CN106156733A - Fingeprint distinguisher and manufacture method thereof - Google Patents
Fingeprint distinguisher and manufacture method thereof Download PDFInfo
- Publication number
- CN106156733A CN106156733A CN201610516940.5A CN201610516940A CN106156733A CN 106156733 A CN106156733 A CN 106156733A CN 201610516940 A CN201610516940 A CN 201610516940A CN 106156733 A CN106156733 A CN 106156733A
- Authority
- CN
- China
- Prior art keywords
- electrode
- substrate
- fingeprint distinguisher
- identification
- sensor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A kind of fingeprint distinguisher and manufacture method thereof, this fingeprint distinguisher, including: a substrate, an induction electrode layer, an identification of fingerprint sensor chip；This substrate has one first side and one second side and multiple perforation, and these perforation connect this first and second side；This induction electrode layer is located at the first side of this substrate, this induction electrode layer has multiple first electrode and multiple second electrode and an insulating barrier, this first and second electrode and this isolation layer stack are arranged, and, this insulating barrier part is arranged between this first and second electrode, further, partial insulative layer bag this first and second electrode attached；This identification of fingerprint sensor chip is located at the second side of aforesaid base plate；The labyrinth of existing fingeprint distinguisher and technologic not convenient can be improved by the structure of the present invention and manufacture method thereof.
Description
Technical field
A kind of fingeprint distinguisher and manufacture method thereof, a kind of fingerprint improving existing complicated fingerprint identification structure
Device for identifying and manufacture method thereof.
Background technology
Existing finger print identification function is a kind of basic security mechanism being equipped in mobile device, existing fingeprint distinguisher
Being divided into free-standing with integrated two big classes, wherein stand alone type is divided into again contact and contactless two kinds, and contact is by sensing
Electrode directly carries out identification to the fingerprint contacted, and is generally disposed at touch area or is independently disposed to non-touch-control region, it addition,
Contactless fingeprint distinguisher then carries out identification of fingerprint by supersonic mode, and contactless identification of fingerprint does not limits
Whether it is touch area or non-touch-control region in set part.
Although, existing identification of fingerprint technology has evolved into ripe, but in the overall construction design of fingeprint distinguisher still
Updating seeking change and innovation, and, because mobile device is the most lightening, therefore how to design and meet the finger that narrow space uses
Stricture of vagina device for identifying also becomes a primary goal.
Further, how existing fingeprint distinguisher technique and structure make user more convenient when using, and discrimination power is higher, then
For present stage headed by the target of weight.
Summary of the invention
Therefore, for solving the shortcoming of above-mentioned prior art, offer one is provided there is more letter
Change the fingeprint distinguisher of structure.
Another object of the present invention is to provide the manufacture method of a kind of fingeprint distinguisher having and more simplifying structure.
For reaching above-mentioned purpose, the present invention provides a kind of fingeprint distinguisher, including: a substrate, an induction electrode layer, a finger
Stricture of vagina identification sensor chip, multiple conductive layer；
Described substrate has one first side and one second side and multiple perforation, and these perforation connect this first and second side；Described sensing
Electrode layer is arranged at the first side of this substrate, and this induction electrode layer has multiple first electrode and multiple second electrode and an insulation
Layer, this first and second electrode and this isolation layer stack are arranged, and, this insulating barrier part is arranged between this first and second electrode,
Further, partial insulative layer bag this first and second electrode attached；Described identification of fingerprint sensor chip is located at the second side of aforesaid base plate；Institute
Stating multiple Conductive layer portions and be arranged in these perforated inner of aforesaid base plate, part is arranged at the second side of this substrate, and, logical
Crossing these electric conductors makes this first and second electrode be electrically connected with this identification of fingerprint sensor chip.
Wherein, this fingeprint distinguisher also has a flexible circuit board, and this flexible circuit board is selective and induction electrode
Layer or this identification of fingerprint sensor chip are electrically connected with.
Wherein, described first electrode is X-direction electrode, and described second electrode is Y-direction electrode, and, between the two by absolutely
Edge layer isolation insulation, described first and second electrode is by this conductive layer is selective and this identification of fingerprint sensor chip is carried out electrically
Connect.
