CN106209133A - A kind of novel ultra-audio circuit chip and novel ultra-audio circuit - Google Patents
A kind of novel ultra-audio circuit chip and novel ultra-audio circuit Download PDFInfo
- Publication number
- CN106209133A CN106209133A CN201610790005.8A CN201610790005A CN106209133A CN 106209133 A CN106209133 A CN 106209133A CN 201610790005 A CN201610790005 A CN 201610790005A CN 106209133 A CN106209133 A CN 106209133A
- Authority
- CN
- China
- Prior art keywords
- audio circuit
- chip body
- novel ultra
- electric capacity
- inductance coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
Abstract
The present invention relates to a kind of novel ultra-audio circuit chip, including chip body, in chip body, be etched with the mutually different electric capacity of multiple capacitance.The invention still further relates to a kind of novel ultra-audio circuit, including chip body and inductance coil, the mutually different electric capacity of multiple capacitance it is etched with in chip body, inductance coil is connected with the input of chip body, and the inductance value of inductance coil is fixed value, one of them electric capacity in multiple electric capacity can be connected by the way of burning by chip body with inductance coil, to realize the frequency coupling of novel ultra-audio circuit.The novel ultra-audio circuit of the present invention, utilizes the multiple electric capacity coupling that chip body is built-in, can preferably regulating frequency mate, controllable impedance is changed common chip inductor into, it is possible to reduce components and parts cost, can direct machine operation, decrease processing cost, make product more competitive superiority.
Description
Technical field
The present invention relates to a kind of circuit chip, particularly relate to a kind of novel ultra-audio circuit chip and a kind of novel super again
Raw circuit.
Background technology
The most wireless product more and more, from little to remote controlled lantern greatly to telecontrolled aircraft, for wireless receiving
The demand of chip increasing, therefore the cost price of chip becomes the key factor of one production development of restriction.Passing
In the superregenerative circuit of system, have a controllable impedance and electric capacity, for regulating the frequency coupling of superregenerative module, and this
Inductance in process of production, is all by manual adjustment, and production efficiency is low, easily makes mistakes, and adds certain one-tenth to product undoubtedly
This.
Because above-mentioned defect, the design people, the most in addition research and innovation, to founding the novel of a kind of new structure
Ultra-audio circuit chip and novel ultra-audio circuit.
Summary of the invention
For solving above-mentioned technical problem, it is an object of the invention to provide one and make ultra-audio circuit without manual adjustment electricity
Sense i.e. can reach the novel ultra-audio circuit chip of frequency coupling.Additionally, the present invention also provides for a kind of without manual adjustment frequency
Rate coupling, production efficiency are high, the novel ultra-audio circuit of low cost.
The novel ultra-audio circuit chip of the present invention, including chip body, is etched with multiple electricity in described chip body
The mutually different electric capacity of capacitance.
The novel ultra-audio circuit of the present invention, including chip body and inductance coil, is etched with many in described chip body
The mutually different electric capacity of individual capacitance, described inductance coil is connected with the input of chip body, and the inductance of inductance coil
Value is fixed value, and described chip body can be by one of them electric capacity in multiple electric capacity and described inductance by the way of burning
Coil connects, to realize the frequency coupling of novel ultra-audio circuit.
By such scheme, the present invention at least has the advantage that the novel ultra-audio circuit chip of the present invention, chip
The built-in multiple electric capacity of body mates with the inductance coil with fixed inductance, and external circuit is no longer necessary to controllable impedance, passes through
When dispatching from the factory, different capacitance couplings is done burning, i.e. realize the frequency coupling of novel ultra-audio circuit.Thus improve production
Efficiency, it is provided that the quality of product, can preferably be applicable to wireless remote control market.Additionally, the novel superregenerative electricity of the present invention
Road, utilizes the multiple electric capacity coupling that chip body is built-in, preferably regulating frequency can mate, controllable impedance changes into common patch
Sheet inductance, it is possible to reduce components and parts cost, can direct machine operation, decrease processing cost, make product more competitive superiority.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Accompanying drawing explanation
Fig. 1 is the circuit theory diagrams of the novel ultra-audio circuit of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is described in further detail.Hereinafter implement
Example is used for illustrating the present invention, but is not limited to the scope of the present invention.
See Fig. 1, a kind of novel ultra-audio circuit chip of a preferred embodiment of the present invention, including chip body U1,
The mutually different electric capacity of multiple capacitance it is etched with in described chip body.
