CN106147677A - LED Lamp cup sealing heat-conducting type is without shadow glue - Google Patents
LED Lamp cup sealing heat-conducting type is without shadow glue Download PDFInfo
- Publication number
- CN106147677A CN106147677A CN201610530027.0A CN201610530027A CN106147677A CN 106147677 A CN106147677 A CN 106147677A CN 201610530027 A CN201610530027 A CN 201610530027A CN 106147677 A CN106147677 A CN 106147677A
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- CN
- China
- Prior art keywords
- parts
- led lamp
- lamp cup
- heat
- cup sealing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Abstract
The invention discloses a kind of LED Lamp cup sealing heat-conducting type without shadow glue, it is characterized in that: each component comprising following weight portion: prepolymer 40 ~ 60 parts, diluent 20 ~ 30 parts, light trigger 2 ~ 5 parts, firming agent microcapsule 10 ~ 20 parts, auxiliary agent 1.5 ~ 2 parts, heat filling 2 ~ 5 parts, heat-conducting silicone grease 5 ~ 10 parts.A kind of LED Lamp cup sealing heat-conducting type that the present invention provides, without shadow glue, has heat conductivility, makes LED good heat dissipation effect, and service life is long, and stability the most of the present invention is strong, can longer-term storage, firming agent is difficult to react with other compositions.
Description
Technical field
The present invention relates to a kind of LED Lamp cup sealing heat-conducting type without shadow glue, belong to technical field of macromolecular adhesive.
Background technology
Along with LED technology received extensive concern as a new generation's lighting engineering in the last few years, LED power strengthens, heat radiation
Problem is the most increasingly paid attention to by people.The light decay of LED or its life-span are the most relevant with its junction temperature, and bad junction temperature of dispelling the heat is the highest,
Life-span is the shortest.
The reason of LED heating is because added electric energy and is not completely converted into luminous energy, but a part changes into
For heat energy.The light efficiency of LED only has 100lm/W, its electro-optical efficiency only about about 20 ~ 30% at present.The most about
The electric energy of 70% all becomes heat energy.
The thermal capacity of LED is the least, and little by little the accumulation of heat will make the junction temperature of lamp improve rapidly, if over a long time
Being operated in the state of high temperature, its life-span will quickly shorten.
Current LED Lamp cup sealing is generally not heat-conducting glue without shadow glue, causes the heat in Lamp cup to be difficult to shed, makes
LED is greatly shortened service life.
It addition, existing LED Lamp cup sealing is without the general less stable of shadow glue, storage period is short, uses without shadow glue and opens
Easily react before envelope, cause inactivating without shadow glue.
Summary of the invention
Present invention solves the technical problem that the LED Lamp cup sealing heat-conducting type being to provide a kind of good heat dissipation effect is without shadow
Glue；Further, the present invention provides a kind of stability strong, can the LED Lamp cup sealing heat-conducting type of longer-term storage without shadow glue.
For solving above-mentioned technical problem, the technical solution used in the present invention is:
LED Lamp cup sealing heat-conducting type, without shadow glue, comprises each component of following weight portion: prepolymer 40 ~ 60 parts, diluent 20
~ 30 parts, light trigger 2 ~ 5 parts, firming agent microcapsule 10 ~ 20 parts, auxiliary agent 1.5 ~ 2 parts, heat filling 2 ~ 5 parts, heat-conducting silicone grease 5 ~ 10
Part.
Described prepolymer includes epoxy resin.
Described diluent includes isobornyl acrylate, tri (propylene glycol) diacrylate and tetramethylolmethane three propylene three
One or more in ester.
Described light trigger includes benzophenone compound.
Described firming agent microcapsule includes the microsphere with capsule material parcel firming agent, a diameter of 100 ~ 200 μm of described microsphere.
The material of preparing of described firming agent microcapsule includes the component of following weight portion: 1 ~ 3 part of firming agent, arabic gum 1 ~ 3
Part, 1 ~ 3 part of gelatin, formalin 0.5 ~ 1.5 part, acid solution is appropriate, and aqueous slkali is appropriate, and distilled water is appropriate, defoamer 0.1 ~ 0.2
Part.
