CN106211585A - Copper plating of printed circuit board supports board device and using method thereof - Google Patents
Copper plating of printed circuit board supports board device and using method thereof Download PDFInfo
- Publication number
- CN106211585A CN106211585A CN201610649639.1A CN201610649639A CN106211585A CN 106211585 A CN106211585 A CN 106211585A CN 201610649639 A CN201610649639 A CN 201610649639A CN 106211585 A CN106211585 A CN 106211585A
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- Prior art keywords
- printed circuit
- circuit board
- sulfuric acid
- dilute sulfuric
- cell body
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
Abstract
The present invention relates to apparatus of producing PCB technical field, particularly relate to copper plating of printed circuit board and support board device and using method thereof, copper plating of printed circuit board is supported board device and is included that cell body, described cell body are provided with the containing cavity for containing dilute sulfuric acid and upper opening；The bottom of described cell body offers leakage fluid dram, and the sidepiece of described cell body offers inlet, is connected the circulation filter having the described dilute sulfuric acid contained in containing cavity described in circulating filtration between described leakage fluid dram with described inlet.The copper plating of printed circuit board of the present invention supports board device, it is possible to realize reducing impurity present in dilute sulfuric acid, thus decrease the copper causing printed circuit board to produce because of impurity slightly, shot copper and the risk of copper consent, be greatly promoted the goods of product；And dilute sulfuric acid can be circulated utilization, not only energy-conserving and environment-protective, additionally it is possible to be substantially reduced production cost.
Description
Technical field
The present invention relates to apparatus of producing PCB technical field, particularly relate to copper plating of printed circuit board support board device and
Its using method.
Background technology
In the production process of printed circuit board, need to make via and realize turning on interconnection between layers, via
Making relates to heavy copper and electroplating technology.First, thin in the hole wall deposition one layer of printed circuit board by the method for electroless copper plating
Copper；Secondly, on the basis of former electroless copper plating, electroplate certain thickness copper by electrochemical method, meet relevant copper thickness and want
Ask, it is ensured that excellent electric conductivity.At present, most printed circuit boards are both needed to be positioned over the foster plate filling weak acid solution after heavy copper
In groove, on the one hand in order to neutralize the heavy copper alkaline medicinal liquid of remnants；On the other hand heavy copper coin face is caused in order to prevent from being long placed in air
Oxidation, affects follow-up electroplating quality then.The specification of existing foster board slot is usually the long * a height of 415cm*155cm*85cm of width *,
Making the acid resisting material that board selection thickness is 1cm supporting board slot, the cell body sidewall supporting board slot has a leakage fluid dram, plate to be supported
After adding dilution heat of sulfuric acid in groove, the printed circuit board after heavy copper can be loaded in supporting board slot temporary.
At least there is following defect in this breeding board slot existing: one, after electroless copper plating by printed circuit board together with sub-basket
Placing and support board slot a period of time, owing to heavy copper basket uses stainless steel, time of being placed in foster board slot is longer to be added
On at mobile or placement process neutron basket by External Force Acting, cause copper scale to bring foster board slot into, cause rear operation printed circuit board copper
Slightly, shot copper and the risk of copper consent；Two, the volume supporting board slot is relatively big, and draining, the time that adds water in process of production are the longest,
Easily make printed circuit board that oxidation occurs during changing water, thus empty in causing the Kong Wutong of follow-up printed circuit board and hole
The quality problem in hole；Three, the discharge outlet supporting board slot is placed in cell body sidewall, is easily caused impurity and is detained during changing water.
Summary of the invention
It is an object of the invention to provide a kind of copper plating of printed circuit board and support board device and using method thereof, it is intended to solve existing
The printed circuit board being positioned in foster board slot having technology easily occurs that copper is thick, the technical problem of the risk of shot copper and copper consent etc..
For achieving the above object, the technical scheme is that a kind of copper plating of printed circuit board supports board device, including groove
Body, described cell body is provided with the containing cavity for containing dilute sulfuric acid and upper opening；The bottom of described cell body offers leakage fluid dram, institute
The sidepiece stating cell body offers inlet, is connected and has for accommodating described in circulating filtration between described leakage fluid dram with described inlet
The circulation filter of the described dilute sulfuric acid that intracavity contains.
