CN106155186A - A kind of embedded main board and electronic product thereof - Google Patents
A kind of embedded main board and electronic product thereof Download PDFInfo
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- CN106155186A CN106155186A CN201510155323.2A CN201510155323A CN106155186A CN 106155186 A CN106155186 A CN 106155186A CN 201510155323 A CN201510155323 A CN 201510155323A CN 106155186 A CN106155186 A CN 106155186A
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- main board
- embedded main
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- 230000006870 function Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 27
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000009434 installation Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000012827 research and development Methods 0.000 description 1
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Abstract
Being both needed to redesign, test-manufacture and debug at design mainboard for solving existing different electronic product, cause it need to put into substantial amounts of manpower and materials, the design cycle is long, the problem affecting its Time To Market, the invention provides a kind of embedded main board and electronic product thereof.The embedded main board that the present invention provides, including a substrate and core board；CPU, internal memory, hard disk and Power Management Unit is included on described core board；Some alternative functional modules installed and interface is included on described substrate；Wherein, described substrate is provided with slot, and described core board is plugged in described slot.This embedded main board using the present invention to provide, is designed to the mode of substrate grafting core board；The requisite module of integrated electronic product in this core board, and by the module of optional installation and Interface design on the substrate.The design cycle of product is greatly reduced, so that product can list in advance.
Description
Technical field
The present invention relates to electronics field, embedded main board field the most thereon.
Background technology
It is respectively arranged with mainboard, wherein, with X86 on the electronic products such as current flat board, box, notebook, all-in-one
As a example by the embedded main board of system architecture, equipped with CPU (English full name: Central Processing on its mainboard
Unit, Chinese full name: central processing unit), internal memory, hard disk, Power Management Unit and other various function moulds
Wherein, some modules are requisite for block and various interface etc., and some is alternative design,
Depending on the function of the electronic product designed as required.
But, applicant is when researching and developing the mainboard of each electronic product, it is found that at present for identical platform
Product is quite a lot of, when designing electronic product based on this same X86 system platform every time, and its embedded master
Plate is both needed to redesign, test-manufacture and debugging etc., needs to put into substantial amounts of manpower and materials in each stage.Make
Cycle required for research and development of products, production or even shipment is the longest, according to traditional product design method, its
Design cycle is generally 3-6 month, and test manufacture needs 2-3 time, the most；Affect its market periods time.
Summary of the invention
It is both needed to redesign, test-manufacture and debug at design mainboard for solving existing different electronic product, causes it
Need to put into substantial amounts of manpower and materials, the design cycle is long, and the problem affecting its Time To Market the invention provides
A kind of embedded main board and electronic product thereof.
On the one hand the embodiment of the present invention provides a kind of embedded main board, including a substrate and core board；
CPU, internal memory, hard disk and Power Management Unit is included on described core board；
Some alternative functional modules installed and interface is included on described substrate；
Wherein, described substrate is provided with slot, and described core board is plugged in described slot.
This embedded main board using the present invention to provide, is designed to the mode of substrate grafting core board；This core
The requisite module of integrated electronic product in plate, and by the module of optional installation and Interface design at this base
On plate.So, when the embedded main board designed on different electronic products, only substrate need to be designed,
And without changing core board.So, after core board is carried out, the design cycle of substrate can shorten to 1 month
Left and right, test manufacture has only to 1-2 time and i.e. can reach volume production, the design cycle of product is greatly reduced, so that producing
Product can list in advance.
Preferably, described substrate is provided with radiator window at slot position.
Preferably, described interface includes showing the one in interface, input/output interface, power input interface
Or it is several.
Preferably, described input/output interface includes USB interface, audio output interface, TF socket and network
One or more in interface.
Preferably, the Functional Module on described substrate includes mixed-media network modules mixed-media, WIFI module and audio-frequency module.
Preferably, described substrate is correspondingly provided with golden finger in slot and on described core board.
Preferably, described substrate is provided with on and off switch.
Preferably, described slot is provided with fastener, and the core board being inserted on described slot is by described fastener
Buckle is fixed on described slot.
Second aspect present invention provides a kind of electronic equipment, including housing and be arranged on the mainboard in this housing,
Described mainboard is above-mentioned embedded main board.