The preparation method of described firming agent microcapsule comprises the following steps:
S01, the preparation of gelatin solution: take 1 ~ 3 part of gelatin, with a small amount of distilled water immersion swelling after, add distilled water to 20 ~ 30 weight
Part, 60 ~ 80 DEG C of heating for dissolving, 50 DEG C of insulations are standby；
S02, the preparation of gumwater: take distilled water 10 ~ 15 weight portion and put in beaker, add arabic gum 1 ~ 3 part, be heated to
70 ~ 80 DEG C, it is stirred to dissolve, adds distilled water after dissolving to 20 ~ 30 weight portions, standby；
S03, the preparation of Emulsion: take 1 ~ 3 part of firming agent and put in mortar, the most in the same direction with gumwater 20 ~ 30 parts
Grind at least 5min, obtain Emulsion；
S04, mixing: described Emulsion is proceeded in beaker, to 50 ~ 60 DEG C of water-baths, add gelatin solution 20 ~ 30 parts, and addition disappears
Infusion 0.1 ~ 0.2 part, stirring；
S05, the preparation of microcapsule: dropping acid is dissolved in S04 in whipping process, regulation pH value is to 3.8 ~ 4.0, and constantly stirs
Mix, obtain microcapsule；
S06, the solidification of microcapsule: add distilled water 50 ~ 100 weight portion of 30 ~ 35 DEG C in whipping process in S05, by beaker
Taking out in water-bath, stirring, natural cooling, when temperature is 30 ~ 35 DEG C, add ice cube, continuing stirring to temperature is less than 10 DEG C,
Add formalin 0.5 ~ 1.5 part, stir at least 15min, then with aqueous slkali regulation pH value to 8 ~ 9, continue stirring at least
15min, obtains the microcapsule after solidification.
Described defoamer includes amylalcohol or capryl alcohol.
Described heat filling includes nanoscale aluminium nitride or CNT.
Described firming agent includes polyether diamine, diethylamine, ethylenediamine, diethylenetriamine or diaminodiphenyl-methane.
Acid solution includes that acetum, described aqueous slkali include sodium hydroxide solution.
A kind of LED Lamp cup sealing heat-conducting type that the present invention provides without the setting of shadow glue, heat filling and heat-conducting silicone grease,
Make the present invention have heat conductivility, make LED good heat dissipation effect；The setting of firming agent microcapsule, makes stability of the present invention strong, can grow
Phase stores, and firming agent is difficult to react with other compositions；The setting of defoamer, makes the bubble that the present invention produces in whipping process
Foam is few, and the microcapsule yield of preparation is high.
Detailed description of the invention
In conjunction with specific examples below, the present invention is described in further detail, and following instance is merely illustrative, this
The protection content of invention is not limited to this.
Embodiment 1:
LED Lamp cup sealing heat-conducting type, without shadow glue, comprises each component of following weight portion: prepolymer 40 parts, diluent 20 parts,
Light trigger 2 parts, firming agent microcapsule 10 parts, auxiliary agent 1.5 parts, heat filling 2 parts, heat-conducting silicone grease 5 parts.
Described prepolymer includes epoxy resin.
Described diluent includes isobornyl acrylate, tri (propylene glycol) diacrylate and tetramethylolmethane three propylene three
One or more in ester.
Described light trigger includes benzophenone compound.
Described firming agent microcapsule includes the microsphere with capsule material parcel firming agent, a diameter of 100 μm of described microsphere.
The material of preparing of described firming agent microcapsule includes the component of following weight portion: 1 part of firming agent, arabic gum 1 part, bright
1 part of glue, formalin 0.5 part, acid solution is appropriate, and aqueous slkali is appropriate, and distilled water is appropriate, defoamer 0.1 part.
The preparation method of described firming agent microcapsule comprises the following steps:
S01, the preparation of gelatin solution: take 1 part of gelatin, with a small amount of distilled water immersion swelling after, add distilled water to 20 weight portions, 60
DEG C heating for dissolving, 50 DEG C of insulations are standby；
S02, the preparation of gumwater: take distilled water 10 weight portion and put in beaker, add arabic gum 1 part, be heated to 70 DEG C,
It is stirred to dissolve, adds distilled water after dissolving to 20 weight portions, standby；
S03, the preparation of Emulsion: take 1 part of firming agent and put in mortar with gumwater 20 parts, be ground to the most in the same direction
Few 5min, obtains Emulsion；
S04, mixing: described Emulsion is proceeded in beaker, to 50 DEG C of water-baths, adds gelatin solution 20 parts, and add defoamer 0.1
Part, stirring；
S05, the preparation of microcapsule: dropping acid is dissolved in S04 in whipping process, regulation pH value is to 3.8, and is stirred continuously,
Microcapsule；
S06, the solidification of microcapsule: add distilled water 50 weight portion of 30 DEG C in whipping process in S05, will take in sub-for beaker water-bath
Going out, stirring, natural cooling, when temperature is 30 DEG C, add ice cube, continuing stirring to temperature is less than 10 DEG C, adds formaldehyde molten
Liquid 0.5 part, stirs at least 15min, then with aqueous slkali regulation pH value to 8, continues to stir at least 15min, obtain the microcapsule after solidification.