Preferably, described circulation filter includes filter, one-level settling tank, suction pump, Drainage pipe and feed liquor
Pipeline；
First end of described Drainage pipe connects with described leakage fluid dram, the second end connects with described one-level settling tank, described
Filter is located on described Drainage pipe and for being filtered through the described dilute sulfuric acid of described Drainage pipe；
First end of described input duct connects with described inlet, the second end connects with described one-level settling tank, described
The described dilute sulfuric acid that suction pump is located in described input duct and is filtered for being drawn through described filter enters into described appearance
Put intracavity.
Preferably, described circulation filter also includes that two-stage precipitation case and intermediate conduit, described two-stage precipitation case are located at
The lower section of described one-level settling tank and connecting with described one-level settling tank through described intermediate conduit, the second end of described input duct
Connect with described two-stage precipitation case.
Preferably, described filter includes shell and is located in described shell and dismountable filter element.
Preferably, described filter also includes the strong magnetic piece being located on described filter element.
Preferably, the bottom surface of described cell body along its width from leading section towards the inclined shape of rearward end, and described groove
The angle formed between bottom surface and the horizontal plane of body is 6～10 °；Described leakage fluid dram is positioned at the bottom of described cell body and is in relatively low
On position.
Preferably, the bottom of described cell body is provided with for supporting described cell body to prevent the bottom stress depression of described cell body
The support seat of deformation.
Preferably, it is provided with in described containing cavity and described containing cavity is spaced apart the mutual disconnected storage tank of at least two
Space bar；The bottom of each described storage tank and sidepiece are equipped with described leakage fluid dram and described inlet, and the institute of described storage tank
State leakage fluid dram and described inlet is all connected by a described circulation filter.
Beneficial effects of the present invention: the copper plating of printed circuit board of the present invention supports board device, is filled by the circulating filtration arranged
Putting and connect the leakage fluid dram and inlet offered on cell body, the dilute sulfuric acid of the splendid attire in such containing cavity can be discharged by leakage fluid dram
And dilute sulfuric acid is filtered and recycles by the circulation filter through arranging, thus realize reducing present in dilute sulfuric acid
Impurity, decreases that the copper causing printed circuit board to produce because of impurity is thick, shot copper and the risk of copper consent, is greatly promoted product
Goods；And dilute sulfuric acid can be circulated utilization, not only energy-conserving and environment-protective, additionally it is possible to be substantially reduced production cost.
The present invention another solution is that a kind of above-mentioned copper plating of printed circuit board supports the using method of board device, bag
Include step used below:
S1: adding concentration in described containing cavity is the dilute sulfuric acid of 3%；
S2: soak in the described dilute sulfuric acid contained in the printed circuit board after heavy copper is positioned over described containing cavity；
S3: start circulation filter, and set in described containing cavity contain described dilute sulfuric acid meet circulating load >=
2Ton/H；
S4: take out, at interval of 3～5 hours, the described printed circuit board being soaked in described dilute sulfuric acid, and reappose
Printed circuit board after heavy copper；
S5: be replaced at interval of 24～36 hours described dilute sulfuric acids to containing in described containing cavity.
Further, described circulation filter includes filter element；After described step S5, also include step S6: every
Every 72～96 hours, described filter element is replaced.
The copper plating of printed circuit board of the present invention supports the using method of board device, in this using method, passes through circulating filtration
Device can periodically remove impurity present in the dilute sulfuric acid being contained in containing cavity, and to completing the dilute sulfuric acid that impurity is removed
It is circulated recycling, so can effectively reduce that the copper causing printed circuit board to produce because of impurity is thick, shot copper and copper plug
The risk in hole, is greatly promoted the goods of product；And recycle dilute sulfuric acid, not only energy-conserving and environment-protective, additionally it is possible to be substantially reduced production
Cost.
Accompanying drawing explanation
Fig. 1 supports the structural representation of board device for the copper plating of printed circuit board that the embodiment of the present invention provides.
Fig. 2 supports the first reality of the circulation filter of board device for the copper plating of printed circuit board that the embodiment of the present invention provides
Execute the structural representation of mode.