The novel ultra-audio circuit of the present invention, including etching in chip body U1 and inductance coil L1, described chip body
Having the mutually different electric capacity of multiple capacitance, described inductance coil is connected with the input of chip body, and inductance coil
Inductance value is fixed value, described chip body can by the way of burning by one of them electric capacity in multiple electric capacity with described
Inductance coil connects, to realize the frequency coupling of novel ultra-audio circuit.
In traditional circuit, inductance coil L1 is controllable impedance, in process of production, needs manual adjustment L1 controllable impedance,
Owing to cost of labor is high, and easily make mistakes so that product relatively costly.In novel ultra-audio circuit, L1 inductance is changed into general
Logical chip inductor, it is possible to reduce components and parts cost, can direct machine operation, decrease processing cost.Utilize the present invention's
Novel ultra-audio circuit chip, the built-in multiple electric capacity of chip body mates, and can preferably regulating frequency mate.
Below it is only the preferred embodiment of the present invention, is not limited to the present invention, it is noted that this technology is led
For the those of ordinary skill in territory, on the premise of without departing from the technology of the present invention principle, it is also possible to make some improvement and modification,
These improve and modification also should be regarded as protection scope of the present invention.
Claims (2)
1. a novel ultra-audio circuit chip, including chip body, it is characterised in that: it is etched with many in described chip body
The mutually different electric capacity of individual capacitance.
2. a novel ultra-audio circuit, it is characterised in that: include chip body and inductance coil, etching in described chip body
Having the mutually different electric capacity of multiple capacitance, described inductance coil is connected with the input of chip body, and inductance coil
Inductance value is fixed value, described chip body can by the way of burning by one of them electric capacity in multiple electric capacity with described
Inductance coil connects, to realize the frequency coupling of novel ultra-audio circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790005.8A CN106209133A (en) | 2016-08-31 | 2016-08-31 | A kind of novel ultra-audio circuit chip and novel ultra-audio circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790005.8A CN106209133A (en) | 2016-08-31 | 2016-08-31 | A kind of novel ultra-audio circuit chip and novel ultra-audio circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106209133A true CN106209133A (en) | 2016-12-07 |
Family
ID=58085437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610790005.8A Pending CN106209133A (en) | 2016-08-31 | 2016-08-31 | A kind of novel ultra-audio circuit chip and novel ultra-audio circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106209133A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120088A (en) * | 1992-09-30 | 1994-04-28 | Nichicon Corp | Chip-type solid-state electrolytic capacitor |
| US6430028B1 (en) * | 2000-11-22 | 2002-08-06 | Newport Fab, Llc | Method for fabrication of an MIM capacitor and related structure |
| CN101005289A (en) * | 2005-12-14 | 2007-07-25 | 三星电子株式会社 | Apparatus for automatically matching frequency of antenna in wireless terminal and method of using the same |
| CN102647810A (en) * | 2011-02-19 | 2012-08-22 | 上海祯显电子科技有限公司 | Converter for smart card |
| CN103337717A (en) * | 2013-06-25 | 2013-10-02 | 华为技术有限公司 | Antenna impedance matching device, semi-conductor chip and antenna impedance matching method |
| CN204795021U (en) * | 2015-07-06 | 2015-11-18 | 济南普赛通信技术有限公司 | Interchangeable wireless device of impedance match module |
-
2016
- 2016-08-31 CN CN201610790005.8A patent/CN106209133A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120088A (en) * | 1992-09-30 | 1994-04-28 | Nichicon Corp | Chip-type solid-state electrolytic capacitor |
| US6430028B1 (en) * | 2000-11-22 | 2002-08-06 | Newport Fab, Llc | Method for fabrication of an MIM capacitor and related structure |
| CN101005289A (en) * | 2005-12-14 | 2007-07-25 | 三星电子株式会社 | Apparatus for automatically matching frequency of antenna in wireless terminal and method of using the same |
| CN102647810A (en) * | 2011-02-19 | 2012-08-22 | 上海祯显电子科技有限公司 | Converter for smart card |
| CN103337717A (en) * | 2013-06-25 | 2013-10-02 | 华为技术有限公司 | Antenna impedance matching device, semi-conductor chip and antenna impedance matching method |
| CN204795021U (en) * | 2015-07-06 | 2015-11-18 | 济南普赛通信技术有限公司 | Interchangeable wireless device of impedance match module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |
|
| RJ01 | Rejection of invention patent application after publication |