluminium wire and its production process |
| CN101645334A (en) * | 2008-08-05 | 2010-02-10 | 北京有色金属研究总院 | Extrusion rolling composite method for producing copper clad aluminum row |
| CN102103906A (en) * | 2009-12-21 | 2011-06-22 | 北京有色金属研究总院 | Method for preparing copper-coated aluminium composite material |
| CN105679460A (en) * | 2016-04-01 | 2016-06-15 | 安徽鑫旭新材料股份有限公司 | Copper-aluminum composite electrical busbar and production method thereof |
-
2016
- 2016-07-28 CN CN201610603632.6A patent/CN106216417A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4537642A (en) * | 1983-01-19 | 1985-08-27 | Sumitomo Electric Industries, Ltd. | Method of manufacturing Al-stabilized superconductor |
| CN1230754A (en) * | 1998-03-26 | 1999-10-06 | 彭星魁 | Compound copper-aluminium wire and its production process |
| CN101645334A (en) * | 2008-08-05 | 2010-02-10 | 北京有色金属研究总院 | Extrusion rolling composite method for producing copper clad aluminum row |
| CN102103906A (en) * | 2009-12-21 | 2011-06-22 | 北京有色金属研究总院 | Method for preparing copper-coated aluminium composite material |
| CN105679460A (en) * | 2016-04-01 | 2016-06-15 | 安徽鑫旭新材料股份有限公司 | Copper-aluminum composite electrical busbar and production method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 杜文佳等: "热处理工艺对Cu/Al 复合界面的影响", 《材料热处理学报》 * |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161214 |