CN106163723B - Laser processing device and correction data creation method - Google Patents
Laser processing device and correction data creation method Download PDFInfo
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- CN106163723B CN106163723B CN201580001534.9A CN201580001534A CN106163723B CN 106163723 B CN106163723 B CN 106163723B CN 201580001534 A CN201580001534 A CN 201580001534A CN 106163723 B CN106163723 B CN 106163723B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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Abstract
A kind of laser processing device (10), it is based on correction data, the distance between working nozzle (2) and workpiece (5) are controlled and perform Laser Processing, the correction data is to the output valve of the sensor of the electrostatic capacitance between the measure working nozzle and the workpiece, it is provided with the relation of the working nozzle and the distance between the workpiece, the laser processing device (10) is at the 1st position on the surface of the workpiece, the position of the vertical of the working nozzle is adjusted based on the 1st correction data, at the 2nd positions different from the 1st position on the surface of the workpiece, the position of the vertical of the working nozzle is adjusted based on 2nd correction data different from the 1st correction data.
Description
Technical field
The present invention relates to carry out copying control, while laser machined laser processing device, generation in laser
Program performed by the correction data creation method and laser processing device of the correction data used in processing unit (plant).
Background technology
In laser processing device, operations described below is carried out by units such as the sensors of capacitance type, i.e. on one side
Constant copying control is remained into the distance between workpiece and processing head is about to, while performing Laser Processing.In patent document 1
In disclose following technologies, i.e. prestore before processing and the upper surface of workpiece, the end face of workpiece and position without workpiece
The voltage value of corresponding profiling sensor when processing beginning according to the voltage value stored, is made whether it is sentencing for end face
It is disconnected, instruction is proceeded by processing.
Patent document 1：Japanese Unexamined Patent Publication 2000-33486 publications
The content of the invention
But according to the above-mentioned prior art, sensor can to whether be located at the endface of workpiece on workpiece surface into
Row judges, but can not achieve no matter processing head is located on the workpiece surfaces such as the corner in the center of workpiece, the end face of workpiece or workpiece
Which position, independently ensure that stable incision action and tracking are acted with the distance at a distance of the end face of workpiece.
The present invention is exactly to propose in view of the foregoing, its object is to obtain a kind of laser processing device, the laser
Processing unit (plant) stable incision action can be independently performed with the distance at a distance of the end face of workpiece and tracking acts.
In order to solve the above problems, purpose is realized, the present invention is a kind of laser processing device, right based on correction data
The distance between working nozzle and workpiece carry out copying control and perform Laser Processing, the correction data to measure working nozzle with
The relation of the distance between the output valve and working nozzle of the sensor of electrostatic capacitance between workpiece and workpiece is advised
Fixed, the laser processing device is at the 1st position on the surface of workpiece, based on the 1st correction data to the vertical of working nozzle
The position in direction is adjusted, at the 2nd positions different from the 1st position on the surface of workpiece, based on the 1st correction data
Different the 2nd correction data and the position of the vertical of working nozzle is adjusted.
The effect of invention
Laser processing device according to the present invention has following effects, i.e. can be with the distance at a distance of the end face of workpiece
Independently perform stable incision action and tracking action.
Description of the drawings
Fig. 1 is the figure for the structure for representing the laser processing device involved by embodiments of the present invention 1.
Fig. 2 is the figure of an example of the structure for the control unit for representing the laser processing device involved by embodiment 1.
Fig. 3 is represented in the laser processing device involved by embodiment 1, has just replaced the working nozzle after working nozzle
The figure of relation between the height of workpiece and sensor output voltage value.
Fig. 4 is represented in the laser processing device involved by embodiment 1, and the working nozzle after profiling correction is at a distance of work
The figure of relation between the height of part and sensor output voltage value.
Fig. 5 is to represent to make in the case that the working nozzle in embodiment 1 is located at the center of workpiece or end face edge
The figure of electrostatic capacitance detection zone and electrostatic capacitance.
Fig. 6 is to show the working nozzle in embodiment 1 at a distance of workpiece for center and the end face edge of workpiece
The figure of relation between height and electrostatic capacitance.
Fig. 7 is to represent the correction data that will be generated in embodiment 1 according to the measured value of the centre of workpiece, with work
The concept map for the situation that the position of the horizontal direction of working nozzle on part surface is independently used.
Fig. 8 is to represent to be based only upon the sensor output voltage value according to the centre on workpiece surface in embodiment 1
Measured value obtained from correction data, when incision acts so as to be processed at center and end face edge on the surface of the workpiece
The height of nozzle becomes the figure of the situation in the case that identical mode carries out copying control.
Fig. 9 is represented in embodiment 1 based on the 1st school obtained from the measured value according to the centre on workpiece surface
Correction data and the 2nd correction data according to obtained from the measured value at the end face edge on workpiece surface, when incision acts
Copying control is carried out in a manner that the height for making working nozzle at center and end face edge on the surface of the workpiece becomes identical
In the case of situation figure.
Figure 10 is to represent to generate the measured value at the center according to workpiece and end face edge in embodiment 1
Interpolation correction data, the concept map of situation about being used when the position of the horizontal direction of working nozzle is located at interpolation region.
Figure 11 be represent the correction data in workpiece center in embodiment 1, the correction data of workpiece end face edge and
The figure of interpolation correction data.
