CN106152078A - High-effect Low-cost LED lamp heat radiation protection mechanism - Google Patents

High-effect Low-cost LED lamp heat radiation protection mechanism Download PDF

Info

Publication number
CN106152078A
CN106152078A CN201510165454.9A CN201510165454A CN106152078A CN 106152078 A CN106152078 A CN 106152078A CN 201510165454 A CN201510165454 A CN 201510165454A CN 106152078 A CN106152078 A CN 106152078A
Authority
CN
China
Prior art keywords
heat
led
emission space
radiator
conductive wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510165454.9A
Other languages
Chinese (zh)
Inventor
黄子晋
黄泰瑜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CN106152078A publication Critical patent/CN106152078A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a kind of high-effect Low-cost LED lamp heat radiation protection mechanism.Many in order to overcome existing LED heat radiation protection mechanism to manufacture waste of material; manufacturing cost is high; radiating efficiency, effect are undesirable; easily burn out LED chip, LED drives power supply module; service life, short grade was not enough; heat-transfer matcrial layer of the present invention bending or bending are formed has the radiator of heat emission space, heat conductive wall, at described heat-transfer matcrial layer or heat conductive wall is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer can launch or stretch.The present invention is used for manufacturing LED; result of the test shows; it can save manufacture material more than 30%; manufacturing cost reduces by more than 27%, LED first can be greatly reduced and purchase cost, good heat dissipation effect of especially conducting heat; LED can be more effectively protected to realize the efficient energy-saving long-life; extend more than one times service life, and make the volume-diminished 1/3rd of LED, the more abundant perfection of the outward appearance of LED.

