CN106182470A - Step-by-step movement cutter sweep - Google Patents

Step-by-step movement cutter sweep Download PDF

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Publication number
CN106182470A
CN106182470A CN201610535432.1A CN201610535432A CN106182470A CN 106182470 A CN106182470 A CN 106182470A CN 201610535432 A CN201610535432 A CN 201610535432A CN 106182470 A CN106182470 A CN 106182470A
Authority
CN
China
Prior art keywords
diamond wire
frame
base
support bar
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610535432.1A
Other languages
Chinese (zh)
Other versions
CN106182470B (en
Inventor
梅秀春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Yimei Molding Co Ltd
Original Assignee
Chongqing Yimei Molding Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Yimei Molding Co Ltd filed Critical Chongqing Yimei Molding Co Ltd
Priority to CN201610535432.1A priority Critical patent/CN106182470B/en
Publication of CN106182470A publication Critical patent/CN106182470A/en
Application granted granted Critical
Publication of CN106182470B publication Critical patent/CN106182470B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention discloses a kind of step-by-step movement cutter sweep, including frame and diamond wire, frame is provided with relative drive roll and driven voller, diamond wire is wound between drive roll and driven voller, base is slidably connected in frame, fixing bar it is fixedly connected with on base, drive roll is rotatably connected on the top of fixing bar, support bar is slidably connected on base, driven voller is arranged on the top of support bar, connect on support bar and have tooth bar, tooth bar is engaged with gear, pinion rotation is connected in frame, rotating disk it is rotatably connected in frame, connecting rod it is hinged with on rotating disk, base is along the side of glide direction and rod hinge connection, diamond wire is arranged over chela, chela connects push rod, pusher slide is automatically connected in frame;By gear and the cooperation of tooth bar, the rate of tension of conveniently adjusted diamond wire, rotating disk and the setting of connecting rod, diamond wire can be made to move back and forth simultaneously and high-speed rotation, so that diamond wire is easier to cutting polysilicon, thus improve cutting efficiency.