Figure 12 is the figure of cut zone obtained from illustrating being split to interpolation region in embodiment 1.
Figure 13 is the flow chart for illustrating the incision action in embodiment 1.
Figure 14 is the flow chart for illustrating the tracking action in embodiment 2.
Specific embodiment
In the following, based on attached drawing, to laser processing device, the correction data creation method involved by embodiments of the present invention
And program is described in detail.In addition, the present invention is not limited to present embodiments.
Embodiment 1
Fig. 1 is the figure for the structure for representing the laser processing device 10 involved by embodiments of the present invention 1.Laser processing device
Putting 10 has：Laser is exposed to workpiece 5 by processing head 1；Working nozzle 2 is installed on the front end of processing head 1, injection auxiliary
Gas, and project laser；Processing head driving portion 3 drives to 3-dimensional processing head 1；And control unit 4, processing head is driven
Portion 3 is controlled.Working nozzle 2 also has the function of the sensor of capacitance type.Workpiece 5 has end face 51.Processing head drives
Dynamic portion 3 and control unit 4 form NC (Numerical Control) device, i.e. numerical control device.Laser processing device 10 by from
Working nozzle 2 front end irradiation laser beam and workpiece 5 is processed.Auxiliary is also sprayed from working nozzle 2 in processing
Gas.
Fig. 2 is an example of the structure for the control unit 4 for representing the laser processing device 10 involved by embodiment 1
Figure.Control unit 4 has：Operational part 41 performs various controls and calculation process；Memory 42 is being worked by operational part 41
It is used in region；And storage part 43, store various information.Operational part 41 is central operation processing unit (CPU：Central
Processing Unit) or system LSI (Large Scale Integration).Memory 42 is such as random access storage
Device (RAM：Random Access Memory) etc. volatile storages.Storage part 43 is that such as hard disk drive or solid-state drive
The non-volatile memory devices such as dynamic device.Control unit 4 is based on the processing program being stored in storage part 43 and to processing head driving portion 3
It is controlled.
Working nozzle 2 doubles as being the capacitance type for being measured the electrostatic capacitance between working nozzle 2 and workpiece 5
Sensor.The sensor of capacitance type is that the electrostatic capacitance between working nozzle 2 and workpiece 5 is measured, will be based on surveying
Determine the sensor that the physical quantity of result is exported, as the physical quantity using as the sensor output voltage value of voltage value into
Row output.Electrostatic capacitance between working nozzle 2 and workpiece 5 is to rely on the value of the distance between working nozzle 2 and workpiece 5.
Using the relation, in laser processing device 10, control unit 4 is based on the corresponding sensor of electrostatic capacitance with being determined
The control of the distance between working nozzle 2 and workpiece 5 is constant by output voltage values.But due to be directed to a variety of materials and each
Thickness of slab and use aperture or variform working nozzle 2, therefore each working nozzle 2 is as the sensor of capacitance type
Characteristic is different.Therefore, when installing new working nozzle 2, it is necessary to the distance and sensor between working nozzle 2 and workpiece 5
Relation between output voltage values is corrected.The correction is known as profiling correction.
Fig. 3 is represented in the laser processing device 10 involved by embodiment 1, the processing after working nozzle is just replaced
Nozzle 2 is at a distance of the figure of the relation between the height of workpiece 5 and sensor output voltage value.So-called working nozzle 2 is at a distance of workpiece 5
Highly, the distance between working nozzle 2 and workpiece 5 are referred to.Fig. 4 is the laser processing device represented involved by embodiment 1
In 10, working nozzle 2 after profiling correction is at a distance of the figure of relation between the height of workpiece 5 and sensor output voltage value.
In Fig. 3 and Fig. 4, sensor output voltage value is expressed in logarithmic.
Laser processing device 10 so that working nozzle 2 at a distance of pass between the height of workpiece 5 and sensor output voltage value
The mode that system stablizes the figure of " just " shown in the chain-dotted line as Fig. 3 performs control.Working nozzle 2 is at a distance of the height of workpiece 5
Relation between sensor output voltage value, specifically, be if working nozzle 2 at a distance of workpiece 5 height for 10mm,
Sensor output voltage value is the relation of 10V.Should figure " just " relation be used as the relation that becomes the benchmark that profiling corrects and
It is stored in storage part 43 or is provided independently from it in the storage region in control unit 4.In figure 3, it is shown in solid line in
After the replacement of working nozzle 2, change working nozzle 2 and institute is measured to sensor output voltage value at a distance of the height of workpiece 5
The correction data being obtained.Correction data is the output valve i.e. sensor output voltage value and working nozzle 2 and workpiece to sensor
Data as defined in relation progress between 5 distance.
Specifically, control unit 4 makes processing head driving portion 3 by working nozzle 2 at a distance of workpiece 5 in the centre of workpiece 5
Multiple and different values is highly set to, the sensor output voltage value under each height is measured.The solid line of Fig. 3 is to be based on being somebody's turn to do
Correction data obtained from measurement result at multiple points.Therefore, the difference between correction data and working nozzle 2 and workpiece 5
Apart from corresponding, pair provided with the corresponding sensor output value of each different distance.According to by working nozzle 2 at a distance of work
The group for the determination data that multiple height of part 5 and sensor output value corresponding thereto are formed and generate the step of correction data
Suddenly, using such as an interpolation or polynomial interpolator shown in well known interpolating method, be not specially limited.
