CN106211606B - A kind of the heat ultrasound sintering method and its device of the compound ink of nano silver/graphene - Google Patents
A kind of the heat ultrasound sintering method and its device of the compound ink of nano silver/graphene Download PDFInfo
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- CN106211606B CN106211606B CN201610576017.0A CN201610576017A CN106211606B CN 106211606 B CN106211606 B CN 106211606B CN 201610576017 A CN201610576017 A CN 201610576017A CN 106211606 B CN106211606 B CN 106211606B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
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- Microelectronics & Electronic Packaging (AREA)
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- Organic Chemistry (AREA)
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- Manufacturing & Machinery (AREA)
- Carbon And Carbon Compounds (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention discloses the ultrasonic sintering methods of heat and its device of a kind of compound ink of nano silver/graphene, by nano silver powder and graphene dispersion in mixed organic solvents, the compound ink of nano silver/graphene that configuration quality percentage is 0.01%~90%；The highly viscous compound ink of nano silver/graphene is extruded from packing element by air pressure, is scribbled by Glue dripping head and forms the flexible base board with conducting channel on flexible substrates；Between the flexible base board with conducting channel of drying is placed on two layers of PDMS protection plastics, applies pressure and reach 3~30MPa of desirable value；Heating temperature is 60~160 DEG C；Then, under conditions of 3~30MPa, 60 160 DEG C, carry out hot pressing pre-sintering, sintering time is 1 10 minutes, heat ultrasound sintering is carried out under conditions of 3 30MPa, 60 160 DEG C, sintering time is 1 10 minutes, passes through ultrasound, the effect of pressure and temperature, it realizes the solid-state diffusion between nano silver/graphene, prepares the flexible circuit with excellent conductive performance and mechanical deflection performance.
Description
Technical field
The present invention relates to the conducting channel preparation methods in a kind of flexible electronic field, and nanometer is used more particularly to a kind of
High intensity, the low resistance flexible circuit preparation method of the compound ink of silver/graphite alkene.The invention further relates to a kind of realization nanometers
The device of the ultrasonic sintering method of heat of the compound ink of silver/graphite alkene.
Background technology
Wearable intelligent equipment is the developing direction in electronics industry future, and flexible electronic technology is key technology therein.
Flexible electronic can be summarized as being that organic/inorganic materials electronic device is produced on flexibility/Drawability plastics or metal sheet
New electronic technology, with its unique flexibility/ductility and efficient, low cost manufacturing technique, in information, the energy, medical treatment, state
Anti- equal fields have wide application prospect.It is the main development side of flexible circuit using nano metal ink as the paper substrate circuit of medium
One of to, it disperses nano metal powder in organic solvent, to prepare conductive ink, passes through ink jet printing, deposition sputtering plating
Ink is deposited on paper base plate by the modes such as film and spray gun spraying prepares circuit.For this purpose, each research institution proposes a variety of preparations
The method of nano-metal particle conductive ink and flexible circuit.Chinese patent CN 1437200 proposes a kind of according to nanometer silver granuel
Sub- self assembly and low temperature fusion welding property, the method that filling epoxy resin reduces colloid viscosity；Chinese patent CN 104877464A are carried
A kind of method preventing nano-metal particle reunion using surfactant is gone out.
But the conducting channel prepared with simple nano metal (being mostly nano silver) ink, due to nanometer after sintering
There are gap between grain, electric conductivity, mechanical property can not show a candle to continuous block metal material, greatly limit the hair of the technology
Exhibition and application.
Graphene is a kind of new material with superior electrical, mechanics, thermal property found 21 century, it is both most
Thin material, and most tough material, 200 times more taller than best steel of fracture strength.It has good bullet again simultaneously
Property, stretch range can reach the 20% of own dimensions.It is that current nature is most thin, the highest material of intensity, and price is low
It is honest and clean.Graphene and nano metal powder are mixed with circuit, there are gap, enhancing electricity between nano particle after being sintered with filling
The electric conductivity on road, mechanical property are to solve one of the method that pure nano metal ink prepares flexible circuit problem at present.
But the introducing of graphene brings and writes inconvenient (graphene is easy to block traditional writing nib), sintering temperature
Spend the problems such as high, sintering time is long, circuitous resistance rate is big after sintering.Therefore, it is necessary to develop a kind of novel nano silver/graphite
The writing of the compound ink of alkene and sintering method, to prepare the flexible circuit of high intensity, low-resistivity.