Description

Step-by-step movement cutter sweep
Technical field
The present invention relates to a kind of cutter sweep, relate to a kind of step-by-step movement cutter sweep.
Background technology
Industrial many thing diamond wires cut, the polysilicon section of such as photovoltaic art.The material of diamond wire Material is critically important.The silicon chip line of cut for photovoltaic art of main flow is hyperfine cutting steel wire at present, and diameter is about 100 Micron.Diamond wire as its name suggests, with diamond is relevant, is generally that the molecule of diamond is inlayed on line, makes Diamond cutting secant;It is known that diamond is superhard, the cutting material having many uses, it is micro-that diamond wire is provided with diamond The sawtooth of type, adds the cutting power of steel wire, can greatly speed up cutting speed.
When using line of cut cutting polysilicon, it is first diamond wire to be fixed on reciprocating-type cutting device, reciprocating cutting Device includes frame, and frame is fixed with two rollers, a drive roll and a driven roll, and connecting between two rollers has Buddha's warrior attendant Line, diamond wire is tensioned on drive roll and driven roll, and driven roll drives diamond wire to realize rotating by drive roll.
The problem that apparatus above exists is: 1, when installing diamond wire, because two roll spacings are from non-adjustable, cannot protect The diamond wire that card is installed is in higher rate of tension;2, because Zhang Jindu cannot be ensured, and when diamond wire cutting polysilicon, gold Just line cutting dynamics also cannot ensure, thus can lengthen clipping time, affects cutting efficiency.
Summary of the invention
The invention is intended to a kind of rate of tension improving diamond wire is provided and the step-by-step movement cutting dress of cutting efficiency can be improved Put.
Step-by-step movement cutter sweep in this programme, including frame and diamond wire, frame be provided with relative drive roll and from Action roller, diamond wire is wound between drive roll and driven voller, and frame slidably connects base, base is fixedly connected with fixing Bar, drive roll is rotatably connected on the top of fixing bar, and base slidably connects support bar, and driven voller is arranged on the top of support bar Portion, the glide direction of base and the glide direction of support bar are mutually perpendicular to, and support bar connects has tooth bar, tooth bar to be engaged with tooth Wheel, pinion rotation is connected in frame, and frame is rotatably connected to rotating disk, and rotating disk is hinged with connecting rod, and base is along slip side To side and rod hinge connection, diamond wire is arranged over chela, and chela connects has push rod, pusher slide to be automatically connected in frame.
The know-why of this programme is: when needs cutting polysilicon chip, be clamped on chela by polysilicon;Rotate actively Roller, drive roll drives driven voller by diamond wire, and diamond wire is in high-speed rotation state, swing pinion, gear driven support bar Motion, first makes support bar to the direction motion near fixing bar, is then arranged between support bar and fixing bar by diamond wire, then Making support bar move to the direction away from fixing bar, make diamond wire tighten, use push rod to promote chela to move downward, chela drives Polysilicon moves downward, and makes polysilicon move to the side of diamond wire, rotates rotating disk, driven by rotary disc connecting rod swing, and connecting rod will Driving base reciprocally to slide, base will drive support bar and fixing bar to slide, and support bar and fixing bar drive diamond wire reciprocal Ground motion, diamond wire moves back and forth and forms mated condition with high-speed rotation, controls push rod simultaneously and promote polysilicon, Buddha's warrior attendant constantly Line cuts polysilicon the most sustainably.
Compared with prior art, the advantage of this programme is: 1, by gear and the cooperation of tooth bar, can facilitate tearing open of diamond wire Unload and install, it is possible to the convenient rate of tension regulating diamond wire, support bar and fixing bar are located remotely from each other and will make the rate of tension of diamond wire Improve;2, after the rate of tension of diamond wire improves, the cutting dynamics of diamond wire can ensure that, driven by rotary disc link lever high-speed swings, even Bar will drive base reciprocally height to slide, and diamond wire moves back and forth and coordinates with high-speed rotation, and diamond wire can be made to be easier to cutting Polysilicon, thus improve cutting efficiency.
Further, gear connects the first motor, and rotating disk connects the second motor, and push rod connects cylinder.Start first Motor, the second motor and cylinder, whole device can be achieved to automated operation.
Further, between support bar and fixing bar, connection has spring.The setting of spring, when support bar is to away from fixing bar Time moving and make diamond wire be in higher rate of tension in direction, spring will strain support bar and fixing bar so that support bar is with solid The stability of fixed pole is more preferable, and can ensure stability when diamond wire cuts.
Further, the first motor and the second motor are motor.Motor more preferably controls, and can make gear and rotating disk Rotational angle more easy to control.
Accompanying drawing explanation
Fig. 1 is the structural representation of step-by-step movement cutter sweep embodiment of the present invention.
Detailed description of the invention
Below by detailed description of the invention, the present invention is further detailed explanation:
Reference in Figure of description includes: frame 1, base 2, fixing bar 3, connecting rod 4, diamond wire 5, chela 6, cylinder 7, Rotating disk 8, spring 9, tooth bar 10, gear 11, drive roll 12, driven voller 13.
Embodiment is basic with reference to shown in Fig. 1: step-by-step movement cutter sweep, including frame 1 and diamond wire 5, frame 1 is provided with phase To drive roll 12 and driven voller 13, diamond wire 5 is wound between drive roll 12 and driven voller 13, drive roll 12 connect have the 3rd Motor, frame 1 connects and has the base 2 of slide anteroposterior, and the left side of base 2 connects fixing bar 3, and drive roll 12 rotates even Being connected on the top of fixing bar 3, connecting on the right side of base 2 has the support bar horizontally slipped, driven voller 13 to be arranged on the top of support bar, Connecting between support bar and fixing bar 3 and have spring 9, on the right side of support bar, upper connection has tooth bar 10, tooth bar 10 to be slidably connected at frame 1 On, tooth bar 10 is engaged with gear 11, and gear 11 is rotatably connected in frame 1, and gear 11 connects the first motor, frame 1 Upper front side is rotatably connected to rotating disk 8, and rotating disk 8 connects the second motor, and rotating disk 8 is hinged with connecting rod 4, and connecting rod 4 is hinged on The front side of base 2, diamond wire 5 is arranged over chela 6, and chela 6 connects push rod, and push rod connects has cylinder 7, cylinder 7 to be fixed on In frame.
When needs cutting polysilicon chip, polysilicon is clamped on chela 6;Start the 3rd motor, rotate actively Roller 12, drive roll 12 drives driven voller 13 by diamond wire, and diamond wire 5 is in high-speed rotation state, starts the first motor, Gear 11 rotates, and gear 11 drives support bar to move, and first makes support bar to left movement, then diamond wire 5 is arranged on support bar And between fixing bar 3, then make support bar move right, and make diamond wire 5 tighten, spring 9 is in extended state, starts cylinder 7, makes Promoting chela 6 to move downward with push rod, chela 6 drives polysilicon to move downward, and before making polysilicon move to diamond wire 5 Side, starts the second motor, and rotating disk 8 rotates, and rotating disk 8 drivening rod 4 swings, and drive base 2 is reciprocally slided by connecting rod 4, Drive support bar and fixing bar 3 are slided by base 2, and support bar and fixing bar 3 drive diamond wire 5 reciprocally to move, and diamond wire 5 is past Multiple motion coordinates cutting with high-speed rotation, then uses cylinder 7 to control push rod and promotes polysilicon, diamond wire 5 just can hold constantly Cut polysilicon continuously.
When diamond wire 5 changed by needs, close the 3rd motor, drive roll 12 stop motion, be again started up the first step Entering motor, gear 11 rotates, and gear 11 band carry-over bar 10 moves, and tooth bar 10 drives support bar to left movement, closes the first stepping Motor, unloads damaged diamond wire 5, installs new diamond wire 5, rotate backward gear 11, and gear 11 is by band carry-over bar 10 Reverse slide, tooth bar 10 drives support bar to move right, and new diamond wire 5 is tightened again, just can continue to cut multi-wafer.
Above-described is only embodiments of the invention, and in scheme, the known general knowledge such as concrete structure and characteristic is not made at this Too much describe.It should be pointed out that, for a person skilled in the art, on the premise of without departing from present configuration, it is also possible to Making some deformation and improvement, these also should be considered as protection scope of the present invention, and these are all without affecting what the present invention implemented Effect and practical applicability.The protection domain that this application claims should be as the criterion with the content of its claim, in description Detailed description of the invention etc. record the content that may be used for explaining claim.