Description

High-effect Low-cost LED lamp heat radiation protection mechanism
Technical field
The present invention relates to the component of a kind of LED, a kind of high-effect Low-cost LED lamp heat radiation protection mechanism.
Background technology
Existing LED in working order under can produce amount of heat, if heat radiation is the most smooth, it is easy to burn out LED chip, LED drives power supply module etc., thus shortens the service life of LED, increases the use cost of LED.
The heat radiation of existing LED is completed by cooling mechanism, and the heat production LED-baseplate to be passed through of LED chip is conducted to cooling mechanism, and heat transfer radiating efficiency is low;The cooling mechanism of existing LED uses monoblock aluminium turning to form, there is perisporium and close impermeable inner chamber, the periphery wall of this inner chamber has the fin of protrusion, all without the heat radiation thermovent (i.e. internal chamber wall closing) of straight-through inner chamber between fin and abutting fins, its weak point is, manufacture waste of material is many, consumptive material is many, manufacture loaded down with trivial details, efficiency is low, cost is high, make at the beginning of LED, to purchase cost to increase, especially dispel the heat the most smooth, radiating efficiency is low, effect is undesirable, easily produce high accumulated temperature, often due to LED accumulated heat heats up high and burns out LED chip, LED drives power supply etc., thus shorten the service life of LED, add use cost, the advantage making LED is had a greatly reduced quality.
Summary of the invention
The purpose of the present invention is aiming at above-mentioned deficiency; a kind of high-effect Low-cost LED lamp heat radiation protection mechanism is provided; its consumptive material is few, manufactures simplicity, cheap for manufacturing cost; LED first can be greatly reduced and purchase cost; especially conducting heat good heat dissipation effect, efficiency is high, it is possible to more effectively protection LED realizes energy-efficient; and the volume of LED can be reduced, improve the outward appearance of LED.
For reaching above-mentioned purpose, the technical scheme is that this high-effect Low-cost LED lamp heat radiation protection mechanism has heat-transfer matcrial layer, the bending of described heat-transfer matcrial layer or bending form the radiator with heat emission space, heat conductive wall.Described heat-transfer matcrial layer can cast (casting system) by mould, the radiator with heat emission space, heat conductive wall it is bent to form by this heat-transfer matcrial layer, described heat emission space, heat conductive wall are bent to form by this heat-transfer matcrial layer, and casting system can concurrently form heat-transfer matcrial layer and is bent to form heat emission space, heat conductive wall by this heat-transfer matcrial layer;Existing sheet material or profile material (such as aluminium plate) can also be selected as heat-transfer matcrial layer, its bending is formed the radiator with heat emission space, heat conductive wall, utilizes sheet material or profile material manufacture, simple process, low cost.
At described heat-transfer matcrial layer or heat conductive wall is provided with thermovent or/and fin.Thermovent improves permeability, strengthens air circulation heat radiation;Fin increases heat transfer area of dissipation, improves radiating efficiency.
The bending of described heat-transfer matcrial layer or bending form the radiator with heat emission space, heat conductive wall, lumen.The heat emission space of this radiator, heat conductive wall radially or annular array, middle part hollow, can form cavity, can arrange LED at this cavity and drive power supply module.
Described radiator or heat-transfer matcrial layer can launch or stretch.Described heat emission space, heat conductive wall have certain transmutability, described radiator can be ring bodies or polyhedron, or other shapes, make the outward appearance of LED form various shape, are full of variety;Described heat emission space, heat conductive wall and the radiator formed thereof are bent by heat-transfer matcrial layer or bending is formed, there is certain transmutability, this radiator or heat-transfer matcrial layer can launch or stretch, heat radiation material layer can use the thinnest, can bend or the flexible material of bending, so can reduce manufacturing cost, improve manufacture, the easy motility installed and practicality.
The bending of described heat-transfer matcrial layer or bending are formed has the radiator of heat emission space, heat conductive wall, bent angle, planomural, lumen, described heat emission space relative to planomural uncovered the most alternately, described lumen is led directly to outside radiator by heat emission space.Described radiator can be folded by mould casting system or sheet material, (casting system) heat-transfer matcrial layer bending or (sheet material) bending form circular cylindrical body or polyhedron radiator etc., use state downside is seen, the bending of described heat-transfer matcrial layer or bending form the heat conductive wall being sequentially connected with, bent angle, planomural, middle part hollow forms lumen, heat emission space is formed between two heat conductive wall, planomural is as the diapire of heat emission space or roof, when planomural is as the diapire of heat emission space, heat emission space uncovered upward, when planomural is as the roof of heat emission space, heat emission space uncovered down, such alternate samsara arranges;Can arrange LED at lumen and drive power supply module, lumen leads directly to outside radiator by heat emission space, good heat dissipation effect of conducting heat.At described heat-transfer matcrial layer or heat conductive wall is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer can launch or stretch.Described bent angle can stretch.