Preferably, described electronic equipment is panel computer, intelligence box, notebook computer or all-in-one.
This electronic product that the embodiment of the present invention provides, motherboard design thereon becomes the side of substrate grafting core board
Formula；The requisite module of integrated electronic product in this core board, and by the module of optional installation and interface
Design is on the substrate.So, when the embedded main board designed on different electronic products, only need to be to base
Plate is designed, and without changing core board.So, after core board is carried out, the design cycle of substrate is permissible
Shortening to about 1 month, test manufacture has only to 1-2 time and i.e. can reach volume production, and the design week of product is greatly reduced
Phase, so that product can list in advance.
Accompanying drawing explanation
Fig. 1 is a kind of embedded main board front schematic view provided in the specific embodiment of the invention；
Fig. 2 is a kind of embedded main board schematic rear view provided in the specific embodiment of the invention；
Fig. 3 is core board front schematic view on a kind of embedded main board provided in the specific embodiment of the invention；
Fig. 4 is that a kind of embedded main board provided in the specific embodiment of the invention is just connecting each external parts
Face schematic diagram；
Fig. 5 is the back of the body that a kind of embedded main board provided in the specific embodiment of the invention connects each external parts
Face schematic diagram.
Wherein, 1, substrate；2, core board；10, slot；11, antenna；12, HDMI；13、
USB interface；14, network interface；15, power input interface；16, USB interface；17, TF socket；
18, on and off switch；19, audio output interface；1a, HDMI cable；1b, VGA wiring；1c, net
Line；1d, power line；1e, USB connecting line；1f, audio output line；101, fastener；20, gold hands
Refer to；21、CPU；22, Power Management Unit；23, hard disk；24, internal memory.
Detailed description of the invention
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, with
Lower combination drawings and Examples, are further elaborated to the present invention.Should be appreciated that described herein
Specific embodiment only in order to explain the present invention, be not intended to limit the present invention.
Embodiment 1
A kind of embedded main board providing the present invention is carried out specific explanations explanation, as shown in Figure 1, Figure 2 institute by this example
Show, including a substrate 1 and core board 2；So-called substrate 1 and core board 2 are all that pcb board is (English complete
Claiming: Printed Circuit Board, Chinese is printed circuit board, also known as printed substrate), it is pacified
Dress electronic devices and components.
Some alternative functional modules installed and interface is included on described substrate 1；
As it is shown on figure 3, include CPU21, internal memory 24, Power Management Unit 22 (English on described core board 2
Literary composition is called for short: PMU, English full name: Power Management Unit) and hard disk 23；Wherein, typically also
Including FLASH (English full name: Flash EEPROM Memory, Chinese is called for short: flash memory) etc..Wherein,
WIFI module and audio-frequency module (i.e. sound card) are the most optionally installed on this core board 2.
Wherein, described substrate 1 is provided with slot 10, and described core board 2 is plugged in described slot 10.Should
Requisite module is installed on core board 2, so, when for different design of electronic products mainboard, should
Core board 2 is generally applicable, it is not necessary to again carry out the design of core board 2, and only need to be by other function moulds optional
Block and peripheral interface are arranged on substrate 1, to reduce its design efforts would, reduce the design cycle, accelerate to produce
Product Time To Market.
As preferred mode, wherein, described substrate 1 is provided with radiator window at slot position (figure not to be marked
Note).Refer specifically to slot 10 position on its substrate 1, be positioned at the lower section of core board 2, this heat radiation is set
Window.
Its, as shown in Figure 1 and Figure 2, described interface includes showing that interface, input/output interface, power supply are defeated
One or more in incoming interface 15 (DCIN).Wherein, as shown in Figure 4, Figure 5, this display interface bag
Include USB interface 13 and HDMI 15 (Chinese full name: HDMI, English: High
Definition Multimedia Interface) in one or more, connecing 13 mouthfuls by this VGA can lead to
Cross VGA wiring 1b to be connected with display device, with output display image.HDMI 12 is by external
HDMI cable 1a realizes transmission and the broadcasting of HD video.Power input interface 15 by power line 1d with
External direct current power supply is connected, and can be that mainboard is directly powered or charges for battery in electronic equipment.