Claims (4)

1. step-by-step movement cutter sweep, including frame and diamond wire, frame is provided with relative drive roll and driven voller, and diamond wire twines It is around between drive roll and driven voller, it is characterised in that in frame, slidably connect base, base is fixedly connected with fixing Bar, drive roll is rotatably connected on the top of fixing bar, and base slidably connects support bar, and driven voller is arranged on the top of support bar Portion, the glide direction of base and the glide direction of support bar are mutually perpendicular to, and support bar connects has tooth bar, tooth bar to be engaged with tooth Wheel, pinion rotation is connected in frame, and frame is rotatably connected to rotating disk, and rotating disk is hinged with connecting rod, and base is along slip side To side and rod hinge connection, diamond wire is arranged over chela, and chela connects has push rod, pusher slide to be automatically connected in frame.
Step-by-step movement cutter sweep the most according to claim 1, it is characterised in that: described gear connects the first motor, turns Dish connects the second motor, and push rod connects cylinder.
Step-by-step movement cutter sweep the most according to claim 2, it is characterised in that: connect between described support bar and fixing bar There is spring.
Step-by-step movement cutter sweep the most according to claim 3, it is characterised in that: described first motor and the second motor are Motor.
CN201610535432.1A 2016-07-08 2016-07-08 Step-by-step movement cutter device Expired - Fee Related CN106182470B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610535432.1A CN106182470B (en) 2016-07-08 2016-07-08 Step-by-step movement cutter device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610535432.1A CN106182470B (en) 2016-07-08 2016-07-08 Step-by-step movement cutter device

Publications (2)

Publication Number Publication Date
CN106182470A true CN106182470A (en) 2016-12-07
CN106182470B CN106182470B (en) 2018-02-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610535432.1A Expired - Fee Related CN106182470B (en) 2016-07-08 2016-07-08 Step-by-step movement cutter device

Country Status (1)

Country Link
CN (1) CN106182470B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1152788A1 (en) * 1983-12-16 1985-04-30 Государственный Научно-Исследовательский И Проектный Институт Силикатного Бетона Автоклавного Твердения Apparatus for cutting raw cellular concrete
JPH0938825A (en) * 1995-08-01 1997-02-10 Nico Tec:Kk Band saw machine
CN201317059Y (en) * 2008-12-17 2009-09-30 吴昔文 Circular arc plate stone cutter
CN104908164A (en) * 2015-06-30 2015-09-16 苏州博优泰工具有限公司 Diamond wire cutting device and cutting process
CN205310558U (en) * 2015-11-26 2016-06-15 新昌县儒岙镇中意小礼品加工厂 Many line cutting device of vertically

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1152788A1 (en) * 1983-12-16 1985-04-30 Государственный Научно-Исследовательский И Проектный Институт Силикатного Бетона Автоклавного Твердения Apparatus for cutting raw cellular concrete
JPH0938825A (en) * 1995-08-01 1997-02-10 Nico Tec:Kk Band saw machine
CN201317059Y (en) * 2008-12-17 2009-09-30 吴昔文 Circular arc plate stone cutter
CN104908164A (en) * 2015-06-30 2015-09-16 苏州博优泰工具有限公司 Diamond wire cutting device and cutting process
CN205310558U (en) * 2015-11-26 2016-06-15 新昌县儒岙镇中意小礼品加工厂 Many line cutting device of vertically

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Granted publication date: 20180213

Termination date: 20190708