In figure 3, the firm working nozzle 2 replaced after working nozzle being shown in solid is at a distance of the height and sensing of workpiece 5
Relation and the figure of " just " between device output voltage values is inconsistent.Therefore, for the height by working nozzle 2 at a distance of workpiece 5
H1 is set to, even if control unit 4 controls processing head driving portion 3 in a manner of sensor output voltage value is made to become V1,
Following errors can be generated, i.e. actually working nozzle 2 becomes H2 at a distance of the height of workpiece 5.
Therefore, in order to make the working nozzle 2 after the firm replacement working nozzle of Fig. 3, apart the height of workpiece 5 and sensor are defeated
Go out relation between the voltage value graphics overlay with " just " as shown in Figure 4, by such as by constant and sensor output voltage value
It is calculated as being multiplied and performs profiling correction.The correction is performed by control unit 4.Then, based on constant and sensor are exported
Value after correction obtained from voltage value is multiplied, control unit 4 control the distance between working nozzle 2 and workpiece 5.That is,
Control unit 4 controls processing head driving portion 3 in a manner of the distance between working nozzle 2 and workpiece 5 is made to become desired value
System.
Implement profiling correction generally, based on the sensor output voltage value that determines of centre in workpiece 5, therefore add
The value of electrostatic capacitance between work nozzle 2 and workpiece 5 can also be set to the value in the case of being approximately infinitepiston by workpiece 5.
But laser processing device 10 can not only be processed the center of workpiece 5, additionally it is possible to end face 51 to workpiece 5 or from
The edge for the part that workpiece 5 is cut away is processed.
Fig. 5 be represent to make working nozzle 2 be located at the center of workpiece 5 or end face edge in the case of electrostatic capacitance inspection
Survey the figure of region 20 and electrostatic capacitance.On the top of Fig. 5, show that the position between working nozzle 2 and processing head 1 and workpiece 5 is closed
System.At the middle part of Fig. 5, working nozzle position 2 ' corresponding with the top of Fig. 5 and electrostatic electricity are shown in the exterior view of workpiece 5
Hold detection zone 20.In the lower part of Fig. 5, the electrostatic capacitance at the position of working nozzle 2 corresponding with the top of Fig. 5 is shown.
If as shown in figure 5, close to the end face 51 of workpiece 5, workpiece 5 cannot be approximately infinitepiston and electrostatic capacitance is obtained, i.e.,
Make the distance between working nozzle 2 and workpiece 5 identical, the value of electrostatic capacitance also become compared with the value of the centre of workpiece 5 compared with
It is small.Fig. 6 is to show working nozzle 2 between the height and electrostatic capacitance of workpiece 5 for center and the end face edge of workpiece 5
Relation figure.Relation of the working nozzle 2 of the centre of workpiece 5 between the height and electrostatic capacitance of workpiece 5 is with solid line
It shows, relation of the working nozzle 2 at the end face edge of workpiece 5 between the height and electrostatic capacitance of workpiece 5 is with chain-dotted line
It shows.Following situations are shown, i.e. working nozzle 2 at a distance of workpiece 5 height it is identical in the case of, the central phase with workpiece 5
Than the value of electrostatic capacitance is smaller at the edge of end face.In addition, in the case where electrostatic capacitance is fixed as C1, i.e. by sensor
In the case of output voltage values are fixed, compared with the H3 of centre, working nozzle 2 at a distance of workpiece 5 height value in end face edge
H4 at portion is smaller.
Fig. 7 is to represent the correction data for generating the measured value of the centre according to workpiece 5, and on 5 surface of workpiece
The concept map for the situation that the position of the horizontal direction of working nozzle 2 is independently used.Fig. 7 is represented according in workpiece 5
Measured value at centre and in the correction data that generates, by the corresponding biography of height with working nozzle 2 at a distance of the desired value of workpiece 5
The situation that the position of sensor output voltage values and the horizontal direction of the working nozzle 2 on 5 surface of workpiece is independently used.Such as
Shown in Fig. 7, if the correction data generated using only the measured value of the centre according to workpiece 5 carries out profiling correction, by
It is different at center and end face edge in relation of the working nozzle 2 between the height and electrostatic capacitance of workpiece 5, therefore
At the end face edge of workpiece 5, it is impossible to which the distance between working nozzle 2 and workpiece 5 are controlled exactly.
Fig. 8 is to represent to be based only upon according to the measured value of the sensor output voltage value of the centre on 5 surface of workpiece and obtain
The correction data arrived, working nozzle 2 is at a distance of workpiece at the center and end face edge when incision acts so that on 5 surface of workpiece
5 height becomes the figure of the situation in the case that identical mode carries out copying control.So-called incision action, refers to make to add
The starting position of work nozzle 2 to the Laser Processing of workpiece 5 approaches, and working nozzle 2 and processing head 1 is made to carry out mobile action.
Laser, but the irradiation laser after the completion of incision action are not irradiated in incision action.On the top of Fig. 8, show working nozzle 2 and
Position relationship between processing head 1 and workpiece 5.In the lower part of Fig. 8, the processing when incision of the centre of workpiece 5 acts is shown
The height of nozzle 2 change with time and the end face edge of workpiece 5 at incision action when working nozzle 2 height at any time
Between variation.