Wherein, described input/output interface include USB (English full name: Universal Serial Bus, general
Universal serial bus) interface 16, audio output interface 19, one or several in TF socket 17 and network interface 14
Kind.As shown in Figure 4, Figure 5, this usb 16 can pass through USB connecting line 1e and external storage equipment
Connect, as USB flash disk, portable hard drive etc. connect, it is achieved the reading of data and write, or keyboard can be connected
With input equipments such as mouses.Audio output apparatus can be connected with audio output line 1f on this audio output interface 19,
Such as earphone and speaker etc..TF (English full name: Trans-flash Card) socket 17 may be inserted into TF
Card.Above-mentioned network interface 14 is RJ45 interface (Registered Jack 45), and it passes through netting twine 1c and network
Connect, it is achieved wire communication.
Wherein, the Functional Module on described substrate 1 includes mixed-media network modules mixed-media, WIFI module and audio-frequency module etc.,
Shown in as shown in Figure 1, Figure 2, this mixed-media network modules mixed-media is used for realizing network communication.The antenna 11 of this WIFI module
It is mounted on substrate 1, to realize WIFI communication.As preferred mode, its WIFI module also may be used
To arrange bluetooth module, so, can with as there is the electronic equipment of bluetooth module realize bluetooth and connect.
Wherein, described substrate 1 is correspondingly provided with in slot 10 and on described core board 2 golden finger 20 (with
Fig. 3 is labeled as example).So, to realize substrate 1 and the electrical connection of core board 2.About mixed-media network modules mixed-media
Can include fiber broadband mixed-media network modules mixed-media and mobile network's module, it can pass through broadband access network or shifting respectively
Dynamic network-in-dialing network.
Its, described substrate 1 is provided with on and off switch 18.This on and off switch 18 is provided with power supply indicator.
Startup and the closedown of electronic equipment can be realized by this on and off switch 18.
Wherein, described slot 10 is provided with fastener 101, is inserted in the core board 2 on described slot 10 by institute
State fastener 101 buckle to be fixed on described slot 10.
This embedded main board using the present invention to provide, is designed to the mode of substrate 1 grafting core board 2；Should
The requisite module of integrated electronic product in core board 2, and by the module of optional installation and Interface design
On this substrate 1.So, when the embedded main board designed on different electronic products, only need to be to substrate 1
It is designed, and without changing core board 2.So, after core board 2 is carried out, the design cycle of substrate 1 can
To shorten to about 1 month, test manufacture has only to 1-2 time and i.e. can reach volume production, and the design of product is greatly reduced
Cycle, so that product can list in advance.
Embodiment 2
This example provides a kind of electronic equipment, including housing and be arranged on the mainboard in this housing, described mainboard
For the embedded main board disclosed in above-described embodiment 1.
Typically, the housing of electronic equipment uses upper lower casing to be interlocked composition, and this mainboard is arranged in this housing,
With internal battery, or the above-mentioned external unidirectional current of power input interface 15 can be passed through as required in it.Should
The general buckle of mainboard in the housing, or uses screw, bolt etc. to be fastened in housing.
Housing preferably employs metal shell or arranges heat sink at the back side of housing, in order to heat radiation, if
Volume is suitable.The front of this housing can arrange display screen as required, or touches display screen.Certainly,
Also display screen can be not provided with, and by the USB interface 13 external-connection displayer part arranged on its mainboard.
Wherein, described electronic equipment is panel computer, intelligence box, notebook computer, projector or one
Machine.
This electronic product that the embodiment of the present invention provides, motherboard design thereon becomes the side of substrate grafting core board
Formula；The requisite module of integrated electronic product in this core board, and by the module of optional installation and interface
Design is on the substrate.So, when the embedded main board designed on different electronic products, only need to be to base
Plate is designed, and without changing core board.So, after core board is carried out, the design cycle of substrate is permissible
Shortening to about 1 month, test manufacture has only to 1-2 time and i.e. can reach volume production, and the design week of product is greatly reduced
Phase, so that product can list in advance.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention
Protection domain within.
