CN106148794B - A kind of copper-tungsten of dopen Nano iron powder and preparation method thereof - Google Patents
A kind of copper-tungsten of dopen Nano iron powder and preparation method thereof Download PDFInfo
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- CN106148794B CN106148794B CN201610693411.2A CN201610693411A CN106148794B CN 106148794 B CN106148794 B CN 106148794B CN 201610693411 A CN201610693411 A CN 201610693411A CN 106148794 B CN106148794 B CN 106148794B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/045—Alloys based on refractory metals
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Abstract
The invention discloses copper-tungsten of a kind of dopen Nano iron powder for belonging to new material preparation techniques scope and preparation method thereof.The copper-tungsten is adulterates the ternary tungsten-copper alloy of micro nanometer iron powder, alloy formula ratio:W content 60 90%, the 0.45wt% of iron content 0.1, surplus is copper;Dispensing, skeleton sintering and melting infiltration sintering by proper proportion form.Dopen Nano state iron powder of the present invention is advantageous to dopant Dispersed precipitate, activated sintering effect can more be played, overcome superfines that there is agglomeration, it is difficult to uniformly it is mixed into the deficiency in copper tungsten powder, the intensity of W skeleton and the relative density of infiltration alloy are improved, so as to effectively improve the arc ablation resistance ability of copper-tungsten.
Description
Technical field
The invention belongs to new material technology scope, the copper-tungsten of more particularly to a kind of dopen Nano iron powder and its preparation side
Method.
Background technology
Copper-tungsten is the pseudo-alloy of the tungsten that a kind of powder metallurgical technique manufactures and copper, strong in electrical and thermal conductivity performance and high temperature
In terms of degree, there is excellent combination property, in addition, copper-tungsten is also with thermal coefficient of expansion is small, arc ablation resistance function admirable
The characteristics of, its metal cutting is functional, is easy to process.Copper-tungsten has wide purposes, and wherein most is applied to
The industries such as space flight, aviation, electronics, electric power, metallurgy.Such as:Electrode, die material, the contact elements of power switch of electric machining
Deng.Ablation resistance is the main performance of copper-tungsten.
Flake nano iron powder outward appearance is black powder, and sheet, thickness about 20nm, the length of side about 200nm. are shown as under Electronic Speculum
The doping iron cobalt nickel element in copper tungsten, can play a part of activated sintering, improve the intensity of W skeleton and the phase of infiltration alloy
To density, so as to effectively improve the arc ablation resistance ability of copper-tungsten.But doping iron-cobalt-nickel causes copper-tungsten conductance
The risk that rate declines, doped chemical is generally controlled to be no more than weight than 0.5%, because copper tungsten is pseudo-alloy, powder metallurgically manufacturing
During, micro doped chemical is added wherein, and homogenization is relatively difficult.Due to the good dispersion of nanomorphic metal, doping is received
Rice state metal is advantageous to dopant Dispersed precipitate, can more play activated sintering effect.
The content of the invention
It is an object of the invention to provide a kind of copper-tungsten of dopen Nano iron powder and preparation method thereof, it is characterised in that
For the copper-tungsten to adulterate the ternary tungsten-copper alloy of micro nanometer iron powder, the copper-tungsten is the ternary for adulterating micro nanometer iron powder
Tungsten-copper alloy, the tungsten-copper alloy formula rate of dopen Nano iron powder:W content 60-90wt%, iron content 0.1-0.45wt%, it is remaining
Measure as copper;0-15wt% copper is first added during dispensing, remaining copper content oozes foot during follow-up infiltration;Its preparation method
Comprise the following steps:
1) according to aforementioned proportion dispensing, specifically include:
1.1 are first according to W content 60-90wt% and copper content 0-15wt% ratio dispensing, are well mixed stand-by;So
Each content of content 0.1-0.45wt% nanometer iron powders is dissolved in 100ml ethanol respectively afterwards, stirs, turns into solution A;
1.2 according to 1:9 ratios add 90ml glycerine in 810ml ethanol, and 80 DEG C of heating water baths are completely dissolved, and turn into molten
Liquid B;
1.3, then by 100ml solution As, add in 900ml solution Bs, are mixed into 1000ml solution Cs, continue with 80 DEG C of water-baths
Heating is well mixed;In this way, nanometer iron powder is mixed in the solvent of ethanol and glycerine, glycerine is used as alloyed powder simultaneously
The binding agent at end uses;
1.4 pour into the ratio according to " 100ml solution Cs/kilogram copper tungsten powder " by mixed uniformly copper tungsten powder, stirring
Uniform, air-dried, 40 mesh sieves excessively are mixed, obtain cohesive copper tungsten powder;
2) skeleton sinters
The copper tungsten powder that step 1.4 obtains is pressed into blank, is put into reducing atmosphere sintering furnace, is burnt according to following technique
Knot:
2.1 are warming up to 350 DEG C of insulation 0.5h with 6-8 DEG C/min of speed, to exclude binding agent;
2.2 are warming up to 1000 DEG C with 10-13 DEG C/min of speed, are incubated 0.5h, carry out pre-sintered;
2.3 are warming up to 1400 DEG C with 6-10 DEG C/min of speed, are incubated 1h, carry out skeleton sintering;
2.4 furnace coolings, room temperature are taken out;
3) melting infiltration sintering
The copper billet of infiltration copper content is will be slightly larger than, is placed on by skeleton sintered compact, being exceeded with heat resisting temperature
1600 DEG C of white fused alumina covering, it is warming up to 1400 DEG C of progress melting infiltration sinterings, soaking time 2H, then furnace cooling to normal temperature, machine
Processing mode removes unnecessary copper, you can obtains qualified product.