In the case where being based only upon correction data, in order to which height of the working nozzle 2 at a distance of workpiece 5 is fixed, even if so that
Sensor output voltage value is controlled as constant mode, also described as illustrated in Figure 6 at the end face edge of workpiece 5,
Height of the working nozzle 2 at a distance of the surface of workpiece 5 is less than desired value, the sensor of centre of the correction data based on workpiece 5
The measured value of output voltage values.That is, at the surface of workpiece 5, target location is compared in the position of the working nozzle 2 in vertical
It is low.When it is acted as the incision shown in the lower part in Fig. 8, when becoming steady state value in the height elapsed time of working nozzle 2
The difference of situation at the situation of centre and end face edge is shown.Also, if it is considered that drive control can when incision acts
It can cause to overshoot, then in the control of the height of the working nozzle 2 at the edge of end face, alternatively it is conceivable to more real than central place
It is overshooted in a state that existing desired value is low.Therefore, the incision at the end face edge of the workpiece 5 according to the lower part of Fig. 8
The situation of action is it is contemplated that it may also happen that the situation that working nozzle 2 and workpiece 5 collide.It understands accordingly, to workpiece 5
In the case that end face edge is processed, the measure of the sensor output voltage value of the centre based on workpiece 5 should not be applied
Correction data obtained from value.
Therefore, in the laser processing device 10 involved by embodiment 1, on the basis of the 1st correction data generation step
On, the 2nd correction data generation step is performed, in the 1st correction data generation step, based on the center on 5 surface of workpiece
Data obtained from locating the 1st data acquisition step performed generate the 1st correction data, in the 2nd correction data generation step
In, based on data obtained from the 2nd data acquisition step performed at the end face edge on 5 surface of workpiece, the 2nd correction of generation
Data.
That is, in the 1st data acquisition step, the centre of 1 position, that is, workpiece 5 on the surface of workpiece 5 will process
The distance between nozzle 2 and workpiece 5 are set to multiple and different values, and control unit 4 is defeated to the distance and the sensor under
Go out the i.e. sensor output voltage value of value to be measured.Herein, the measure of the distance between working nozzle 2 and workpiece 5 is with following
Mode performs.The origin position being set at the surface of workpiece 5 in vertical, control unit 4 first to using origin position as
The position on benchmark, workpiece 5 surface measures.Then, control unit 4 is based on the information from processing head driving portion 3, with original
The position of 2 front end of working nozzle in vertical is obtained at the surface of workpiece 5 on the basis of point position.Control unit 4 being capable of base
In the position of 2 front end of the position on the surface of obtained workpiece 5 and working nozzle, be obtained between working nozzle 2 and workpiece 5 away from
From.
Then, in the 1st correction data generation step, control unit 4 is added based on what is determined in the 1st data acquisition step
The distance between work nozzle 2 and workpiece 5 and sensor output voltage value generate the 1st correction data at the 1st position.
On the basis of the 1st data acquisition step, in the 2nd data acquisition step, with the 1st on the surface of workpiece 5
At 2 different positions of position, that is, end face edge, the distance between working nozzle 2 and workpiece 5 are set to multiple and different values, controlled
Portion 4 processed is measured the output valve, that is, sensor output voltage value of the distance and the sensor under.Then, the 2nd
In correction data generation step, control unit 4 is based between the working nozzle 2 and workpiece 5 determined in the 2nd data acquisition step
Distance and sensor output voltage value, generate the 2nd position at the 2nd correction data.
Then, at the 1st and the 2nd position on the surface of workpiece 5, control unit 4 uses the 1st and the 2nd correction data respectively
Profiling correction is carried out, height of position, the i.e. working nozzle 2 to the vertical of working nozzle 2 at a distance of the surface of workpiece 5 carries out
Adjustment.
In addition, the measure in the 1st and the 2nd data acquisition step need not be carried out by the workpiece 5 being actually processed,
The measure different from the workpiece 5 for being actually subjected to be processed can be configured at workpiece at workpiece 5 in advance, in measure workpiece
Implement said determination with the different position in end face edge this 2 in center.Based on the measurement result, in the 1st and the 2nd correction data
The the 1st and the 2nd correction data is generated in generation step.Measure at 2 different positions need incision action and after
State tracking action execution before, i.e. execution copying control before carry out.It is asked based on measurement result by well known interpolating method
The the 1st and the 2nd correction data gone out is saved in memory 42, storage part 43 or is provided independently from them in control unit 4
Storage region in.
Fig. 9 is represented in embodiment 1, based on the 1st school being worth to according to the measure of the centre on 5 surface of workpiece
Correction data and the 2nd correction data according to obtained from the measured value at the end face edge on 5 surface of workpiece, when incision acts
Profiling has been carried out in a manner that the height for making working nozzle 2 at center and the end face edge on 5 surface of workpiece becomes identical
The figure of situation in the case of control.On the top of Fig. 9, show that the position between working nozzle 2 and processing head 1 and workpiece 5 is closed
System.In the lower part of Fig. 9, show workpiece 5 centre incision action when working nozzle 2 height change with time and
The height of working nozzle 2 when incision at the end face edge of workpiece 5 acts changes with time.In the end face edge of workpiece 5
Place, since control unit 4 is based on the 2nd correction data obtained from the measured value according to the sensor output voltage value at the edge of end face
And incision action is performed, therefore the height of the working nozzle 2 when can make the elapsed time and become steady state value, and based on the 1st school
Correction data and perform incision action in the case of centre working nozzle 2 it is highly consistent.It is thus possible to it enough prevents by scheming
Collision caused by the overshoot illustrated in 8.