It is provided with LED chip or LED-baseplate or LED circuit at described planomural.Directly LED chip or LED-baseplate or LED circuit being arranged on described planomural, heat transfer more directly efficiently, can save manufacture material, simplifies manufacturing process, reduces manufacturing cost, improves radiating efficiency, increases the service life.
The bending of described heat-transfer matcrial layer or bending are formed has the radiator of heat emission space, heat conductive wall, bent angle, lumen, described heat emission space relative to bent angle uncovered the most alternately, described lumen is led directly to outside radiator by heat emission space.Described radiator can cast system, and heat-transfer matcrial layer is bent to form circular cylindrical body or polyhedron radiator;Or use sheet metal bending to form circular cylindrical body or polyhedron radiator.Use state downside is seen, the bending of described heat-transfer matcrial layer or bending form heat conductive wall, the bent angle being sequentially connected with, heat emission space is formed between bent angle and two heat conductive wall thereof, described bent angle is as the diapire of heat emission space or roof, when bent angle is as the diapire of heat emission space, relative to the heat emission space of bent angle uncovered upward, when bent angle is as the roof of heat emission space, relative to the heat emission space of bent angle uncovered down, such samsara is alternately.Can arrange LED at lumen and drive power supply module, lumen leads directly to outside radiator by heat emission space, good heat dissipation effect of conducting heat.At described heat-transfer matcrial layer or heat conductive wall is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer can launch or stretch.Described bent angle can stretch.
The bending of described heat-transfer matcrial layer or bending are formed has the radiator of heat emission space, heat conductive wall, bent angle, lumen, described heat emission space relative to bent angle uncovered the most alternately.Described bent angle connects two heat conductive wall and forms heat emission space, bent angle interior then heat emission space uncovered outwardly, bent angle the most then heat emission space uncovered inwardly.This radiator can have the heat-transfer matcrial layer of multiple-layer overlapped from the inside to the outside and be bent by heat-transfer matcrial layer or bending forms the heat emission space of multiple overlap, bent angle, heat conductive wall.At described heat-transfer matcrial layer or heat conductive wall is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer can launch or stretch, described bent angle can stretch.LED can be set at described lumen and drive power supply module.
The bending of described heat-transfer matcrial layer or bending are formed has the radiator of heat emission space, heat conductive wall, bent angle, planomural, lumen, described heat emission space relative to planomural or bent angle uncovered the most alternately.Two bent angles, planomurals are connected between two heat conductive wall, or connect a bent angle between two heat conductive wall and form heat emission space, relative to the heat emission space of planomural or bent angle uncovered the most alternately, planomural or bent angle interior then heat emission space uncovered outwardly, planomural or bent angle the most then heat emission space uncovered inwardly.This radiator can have the heat-transfer matcrial layer of multiple-layer overlapped from the inside to the outside and be formed the heat emission space of multiple overlap, bent angle, heat conductive wall, planomural by the bending of this heat-transfer matcrial layer or bending.At described heat-transfer matcrial layer or heat conductive wall is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer can launch or stretch, described bent angle can stretch.LED can be set at described lumen and drive power supply module, at the end of this radiator or the side of heat-transfer matcrial layer or heat conductive wall, planomural, LED chip or LED-baseplate or LED circuit can be set.
The bending of described heat-transfer matcrial layer or bending roll and form the radiator with heat emission space, heat conductive wall, lumen.Described heat conductive wall, heat emission space arrange in the form of a ring, lower open mouth on described heat emission space.Described heat-transfer matcrial layer continuous bend rolls formation column or polygon radiator, heat-transfer matcrial layer continuous bend rolls and can form multilamellar in the form of a ring or polygonal heat conductive wall, heat emission space, under use state, lower open mouth on described heat emission space is formed between heat conductive wall.At described heat-transfer matcrial layer or heat conductive wall is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer can launch or stretch, LED can be set at described lumen and drive power supply module, on the end of this radiator or the side of heat-transfer matcrial layer or outer heat conductive wall, LED chip or LED-baseplate or LED circuit can be set.