Described defoamer includes amylalcohol or capryl alcohol.
Described heat filling includes nanoscale aluminium nitride or CNT.
Described firming agent includes polyether diamine, diethylamine, ethylenediamine, diethylenetriamine or diaminodiphenyl-methane.
Embodiment 2:
LED Lamp cup sealing heat-conducting type, without shadow glue, comprises each component of following weight portion: prepolymer 60 parts, diluent 30 parts,
Light trigger 5 parts, firming agent microcapsule 20 parts, auxiliary agent 2 parts, heat filling 5 parts, heat-conducting silicone grease 10 parts.
Described prepolymer includes epoxy resin.
Described diluent includes isobornyl acrylate, tri (propylene glycol) diacrylate and tetramethylolmethane three propylene three
One or more in ester.
Described light trigger includes benzophenone compound.
Described firming agent microcapsule includes the microsphere with capsule material parcel firming agent, a diameter of 200 μm of described microsphere.
The material of preparing of described firming agent microcapsule includes the component of following weight portion: 3 parts of firming agent, arabic gum 3 parts, bright
3 parts of glue, formalin 1.5 parts, acid solution is appropriate, and aqueous slkali is appropriate, and distilled water is appropriate, defoamer 0.2 part.
The preparation method of described firming agent microcapsule comprises the following steps:
S01, the preparation of gelatin solution: take 3 parts of gelatin, with a small amount of distilled water immersion swelling after, add distilled water to 30 weight portions,
80 DEG C of heating for dissolving, 50 DEG C of insulations are standby；
S02, the preparation of gumwater: take distilled water 15 weight portion and put in beaker, add arabic gum 3 parts, be heated to 80 DEG C,
It is stirred to dissolve, adds distilled water after dissolving to 30 weight portions, standby；
S03, the preparation of Emulsion: take 3 parts of firming agent and put in mortar with gumwater 30 parts, be ground to the most in the same direction
Few 5min, obtains Emulsion；
S04, mixing: described Emulsion is proceeded in beaker, to 60 DEG C of water-baths, adds gelatin solution 30 parts, and add defoamer 0.2
Part, stirring；
S05, the preparation of microcapsule: dropping acid is dissolved in S04 in whipping process, regulation pH value is to 4.0, and is stirred continuously,
Microcapsule；
S06, the solidification of microcapsule: add distilled water 100 weight portion of 35 DEG C in whipping process in S05, by sub-for beaker water-bath
Taking out, stirring, natural cooling, when temperature is 35 DEG C, add ice cube, continuing stirring to temperature is less than 10 DEG C, adds formaldehyde
Solution 1.5 parts, stirs at least 15min, then with aqueous slkali regulation pH value to 9, continues to stir at least 15min, and obtain after solidification is micro-
Capsule.
Described defoamer includes amylalcohol or capryl alcohol.
Described heat filling includes nanoscale aluminium nitride or CNT.
Described firming agent includes polyether diamine, diethylamine, ethylenediamine, diethylenetriamine or diaminodiphenyl-methane.
The above is only the preferred embodiment of the present invention, it should be pointed out that: for the ordinary skill people of the art
For Yuan, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (10)
1.LED lamp Lamp cup sealing heat-conducting type is without shadow glue, it is characterised in that: comprise each component of following weight portion: prepolymer 40 ~
60 parts, diluent 20 ~ 30 parts, light trigger 2 ~ 5 parts, firming agent microcapsule 10 ~ 20 parts, auxiliary agent 1.5 ~ 2 parts, heat filling 2 ~ 5 parts,
Heat-conducting silicone grease 5 ~ 10 parts.
LED Lamp cup sealing heat-conducting type the most according to claim 1 is without shadow glue, it is characterised in that: described prepolymer bag
Include epoxy resin.
LED Lamp cup sealing heat-conducting type the most according to claim 1 is without shadow glue, it is characterised in that: described diluent bag
Include one or more in isobornyl acrylate, tri (propylene glycol) diacrylate and tetramethylolmethane three propylene three ester.
LED Lamp cup sealing heat-conducting type the most according to claim 1 is without shadow glue, it is characterised in that: described light trigger
Including benzophenone compound.
LED Lamp cup sealing heat-conducting type the most according to claim 1 is without shadow glue, it is characterised in that: described firming agent is micro-
Capsule includes the microsphere with capsule material parcel firming agent, a diameter of 100 ~ 200 μm of described microsphere.