Wherein, described insulating barrier is SiO2Or OverCoated therein any one.
Wherein, this penetration hole diameter described is 1um ~ 25um.
There is provided a kind of fingeprint distinguisher manufacture method for reaching the above-mentioned purpose present invention, comprise the following steps:
One substrate is provided, and in this substrate one side coating one first metal coating；
By gold-tinted lithography, this first metal coating is etched and is formed multiple first electrode；
In these first electrodes and this substrate surface coating one insulating barrier；
In this insulating barrier side coating one second metal coating；
By gold-tinted lithography, this second metal coating is etched and is formed multiple second electrode；
In this substrate, another side laterally with multiple first electrode carries out piercing process, the multiple perforation of molding；
And there is side coating 1 the 3rd metal coating of multiple perforation in this substrate, and the 3rd metal coating is poured into simultaneously
In these perforation；
By gold-tinted lithography the 3rd metal coating etches and formed a conductive layer with multiple electric conductor；
One identification of fingerprint sensor chip is arranged on this conductive layer and is combined with this substrate, and, this identification of fingerprint sensor chip
It is electrically connected with this conductive layer.
Wherein, this first and second electrode is transparent or opaque characteristic therein any one.
Wherein, piercing process can be carried out by etching or the mode such as boring or laser perforation.
Wherein, identification of fingerprint sensor chip is combined in the conduction of this substrate by COG (chip on glass) technology mode
On layer.
Further, existing fingeprint distinguisher can be improved by the fingeprint distinguisher of the present invention and manufacture method thereof the most multiple
Miscellaneous structure.
Accompanying drawing explanation
Fig. 1: for the three-dimensional exploded view of fingeprint distinguisher first embodiment of the present invention.
Fig. 2: for the combination section of fingeprint distinguisher first embodiment of the present invention.
Fig. 3: for the combination section of fingeprint distinguisher the second embodiment of the present invention.
Fig. 4: for the flow chart of steps of fingeprint distinguisher manufacture method of the present invention.
Fig. 5: for the process schematic representation of fingeprint distinguisher manufacture method of the present invention.
Fig. 6: for the process schematic representation of fingeprint distinguisher manufacture method of the present invention.
Fig. 7: for the process schematic representation of fingeprint distinguisher manufacture method of the present invention.
Fig. 8: for the process schematic representation of fingeprint distinguisher manufacture method of the present invention.
Description of reference numerals
Fingeprint distinguisher 1
Substrate 11
First side 111
Second side 112
Perforation 113
First metal coating 11a
Second metal coating 11b
3rd metal coating 11c
Induction electrode layer 12
First electrode 121
Second electrode 122
Insulating barrier 123
Identification of fingerprint sensor chip 13
Foot position 131
Conductive layer 14
Electric conductor 141
Flexible circuit board 2.
Detailed description of the invention
The above-mentioned purpose of the present invention and structure thereof and characteristic functionally, will give according to the preferred embodiment of appended accompanying drawing
Explanation.
Refer to Fig. 1,2, for stereo decomposing and the combination section of fingeprint distinguisher first embodiment of the present invention, described
Fingeprint distinguisher 1, including: substrate 11, induction electrode layer 12, identification of fingerprint sensor chip 13, conductive layer 14；
Described substrate 11 has one first side 111,1 second side 112 and multiple perforation 113,111,112 points, described first and second side
Not being arranged at the upper and lower both sides of this substrate 11, these perforation 113 run through first and second side 111,112 of this substrate 11 and connect this
First and second side 111,112, these 113 a diameter of 1um ~ 25um that bore a hole.
Described induction electrode layer 12 is arranged at the first side 111 of this substrate 11, and this induction electrode layer 12 has multiple first
Electrode 121, multiple second electrode 122 and insulating barrier 123, this first and second electrode 121,122 and this insulating barrier 123 lamination set
Put, and, this insulating barrier 123 part is arranged between this first and second electrode 121,122, and, partial insulative layer 123 is coated with
This first and second electrode 121,122.