nullCompared with the prior art,The present invention can use die casting,Or employing sheet material、Profile material (such as rectangle sheet material) etc. folds、Roll,Bent by heat-transfer matcrial layer or bending is formed and has some heat emission space、The column of heat conductive wall or the radiator of other shapes,This radiator has some heat emission space、Heat conductive wall,The lateral surface of whole radiator is connected by heat emission space or thermovent with (or center) in the middle part of it,The end of this radiator can connect formation end face by the side end of heat-transfer matcrial layer,End face at this radiator、Or planomural、Or the lateral end panel of heat-transfer matcrial layer、Or LED circuit can be set on outer heat transfer wall、LED chip、LED illuminator、LED-baseplate etc.,The lumen of described radiator,The installation position (installation cavity) of power supply module can be driven as LED,This radiator can be with die casting,Or employing sheet material、Profile material folds、Roll,Two end edge of sheet material are docked or amplexiform formation column with neighbouring heat conductive wall,Its consumptive material is few,Manufacture simplicity,Low cost of manufacture,Especially conduct heat good heat dissipation effect、Efficiency is high,The volume of LED can be reduced,The profile of abundant LED,Improve the outward appearance of LED.
The present invention is used for manufacturing LED, and result of the test shows, manufactures material and saves more than 30%, manufacturing cost reduces by more than 27%, extends more than one times service life, the volume-diminished 1/3rd of LED, the appearance design of LED is more flexible, and face shaping is more perfect.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of one embodiment of the present invention, its relative to the heat emission space of planomural uncovered the most alternately.
Fig. 2 is that Fig. 1 launches or stretches the intercept schematic diagram after rectangularity plate heat transfer material layer.
Fig. 3 is the schematic perspective view of another all embodiment of the present invention, its relative to bent angle uncovered the most alternately.
Fig. 4 is the schematic perspective view of another embodiment of the present invention, and it has the heat-transfer matcrial layer of multiple-layer overlapped, heat emission space, heat conductive wall, bent angle, relative to the heat emission space of bent angle uncovered the most alternately.
Fig. 5 is the schematic perspective view of another embodiment of the present invention, its relative to the heat emission space of planomural uncovered inwardly and relative to bent angle uncovered the most alternately.
Fig. 6 is that Fig. 5 launches or stretches the intercept schematic diagram after rectangularity plate heat transfer material layer.
Fig. 7 is the schematic perspective view of another embodiment of the present invention, and heat-transfer matcrial layer is bent to form the annular heat conductive wall of multiple-layer overlapped, heat emission space, lower open mouth on heat emission space.
Fig. 8 is that Fig. 7 launches or stretches the intercept schematic diagram after rectangularity plate heat transfer material layer.
In figure, 1. heat-transfer matcrial layer, 2. heat emission space, 3. heat conductive wall, 4. bent angle, 5. planomural, 6. thermovent, 7. lumen.
Detailed description of the invention
As shown in Fig. 16, this high-effect Low-cost LED lamp heat radiation protection mechanism, there is heat-transfer matcrial layer 1, heat-transfer matcrial layer 1 bends or bending is formed and has heat emission space 2, the radiator of heat conductive wall 3.Heat conductive wall 3 can be vertically arranged, horizontal, tilting, or bent by heat-transfer matcrial layer 1 or bending forms wave heat conductive wall, concavo-convex heat conductive wall etc., the heat emission space 2 formed between adjacent heat conductive wall 1 can have three faces, two faces, and other faces are opened wide.
Heat-transfer matcrial layer 1 can cast (casting system) by mould, it is bent to form by this heat-transfer matcrial layer and there is heat emission space 2, the radiator of heat conductive wall 3, heat emission space 2, heat conductive wall 3 are bent to form by this heat-transfer matcrial layer 1, and casting system can concurrently form heat-transfer matcrial layer 1 and the heat emission space 2 being bent to form by this heat-transfer matcrial layer 1, heat conductive wall 3;Existing sheet material or profile material (such as aluminium plate) can also be selected as heat-transfer matcrial layer 1, its bending formed and have heat emission space 2, the radiator of heat conductive wall 3, utilize sheet material or profile material manufacture, simple process, cost is lower.Heat-transfer matcrial layer 1 bends or bending can form column, polygon, ring-type etc. radiator.