LED Lamp cup sealing heat-conducting type the most according to claim 5 is without shadow glue, it is characterised in that: described firming agent is micro-
The material of preparing of capsule includes the component of following weight portion: 1 ~ 3 part of firming agent, arabic gum 1 ~ 3 part, 1 ~ 3 part of gelatin, formalin
0.5 ~ 1.5 part, acid solution is appropriate, and aqueous slkali is appropriate, and distilled water is appropriate, defoamer 0.1 ~ 0.2 part.
LED Lamp cup sealing heat-conducting type the most according to claim 6 is without shadow glue, it is characterised in that: described firming agent is micro-
The preparation method of capsule comprises the following steps:
S01, the preparation of gelatin solution: take 1 ~ 3 part of gelatin, with a small amount of distilled water immersion swelling after, add distilled water to 20 ~ 30 weight
Part, 60 ~ 80 DEG C of heating for dissolving, 50 DEG C of insulations are standby；
S02, the preparation of gumwater: take distilled water 10 ~ 15 weight portion and put in beaker, add arabic gum 1 ~ 3 part, be heated to
70 ~ 80 DEG C, it is stirred to dissolve, adds distilled water after dissolving to 20 ~ 30 weight portions, standby；
S03, the preparation of Emulsion: take 1 ~ 3 part of firming agent and put in mortar, the most in the same direction with gumwater 20 ~ 30 parts
Grind at least 5min, obtain Emulsion；
S04, mixing: described Emulsion is proceeded in beaker, to 50 ~ 60 DEG C of water-baths, add gelatin solution 20 ~ 30 parts, and addition disappears
Infusion 0.1 ~ 0.2 part, stirring；
S05, the preparation of microcapsule: dropping acid is dissolved in S04 in whipping process, regulation pH value is to 3.8 ~ 4.0, and constantly stirs
Mix, obtain microcapsule；
S06, the solidification of microcapsule: add distilled water 50 ~ 100 weight portion of 30 ~ 35 DEG C in whipping process in S05, by beaker
Taking out in water-bath, stirring, natural cooling, when temperature is 30 ~ 35 DEG C, add ice cube, continuing stirring to temperature is less than 10 DEG C,
Add formalin 0.5 ~ 1.5 part, stir at least 15min, then with aqueous slkali regulation pH value to 8 ~ 9, continue stirring at least
15min, obtains the microcapsule after solidification.
LED Lamp cup sealing heat-conducting type the most according to claim 6 is without shadow glue, it is characterised in that: described defoamer bag
Include amylalcohol or capryl alcohol.
LED Lamp cup sealing heat-conducting type the most according to claim 1 is without shadow glue, it is characterised in that: described heat filling
Including nanoscale aluminium nitride or CNT.
LED Lamp cup sealing heat-conducting type the most according to claim 5 is without shadow glue, it is characterised in that: described firming agent bag
Include polyether diamine, diethylamine, ethylenediamine, diethylenetriamine or diaminodiphenyl-methane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610530027.0A CN106147677A (en) | 2016-07-07 | 2016-07-07 | LED Lamp cup sealing heat-conducting type is without shadow glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610530027.0A CN106147677A (en) | 2016-07-07 | 2016-07-07 | LED Lamp cup sealing heat-conducting type is without shadow glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106147677A true CN106147677A (en) | 2016-11-23 |
Family
ID=58062821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610530027.0A Pending CN106147677A (en) | 2016-07-07 | 2016-07-07 | LED Lamp cup sealing heat-conducting type is without shadow glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106147677A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553545A (en) * | 2006-09-22 | 2009-10-07 | 汉高公司 | Bonding method and adhesive resin composition |
| CN102989381A (en) * | 2011-09-14 | 2013-03-27 | 唐宿彬 | Preparation technology of liquid microcapsule gel breaker by controlling pH value of system |
| CN104937027A (en) * | 2013-01-23 | 2015-09-23 | 汉高知识产权控股有限责任公司 | Underfill composition and packaging process using the same |
-
2016
- 2016-07-07 CN CN201610530027.0A patent/CN106147677A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553545A (en) * | 2006-09-22 | 2009-10-07 | 汉高公司 | Bonding method and adhesive resin composition |
| CN102989381A (en) * | 2011-09-14 | 2013-03-27 | 唐宿彬 | Preparation technology of liquid microcapsule gel breaker by controlling pH value of system |
| CN104937027A (en) * | 2013-01-23 | 2015-09-23 | 汉高知识产权控股有限责任公司 | Underfill composition and packaging process using the same |
Non-Patent Citations (1)
| Title |
|---|
| 贺曼罗: "《环氧树脂胶粘剂》", 30 April 2004, 中国石化出版社 * |
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Application publication date: 20161123 |
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