Also, different from any one in 1 position, that is, workpiece center and 2 positions, that is, workpiece end face edge
When working nozzle 2 is cut in position, that is, interpolation region, it can use and carry out interpolation according to the 1st and the 2nd correction data and obtain
The interpolation correction data arrived controls height of the working nozzle 2 at a distance of workpiece 5.
Figure 10 is to represent to generate the measured value at the center according to workpiece 5 and end face edge in embodiment 1
Interpolation correction data, the concept of situation about being used when the position of the horizontal direction of working nozzle 2 is located at interpolation region
Figure.Figure 10 represents that the sensor corresponding to height of the working nozzle 2 at a distance of the desired value of workpiece 5 in interpolation correction data is defeated
Go out the situation that voltage value is used in interpolation region.The position that interpolation region is set in the horizontal direction of working nozzle 2 is leaned on
In the region of the end face 51 of nearly workpiece 5.Nozzle diameter of the width in interpolation region due to depending on working nozzle 2, every
It can be changed during secondary replacement working nozzle 2.
Figure 11 be represent the correction data in workpiece center in embodiment 1, the correction data of workpiece end face edge and
The figure of interpolation correction data.The transverse axis of Figure 11 is height of the working nozzle 2 at a distance of workpiece 5, and the longitudinal axis is sensor output voltage.Figure
11 " correction data in workpiece center " is the 1st position i.e. centre of workpiece 5 on the surface of workpiece 5, by working nozzle 2
Multiple and different values is set at a distance of the height of workpiece 5, control unit 4 is measured the sensor output voltage value under each height
Obtained from the 1st correction data." correction data of workpiece end face edge " of Figure 11 be on the surface of workpiece 5 with the 1st
At the different 2 positions, that is, end face edge in position, height of the working nozzle 2 at a distance of workpiece 5 is set to multiple and different values, is controlled
2nd correction data obtained from portion 4 is measured the sensor output voltage value under each height.
Interpolation correction data be Figure 11 " the 1st interpolation correction data ", " the 2nd interpolation correction data " ... " (n-1) insert
Mend correction data "." the 1st interpolation correction data ", " the 2nd interpolation correction data " ... " (n-1) interpolation correction data " is being incited somebody to action
The interpolation region segmentation of Figure 10 obtained from n in cut zone in addition to the cut zone near proximal end face 51
(n-1) used in a cut zone.Based on " correction data in workpiece center " and " correction number of workpiece end face edge
According to ", it carries out interpolation using such as well known interpolating method of an interpolation or polynomial interpolator and calculates " the 1st interpolation correction number
According to ", " the 2nd interpolation correction data " ... " (n-1) interpolation correction data ".A simple interpolation and cut zone are apart
The distance of workpiece end face 51 correspondingly, adds " correction data in workpiece center " and " correction data of workpiece end face edge "
Power, determines the interpolation correction data used in the cut zone.Specifically, so that the cut zone of close workpiece end face 51
Interpolation correction data become close to " correction data of workpiece end face edge " value so that close to workpiece center cut zone
The mode that becomes close to the value of " correction data in workpiece center " of interpolation correction data be weighted and calculate and be obtained.The calculating
Both can be immediately performed after being obtained to " correction data in workpiece center " and " correction data of workpiece end face edge ",
It can be performed when practically using interpolation correction data.Interpolation correction data is calculated simultaneously before the execution of copying control
In the case of being obtained, which is stored in memory 42, storage part 43 or is provided independently from them in control unit
In storage region in 4.
Figure 12 is the figure of cut zone obtained from illustrating to be split the interpolation region in embodiment 1.It if will
Distance of the working nozzle 2 at a distance of the end face 51 in the left side of workpiece 5 is set to x, then x is greater than or equal to l1And less than or equal to lnArea
Domain is interpolation region, according to l1、 l2、…ln-1It is multiple cut zone by interpolation region segmentation.From end face 51 until center
Distance is lM.Relation between the distance x of end face 51 and used correction data is directed to the following institute of each cut zone
Show.
X ＜ l1" correction data of workpiece end face edge ",
l1≤ x ＜ l2" the 1st interpolation correction data ",
l2≤ x ＜ l3" the 2nd interpolation correction data ",
…
ln-1≤ x ＜ ln" (n-1) interpolation correction data ",
ln≤ x ＜ lM" correction data in workpiece center "
In fig. 12,51 distance of end face in the left side with workpiece 5 is set to x and illustrated, but also similarly
It determines the 51 corresponding interpolation region of end face with the right side of workpiece 5, determines institute's correction data to be used.Due to lnIt determines to insert
The width in region is mended, therefore as described above, can be changed when replacing working nozzle 2 every time.If it can determine ln, then
So as to suitably determine l using the scope of the error of same correction data1、l2、…ln-1.