The second that Fig. 3 supports the circulation filter of board device for the copper plating of printed circuit board that the embodiment of the present invention provides is real
Execute the structural representation of mode.
Fig. 4 supports the flow chart of the using method of board device for the copper plating of printed circuit board that the embodiment of the present invention provides.
Reference includes:
10 cell body 11 containing cavity 12 leakage fluid drams
13 inlet 14 leading section 15 rearward end
20 circulation filter 21 filter 22 one-level settling tanks
23 suction pump 24 Drainage pipe 25 input duct
26 two-stage precipitation case 27 intermediate conduit 30 support seat
40 space bar 211 shell 212 filter elements
213 strong magnetic pieces.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that Fig. 1～4 describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention, it is to be understood that term " length ", " width ", " on ", D score, "front", "rear",
The orientation of the instruction such as "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward " or position relationship are for based on accompanying drawing institute
The orientation shown or position relationship, be for only for ease of and describe the present invention and simplify description rather than instruction or the dress of hint indication
Put or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limit to the present invention
System.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In describing the invention, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be that machinery connects
Connect, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, in can being two elements
The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, can be according to concrete feelings
Condition understands above-mentioned term concrete meaning in the present invention.
As shown in Figure 1 to Figure 3, a kind of copper plating of printed circuit board that the embodiment of the present invention provides supports board device, including cell body
10, described cell body 10 is provided with the containing cavity 11 for containing dilute sulfuric acid and upper opening；The bottom of described cell body 10 offers row
Liquid mouth 12, the sidepiece of described cell body 10 offers inlet 13, is connected useful between described leakage fluid dram 12 with described inlet 13
The circulation filter 20 of the described dilute sulfuric acid contained in containing cavity described in circulating filtration 11.
Concrete, the copper plating of printed circuit board of the embodiment of the present invention supports board device, by the circulation filter 20 arranged
Connecting the leakage fluid dram 12 and inlet 13 offered on cell body 10, the dilute sulfuric acid of the splendid attire in such containing cavity 11 can pass through discharge opeing
Mouthfuls 12 discharge and pass through the circulation filter 20 of setting filters dilute sulfuric acid and recycles, thus realizes reducing dilute sulfur
Impurity present in acid, decreases that the copper causing printed circuit board to produce because of impurity is thick, shot copper and the risk of copper consent, significantly
The goods of improving product；And dilute sulfuric acid can be circulated utilization, not only energy-conserving and environment-protective, additionally it is possible to be substantially reduced and produce into
This.
Further, leakage fluid dram 12 is arranged on the bottom of cell body 10, is so carrying out dilute sulfuric acid discharge opeing circular filtration type, heavy
The impurity such as the copper scale on the bottom of cell body 10 that form sediment can be discharged by this leakage fluid dram 12 substantially, reduces at cell body 10 as far as possible
Bottom in be detained impurity level such that it is able to promote dilute sulfuric acid degree of purity.
The copper plating of printed circuit board of the embodiment of the present invention supports board device, it is possible to effectively will be because printed circuit board is at dilute sulfuric acid
Immersion process in the copper scale that produces or the impurity that enters into dilute sulfuric acid from the external world because containing cavity 11 has opening enter
Row is removed, and this makes it possible to avoid because the attachment of such impurity causes printed circuit board to go out in rear operation on a printed circuit board
Existing copper is thick, shot copper and the problem of copper consent, so, can be greatly promoted printed circuit board quality after dilute sulfuric acid soaks.