Described first electrode 121 is X-direction electrode, and described second electrode 122 is Y-direction electrode, and, between the two by absolutely
Edge layer 123 isolation insulation, described first and second electrode 121,122 is by this conductive layer 14 is selective and this identification of fingerprint senses
Chip 13 is electrically connected with, and described insulating barrier 123 is SiO2Or OverCoated therein any one.
Described identification of fingerprint sensor chip 13 is located at the second side 112 of aforesaid base plate 11, and, this identification of fingerprint sensing core
Sheet 13 has multiple foot position 131, and this conductive layer 14 has multiple electric conductor 141, and these electric conductor 141 parts are arranged in aforementioned base
The perforation 113 of plate 11 is internal, and partially electronically conductive body 141 is arranged at the second side 112 of this substrate 11, and, by these electric conductors
141 make this first and second electrode 121,122 be electrically connected with the foot position 131 of this identification of fingerprint sensor chip 13.
Refer to Fig. 3, for the combination section of fingeprint distinguisher the second embodiment of the present invention, as it can be seen, this enforcement
Example part-structure is identical with aforementioned first embodiment therefore will not be described in great detail at this, and the present embodiment is different from aforementioned first embodiment
Part is that it also has a flexible circuit board 2, and this flexible circuit board 2 is selective and induction electrode layer 12 or this identification of fingerprint
Sensor chip 13 is electrically connected with.
Refer to Fig. 4,5,6,7,8, for flow chart of steps and the technique signal of fingeprint distinguisher manufacture method of the present invention
Figure, and, in the lump refering to earlier figures 1～3, as it can be seen, fingeprint distinguisher manufacture method of the present invention comprises the following steps:
S1 a: substrate is provided, and in this substrate one side coating one first metal coating；
There is provided a substrate 11 to use as base material, this substrate 11 can be silicon material or glass material therein any one, and, should
Substrate 11 has upper and lower two sides (first and second side 111,112), selects in upper side (the first side 111) with the side of coating plated film
Formula coating one first metal coating 11a.
S2: this first metal coating is etched and formed multiple first electrode by gold-tinted lithography；
This first metal coating 11a is carried out gold-tinted lithography, and by gold-tinted lithography by this first metal coating 11a
Etch and formed multiple first electrode 121.
S3: in these first electrodes and this substrate surface coating one insulating barrier；
Drape over one's shoulders in place of not there is by the way of coating plated film on these first electrodes 121 and these substrates 11 first electrode 121
Cover a layer insulating 123 to use as insulation.
S4: in this insulating barrier side coating one second metal coating；
In the side of aforementioned dielectric layer 123 by the way of coating coating coating one second metal coating 11b.
S5: this second metal coating is etched and formed multiple second electrode by gold-tinted lithography；
By gold-tinted lithography, this second metal coating 11b etching is formed multiple second electrodes 122.
S6: another side laterally with multiple first electrode carries out piercing process in this substrate, the multiple perforation of molding；
Carry out boring work in the second surface, side 112 of this substrate 11 to the direction of this first side 111 and form multiple perforation 113,
Further, these these substrate first and second sides 111,112 of perforation 113 connection, make first and second side 111,112 phase interconnection of this substrate 11
Logical, 113 techniques of boring a hole can be carried out by etching or the mode such as boring or laser perforation.
S7: and there is side coating 1 the 3rd metal coating of multiple perforation in this substrate, and by the 3rd metal coating
Pour in these perforation simultaneously；
In the second side 112 coating 1 the 3rd metal coating 11c of this substrate 11 by the way of coating plated film, and, make simultaneously
3rd metal coating 11c pours in the perforation 113 of this substrate 11 previous institute molding simultaneously, the 3rd metal coating 11c and this
A little first and second electrodes 121,122 are electrically connected with.
S8: by gold-tinted lithography the 3rd metal coating etches and formed a conduction with multiple electric conductor
Layer；
By gold-tinted lithography technique, the 3rd metal coating 11c is etched, makes thereafter the 3rd metal coating 11c shape
Becoming to have a conductive layer 14 of multiple electric conductor 141, these electric conductors 141 are for metal routing and are arranged in aforementioned perforation 113
Circuit.