Explanation makes working nozzle 2 carry out incision action using the interpolation correction data determined in the above described manner below
Action example.Figure 13 is the flow chart for illustrating the incision action in embodiment 1.
Initially, if user presses the start button (not shown) of laser processing device 10,4 start program of control unit fortune
Turn (step S11).Specifically, control unit 4 starts a cut through the standard of action based on the processing program being stored in storage part 43
It is standby.First, in step S12, control unit 4 determines location information.That is, control unit 4 is based on camera information, with workpiece 5
The relevant data of shape and processing program confirm the current shape of workpiece 5, determine in 2 dimensions on 5 surface of workpiece
The position and the position of the end face 51 of workpiece 5 that processing head 1 is cut.When carrying out the decision, can use well known
Means.
If determining the position of position that processing head 1 cut and end face 51 in step s 12, from
Distance x of the nearest end face 51 in the position cut on the workpiece surface until working nozzle 2 is determined, therefore
Cut zone is determined.That is, processing head 1 is carried out cutting in which of above-mentioned multiple cut zone cut zone and is determined.
Therefore, it is possible to determine control unit 4 by correction data (step S13) to be used.Specifically, as correction data, can determine
Determine " correction data in workpiece center ", " correction data of workpiece end face edge ", " the 1st interpolation correction data ", " the 2nd interpolation
Correction data " ... which of " (n-1) interpolation correction data " is used as correction data.
If be in step s 13 determined correction data to be used, which is set in all by control unit 4
Such as memory 42 or preserve processing program storage part 43 storage region in (step S14).In addition, correction data can also
It is set in and is provided independently from memory 42 and storage part 43 in the storage region (not shown) in control unit 4.Then, control
Portion 4 processed performs profiling correction based on the correction data being set in storage region, starts a cut through action (step S15).Due to school
Correction data defines the output valve of the corresponding sensor of each different distance between working nozzle 2 and workpiece 5, senses
Device output voltage values, therefore can also make incision action being set to the distance between working nozzle 2 and workpiece 5 of target with adding
The difference of the position for the horizontal direction on 5 surface of workpiece that foreman 1 is cut and change.That is, after incision action is performed
During Laser Processing, the desired value of the distance between working nozzle 2 and workpiece 5 can not also be made for fixed value, but with execution
The difference of the position of horizontal direction on 5 surface of workpiece of Laser Processing and change.
As described above, the laser processing device 10 involved by 1 according to embodiment, by depending on processing head 1
The position cut and correction data is switched over, so as to the pin-point accuracy to working nozzle 2 at a distance of workpiece 5
Ground is detected.As a result, even if close to the end face 51 of workpiece 5, stable incision action can be also realized, it can be with apart holding
The distance in face 51 independently performs stable incision action.That is, independently realize surely the position that can be tieed up with 2 on workpiece surface
Fixed incision action.It is bad without processing thereby, it is possible to perform the incision action at the edge of end face, it can expect that laser adds
Frock puts the raising of 10 yield rate.Also, it in the incision action at the edge of end face, even if being overshooted, can also keep away
Exempt from the collision of working nozzle 2 and workpiece 5.
Embodiment 2
In embodiment 2, illustrate the and then laser processing device 10 involved by embodiment 1 incision action it is dynamic
Make, i.e. tracking acts.Therefore, the laser processing device 10 involved by embodiment 2 is identical with embodiment 1.It is acted in tracking
In, working nozzle 2 is moved to 2 dimensions on the surface of workpiece 5.Copying control is also performed in tracking action.It is dynamic in tracking
In work, perform to workpiece 5 irradiate laser Laser Processing, but there may also be make laser irradiation be in stop during.Figure
14 be the flow chart for illustrating the tracking action in embodiment 2.
Start tracking action in the step s 21.Control unit 4 started based on the processing program being stored in storage part 43 with
Track acts.Specifically, first, control unit 4 determines location information in step S22.That is, control unit 4 be based on camera information,
With the relevant data of shape and processing program of workpiece 5, the current shape of workpiece 5 is confirmed, determines 5 surface of workpiece
2 dimension on processing heads 1 will be into the position of line trace and the position of the end face of workpiece 5 51.When carrying out the decision, can make
With well known method.
In step S22, if processing head 1 will be determined into the position of the position of line trace and end face 51, from wanting
Distance x of the end face 51 nearest into the position of line trace on the workpiece surface until working nozzle 2 is determined, therefore cut section
Domain is determined.That is, processing head 1 to which of multiple cut zone for illustrating in embodiment 1 cut zone into line trace
It is determined.Therefore, it is possible to determine control unit 4 by correction data (step S23) to be used.Specifically, as correction data,
It can determine " correction data in workpiece center ", " correction data of workpiece end face edge ", " the 1st interpolation correction data ", "
2 interpolation correction datas " ... which of " (n-1) interpolation correction data " is used as correction data.