As shown in Figure 1 to Figure 2, in the present embodiment, described circulation filter 20 includes filter 21, one-level settling tank
22, suction pump 23, Drainage pipe 24 and input duct 25；First end of described Drainage pipe 24 is with described leakage fluid dram 12 even
Logical, the second end connects with described one-level settling tank 22, and described filter 21 is located on described Drainage pipe 24 and for filtering warp
Cross the described dilute sulfuric acid of described Drainage pipe 24；First end of described input duct 25 connects with described inlet 13, the second end
Connecting with described one-level settling tank 22, described suction pump 23 is located in described input duct 25 and for being drawn through described filtration
The described dilute sulfuric acid that device 21 filters enters in described containing cavity 11.Concrete, circulation filter 20 is so work: dilute
The leakage fluid dram 12 that sulphuric acid is offered from the bottom being located at cell body 10 enters in Drainage pipe 24, and then dilute sulfuric acid enters into filter 21
Inside filtering, the dilute sulfuric acid through filtering continues to be drained into one-level settling tank 22, then suction pump 23 work from Drainage pipe 24
Make, to aspirating through the dilute sulfuric acid filtered in one-level settling tank 22, to enter the containing cavity of cell body 10 through input duct 25
In 11, the most i.e. dilute sulfuric acid is completed the circulating filtration of single.Through circulation filter 20, dilute sulfuric acid is filtered, a side
Other impurity such as the copper scale that is present in dilute sulfuric acid can be effectively removed in face；On the other hand, the dilute sulfuric acid completing to filter can be again
Secondary recycle, reduce the material cost using dilute sulfuric acid.
It should be noted that the effect of one-level settling tank 22 is can to sink the dilute sulfuric acid completing to filter further
Form sediment, if so there is also trickleer impurity in one-level settling tank 22, it is also possible to reduce it by precipitation and go successively to
Probability in containing cavity 11, it is possible to promote the quality to the dilute sulfuric acid that filtration cycle uses further.
As shown in figures 1 and 3, in the present embodiment, further, described circulation filter 20 also includes two-stage precipitation case
26 and intermediate conduit 27, described two-stage precipitation case 26 be located at described one-level settling tank 22 lower section and through described intermediate conduit 27 with
Described one-level settling tank 22 connects, and the second end of described input duct 25 connects with described two-stage precipitation case 26.Concrete, due to
The lower section being in one-level settling tank 22 is located at by two-stage precipitation case 26, and connected with one-level settling tank 22 by intermediate conduit 27, this
Sample, after the dilute sulfuric acid in one-level settling tank 22 completes to precipitate for the first time, can flow into two-stage precipitation case through intermediate conduit 27
Secondary precipitation is carried out, so through for the first time and can more enter after the precipitation of the second time dilute sulfuric acid to completing filtration in 26
Will be present in one step the contamination precipitations such as the copper scale in dilute sulfuric acid to go out, there is copper scale in the dilute sulfuric acid of maximized minimizing Recycling
Deng impurity.So, can substantially completely avoid because the attachment of such impurity causes printed circuit board on a printed circuit board
Occur that copper is thick in rear operation, shot copper and the problem of copper consent.
Wherein, above-mentioned one-level settling tank 22 and the effect of two-stage precipitation case 26 are to be in one-level settling tank for precipitation
22 and two-stage precipitation case 26 in dilute sulfuric acid present in the impurity of copper scale etc., the impurity after it precipitates can isolate,
And be prevented from its again pass by pipeline flow out, therefore, in conjunction with one-level settling tank 22 and twice precipitation energy of two-stage precipitation case 26
Enough it is greatly promoted the quality of the dilute sulfuric acid that filtration cycle uses.
Drainage pipe 24, input duct 25 and intermediate conduit 27 in the present embodiment all use acid proof material manufacture and
Become, the corrosion of dilute sulfuric acid so can be avoided to cause damage.
As shown in Figure 2 to Figure 3, in the present embodiment, described filter 21 includes shell 211 and is located at described shell 211
Interior and dismountable filter element 212.Concrete, dilute sulfuric acid filters through filtration core 212 such that it is able to removes and is present in dilute sulfuric acid
In the impurity such as copper scale.Wherein, it is the detachable structure installed design between filter element 212 and shell 211, so can facilitate clear
Except filtering residue present on filter element 212 or filter element 212 is replaced, facilitates maintenance and the maintenance in later stage, reasonable in design,
Practical.
As shown in Figure 2 to Figure 3, in the present embodiment, described filter 21 also includes the strong magnetic piece being located on described filter element 212
213.Concrete, strong magnetic piece 213 can have magnetic metal impurities by strong magnetic-adsorption, so, it is also possible to the most clear
Except the metal impurities being present in dilute sulfuric acid, the quality to the dilute sulfuric acid used through filtration cycle further.
