CN106146772A - A kind of preparation method of alkyl phenolic curing resin - Google Patents
A kind of preparation method of alkyl phenolic curing resin Download PDFInfo
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- CN106146772A CN106146772A CN201510185984.XA CN201510185984A CN106146772A CN 106146772 A CN106146772 A CN 106146772A CN 201510185984 A CN201510185984 A CN 201510185984A CN 106146772 A CN106146772 A CN 106146772A
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- acid
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- curing resin
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Abstract
The present invention relates to the new preparation process of a kind of alkyl phenolic curing resin, heat and alkyl phenol is melted, under base catalyst effect, after fully reacting with formaldehyde, neutralize with acid, washing, vacuum dehydration, obtain alkyl phenolic curing resin.The alkyl phenolic curing resin of the present invention, compared with similar alkyl phenolic curing resin, has more preferable curability, and rubber can be made to have higher intensity.
Description
Technical field
The present invention relates to the preparation method of a kind of alkyl phenolic curing resin.
Background technology
Butyl rubber is elastomeric one, isobutene. and isoprene synthesize.Butyl rubber has good chemically stable
Property and heat stability, oil resistant, oxytolerant, resistance to ozone, acid and alkali-resistance, the most prominent is air-tightness and watertightness, its saturating to air
The rate of mistake is only the 1/7 of natural rubber, the 1/5 of butadiene-styrene rubber, and the transmitance to steam is then the 1/200 of natural rubber, butylbenzene rubber
The 1/140 of glue.Therefore mainly for the manufacture of various rubbers such as tube, steam pipe, curing bag and packing rings.
Butyl rubber typically can vulcanize with sulfur, paraquinonedioxime or alkyl phenolic resin.Use sulfur vulcanization, have not
Wrong physical and mechanical properties and curingprocess rate, but sulphur dosage more than 1.5 parts time easy bloom, goods Applicable temperature scope is relatively low,
Being 100 DEG C～140 DEG C, the butyl rubber that degree of unsaturation is low, activity is the least, so that being difficult to sulfur and ultras sulfuration.Make
With the butyl rubber of paraquinonedioxime sulfuration, there is preferable ozone resistance and thermostability, use temperature to can reach 150 DEG C, sulfuration
Speed is fast, but easily incipient scorch.Use curing resin vulcanized butyl rubber, generate heat-staple-C-C-and-C-O-C-cross-bond. almost
Do not produce recovery phenomenon, higher than-C-S-C-type cross-bond to the stability of heat, mechanism, goods can at 150 DEG C～
Using at l70 DEG C, goods also have low compression deformation performance and good endurance and other physical property, the butyl of resin cure
Rubber, is particularly useful for making the inner tube of a tyre and the capsule of tires.
At present, the synthetic method of alkyl phenolic curing resin mainly has: Zhao Xiangren, Wang Qiaoxian and Sun Decheng " chemical industry with
Engineering " phase nineteen ninety the 1st 23～the synthetic method of page 29, reaction temperature is 70,80 or 90 DEG C, and catalyst is NaOH.
The alkyl phenolic curing resin curability using the method synthesis is more general.
Summary of the invention
It is an object of the invention to provide the new preparation method of a kind of alkyl phenolic curing resin, described preparation method is: heating
Alkyl phenol is melted, under base catalyst effect, under certain reaction temperature, after fully reacting with formaldehyde, neutralizes with acid, water
Wash, vacuum dehydration, obtain alkyl phenolic curing resin.Wherein, the reaction scheme of described method is as follows:
Wherein, R is the alkyl of 8-16 carbon, n=0～20.Preferably, R is 8 or 12, and n is 0,1,2,3.
Wherein, described alkyl phenol isWherein, R is the alkyl of 8-16 carbon.Preferably, described alkyl phenol includes octyl group
Phenol, dodecylphenol etc..
Wherein, described base catalyst is sodium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide or magnesium hydroxide.
Wherein, described reaction temperature is 91～100 DEG C.
Wherein, the acid used of described neutralization be oxalic acid, DBSA, p-methyl benzenesulfonic acid, nitric acid, sulphuric acid, hydrochloric acid,
Phosphoric acid or acetic acid.
Wherein, the alkyl phenolic curing resin that described method prepares, its softening point is more than 75 DEG C；Preferably, softening point
It it is 80～95 DEG C.In specific embodiments, softening point is 82.5 DEG C～89.1 DEG C.
The invention allows for the alkyl phenolic curing resin prepared as stated above, its structural formula is as follows:
Wherein, R is the alkyl of 8-16 carbon, n=0～20.Preferably, R is 8 or 12, and n is 0,1,2,3.
Beneficial effect of the present invention includes: compared with the conventional method, and the alkyl phenolic curing resin that the inventive method prepares has
Preferably curability, mechanical property, lear energy.
Detailed description of the invention
In conjunction with specific examples below, the present invention is described in further detail, and the protection content of the present invention is not limited to following
Embodiment.Under the spirit and scope without departing substantially from inventive concept, those skilled in the art it is conceivable that change and advantage all wrapped
Include in the present invention, and with appending claims as protection domain.Implement the process of the present invention, condition, reagent, reality
Proved recipe methods etc., outside the lower content mentioned specially, are universal knowledege and the common knowledge of this area, and the present invention does not has spy
Do not limit content.