If be determined correction data to be used in step S23, which is set in all by control unit 4
Such as memory 42 or preserve processing program storage part 43 storage region in (step S24).In addition, correction data
It can be set in and be provided independently from memory 42 and storage part 43 in the storage region (not shown) in control unit 4.So
Afterwards, control unit 4 is based on the correction data being set in storage region, while profiling correction is performed, while starting in step S23
Tracking action (step S25) in the cut zone being obtained.In tracking action, pass through the drive shaft of processing head driving portion 3
It is mobile, so that processing head 1 is also moved in the horizontal direction.In the same manner as incision action, in tracking action, also may be used
So as to it is set to the level on 5 surface of workpiece that the distance between working nozzle 2 and workpiece 5 of target are tracked with processing head 1
The difference of the position in direction and change.That is, working nozzle 2 and workpiece when can also laser machine execution in tracking action
The distance between 5 desired value is not fixed value, and with the position of the horizontal direction on 5 surface of workpiece for performing Laser Processing
Difference and change.
In step s 25, in the case that the tracking action in the cut zone being obtained in step S23 has terminated, that is, exist
Processing head 1 needs pair region different from the cut zone, and into the case of line trace, return to step S22 repeats above-mentioned
Action.
As described above, the laser processing device 10 involved by 2 according to embodiment, by depending on processing head 1
The position to be tracked and correction data is switched over, so as to working nozzle 2 at a distance of workpiece 5 highly accurately into
Row detection.As a result, even if close to the end face 51 of workpiece 5, stable tracking action can be also carried out, it can be with end face apart
51 distance independently performs stable tracking action.That is, independently realize surely the position that can be tieed up with 2 on workpiece surface
Fixed tracking action.It is bad without processing occurs thereby, it is possible to perform the tracking action at the edge of end face, it can expect laser
The raising of the yield rate of processing unit (plant) 10.Also, it in the tracking action at the edge of end face, even if overshooting, can also keep away
Exempt from the collision of working nozzle 2 and workpiece 5.
In embodiment 1 and 2, illustrate quiet between the sensor pair of capacitance type and working nozzle 2 and workpiece 5
The corresponding voltage value of capacitance, i.e. sensor output voltage value are exported but it is also possible to be to working nozzle 2 and workpiece 5
Between electrostatic capacitance the sensor that is exported of value, i.e. electrostatic capacitance value in itself.
In addition, in embodiment 1 and 2, using correction data as represent the distance between working nozzle 2 and workpiece 5,
The data of relation between the corresponding voltage value of electrostatic capacitance between working nozzle 2 and workpiece 5 are illustrated, but
Can also be represent electrostatic capacitance value between the distance between working nozzle 2 and workpiece 5 and working nozzle 2 and workpiece 5 it
Between relation data.In this case, if being respectively seen as the solid line of Fig. 6 and dashdotted relation by workpiece centre
Measure and the 1st correction data generated and the 2nd correction data generated by the measure at workpiece end face edge, then
Interpolation correction data is present between the solid line of Fig. 6 and chain-dotted line.Also, the figure of " just " of Fig. 3 can also be will be equivalent to
Relation between distance and electrostatic capacitance value is pre-set in as the relation of the benchmark as profiling correction in control unit 4
In storage region.
One example of the representation present disclosure shown in above embodiment, can also with others known in
Technology is combined, without departing from the spirit and scope of the invention, additionally it is possible to a part for structure be omitted, changed.
The explanation of label
1 processing head, 2 working nozzles, 2 ' working nozzle positions, 3 processing head driving portions, 4 control units, 5 workpiece, 10 laser
Processing unit (plant), 20 electrostatic capacitance detection zones, 41 operational parts, 42 memories, 43 storage parts, 51 end faces.
Claims (15)
1. a kind of laser processing device based on correction data, controls the distance between working nozzle and workpiece and is held
Row Laser Processing, output of the correction data to the sensor of the electrostatic capacitance between the measure working nozzle and the workpiece
Value and the relation of the working nozzle and the distance between the workpiece provided,
The laser processing device is characterized in that,
At the 1st position on the surface of the workpiece, based on the 1st correction data to the vertical of the working nozzle
Position is adjusted, at the 2nd positions different from the 1st position on the surface of the workpiece, based on the 1st school
The 2nd different correction data of correction data and the position of the vertical of the working nozzle is adjusted.
2. laser processing device according to claim 1, which is characterized in that have：
Processing head is equipped with the working nozzle；
Processing head driving portion drives the processing head；And
Control unit controls the processing head driving portion based on the 1st correction data at the 1st position,
The processing head driving portion is controlled based on the 2nd correction data at the 2nd position.
3. laser processing device according to claim 1, which is characterized in that
At the positions different from the 1st and the 2nd position on the surface of the workpiece, based on interpolation correction data to institute
The position for stating the vertical of working nozzle is adjusted, which is based on the 1st correction data and described
2nd correction data is carried out obtained from interpolation.
4. laser processing device according to claim 1, which is characterized in that
Make the distance between the working nozzle and the workpiece in Laser Processing variation.
5. laser processing device according to any one of claim 1 to 4, which is characterized in that
At the 1st position to the output valve of the distance between the working nozzle and the workpiece and the sensor into
Row measures, and the 1st correction data is generated, to the distance between the working nozzle and the workpiece at the 2nd position
And the output valve of the sensor is measured, and generates the 2nd correction data.
6. laser processing device according to any one of claim 1 to 4, which is characterized in that
The correction data represents the distance and the relation between the corresponding voltage value of the electrostatic capacitance.
7. laser processing device according to any one of claim 1 to 4, which is characterized in that
The correction data represents the relation between the distance and the value of the electrostatic capacitance.