Invention content
First technical problem to be solved by this invention be propose it is a kind of realize high intensity, low-resistivity flexible circuit
The ultrasonic sintering method of heat of the compound ink of nano silver/graphene of preparation.
Boundary technical problem to be solved by this invention is to provide a kind of heat for realizing the compound ink of nano silver/graphene
The device of ultrasonic sintering method.
In order to solve above-mentioned first technical problem, the heat ultrasound of the compound ink of nano silver/graphene provided by the invention
Sintering method includes the following steps：
(1), the compound ink of nano silver/graphene is configured：Absolute ethyl alcohol, polyethylene glycol and glycerine are passed through into ultrasonic vibration
It mixes, forms the mixed organic solvents that viscosity is 0.01~100 Pa Sec；Then by churned mechanically mode by nanometer
Silver powder and graphene by nano Silver quality percentage are 96~99.9%, graphene mass percent is 4%~0.1% dispersion
In mixed organic solvents, configuration quality percentage be 0.01%~90% the compound ink of nano silver/graphene；Then it will mix
It is filling in Glue dripping head to close the uniform compound ink of nano silver/graphene, prepares circuit and writes；
(2), the writing of the compound ink of nano silver/graphene：By air pressure by highly viscous nano silver/graphene composite ink
Water is extruded from packing element, is scribbled by Glue dripping head and is formed the flexible base board with conducting channel on flexible substrates；
Finally by the printed flexible base board with conducting channel be placed in drying oven with 55 DEG C~65 DEG C dry 2 hours~
4 hours, to remove volatilizable organic solvent；It then takes out to carry the flexible base board of conducting channel, carries out the burning of next step
Knot；
(3), the ultrasonic sintering process of the heat of the compound ink of nano silver/graphene is：By the flexibility with conducting channel of drying
Substrate is placed between two layers of PDMS protection plastics, and the thickness of PDMS is 100~500 microns, is then placed on flexible base board and adds
In thermal station；By ultrasonic transducer end pressure on flexible substrates, on flexible base board apply pressure reach desirable value 3~
30MPa；It is 60~160 DEG C that warm table carries out heating temperature to flexible base board；Then, in 3~30MPa, 60~160 DEG C of condition
Under, hot pressing pre-sintering is carried out, sintering time is 1~10 minute, next, under conditions of 3~30MPa, 60~160 DEG C, is opened
Ultrasonic vibration is opened, heat ultrasound sintering is carried out, sintering time is 1~10 minute, by ultrasound, the effect of pressure and temperature, is realized
Solid-state diffusion between nano silver/graphene forms flexible circuit, prepares with excellent conductive performance and mechanical deflection performance
Flexible circuit.
It is 99.5% that nano silver powder and graphene, which press nano Silver quality percentage, in above-mentioned steps (1), graphene quality
Percentage is 0.5%.
By the absolute ethyl alcohol, polyethylene glycol and glycerine with percent by volume 50 in above-mentioned steps (1):45:5 pass through
Ultrasonic vibration mixes.
Flexible base board described in above-mentioned steps (1) is filter paper, rubber or printing paper.
The thickness of PDMS described in above-mentioned steps (3) is 300 microns.
Reach desirable value 15MPa to applying pressure on flexible circuit board sample described in above-mentioned steps (3), it is described
It is 120 DEG C that warm table carries out heating temperature to flexible circuit board sample.
Carry out hot pressing pre-sintering described in above-mentioned steps (3), sintering time are 4 minutes；Described in progress heat ultrasound
Sintering, sintering time are 4 minutes.
The supersonic frequency used in heat ultrasound sintering described in above-mentioned steps (3) is 20-120kHz；Power is 100-
3000W。
The supersonic frequency used in heat ultrasound sintering described in above-mentioned steps (3) is 35kHz；Power is 500W.