Further, at heat-transfer matcrial layer 1 or heat conductive wall 3 arranges thermovent 6 or/and fin, and heat-transfer matcrial layer 1 is made to bend or bending is formed and has heat emission space 2, heat conductive wall 3, the radiator of lumen 7;Radiator or heat-transfer matcrial layer 1 can launch, stretch.
Fig. 1 is one embodiment of the present invention.Heat-transfer matcrial layer 1 bends or bending is formed and has heat emission space 2, heat conductive wall 3, bent angle 4, planomural 5, the radiator of lumen 7, heat emission space 2 relative to planomural 5 uncovered the most alternately, lumen 7 is led directly to outside radiator by heat emission space 2.Described radiator can be by mould casting system or employing sheet material, profile material folds, (casting system) heat-transfer matcrial layer 1 bends or (sheet material) bending forms circular cylindrical (can also form polyhedron) radiator, use state downside is seen, heat-transfer matcrial layer 1 bends or bending forms the heat conductive wall 3 being sequentially connected with, bent angle 4, planomural 5, middle part hollow forms lumen 7, heat emission space 2 is formed between two heat conductive wall 3, heat emission space 2 three opens wide, planomural 5 is as the diapire of heat emission space 2 or roof, when planomural 5 is as the diapire of heat emission space 2, uncovered (planomural 5 relative to as diapire) of heat emission space 2 upward, when planomural 5 is as the roof of heat emission space 2, uncovered (planomural 5 relative to as roof) of heat emission space 2 down, such alternate samsara arranges;Can arrange LED at lumen 7 drives power supply module, lumen 7 to lead directly to outside radiator by heat emission space 2, good heat dissipation effect of conducting heat.At described heat-transfer matcrial layer 1 or heat conductive wall 3 is provided with thermovent or/and fin.Described radiator or heat-transfer matcrial layer 1 can launch, stretch, and described bent angle 4 can stretch, such as Fig. 2.At planomural 5, LED circuit, LED chip, LED-baseplate etc. can be set.
The another embodiment of Fig. 1 is, heat-transfer matcrial layer 1 bends or bending is formed and has heat emission space 2, heat conductive wall 3, bent angle 4, the radiator of lumen 7, heat emission space 2 relative to bent angle 4 uncovered the most alternately, lumen 7 is led directly to outside radiator by heat emission space 2.I.e. eliminating planomural 5 on the basis of Fig. 1, heat conductive wall 3 is connected by bent angle 4 and is formed heat emission space 2.Use state downside is seen, described heat-transfer matcrial layer 1 bends or bending forms heat conductive wall 3, the bent angle 4 being sequentially connected with, heat emission space 2 is formed between two heat conductive wall 3, described bent angle 4 is as the diapire of heat emission space 2 or roof, when bent angle 4 is as the diapire of heat emission space 2, uncovered (bent angle 4 relative to as diapire) of heat emission space 2 upward, when bent angle 4 is as the roof of heat emission space 2, down, such samsara is alternately for uncovered (bent angle 4 relative to as roof) of heat emission space 2.Can arrange LED at lumen 7 drives power supply module, lumen 7 to lead directly to outside radiator by heat emission space 2, good heat dissipation effect of conducting heat.At heat-transfer matcrial layer 1 or heat conductive wall 3 is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer 1 can launch or stretch, described bent angle 4 can stretch.In the limit end of heat-transfer matcrial layer 1 or bent angle 4 or heat conductive wall 3, LED circuit, LED chip, LED-baseplate etc. can be set.
Fig. 3 is another embodiment of the present invention.Heat-transfer matcrial layer 1 bend or bending formed there is heat emission space 2, heat conductive wall 3, bent angle 4, the radiator of lumen 7, heat emission space 2 relative to bent angle 4 uncovered the most alternately.Bent angle 4 connects two heat conductive wall 3 and forms heat emission space 2, bent angle 4 interior then heat emission space 2 uncovered (relative to bent angle 4) outwardly, uncovered (relative to the bent angle 4) of bent angle 4 the most then heat emission space 2 inwardly, such samsara come and go forms polyhedron alternately.Can arrange LED at lumen 7 and drive power supply module, at heat-transfer matcrial layer 1 or heat conductive wall 3 is provided with thermovent 6 or/and fin, lumen 7 is connected outside radiator by thermovent 6.Described radiator or heat-transfer matcrial layer 1 can launch or stretch, and described bent angle 4 can stretch.In the limit end of heat-transfer matcrial layer 1 or the end face of radiator or heat conductive wall 3, LED circuit, LED chip, LED-baseplate etc. can be set.
Fig. 4 is another embodiment of the present invention.This multiaspect radiator has the heat-transfer matcrial layer 1 of multiple-layer overlapped from the inside to the outside and is bent by heat-transfer matcrial layer 1 or bending forms the heat emission space 2 of multiple overlap, bent angle 4, heat conductive wall 3.At heat-transfer matcrial layer 1 or heat conductive wall 3 is provided with thermovent or/and fin, described radiator or heat-transfer matcrial layer 1 can launch or stretch, described bent angle 4 can stretch, and can arrange LED at lumen 7 and drive power supply module.At the end face of described radiator or the limit end of heat-transfer matcrial layer 1 or outer heat transfer wall 3, LED circuit, LED chip, LED-baseplate etc. can be set.