8. a kind of laser processing device based on correction data, controls the distance between working nozzle and workpiece and is held
Row Laser Processing, output of the correction data to the sensor of the electrostatic capacitance between the measure working nozzle and the workpiece
Value and the relation of the working nozzle and the distance between the workpiece provided,
The laser processing device is characterized in that,
The 1st position on the surface of the workpiece and 2nd different from the 1st position on the surface of the workpiece
At position, in order to generate the correction data and to the distance between the working nozzle and the workpiece and the sensor
Output valve is measured.
9. laser processing device according to claim 8, which is characterized in that have：
Processing head is equipped with the working nozzle；
Processing head driving portion drives the processing head；And
Control unit, in order to generate the correction data, at the 1st position and the 2nd position, to the working nozzle
The output valve of the distance between described workpiece and the sensor is measured.
10. laser processing device according to claim 8, which is characterized in that
Using the workpiece different from the workpiece that perform the Laser Processing, before the execution of the Laser Processing, add to described
The output valve of the distance between work nozzle and the workpiece and the sensor is measured.
11. the laser processing device according to any one of claim 8 to 10, which is characterized in that
The correction data represents the distance and the relation between the corresponding voltage value of the electrostatic capacitance.
12. the laser processing device according to any one of claim 8 to 10, which is characterized in that
The correction data represents the relation between the distance and the value of the electrostatic capacitance.
13. a kind of correction data creation method is used in laser processing device and generates correction data, the laser processing device
It puts based on correction data, the distance between working nozzle and workpiece is controlled and perform Laser Processing, the correction data pair
Measure the sensor of the electrostatic capacitance between the working nozzle and the workpiece output valve and the working nozzle with it is described
The relation of the distance between workpiece provided,
The correction data creation method is characterized in that having：
1st data acquisition step, at the 1st position on the surface of the workpiece, to the working nozzle and the workpiece
Distance and the output valve of the sensor be measured；
1st correction data generation step, based on the working nozzle and institute determined in the 1st data acquisition step
The distance of workpiece and the output valve of the sensor are stated, generates the 1st correction data at the 1st position；
2nd data acquisition step, at the 2nd positions different from the 1st position on the surface of the workpiece, to described
The output valve of the distance and the sensor of working nozzle and the workpiece is measured；And
2nd correction data generation step, based on the working nozzle and institute determined in the 2nd data acquisition step
The distance of workpiece and the output valve of the sensor are stated, generates the 2nd correction data at the 2nd position.
14. correction data creation method according to claim 13, which is characterized in that
The correction data represents the distance and the relation between the corresponding voltage value of the electrostatic capacitance.
15. correction data creation method according to claim 13, which is characterized in that
The correction data represents the relation between the distance and the value of the electrostatic capacitance.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2015/057589 WO2016147273A1 (en) | 2015-03-13 | 2015-03-13 | Laser processing device, calibration data generation method, and program |
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| CN106163723A CN106163723A (en) | 2016-11-23 |
| CN106163723B true CN106163723B (en) | 2018-05-29 |
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| JP (1) | JP5897233B1 (en) |
| CN (1) | CN106163723B (en) |
| WO (1) | WO2016147273A1 (en) |
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| CN110039190B (en) * | 2019-04-03 | 2021-05-28 | 大族激光科技产业集团股份有限公司 | Laser cutting control method and device and computer readable storage medium |
| CN111026036B (en) * | 2019-12-26 | 2023-02-28 | 大族激光科技产业集团股份有限公司 | Laser head idle movement control method and control system |
| JP7446843B2 (en) * | 2020-02-10 | 2024-03-11 | キヤノン株式会社 | Laser processing equipment, laser processing method, and article manufacturing method |
| WO2024111062A1 (en) * | 2022-11-22 | 2024-05-30 | ファナック株式会社 | Control device and computer-readable recording medium |
| CN115971691A (en) * | 2023-03-21 | 2023-04-18 | 济南森峰激光科技股份有限公司 | Capacitive distance measurement system and method for laser cutting |
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| CN101850471A (en) * | 2009-03-31 | 2010-10-06 | 三菱电机株式会社 | Laser processing device and laser processing |
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2015
- 2015-03-13 JP JP2015546363A patent/JP5897233B1/en not_active Expired - Fee Related
- 2015-03-13 WO PCT/JP2015/057589 patent/WO2016147273A1/en active Application Filing
- 2015-03-13 CN CN201580001534.9A patent/CN106163723B/en not_active Expired - Fee Related
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| JPH0395187U (en) * | 1990-01-11 | 1991-09-27 | ||
| US6034348A (en) * | 1996-12-18 | 2000-03-07 | Electronics And Telecommunications Research Institute | Micro etching system using laser ablation |
| JP2002011587A (en) * | 2000-06-29 | 2002-01-15 | Koike Sanso Kogyo Co Ltd | Height profiling device |
| CN1981976A (en) * | 2005-12-12 | 2007-06-20 | 普雷茨特两合公司 | Laser machining apparatus and its running and controlling methods |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2016147273A1 (en) | 2017-04-27 |
| JP5897233B1 (en) | 2016-03-30 |
| WO2016147273A1 (en) | 2016-09-22 |
| CN106163723A (en) | 2016-11-23 |
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