In order to solve above-mentioned second technical problem, the heat provided by the invention for realizing the compound ink of nano silver/graphene
The device of ultrasonic sintering method, including the writing system of the compound ink of nano silver/graphene and the compound ink of nano silver/graphene
The ultrasonic sintering system of heat, the structure of the writing system of the compound ink of nano silver/graphene is：Pedestal is write to be equipped with
Column and upper and lower translation platform and writing movements translation stage are write, the writing column and upper and lower translation platform are equipped with to write and fix
Holder, the writing fixing bracket, which is equipped with, writes force snesor and packing element, and the upper end of the packing element passes through tracheae and sky
Air pressure force controller connects, and the lower end of the packing element is connected with Glue dripping head；The writing movements translation stage, write column and
Upper and lower translation platform writes force snesor and air pressure controller and writes control computer using communication connection；Described receives
The structure of the ultrasonic sintering system of heat of the rice compound ink of silver/graphite alkene is：It is sintered pedestal and is equipped with sintering column and upper and lower translation
Platform and sintering motion translation platform, the sintering column and upper and lower translation platform are equipped with and are sintered to fix holder, and the sintering is solid
Fixed rack is equipped with sintering force snesor and energy converter, the energy converter are connect with ultrasonic generator, the energy converter
Front end is equipped with amplitude transformer, and the front end of the amplitude transformer is equipped with tool heads；The sintering motion translation platform is equipped with warm table；
The sintering column and upper and lower translation platform, sintering motion translation platform, warm table, sintering force snesor and ultrasonic generator and burning
Control computer is tied using communication connection.
Using the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene of above-mentioned technical proposal and its device, prepare
Flexible circuit have good conductive property.As sintering time increases, the flexibility of the compound ink preparation of nano silver/graphene
The average resistivity of circuit is since 1.6 Ω | and it is continuously decreased m, at 16 minutes, reaches lower resistivity, be fine silver resistance
1.87 times of rate, are further added by sintering time later, and resistivity is not decreased obviously；And prepared by the pure nano silver conductive ink of tradition
For flexible circuit in identical sintering time, flexible circuit prepared by resistivity ink all more compound than nano silver/graphene is big.Explanation
Flexible circuit prepared by the method for the present invention has preferable electric conductivity.
1) using flexible circuit prepared by the above method has good mechanical resistance bending performance.Mechanical resistance bending performance
Test method is：The both ends for holding flexible circuit, the bending being repeated, and every 300 times, sample is averaged after measurement bending
Resistance passes through the mechanical resistance bending performance for changing energy judgement sample of resistance.As bending number increases to 3000 times from 0, this
The average resistance of flexible circuit prepared by the compound ink of invention nano silver/graphene only increases to 0.6 ohm from 0.51；And it passes
The resistance that pure nano silver conductive ink of uniting prepares circuit then increases to 0.92 ohm from 0.7.Illustrate prepared by the method for the present invention
Flexible circuit has preferable mechanical deflection performance.
Advantageous effect using the present invention has：
1, graphene has excellent electric conductivity and larger specific surface area, and the graphene film in conductive ink can be by phase
Together, even if there is gap between nano-Ag particles, the bridge joint of graphene film can form excellent electricity to adjacent nano-Ag particles bridge joint
Channel, hence it is evident that electric conductivity, the mechanical property for improving circuit make up the harmful effect that pore belt is come.
2, nano silver and graphene can equably, with different mass percents be dispersed in mixed organic solvents, mixing
Organic solvent has good hydrophily, and can change hybrid conductive ink viscosity as needed, therefore, can be in different substrates
On, with different nano silvers and graphene mass percent, write various required circuits.
3, hybrid conductive ink is write using dispensing method, it can be big by adjusting Glue dripping head bore, ink viscosity, air pressure
It is small, to adjust the width and thickness of prepared flexible circuit.
4, the dispenser system controlled by computer can use common modeling software (such as PorE, CAD) to establish circuit pattern mould
Type is printed after importing model, realizes prepared by required variously-shaped circuit.
5, using ultrasonic wave added hot pressed sintering, the gap between nano-Ag particles is reduced, increases the compactness of sample, is improved soft
The conductive capability of property circuit.
6, quick (8 points of nano silver/graphene circuit be can be achieved under 120 DEG C, the low temperature and lower pressure of 15MPa
Clock) sintering.
In conclusion the present invention be it is a kind of realize high intensity, low-resistivity flexible circuit prepare nano silver/graphene
The ultrasonic sintering method of heat and its device of compound ink.
Description of the drawings
Fig. 1 is the structural schematic diagram of the writing system of the compound ink of nano silver/graphene of the present invention.