Fig. 5 is another embodiment of the present invention, heat-transfer matcrial layer 1 bends or bending forms the multiaspect radiator (this figure is its cross sectional representation) with heat emission space 2, heat conductive wall 3, bent angle 4, planomural 5, lumen 7, heat emission space 2 relative to planomural uncovered inwardly, relative to bent angle uncovered outwardly, the most alternately.Connect 4, planomural 5 of two bent angles between two heat conductive wall 3 and form heat emission space 2, or connect a bent angle 4 between two heat conductive wall 3 and form heat emission space 2, uncovered (relative to the planomural 5) of planomural 5 the most then heat emission space 2 inwardly, bent angle 4 interior then heat emission space 2 uncovered (relative to bent angle 4) outwardly.This radiator can have the heat-transfer matcrial layer 1 of multiple-layer overlapped from the inside to the outside and be bent by this heat-transfer matcrial layer 1 or bending forms the heat emission space 2 of multiple overlap, bent angle 4, heat conductive wall 3, planomural 5.At described heat-transfer matcrial layer 1 or heat conductive wall 3 is provided with thermovent or/and fin.Described radiator or heat-transfer matcrial layer 1 can launch or stretch, and described bent angle 4 can stretch, such as Fig. 6.LED can be set at lumen 7 and drive power supply module.On the end face of this radiator or the lateral end panel of heat-transfer matcrial layer 1 or heat conductive wall 3, planomural 5, LED chip or LED-baseplate can be set.
Fig. 7 is another embodiment of the present invention.Heat-transfer matcrial layer 1 bends or bending rolls formation and has heat emission space 2, heat conductive wall 3, the column of lumen 7 or multiaspect radiator.Described heat conductive wall 3, heat emission space 4 arrange in the form of a ring, lower open mouth on described heat emission space 4.Heat-transfer matcrial layer 1 continuous bend rolls formation column or polygon radiator, heat-transfer matcrial layer 1 continuous bend rolls and can form the spaced multilamellar of tool in the form of a ring or the heat conductive wall 3 of polygonal arrangement, interval between heat conductive wall forms heat emission space 2, under use state, lower open mouth on heat emission space 2.At heat-transfer matcrial layer 1 or heat conductive wall 3 is provided with thermovent or/and fin.Described radiator or heat-transfer matcrial layer 1 can launch or stretch, and see Fig. 8.LED can be set at described lumen 7 and drive power supply module, on the end of this radiator or end face or the lateral end panel of heat-transfer matcrial layer or outer heat conductive wall, LED chip or LED-baseplate can be set.
Other embodiment: can be by casting system or use sheet material as heat-transfer matcrial layer 1, bending folds (connection of sheet material two end edge), having some concavo-convex heat conductive wall 3, some similar V-arrangements or/and the column radiator of U-shaped heat emission space 2, this column radiator launches to be rectangle sheet material.Heat-transfer matcrial layer 1 is bent to form some concavo-convex heat conductive wall 3, some similar V-arrangements or/and the heat emission space 2 of U-shaped.At the concave bottom of concavo-convex heat conductive wall 3 or/and convex top, can arrange rectangular thermovent 6, this rectangular thermovent 6 is axially opened in the concave bottom of concavo-convex heat conductive wall 3 or/and convex top along column radiator.Axially being opened in the concave bottom of concavo-convex heat conductive wall 3 or/and the rectangle thermovent 6 on convex top along column radiator, its radiating effect is better than the thermovent 6 laterally offered along radiator.Further, at the concave bottom of concavo-convex heat conductive wall 3 or/and convex top, axially offering narrow upper width (under use state) under rectangle thermovent along radiator, so can produce thermal current and squeeze spray effect, make heat radiation more smooth, effect is more preferable.Heat-transfer matcrial layer 1 bending can form lumen 7, can drive power supply module with mounted LED lamp at this lumen 7.In the end face of described radiator, the lateral end panel (limit end) of heat-transfer matcrial layer, heat conductive wall, LED chip, LED circuit, LED illuminator, LED-baseplate can be set.
For having Spaced overlap heat conductive wall, the cylinder of heat emission space, polygon radiator, the heat conductive wall 3 being bent to form at heat-transfer matcrial layer 1 can arrange rectangle, circle, polygon thermovent, further, this thermovent line correspondence is opened in the heat conductive wall 3 of each layer, narrow upper width (use state) under long and narrow thermovent, so can obtain thermal current and squeeze spray effect, make heat radiation more smooth, effect is more preferable.It can be formed by rectangle sheet material (such as aluminium) continuous bend, can drive power supply module with mounted LED lamp at its lumen 7 formed.In the end face of described radiator, the lateral end panel (limit end) of heat-transfer matcrial layer, heat conductive wall, LED chip, LED circuit, LED illuminator, LED-baseplate can be set.