S9: an identification of fingerprint sensor chip is arranged on this conductive layer and is combined with this substrate, and, this identification of fingerprint sense
Survey chip to be electrically connected with this conductive layer.
By an identification of fingerprint sensor chip 13 by COG(chip on glass) technology mode is combined in this substrate 11
On conductive layer 14, and, make multiple foot positions 131 of this identification of fingerprint sensor chip 13 be electrically connected with aforesaid conductive layer 14.
These first and second electrodes 111,112 in fingeprint distinguisher of the present invention and manufacture method thereof are transparent or impermeable
Bright characteristic therein any one.
The shortcoming that can be improved existing fingeprint distinguisher by fingeprint distinguisher of the present invention and manufacture method thereof, the most greatly
Width improves identification of fingerprint degree of accuracy and reduces manufacturing cost.
Although the present invention has utilized above-mentioned preferred embodiment to illustrate, so it is not limited to the protection model of the present invention
Enclosing, any those skilled in the art are within without departing from the spirit and scope of the present invention, and relative above-described embodiment carries out various change
Dynamic and amendment still belongs to the scope that the present invention is protected, and therefore protection scope of the present invention is with being as the criterion that claims are defined.
Claims (9)
1. a fingeprint distinguisher, including:
One substrate, has one first side and one second side and multiple perforation, and these perforation connect this first and second side；
One induction electrode layer, is arranged at the first side of this substrate, and this induction electrode layer has multiple first electrode and multiple second
Electrode and an insulating barrier, this first and second electrode and this isolation layer stack arrange, and, this insulating barrier part be arranged at this first,
Between two electrodes, and, partial insulative layer bag this first and second electrode attached；
One identification of fingerprint sensor chip, is located at the second side of aforesaid base plate；
One conductive layer, has multiple electric conductor, and these electrical conductor portion are arranged in these perforated inner of aforesaid base plate, and these should
Electrical conductor portion is arranged at the second side of this substrate, and, make this first and second electrode and this identification of fingerprint by these electric conductors
Sensor chip is electrically connected with.
2. fingeprint distinguisher as claimed in claim 1, it is characterised in that it also has a flexible circuit board, this soft electricity
Road plate is selective with induction electrode floor or the electric connection of this identification of fingerprint sensor chip.
3. fingeprint distinguisher as claimed in claim 1, it is characterised in that described first electrode is X-direction electrode, described the
Two electrodes are Y-direction electrode, and, between the two by insulating barrier isolation insulation, described first and second electrode is selected by this conductive layer
Being electrically connected with this identification of fingerprint sensor chip of property.
4. fingeprint distinguisher as claimed in claim 1, it is characterised in that described insulating barrier is SiO2Or OverCoated its
In any one.
5. fingeprint distinguisher as claimed in claim 1, it is characterised in that these penetration hole diameters described are 1um ~ 25um.
6. a fingeprint distinguisher manufacture method, comprises the following steps:
One substrate is provided, and in this substrate one side coating one first metal coating；
By gold-tinted lithography, this first metal coating is etched and is formed multiple first electrode；
In these first electrodes and this substrate surface coating one insulating barrier；
In this insulating barrier side coating one second metal coating；
By gold-tinted lithography, this second metal coating is etched and is formed multiple second electrode；
In this substrate, another side laterally with multiple first electrode carries out piercing process, the multiple perforation of molding；
And there is side coating 1 the 3rd metal coating of multiple perforation in this substrate, and the 3rd metal coating is poured into simultaneously
In these perforation；
By gold-tinted lithography the 3rd metal coating etches and formed a conductive layer with multiple electric conductor；
One identification of fingerprint sensor chip is arranged on this conductive layer and is combined with this substrate, and, this identification of fingerprint sensor chip
It is electrically connected with this conductive layer.
7. fingeprint distinguisher manufacture method as claimed in claim 6, it is characterised in that these first and second electrodes are transparent
Or opaque characteristic therein any one.
8. fingeprint distinguisher manufacture method as claimed in claim 6, it is characterised in that piercing process can be by etching or brill
The modes such as hole or laser perforation are carried out.