Embodiment 1:
In the 1000ml four-hole boiling flask with stirring, thermometer and condenser, put into 268g alkyl phenol, 5g sodium hydroxide, add
Heat to alkyl phenol is completely melt, opens stirring, is heated to 95 DEG C, drips 211g liquid formaldehyde (content of formaldehyde in 30 minutes
37%), after reacting 2 hours at 95 DEG C, add 8g oxalic acid and neutralize, after neutralizing 20 minutes, add 268g toluene, wash,
Taking toluene layer, normal pressure reclaims toluene, after 135 DEG C, is evacuated to-0.095Mpa, at 135 DEG C, under-0.095Mpa, keeps
After 10 minutes, obtaining alkyl phenolic curing resin, resin softening point is 87.5 DEG C.
Other embodiments 2～10 and comparative example, implements step and sees embodiment 1, and implementation condition is shown in Table 1.
Table 1
Embodiment 11:
The product that embodiment 1,3,7,9 prepares is used for rubber, carries out application test, and the alkyl phenolic synthesized with comparative example
Curing resin contrasts.The formula of rubber composition is shown in Table 2.Test result is shown in Table 3.From table 3, the alkyl of the present invention
Phenolic curing resins, has more preferable curability, mechanical property, lear energy.
Table 2
| Sequence number | Raw material | Mass fraction |
| 1 | IIR | 100.00 |
| 2 | CR | 5.00 |
| 3 | N375 | 60.00 |
| 4 | Oleum Ricini | 6.00 |
| 5 | ZnO | 5.00 |
| 6 | Embodiment 1,3,7,9 product, comparative example | 10.00 |
| 7 | B WAX | 1.00 |
Table 3
Claims (5)
1. the preparation method of an alkyl phenolic curing resin, it is characterised in that said method comprising the steps of: heating is by alkyl phenol
Fusing, fully reacts with formaldehyde under base catalyst effect, then, neutralizes with acid, washing, vacuum dehydration, obtains alkane
Base phenolic curing resins；
The reaction equation of described method is as follows:
Wherein, R is the alkyl of 8-16 carbon, n=0～20.
Preparation method the most according to claim 1, it is characterised in that described base catalyst be sodium hydroxide, calcium hydroxide,
Potassium hydroxide, barium hydroxide or magnesium hydroxide.
Preparation method the most according to claim 1, it is characterised in that described reaction temperature is 91～100 DEG C.
Preparation method the most according to claim 1, it is characterised in that the acid used of described neutralization is oxalic acid, detergent alkylate sulphur
Acid, p-methyl benzenesulfonic acid, phosphoric acid, nitric acid, sulphuric acid, hydrochloric acid or acetic acid.
5. the alkyl phenolic curing resin prepared by claim 1 method, its structure is as follows:
Wherein, R is the alkyl of 8-16 carbon, n=0～20.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510185984.XA CN106146772A (en) | 2015-04-17 | 2015-04-17 | A kind of preparation method of alkyl phenolic curing resin |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510185984.XA CN106146772A (en) | 2015-04-17 | 2015-04-17 | A kind of preparation method of alkyl phenolic curing resin |
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| CN106146772A true CN106146772A (en) | 2016-11-23 |
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| CN201510185984.XA Pending CN106146772A (en) | 2015-04-17 | 2015-04-17 | A kind of preparation method of alkyl phenolic curing resin |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108530771A (en) * | 2018-04-09 | 2018-09-14 | 华奇（中国）化工有限公司 | A kind of alkylphenol formaldehyde curing resin and its preparation method and application |
| CN111635629A (en) * | 2020-06-30 | 2020-09-08 | 重庆科聚孚工程塑料有限责任公司 | Low-water-absorption glass fiber reinforced halogen-free flame-retardant polyamide material and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101486785A (en) * | 2008-12-31 | 2009-07-22 | 武汉径河化工有限公司 | Solvent-free method for preparing tackified p-tert-butyl phenolic resin |
| CN102532446A (en) * | 2011-12-21 | 2012-07-04 | 桂林兴松林化有限责任公司 | Preparation method of mixed phenolic rosin modified phenolic resin |
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2015
- 2015-04-17 CN CN201510185984.XA patent/CN106146772A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101486785A (en) * | 2008-12-31 | 2009-07-22 | 武汉径河化工有限公司 | Solvent-free method for preparing tackified p-tert-butyl phenolic resin |
| CN102532446A (en) * | 2011-12-21 | 2012-07-04 | 桂林兴松林化有限责任公司 | Preparation method of mixed phenolic rosin modified phenolic resin |
Non-Patent Citations (1)
| Title |
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| 赵向仁等: "辛基酚醛硫化树脂研究", 《化学工业与工程》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108530771A (en) * | 2018-04-09 | 2018-09-14 | 华奇（中国）化工有限公司 | A kind of alkylphenol formaldehyde curing resin and its preparation method and application |
| CN111635629A (en) * | 2020-06-30 | 2020-09-08 | 重庆科聚孚工程塑料有限责任公司 | Low-water-absorption glass fiber reinforced halogen-free flame-retardant polyamide material and preparation method thereof |
| CN111635629B (en) * | 2020-06-30 | 2022-11-25 | 重庆科聚孚工程塑料有限责任公司 | Low-water-absorption glass fiber reinforced halogen-free flame-retardant polyamide material and preparation method thereof |
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| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Shen Minliang Inventor after: Meng Zhenyu Inventor before: Shen Minliang |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170331 Address after: 215635 Jiangsu, Jiangsu, Yangtze River, Yangtze River International Chemical Industrial Park, Tian Ba Road, No. 99, No., Suzhou Applicant after: SINO LEGEND (ZHANGJIAGANG) CHEMICAL CO., LTD. Applicant after: Tongcheng Chemical Co. Ltd. (China) Address before: 201507 Jinshan District Chemical Industrial Park, North Galaxy Road, No. 66, Shanghai Applicant before: Tongcheng Chemical Co. Ltd. (China) |
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Application publication date: 20161123 |