Fig. 2 is the structural schematic diagram of the ultrasonic sintering system of heat of the compound ink of nano silver/graphene of the present invention.
Fig. 3 is the photo of paper substrate nano silver/graphene flexible circuit prepared by the method for the present invention.
Fig. 4 is influence diagram of the sintering time to flexible circuit conductive performance.
Fig. 5 is the bend resistance the performance test results figure of flexible circuit.
Specific implementation mode
The invention will be further described below in conjunction with the accompanying drawings.
Referring to Fig. 1 and Fig. 2, the heat ultrasonic sintering method provided by the invention for realizing the compound ink of nano silver/graphene
Device includes the heat ultrasound sintering system of the writing system of the compound ink of nano silver/graphene and the compound ink of nano silver/graphene
System, the structure of the writing system of the compound ink of nano silver/graphene are：It writes pedestal 11 and is equipped with writing column and upper and lower translation
Platform 2 and writing movements translation stage 12, write column and upper and lower translation platform 2 is equipped with and writes fixing bracket 7, write fixing bracket 7
It is equipped with writing force snesor 4 and packing element 6, the upper end of packing element 6 is connect by tracheae 5 with air pressure controller 3, packing element 6
Lower end is connected with Glue dripping head 9；Equipped with the compound ink of nano silver/graphene 8 in packing element 6；Glue dripping head 9 is to just writing motion translation platform
12；Writing movements translation stage 12 writes column and upper and lower translation platform 2, writes force snesor 4 and air pressure controller 3 and book
Control computer 1 is write using communication connection；The structure of the ultrasonic sintering system of heat of the compound ink of nano silver/graphene is：Sintering
Pedestal 21 is equipped with sintering column and upper and lower translation platform 14 and sintering motion translation platform 20, is sintered on column and upper and lower translation platform 14
Equipped with holder 18 is sintered to fix, is sintered to fix holder 18 and is equipped with sintering force snesor 16 and energy converter 17, energy converter 17 with it is super
Acoustic generator 15 connects, and the front end of energy converter 17 is equipped with amplitude transformer 23, and the front end of amplitude transformer 23 is equipped with tool heads 22；Sintering movement
Translation stage 20 is equipped with warm table 19；Flexible base board 10 is placed on warm table 19, flexible base board 10 is submitted a written statement to a higher authority with flexible circuit
25；Flexible base board 10 is equipped with upper PDMS protective films 24 and lower PDMS protective films 26；Tool heads 22 are to positive warm table 19；Sintering is vertical
Column and upper and lower translation platform 14, sintering motion translation platform 20, warm table 19, sintering force snesor 16 and ultrasonic generator 15 and sintering
Control computer 13 is using communication connection.
Referring to Fig. 1, Fig. 2 and Fig. 3, the ultrasonic sintering method of heat of the compound ink of nano silver/graphene provided by the invention, packet
Include following steps：
1) the compound ink of nano silver/graphene is configured：By absolute ethyl alcohol, polyethylene glycol and glycerine with percent by volume
50:45:5 are mixed by ultrasonic vibration, form a kind of big viscosity mixed organic solvents, by changing above-mentioned three kinds of components
Percent by volume, mixed organic solvents of the viscosity from 0.01~100 Pa Sec of various viscosity can be formed；Then pass through mechanical agitation
Mode by nano silver powder and graphene be 96~99.9% by nano Silver quality percentage, graphene mass percent is
4%~0.1%, preferably 99.5%：0.5% is dispersed in mixed organic solvents, is dispersed in mixed organic solvents, due to mixing
The viscosity of organic solvent can be adjusted arbitrarily, therefore, can be realized multiple from nano silver/graphenes of 0.01%-90% mass percents
Close the configuration of ink 8；And traditional ink proportioning, it is difficult to realize 10% or more mass percent proportioning；Then it will mix equal
The compound ink 8 of even nano silver/graphene is filling in packing element 6, and packing element 6 is fixed on and is write on fixing bracket 7, prepares electricity
Road book is write.