As it is shown in figure 1, in the present embodiment, the bottom surface of described cell body 10 along its width from leading section 14 towards rearward end
15 inclined shapes, and between the bottom surface of described cell body 10 and horizontal plane, the angle of formation is 6～10 °；Described leakage fluid dram 12 is positioned at
The bottom of described cell body 10 is on relatively low position.Concrete, the skewed structure design of the bottom surface of cell body 10, Ke Yifang
Just the dilute sulfuric acid in containing cavity 11 is the most sharp because gravity carries out filtration cycle in leakage fluid dram 12 is expelled to circulation filter 20
With.Meanwhile, it is also beneficial to exist and together drains into circulation filter facing to dilute sulfuric acid through leakage fluid dram 12 with the impurity in dilute sulfuric acid
Filter in 20.It addition, between the bottom surface of cell body 10 and horizontal plane formed angle be specifically as follows 6 °, 7 °, 8 °, 9 ° or
10 °, it is preferable that the angle formed between bottom surface and the horizontal plane of cell body 10 is 8 °.The structure design of this kind of gradient both can have
It is beneficial to dilute sulfuric acid flowing and flows out from leakage fluid dram 12, it is also possible to avoiding causing the local location of containing cavity 11 because the gradient is too big
The degree of depth not affect the immersion to printed circuit board.
As it is shown in figure 1, in the present embodiment, the bottom of described cell body 10 is provided with for supporting described cell body 10 described to prevent
The support seat 30 of the bottom stress Dish deformation of cell body 10.Concrete, when being loaded with dilute sulfuric acid and being soaked in containing cavity 11
During printed circuit board in dilute sulfuric acid, the bottom of cell body 10 can be imposed severe pressure by dilute sulfuric acid and printed circuit board, arranges
The bottom of cell body 10 can be supported by the support seat 30 in the bottom of cell body 10, it is to avoid the bottom of cell body 10 is because being pressed
Power and cause that Dish deformation occurs, even occur perforation phenomenon.So, can promote cell body 10 stability in use and
Reliability, it is to avoid the thunder bolt that dilute sulfuric acid leaks occurs, it is ensured that production safety is carried out.
As it is shown in figure 1, in the present embodiment, be provided with in described containing cavity 11 and described containing cavity 11 be spaced apart at least two phase
The space bar 40 of mutual disconnected storage tank (not shown)；The bottom of each described storage tank and sidepiece are equipped with described leakage fluid dram 12
With described inlet 13, and the described leakage fluid dram 12 of described storage tank and described inlet 13 are all by a described circulating filtration
Device 20 connects.Concrete, the containing cavity 11 of large volume can be at least divided into the accommodating of two less volumes by space bar 40
Groove, the amount so adding the dilute sulfuric acid in single storage tank to reduces, and speed promotes, and enters the dilute sulfuric acid in single storage tank
Row is changed or discharges the speed recycled the most faster, it is possible to be greatly promoted production efficiency.And specifically it is being replaced dilute sulfur
During acid, being at least able to ensure that another one storage tank can normally use, the working time is uninterrupted continuously, promotes product further
Come into force rate.
Further, space bar 40 can include more than two pieces, so by space bar 40 containing cavity 11 spaced apart just
It is formed with at least three storage tank, is set as the case may be.
As shown in Figure 4, the embodiment of the present invention additionally provides a kind of above-mentioned copper plating of printed circuit board and supports the use of board device
Method, including step used below:
S1: adding concentration in described containing cavity 11 is the dilute sulfuric acid of 3%；
S2: soak in the described dilute sulfuric acid contained in the printed circuit board after heavy copper is positioned over described containing cavity 11；
S3: start circulation filter 20, and set circulation satisfied to the described dilute sulfuric acid contained in described containing cavity 11
Amount >=2Ton/H；
S4: take out, at interval of 3～5 hours, the described printed circuit board being soaked in described dilute sulfuric acid, and reappose
Printed circuit board after heavy copper；
S5: be replaced at interval of 24～36 hours described dilute sulfuric acids to containing in described containing cavity 11.