Claims (10)
1. an embedded main board, it is characterised in that include a substrate and core board；
CPU, internal memory, hard disk and Power Management Unit is included on described core board；
Some alternative functional modules installed and interface is included on described substrate；
Wherein, described substrate is provided with slot, and described core board is plugged in described slot.
Embedded main board the most according to claim 1, it is characterised in that slot position on described substrate
The place of putting is provided with radiator window.
Embedded main board the most according to claim 1, it is characterised in that described interface includes display
One or more in interface, input/output interface, power input interface.
Embedded main board the most according to claim 3, it is characterised in that described input/output interface
Including one or more in USB interface, audio output interface, TF socket and network interface.
Embedded main board the most according to claim 3, it is characterised in that the function on described substrate
Module includes mixed-media network modules mixed-media, WIFI module and audio-frequency module.
Embedded main board the most according to claim 1, it is characterised in that on described substrate in slot
And it is correspondingly provided with golden finger on described core board.
Embedded main board the most according to claim 1, it is characterised in that described substrate is provided with electricity
Source switch.
Embedded main board the most according to claim 1, it is characterised in that described slot is provided with card
Fastener, the core board being inserted on described slot is fixed on described slot by described fastener buckle.
9. an electronic equipment, including housing and be arranged on the mainboard in this housing, it is characterised in that institute
Stating mainboard is embedded main board described in any one in claim 1-8.
Electronic equipment the most according to claim 9, it is characterised in that described electronic equipment is flat
Plate computer, intelligence box, notebook computer, projector or all-in-one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510155323.2A CN106155186A (en) | 2015-04-02 | 2015-04-02 | A kind of embedded main board and electronic product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510155323.2A CN106155186A (en) | 2015-04-02 | 2015-04-02 | A kind of embedded main board and electronic product thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106155186A true CN106155186A (en) | 2016-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510155323.2A Pending CN106155186A (en) | 2015-04-02 | 2015-04-02 | A kind of embedded main board and electronic product thereof |
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| Country | Link |
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| CN (1) | CN106155186A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040726A (en) * | 2018-10-12 | 2018-12-18 | 深圳市安卓微科技有限公司 | Mainboard and projection device |
| CN110262990A (en) * | 2019-07-03 | 2019-09-20 | 延锋伟世通汽车电子有限公司 | LVDS video source module and its application method |
| CN110447144A (en) * | 2017-08-18 | 2019-11-12 | 株式会社Lg化学 | The BMS module and its design method of customization |
| CN114860039A (en) * | 2022-04-19 | 2022-08-05 | 苏州稳信智能科技有限公司 | Modular edge computing industrial personal computer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102929351A (en) * | 2012-11-07 | 2013-02-13 | 联达科技(厦门)有限公司 | Detachable main board |
| US20140133083A1 (en) * | 2012-11-09 | 2014-05-15 | Nvidia Corporation | Graphics card and base plate and core board for the graphics card |
| CN204515617U (en) * | 2015-04-02 | 2015-07-29 | 深圳市兴华盛科技有限公司 | A kind of embedded main board and electronic product thereof |
-
2015
- 2015-04-02 CN CN201510155323.2A patent/CN106155186A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102929351A (en) * | 2012-11-07 | 2013-02-13 | 联达科技(厦门)有限公司 | Detachable main board |
| US20140133083A1 (en) * | 2012-11-09 | 2014-05-15 | Nvidia Corporation | Graphics card and base plate and core board for the graphics card |
| CN204515617U (en) * | 2015-04-02 | 2015-07-29 | 深圳市兴华盛科技有限公司 | A kind of embedded main board and electronic product thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110447144A (en) * | 2017-08-18 | 2019-11-12 | 株式会社Lg化学 | The BMS module and its design method of customization |
| CN109040726A (en) * | 2018-10-12 | 2018-12-18 | 深圳市安卓微科技有限公司 | Mainboard and projection device |
| CN110262990A (en) * | 2019-07-03 | 2019-09-20 | 延锋伟世通汽车电子有限公司 | LVDS video source module and its application method |
| CN114860039A (en) * | 2022-04-19 | 2022-08-05 | 苏州稳信智能科技有限公司 | Modular edge computing industrial personal computer |
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Application publication date: 20161123 |
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