2) writing of the compound ink of nano silver/graphene 8：It opens and writes control computer 1, circuit model is imported flexible
Circuit writes control software, and carries out hierarchy slicing and path planning.Adjust the Glue dripping head 9 and writing movements translation stage of packing element 6
12 opposite positions reach optimum position when distance between the two reaches 1mm, and Glue dripping head 9 is fixed.Open air pressure
Air pressure adjustment is reached 10psi, by air pressure by the compound ink 8 of highly viscous nano silver/graphene, from packing element by force controller 3
It is extruded in 6, writing on flexible base board 10 by the painting of Glue dripping head 9, (flexible base board 10 is filter paper, rubber or printing paper, herein preferred phase
Paper) on, meanwhile, 12 movement flexible base board 10 of writing movements translation stage is controlled by writing control computer 1, in flexible base board
Required various circuit patterns are formed on 10.The width of circuit can be changed by changing the diameter of Glue dripping head 9.The above method can be real
The now uniform book from the compound ink of nano silver/graphene of 0.01%-90% mass percents 8 on various flexible base boards 10
It writes, and traditional ball pen head Writing method, it can only realize that 10% or more mass percent matches the book of pure silver ink
It writes.
Finally by printed the flexible base board 10 with conducting channel be placed in drying oven with 60 DEG C dry 3 hours, to go
Except volatilizable organic solvent；It then takes out to carry the flexible base board 10 of conducting channel, carries out the sintering of next step.
3) the ultrasonic sintering process of the heat of the compound ink of nano silver/graphene is：Flexibility by drying, with conducting channel
Substrate 10 is put between PDMS protective films 24 and lower PDMS protective films 26, upper PDMS protective films 24 and lower PDMS protective films 26
Thickness is 100~500 microns, preferably 300 microns, flexible circuit can be protected not contaminated and reduce ultrasound and transmitted
Then flexible base board 10 is placed on warm table 19 by the amplitude fading in journey；It is sintered the control sintering column of control computer 13
And upper and lower translation platform 14 moves down, and the tool heads 22 of 17 end of energy converter are pressed on flexible base board 10, meanwhile, sintering control
The detection sintering force snesor 16 of computer 13, until the pressure applied on flexible base board 10 reaches 3~30MPa of desirable value, preferably
15MPa；At the same time, sintering control computer 13 controls warm table 19 and is heated to flexible base board 10, and temperature is 60~160
DEG C, preferably 120 degrees Celsius；Then, under conditions of 15MPa, 120 DEG C, hot pressing pre-sintering is carried out, sintering time is 1~10 point
Clock, preferably 4 minutes open ultrasonic generator 15 and carry out ultrasonic vibration, carry out heat next, under conditions of 15MPa, 120 DEG C
Ultrasound sintering, sintering time be 1~10 minute, preferably 4 minutes, by ultrasound, pressure and temperature effect, realize nano silver/
Solid-state diffusion between graphene forms conductive flex circuitry, prepares with excellent conductive performance and mechanical deflection performance
Flexible circuit.Above-mentioned heat ultrasound sintering supersonic frequency used is 20-120kHz, preferably 35kHz；Power is 100-3000W, excellent
500W is selected, the structure that substrate is destroyed to avoid excessive power closes the integrality of circuit after the completion of sintering, while being avoided that too small
Power can not provide sintering needed for energy.Sintered circuit is as shown in Figure 3.
The flexible circuit prepared using the above method is had good conductive property.Fig. 4 is sintering time to flexible circuit
The affecting laws of resistivity, as shown in Figure 4：As sintering time increases, the flexible electrical of the compound ink preparation of nano silver/graphene
The average resistivity on road is since 1.6 Ω | and it is continuously decreased m, at 16 minutes, reaches lower resistivity, be fine silver resistivity
1.87 times, be further added by sintering time later, resistivity is not decreased obviously；And the pure nano silver conductive ink preparation of tradition is soft
Property circuit in identical sintering time, flexible circuit prepared by resistivity ink all more compound than nano silver/graphene is big.Illustrate this
Flexible circuit prepared by inventive method has preferable electric conductivity.
There is good mechanical resistance bending performance using flexible circuit prepared by the above method.The survey of mechanical resistance bending performance
Method for testing is：The both ends for holding flexible circuit, the bending being repeated, and every 300 times, measure the average electricity of sample after bending
Resistance passes through the mechanical resistance bending performance for changing energy judgement sample of resistance.Test result such as Fig. 5, as seen from the figure：With bending time
Number increases to 3000 times from 0, the average resistance of flexible circuit prepared by the compound ink of nano silver/graphene of the present invention only from
0.51 increases to 0.6 ohm；And the resistance that the pure nano silver conductive ink of tradition prepares circuit then increases to 0.92 ohm from 0.7.