9. fingeprint distinguisher manufacture method as claimed in claim 6, it is characterised in that identification of fingerprint sensor chip passes through
COG technology mode is combined on the conductive layer of this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610516940.5A CN106156733A (en) | 2016-07-01 | 2016-07-01 | Fingeprint distinguisher and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610516940.5A CN106156733A (en) | 2016-07-01 | 2016-07-01 | Fingeprint distinguisher and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106156733A true CN106156733A (en) | 2016-11-23 |
Family
ID=58062695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610516940.5A Pending CN106156733A (en) | 2016-07-01 | 2016-07-01 | Fingeprint distinguisher and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106156733A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766053A (en) * | 2015-03-26 | 2015-07-08 | 业成光电（深圳）有限公司 | Fingerprint recognition device and manufacturing method thereof |
| CN105335728A (en) * | 2015-11-13 | 2016-02-17 | 关键应用科技股份有限公司 | Fingerprint identification unit |
| CN205176816U (en) * | 2015-12-03 | 2016-04-20 | 关键应用科技股份有限公司 | Touch devices with fingerprint is discerned |
| US20160188032A1 (en) * | 2014-12-25 | 2016-06-30 | Chih-Chung Lin | Touch panel capable of identifying fingerprint |
-
2016
- 2016-07-01 CN CN201610516940.5A patent/CN106156733A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160188032A1 (en) * | 2014-12-25 | 2016-06-30 | Chih-Chung Lin | Touch panel capable of identifying fingerprint |
| CN104766053A (en) * | 2015-03-26 | 2015-07-08 | 业成光电（深圳）有限公司 | Fingerprint recognition device and manufacturing method thereof |
| CN105335728A (en) * | 2015-11-13 | 2016-02-17 | 关键应用科技股份有限公司 | Fingerprint identification unit |
| CN205176816U (en) * | 2015-12-03 | 2016-04-20 | 关键应用科技股份有限公司 | Touch devices with fingerprint is discerned |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101179530B1 (en) | Touch panel stackup | |
| CN104199586B (en) | A kind of array base palte, In-cell touch panel and touch control display apparatus | |
| CN205665677U (en) | Display panel | |
| CN105138958B (en) | Electronic equipment, display screen and panel | |
| CN106865486B (en) | Capacitive fingerprint sensing device and forming method thereof and electronic product | |
| CN102449582A (en) | Capacitance type input device | |
| WO2007084879A3 (en) | Low resistance and inductance backside through vias and methods of fabricating same | |
| EP2784639A2 (en) | Touch panel and touch device with the same | |
| TW201627837A (en) | Touch sensor device | |
| TW201216117A (en) | Electronic device having a hidden input key and method of manufacturing an electronic device | |
| CN107272979A (en) | Touch panel, manufacturing method and touch device | |
| CN110023888A (en) | Transparent electrode component and its manufacturing method and the static capacity type sensor for using the transparent electrode component | |
| CN204406428U (en) | A kind of encapsulating structure of fingerprint Identification sensor | |
| CN206479965U (en) | Touch display screen and pressure sensitive touch-screen | |
| CN106156733A (en) | Fingeprint distinguisher and manufacture method thereof | |
| CN106873831A (en) | Touch display screen, pressure sensitive touch-screen and preparation method thereof | |
| CN106373923B (en) | Flexible display panel and manufacturing method thereof, electronic product and display thereof | |
| CN206312169U (en) | Fingerprint sensing device and electronic equipment | |
| KR20170003274A (en) | Sensor package, electronic device having the same and method of detecting fake fingerprint of the same | |
| TWI617992B (en) | Fingerprint identification device andmanufacturing method thereof | |
| CN207976857U (en) | Touch panel | |
| CN205038621U (en) | Touch panel | |
| JP2020535506A (en) | Touch panel and touch device | |
| CN108491114A (en) | touch panel, touch panel preparation method and touch device | |
| US20190138130A1 (en) | Touch control device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161221 Address after: Taiwan County Hsinchu County Road nine Chinese jhubei City, No. 147 7 floor Applicant after: Core Polytron Technologies Inc Address before: Taiwan County, Hsinchu, China Town, East Zhongxing Road 2, No. 225, building 3 Applicant before: KEY APPLIC TECHNOLOGY CO., LTD. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161123 |