Claims (10)

1. a high-effect Low-cost LED lamp heat radiation protection mechanism, has heat-transfer matcrial layer (1), it is characterized in that, the bending of described heat-transfer matcrial layer (1) or bending are formed has heat emission space (2), the radiator of heat conductive wall (3).
High-effect Low-cost LED lamp the most according to claim 1 heat radiation protection mechanism, is characterized in that, described heat-transfer matcrial layer (1) or heat conductive wall (3) is provided with thermovent (6) or/and fin.
High-effect Low-cost LED lamp the most according to claim 1 heat radiation protection mechanism, is characterized in that, the bending of described heat-transfer matcrial layer (1) or bending are formed has heat emission space (2), heat conductive wall (3), the radiator of lumen (7).
High-effect Low-cost LED lamp the most according to claim 1 heat radiation protection mechanism, is characterized in that, described radiator or heat-transfer matcrial layer (1) can launch or stretch.
5. according to the high-effect Low-cost LED lamp heat radiation protection mechanism described in any one of claim 1-4; it is characterized in that; the bending of described heat-transfer matcrial layer (1) or bending are formed has heat emission space (2), heat conductive wall (3), bent angle (4), planomural (5), the radiator of lumen (7); described heat emission space (2) uncovered the most alternately, described lumen (7) by the straight-through radiator of heat emission space (2) outside.
High-effect Low-cost LED lamp the most according to claim 5 heat radiation protection mechanism, is characterized in that, be provided with LED chip or LED-baseplate at described planomural (5).
7. according to the high-effect Low-cost LED lamp heat radiation protection mechanism described in any one of claim 1-4; it is characterized in that; the bending of described heat-transfer matcrial layer (1) or bending are formed has heat emission space (2), heat conductive wall (3), bent angle (4), the radiator of lumen (7); described heat emission space (2) uncovered the most alternately, described lumen (7) by the straight-through radiator of heat emission space (2) outside.
8. according to the high-effect Low-cost LED lamp heat radiation protection mechanism described in any one of claim 1-4; it is characterized in that; described heat-transfer matcrial layer (1) bending or bending formed there is heat emission space (2), heat conductive wall (3), bent angle (4), the radiator of lumen (7), described heat emission space (2) uncovered the most alternately.
9. according to the high-effect Low-cost LED lamp heat radiation protection mechanism described in any one of claim 1-4; it is characterized in that; described heat-transfer matcrial layer (1) bending or bending formed there is heat emission space (2), heat conductive wall (3), bent angle (4), planomural (5), the radiator of lumen (7), described heat emission space (2) uncovered the most alternately.
10. according to the high-effect Low-cost LED lamp heat radiation protection mechanism described in any one of claim 1-4; it is characterized in that; the bending of described heat-transfer matcrial layer (1) or bending roll formation and have heat emission space (2), heat conductive wall (3), the radiator of lumen (7); described heat conductive wall (3), heat emission space (4) arrange in the form of a ring, the upper lower open mouth of described heat emission space (4).
CN201510165454.9A 2014-10-29 2015-04-09 High-effect Low-cost LED lamp heat radiation protection mechanism Pending CN106152078A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201410596415X 2014-10-29
CN201420638374 2014-10-29
CN201410596415 2014-10-29
CN2014206383741 2014-10-29