Illustrate that the flexible circuit prepared by the method for the present invention has preferable mechanical deflection performance.
Claims (10)
1. a kind of ultrasonic sintering method of the heat of compound ink of nano silver/graphene, it is characterized in that：Include the following steps：
(1), the compound ink of nano silver/graphene is configured：Absolute ethyl alcohol, polyethylene glycol and glycerine are mixed by ultrasonic vibration
Together, the mixed organic solvents that viscosity is 0.01~100 Pa Sec are formed；Then by churned mechanically mode by nano-silver powder
End and graphene by nano Silver quality percentage are 96~99.9%, graphene mass percent be 4%~0.1% be dispersed in it is mixed
It closes in organic solvent, the compound ink of nano silver/graphene that configuration quality percentage is 0.01%~90%；Then it will mix equal
The even compound ink of nano silver/graphene is filling in Glue dripping head, prepares circuit and writes；
(2), the writing of the compound ink of nano silver/graphene：By air pressure by the highly viscous compound ink of nano silver/graphene from
It is extruded in packing element, is scribbled by Glue dripping head and form the flexible base board with conducting channel on flexible substrates；
Finally the flexible base board with conducting channel is placed in drying oven and is dried 2 hours~4 hours with 55 DEG C~65 DEG C, with removal
Volatilizable organic solvent；It then takes out to carry the flexible base board of conducting channel, carries out the sintering of next step；
(3), the ultrasonic sintering process of the heat of the compound ink of nano silver/graphene is：By the flexible base board with conducting channel of drying,
It is placed between two layers of PDMS protection plastics, the thickness of PDMS is 100~500 microns, and flexible base board is then placed on warm table
On；On flexible substrates by ultrasonic transducer end pressure, reach 3~30MPa of desirable value to application pressure on flexible base board；Add
The heating that thermal station is 60~160 DEG C into trip temperature to flexible base board；Then, under conditions of 3~30MPa, 60~160 DEG C, into
Row hot pressing is pre-sintered, and sintering time is 1-10 minutes, next, under conditions of 3~30MPa, 60~160 DEG C, opens ultrasound
Vibration, carry out heat ultrasound sintering, sintering time be 1~10 minute, by ultrasound, pressure and temperature effect, realize nano silver/
Solid-state diffusion between graphene forms flexible circuit, prepares the flexibility with excellent conductive performance and mechanical deflection performance
Circuit.
2. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1, it is characterized in that：It is above-mentioned
By the absolute ethyl alcohol, polyethylene glycol and glycerine with percent by volume 50 in step (1):45:5 are mixed by ultrasonic vibration
Together.
3. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1 or 2, it is characterized in that：On
It is filter paper, rubber or printing paper to state the flexible base board described in step (1).
4. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1 or 2, it is characterized in that：On
It is 99.5% that nano silver powder and graphene, which are stated in step (1), by nano Silver quality percentage, and graphene mass percent is
0.5%.
5. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1 or 2, it is characterized in that：On
State and reach desirable value 15MPa to applying pressure on flexible base board described in step (3), the warm table to flexible base board into
Row heating temperature is 120 DEG C.
6. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1 or 2, it is characterized in that：On
The thickness for stating the PDMS described in step (3) is 300 microns.
7. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1 or 2, it is characterized in that：On
The carry out hot pressing pre-sintering described in step (3) is stated, sintering time is 4 minutes；The progress heat ultrasound sintering, sintering time
It is 4 minutes.
8. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1 or 2, it is characterized in that：On
The supersonic frequency stated used in the heat ultrasound sintering described in step (3) is 20-120kHz；Power is 100-3000W.
9. the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene according to claim 1 or 2, it is characterized in that：On
The supersonic frequency stated used in the heat ultrasound sintering described in step (3) is 35kHz；Power is 500W.