The beneficial effects of the invention are as follows dopen Nano state iron powder of the present invention to be advantageous to dopant Dispersed precipitate, can more play work
Change agglomeration, overcome superfines that there is agglomeration, it is difficult to uniformly be mixed into the deficiency in copper tungsten powder, improve W skeleton
The relative density of intensity and infiltration alloy, so as to effectively improve the arc ablation resistance ability of copper-tungsten.
Embodiment
The present invention provides a kind of copper-tungsten of dopen Nano iron powder and preparation method thereof, and the copper-tungsten is micro to adulterate
The ternary tungsten-copper alloy of nanometer iron powder, the tungsten-copper alloy formula rate of dopen Nano iron powder:W content 60-90%, iron content
0.1-0.45wt%, surplus are copper;0-15wt% copper is first added during dispensing, remaining copper content is during follow-up infiltration
Ooze foot;It is described as follows below using configuring 1kg copper tungsten powders as embodiment.
Embodiment 1
1) according to the ratio dispensing of table 1,
The bronze medal of table 1, tungsten, iron proportioning
Specific steps include:
1.1, first in W content in table 1 and each ratio dispensing of copper content, are well mixed stand-by respectively;Then by content
0.45wt% nanometer iron powder is dissolved in 100ml ethanol respectively, stirs, and turns into solution A;
1.2 according to 1:9 ratios add 90ml glycerine in 810ml ethanol, and 80 DEG C of heating water baths are completely dissolved, and turn into molten
Liquid B;
1.3, then by 100ml solution As, add in 900ml solution Bs, are mixed into 1000ml solution Cs, continue with 80 DEG C of water-baths
Heating is well mixed;In this way, nanometer iron powder is mixed in the solvent of ethanol and glycerine, glycerine is used as alloyed powder simultaneously
The binding agent at end uses;
1.4 pour into the ratio according to " 100ml solution Cs/kilogram copper tungsten powder " by mixed uniformly copper tungsten powder, stirring
Uniform, air-dried, 40 mesh sieves excessively are mixed, obtain cohesive copper tungsten powder;
2) skeleton sinters
The copper tungsten powder that step 1.4 obtains is pressed into blank, is put into reducing atmosphere sintering furnace, is burnt according to following technique
Knot:
2.1 are warming up to 350 DEG C of insulation 0.5h with 6-8 DEG C/min of speed, to exclude binding agent;
2.2 are warming up to 1000 DEG C with 10-13 DEG C/min of speed, are incubated 0.5h, carry out pre-sintered;
2.3 are warming up to 1400 DEG C with 6-10 DEG C/min of speed, are incubated 1h, carry out skeleton sintering;
2.4 furnace coolings, room temperature are taken out;
3) melting infiltration sintering
It is placed on by skeleton sintered compact, the copper billet of infiltration copper content in the table 1 for infiltration with heat-resisting temperature
The white fused alumina covering more than 1600 DEG C is spent, is warming up to 1400 DEG C of progress melting infiltration sinterings, soaking time 2H, then furnace cooling is to often
Temperature, machining mode remove unnecessary copper, you can obtain qualified product.
Embodiment 2
Technical process is same as Example 1, and the content for changing nanometer iron powder is 0.35wt%, and infiltration copper content changes accordingly
Become, copper as shown in table 2, tungsten, iron proportioning;Unnecessary copper is finally removed with machining mode, you can obtain qualified product.