The copper plating of printed circuit board of the embodiment of the present invention supports the using method of board device, in this using method, by following
Impurity present in the dilute sulfuric acid being contained in containing cavity 11 can periodically be removed by ring defecator 20, and clear to completing impurity
The dilute sulfuric acid removed is circulated recycling, so can effectively reduce the copper causing printed circuit board to produce because of impurity thick,
Shot copper and the risk of copper consent, be greatly promoted the goods of product；And recycle dilute sulfuric acid, not only energy-conserving and environment-protective, additionally it is possible to big
Reduce greatly production cost.
Concrete, in step S1, add in containing cavity 11 in the degree of depth of the dilute sulfuric acid that concentration is 3% and containing cavity 11
Deep depth ratio is 2/3～3/4, and in other words, the ratio spending the degree the most deeply with containing cavity 11 the most deeply of dilute sulfuric acid can be
2/3,17/24 or 3/4, the design of this ratio can avoid the amount of dilute sulfuric acid too greatly because overflowing immersed with printed circuit board
Go out outside containing cavity 11；Can also ensure that the amount of dilute sulfuric acid is abundant to meet the single immersion to the quantity of printed circuit board.
In step S2, can by by polylith printed circuit panel assembly in sub-basket, be then placed in the lump together with sub-basket
Dilute sulfuric acid soaks, the most not only facilitates and polylith printed circuit board is placed in dilute sulfuric acid, and convenient by polylith printing electricity
Road plate takes out from dilute sulfuric acid.
In step S3, the circulation filter of startup 20 meet the circulating load to dilute sulfuric acid can be 2Ton/H, 3Ton/H,
4Ton/H, 5Ton/H or more than 6Ton/H；Preferably, the satisfied circulating load to dilute sulfuric acid of circulation filter 20 of startup is
2Ton/H, 3Ton/H and 4Ton/H are optimal, are so able to ensure that and effectively filter dilute sulfuric acid in one hour in unit
Cycling and reutilization, also avoids because too greatly the filtration frequencies of dilute sulfuric acid is affected the immersion efficiency to printed circuit board and matter
Amount.
In step S4, single is opposite to the soak time of the dilute sulfuric acid in containing cavity 11 and meets 3～i.e. complete for 5 hours,
Such as, soak time can be 3 hours, 4 hours or 5 hours；Then a collection of the printing after heavy copper is completed by new
Circuit board is placed in the dilute sulfuric acid in containing cavity 11 immersion again, and so circulation operates.
In step S5, it is replaced at interval of 24～36 hours described dilute sulfuric acids to containing in described containing cavity 11；
Concrete, can be i.e. the dilute sulfuric acid in containing cavity 11 to be replaced every 24 hours, 30 hours or 36 hours,
Thus being avoided that causes it acid to decline thus affect printed circuit board because the number of times of dilute sulfuric acid cycling and reutilization arrive too much
Soak effect.
As shown in figs. 2 to 4, further, described circulation filter 20 includes filter element 212；After described step S5,
Also include step S6: at interval of 72～96 hours, described filter element 212 is replaced；Concrete, the replacing construction of filter element 212
Can be 72 hours, 84 hours or 96 hours, within this interval time, the filter element 212 of circulation filter 20 is entered
Row is changed, and filter element 212 can be avoided to affect dilute sulfur because of the existence of filtering residue after being in filtration duty a period of time
The filter effect of acid, that is to say and may insure that the quality filtering dilute sulfuric acid.
Understanding the present invention in sum is to have above-described good characteristic, is made it on using, promotes in the past
The usefulness that do not has in technology and there is practicality, become the product of a great practical value.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all think ofs in the present invention
Want with principle within any amendment, equivalent or the improvement etc. made, should be included within the scope of the present invention.
Claims (10)
1. copper plating of printed circuit board supports a board device, and including cell body, described cell body is provided with and opens for containing dilute sulfuric acid and top
The containing cavity of mouth；It is characterized in that, the bottom of described cell body offers leakage fluid dram, and the sidepiece of described cell body offers inlet,
It is connected between described leakage fluid dram with described inlet and has following of the described dilute sulfuric acid contained in containing cavity described in circulating filtration
Ring defecator.