10. realizing the device of the ultrasonic sintering method of the heat of the compound ink of nano silver/graphene described in claim 1, feature
It is：The heat ultrasound sintering system of writing system and the compound ink of nano silver/graphene including the compound ink of nano silver/graphene
System, the structure of the writing system of the compound ink of nano silver/graphene are：Write pedestal (11) be equipped with write column and
Upper and lower translation platform (2) and writing movements translation stage (12) are write, the writing column and writing upper and lower translation platform (2) are equipped with
Fixing bracket (7) is write, the writing fixing bracket (7), which is equipped with, writes force snesor (4) and packing element (6), the glue
The upper end of cylinder (6) is connect by tracheae (5) with air pressure controller (3), and the lower end of the packing element (6) is connected with Glue dripping head
(9)；The writing movements translation stage (12) writes column and writes upper and lower translation platform (2), writes force snesor (4) and empty
Air pressure force controller (3) uses communication connection with control computer (1) is write；The compound ink of nano silver/graphene
The structure of hot ultrasound sintering system is：It is sintered pedestal (21) and is equipped with sintering column and sintering upper and lower translation platform (14) and sintering fortune
Dynamic translation stage (20), the sintering column and sintering upper and lower translation platform (14), which are equipped with, is sintered to fix holder (18), described
It is sintered to fix holder (18) and is equipped with sintering force snesor (16) and energy converter (17), the energy converter (17) occurs with ultrasound
Device (15) connects, and the front end of the energy converter (17) is equipped with amplitude transformer (23), and the front end of the amplitude transformer (23) is equipped with work
Has head (22)；The sintering motion translation platform (20) is equipped with warm table (19)；The sintering column and sintering is flat up and down
Moving stage (14), sintering motion translation platform (20), warm table (19), sintering force snesor (16) and ultrasonic generator (15) and sintering
Control computer (13) is using communication connection.
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| CN107824393A (en) * | 2017-11-23 | 2018-03-23 | 河北立德电子有限公司 | A kind of point glue equipment with ultrasonic vibration and the dispensing method using its progress |
| US20190174633A1 (en) * | 2017-12-05 | 2019-06-06 | Illinois Tool Works Inc. | Material temperature sensor for stencil printer |
| US10933483B2 (en) | 2017-12-05 | 2021-03-02 | Illinois Tool Works Inc. | IR non-contact temperature sensing in a dispenser |
| EP3746300B1 (en) * | 2018-02-01 | 2023-05-03 | The Procter & Gamble Company | System and method for dispensing material |
| US10849843B2 (en) | 2018-02-01 | 2020-12-01 | The Procter & Gamble Company | Stable cosmetic ink composition |
| US10813857B2 (en) | 2018-02-01 | 2020-10-27 | The Procter & Gamble Company | Heterogenous cosmetic ink composition for inkjet printing applications |
| CN110429209B (en) * | 2018-08-23 | 2022-01-11 | 广东聚华印刷显示技术有限公司 | Preparation method and processing equipment of metal structure based on roll-to-roll printing technology |
| CN109623068B (en) * | 2019-01-10 | 2021-02-19 | 哈尔滨工业大学（深圳） | Nano-silver connection method based on multipoint ultrasonic vibration |
| CN109540374B (en) * | 2019-01-10 | 2024-03-15 | 中南大学 | Ultrasonic sintering packaging device |
| CN111148363B (en) * | 2019-12-31 | 2021-06-11 | 浙江理工大学 | Method for preparing flexible circuit board by etching-writing nano conductive material on surface of polymer film |
| CN111239183B (en) * | 2020-03-10 | 2022-03-18 | 嘉兴学院 | Device and method for measuring dynamic thermal conductivity coefficient of silver nanoparticle conductive ink in sintering process |
| CN116179020B (en) * | 2023-03-01 | 2024-04-19 | 哈尔滨工业大学（深圳） | Preparation method of liquid metal microparticle ink conductive circuit |
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| EP2608287A1 (en) * | 2011-12-22 | 2013-06-26 | Meggitt A/S | Flexible piezoelectric material, production and use thereof |
| CN105101658A (en) * | 2015-09-09 | 2015-11-25 | 中南大学 | Hot ultrasonic low-temperature sintering method and device of nano silver conductive ink |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2608287A1 (en) * | 2011-12-22 | 2013-06-26 | Meggitt A/S | Flexible piezoelectric material, production and use thereof |
| CN105101658A (en) * | 2015-09-09 | 2015-11-25 | 中南大学 | Hot ultrasonic low-temperature sintering method and device of nano silver conductive ink |
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