The bronze medal of table 2, tungsten, iron proportioning
Embodiment 3
Technical process is same as Example 1, and the content for changing nanometer iron powder is 0.25wt%, and infiltration copper content changes accordingly
Become, copper as shown in table 3, tungsten, iron proportioning;Unnecessary copper is finally removed with machining mode, you can obtain qualified product.
The bronze medal of table 3, tungsten, iron proportioning
。
Claims (1)
1. a kind of preparation method of the copper-tungsten of dopen Nano iron powder, it is characterised in that the copper-tungsten is received for doping is micro
The ternary tungsten-copper alloy of rice iron powder, the tungsten-copper alloy formula rate of dopen Nano iron powder:W content 60-90%, iron content 0.1-
0.45wt%, surplus are copper;0-15wt% copper is first added during dispensing, remaining copper content is oozed during follow-up infiltration
Foot;Its preparation method comprises the following steps:
1) according to W content 60-90wt%, iron content 0.1-0.45wt% ratio dispensing, surplus is that copper carries out dispensing;Specifically
Including:
1.1 are first according to W content 60-90wt% and copper content 0-15wt% ratio dispensing, are well mixed stand-by;Then will
Each content of content 0.1-0.45wt% nanometer iron powders is dissolved in 100ml ethanol respectively, stirs, turns into solution A;
1.2 according to 1:9 ratios add 90mL glycerine in 810mL ethanol, and 80 DEG C of heating water baths are completely dissolved, and turn into solution B;
1.3, then by 100mL solution As, add in 900mL solution Bs, are mixed into 1000mL solution Cs, continue with 80 DEG C of heating water baths
It is well mixed;In this way, nanometer iron powder is mixed in the solvent of ethanol and glycerine, glycerine is simultaneously as alloy powder
Binding agent uses;
1.4 pour into the ratio according to " 100mL solution Cs/kilogram copper tungsten powder " in mixed uniformly copper tungsten powder, stir,
Air-dry, cross 40 mesh sieves, obtain cohesive copper tungsten powder;
2) skeleton sinters
The bond copper tungsten powder that step 1.4 obtains is pressed into blank, is put into reducing atmosphere sintering furnace, is burnt according to following technique
Knot:
2.1 are warming up to 350 DEG C of insulation 0.5h with 6-8 DEG C/min of speed, to exclude binding agent;
2.2 are warming up to 1000 DEG C with 10-13 DEG C/min of speed, are incubated 0.5h, carry out pre-sintered;
2.3 are warming up to 1400 DEG C with 6-10 DEG C/min of speed, are incubated 1h, carry out skeleton sintering;
2.4 furnace coolings, room temperature are taken out;
3) melting infiltration sintering
The copper billet of infiltration copper content is will be slightly larger than, is placed on by skeleton sintered compact, with heat resisting temperature more than 1600 DEG C
White fused alumina covering, be warming up to 1400 DEG C progress melting infiltration sinterings, soaking time 2H, then furnace cooling to normal temperature, machining side
Formula removes unnecessary copper, you can obtains qualified product.
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CN114535589B (en) * | 2022-01-07 | 2024-02-13 | 西安理工大学 | Preparation method of tungsten copper heat sink component for optical module |
CN117802378B (en) * | 2024-02-29 | 2024-04-30 | 东北大学 | Tungsten copper composite material with multi-scale structure and preparation method thereof |
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JP2559085B2 (en) * | 1992-01-17 | 1996-11-27 | 東京タングステン株式会社 | Composite sintered material and manufacturing method thereof |
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CN1157467A (en) * | 1995-12-13 | 1997-08-20 | 东芝株式会社 | Contact material for vacuum interrupter and method for producing the same |
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CN101658905A (en) * | 2009-10-16 | 2010-03-03 | 大连理工大学 | Methods for preparing continuous casting crystallizer copper plate surface modified W-Cu alloy layer and application thereof |
CN102347158A (en) * | 2010-07-29 | 2012-02-08 | 蒋国泉 | Processing technique for high-power hard copper-tungsten-iron (Cu-W-Fe) compound electrical contact |
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Effective date of registration: 20200521 Address after: 034000 Hill 0005, South Second Lane, Fenyuan Street, Xinzhou Development Zone, Shanxi Province Patentee after: Xinzhou Shanghuayang Electrical Equipment Co.,Ltd. Address before: 100018 Beijing city Chaoyang District Backstreet No. 116 Patentee before: BEIJING SHINEWINNER ELECTRONIC TECHNOLOGY DEVELOPMENT Co.,Ltd. |