Publications (1)

Publication Number Publication Date
CN106152078A true CN106152078A (en) 2016-11-23

Family

ID=54471544

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201520210771.3U Expired - Fee Related CN204756841U (en) 2014-10-29 2015-04-09 High -effect low -cost LED lamp heat radiation protection mechanism
CN201510165454.9A Pending CN106152078A (en) 2014-10-29 2015-04-09 High-effect Low-cost LED lamp heat radiation protection mechanism

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201520210771.3U Expired - Fee Related CN204756841U (en) 2014-10-29 2015-04-09 High -effect low -cost LED lamp heat radiation protection mechanism

Country Status (1)

Country Link
CN (2) CN204756841U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114673972A (en) * 2022-05-31 2022-06-28 佛山市捷力威金属制品有限公司 Heat abstractor and fishing lamp

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204756841U (en) * 2014-10-29 2015-11-11 黄子晋 High -effect low -cost LED lamp heat radiation protection mechanism

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201892180U (en) * 2010-01-28 2011-07-06 陈世明 Combined structure of bent-surface fin module and heat source
CN102606923A (en) * 2012-03-12 2012-07-25 浙江名芯半导体科技有限公司 Screw-free light emitting diode (LED) bulb lamp
CN202469981U (en) * 2012-02-21 2012-10-03 黄子晋 Low-cost high-efficiency heat radiator for long-service-life energy-saving LED lamp
CN203115909U (en) * 2012-12-26 2013-08-07 深圳市仕贝德科技有限公司 Integrated LED (Light Emitting Diode) radiator
US20140247609A1 (en) * 2011-10-26 2014-09-04 Hangzhou Hpwinner Opto Corporation Manufacturing method of lamp housing type heat-sink, lamp housing type heat-sink and led lighting device
CN204756841U (en) * 2014-10-29 2015-11-11 黄子晋 High -effect low -cost LED lamp heat radiation protection mechanism

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201892180U (en) * 2010-01-28 2011-07-06 陈世明 Combined structure of bent-surface fin module and heat source
US20140247609A1 (en) * 2011-10-26 2014-09-04 Hangzhou Hpwinner Opto Corporation Manufacturing method of lamp housing type heat-sink, lamp housing type heat-sink and led lighting device
CN202469981U (en) * 2012-02-21 2012-10-03 黄子晋 Low-cost high-efficiency heat radiator for long-service-life energy-saving LED lamp
CN102606923A (en) * 2012-03-12 2012-07-25 浙江名芯半导体科技有限公司 Screw-free light emitting diode (LED) bulb lamp
CN203115909U (en) * 2012-12-26 2013-08-07 深圳市仕贝德科技有限公司 Integrated LED (Light Emitting Diode) radiator
CN204756841U (en) * 2014-10-29 2015-11-11 黄子晋 High -effect low -cost LED lamp heat radiation protection mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114673972A (en) * 2022-05-31 2022-06-28 佛山市捷力威金属制品有限公司 Heat abstractor and fishing lamp

Also Published As

Publication number Publication date
CN204756841U (en) 2015-11-11

Similar Documents

Publication Publication Date Title
CN204756841U (en) High -effect low -cost LED lamp heat radiation protection mechanism
CN103174968A (en) Lamp socket and lamp
CN104791885A (en) Vertical heater capable of outflowing air by 360 degrees
CN104654433A (en) Cooling fin with zigzag heat dissipation part and electrothermal oil heater using cooling fin
CN201269511Y (en) LED lamp with improved cooling structure
CN106152079A (en) The manufacture method of high-effect Low-cost LED lamp heat radiation protection mechanism
CN204534784U (en) A kind of can the vertical warmer of 360 degree of air-out
CN202001886U (en) Light emitting diode lamp bulb
CN102721315A (en) Electrothermal oil heater and radiating fin structure thereof
CN204649054U (en) A kind of Split radiator
CN201993023U (en) Electric heating oil heater and radiating fin structure thereof
CN204373051U (en) With tortuous radiating part fin and use the electric heating installation using oil as medium of this fin
CN202747003U (en) Candle lamp
CN207893722U (en) Radiator
CN105889823A (en) Convection heat dissipation type LED downlight
CN205332879U (en) Three unit construction formula cooling tubes
CN103939868A (en) Heat-dissipation structure of LED lamp
CN203179840U (en) Energy saving lamp
CN206656176U (en) Low cost manufactures the pattern of high-quality LED
CN206410583U (en) Single hole gets radiating tube ready
CN206656309U (en) The high-quality LED cooling mechanism curable type the core of the card of low cost
CN201242369Y (en) Gilled tube radiator for automobile
CN202024479U (en) Water tank of gas water heater
CN206207077U (en) The radiator and LEDbulb lamp of LEDbulb lamp
CN205560356U (en) LED (light emitting diode) lamp with long service life

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20161123

WD01 Invention patent application deemed withdrawn after publication