Copper plating of printed circuit board the most according to claim 1 supports board device, it is characterised in that described circulation filter bag
Include filter, one-level settling tank, suction pump, Drainage pipe and input duct；
First end of described Drainage pipe connects with described leakage fluid dram, the second end connects with described one-level settling tank, described filtration
Device is located on described Drainage pipe and for being filtered through the described dilute sulfuric acid of described Drainage pipe；
First end of described input duct connects with described inlet, the second end connects with described one-level settling tank, described suction
The described dilute sulfuric acid that pump is located in described input duct and is filtered for being drawn through described filter enters into described containing cavity
In.
Copper plating of printed circuit board the most according to claim 2 supports board device, it is characterised in that described circulation filter is also
Including two-stage precipitation case and intermediate conduit, described two-stage precipitation case is located at the lower section of described one-level settling tank and through described intervalve
Road connects with described one-level settling tank, and the second end of described input duct connects with described two-stage precipitation case.
Copper plating of printed circuit board the most according to claim 2 supports board device, it is characterised in that described filter includes shell
And be located in described shell and dismountable filter element.
Copper plating of printed circuit board the most according to claim 4 supports board device, it is characterised in that described filter also includes setting
Strong magnetic piece on described filter element.
6. support board device according to the copper plating of printed circuit board described in any one of Claims 1 to 5, it is characterised in that described cell body
Bottom surface along its width from leading section towards the inclined shape of rearward end, and between the bottom surface of described cell body and horizontal plane formed
Angle be 6～10 °；Described leakage fluid dram is positioned at the bottom of described cell body and is on relatively low position.
7. support board device according to the copper plating of printed circuit board described in any one of Claims 1 to 5, it is characterised in that described cell body
Bottom be provided with for supporting described cell body to prevent the support seat of the bottom stress Dish deformation of described cell body.
8. support board device according to the copper plating of printed circuit board described in any one of Claims 1 to 5, it is characterised in that described accommodating
Intracavity is provided with the space bar that described containing cavity is spaced apart the mutual disconnected storage tank of at least two；The end of each described storage tank
Portion and sidepiece are equipped with described leakage fluid dram and described inlet, and the described leakage fluid dram of described storage tank and described inlet the most logical
Cross a described circulation filter to connect.
9. the copper plating of printed circuit board described in any one of claim 1～8 supports a using method for board device, and its feature exists
In, including step used below:
S1: adding concentration in described containing cavity is the dilute sulfuric acid of 3%；
S2: soak in the described dilute sulfuric acid contained in the printed circuit board after heavy copper is positioned over described containing cavity；
S3: start circulation filter, and set in described containing cavity contain described dilute sulfuric acid meet circulating load >=2Ton/
H；
S4: take out, at interval of 3～5 hours, the described printed circuit board being soaked in described dilute sulfuric acid, and reappose heavy copper
After printed circuit board；
S5: be replaced at interval of 24～36 hours described dilute sulfuric acids to containing in described containing cavity.
Copper plating of printed circuit board the most according to claim 9 supports the using method of board device, it is characterised in that described in follow
Ring defecator includes filter element；After described step S5, also include step S6: at interval of 72～96 hours to described filter element
It is replaced.
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| CN201610649639.1A CN106211585A (en) | 2016-08-09 | 2016-08-09 | Copper plating of printed circuit board supports board device and using method thereof |
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| CN201610649639.1A CN106211585A (en) | 2016-08-09 | 2016-08-09 | Copper plating of printed circuit board supports board device and using method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140186651A1 (en) * | 2012-12-28 | 2014-07-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having copper plated layer with roughness and method of manufacturing the same |
| CN104202909A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | High-thermal-conductivity metal circuit board production method |
| CN205171009U (en) * | 2015-11-30 | 2016-04-20 | 北大方正集团有限公司 | Medicine water circle device and have device's heavy copper system, electroplating system |
-
2016
- 2016-08-09 CN CN201610649639.1A patent/CN106211585A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140186651A1 (en) * | 2012-12-28 | 2014-07-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having copper plated layer with roughness and method of manufacturing the same |
| CN104202909A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | High-thermal-conductivity metal circuit board production method |
| CN205171009U (en) * | 2015-11-30 | 2016-04-20 | 北大方正集团有限公司 | Medicine water circle device and have device's heavy copper system, electroplating system |
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Application publication date: 20161207 |