CN106145689A - Glass thinning equipment - Google Patents
Glass thinning equipment Download PDFInfo
- Publication number
- CN106145689A CN106145689A CN201510138118.5A CN201510138118A CN106145689A CN 106145689 A CN106145689 A CN 106145689A CN 201510138118 A CN201510138118 A CN 201510138118A CN 106145689 A CN106145689 A CN 106145689A
- Authority
- CN
- China
- Prior art keywords
- glass
- thickness
- measurement equipment
- reduction processing
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
Abstract
The present invention relates to a kind of glass thinning equipment, more specifically it relates to a kind of for more accurately by thinning for glass to have the glass thinning equipment of target thickness.In order to improve the accuracy of target thickness, apply glass wherein, in the etching region of reduction processing, to arrange the main thickness measurement equipment that can measure thickness of glass in real time.
Description
Technical field
The present invention relates to a kind of glass thinning equipment, more particularly, to one for more accurately by thinning for glass with
There is the glass thinning equipment of target thickness.
Background technology
While manufacturing the flat faced displays such as such as liquid crystal display (LCD), apply various process to substrate.Example
As, for predetermined purpose, glass experience reduction processing etc..While glass stands reduction processing, presetting
Etching period during use etching liquid to glass.
If performing reduction processing for each sheet glass during identical etching period, then cannot expect each sheet glass
Expectation thickness (that is, target thickness).In other words, it is impossible to all sheet glass are etched into be respectively provided with desired
Target etch depth.
Summary of the invention
Therefore, in order to solve problem above, it is contemplated that the present invention；It is an aspect of the present invention to provide a kind of for more accurate
Really by thinning for glass to have the glass thinning equipment of target thickness.
According to the embodiment of the present invention, a kind of glass thinning equipment includes: chamber, and this chamber includes: logical loading
The loading zone arranged in road and rinsing area；Etching region, to the glass loaded along described loading passage in described etching region
Glass applies reduction processing；And in relief passage arrange rinsing area and unloading district, taken out by described relief passage
Live through the glass of reduction processing；Cassette, this cassette is arranged at described chamber indoor moving, and this cassette is vertical
Accommodate at least one sheet glass；Main thickness measurement equipment, this main thickness measurement equipment is arranged on the described etching region of described chamber
In and measure the thickness of glass of experience reduction processing in real time；And controller, if by described main thickness measurement equipment
The thickness of glass recorded reaches target thickness, and the most described controller stops the reduction processing that carries out glass and controls institute
State cassette to move along described relief passage.
Accompanying drawing explanation
According to description to illustrative embodiments below in conjunction with the accompanying drawings, above and/or other aspect of the present invention will become
Must understand and be easier to understand, wherein:
Fig. 1 illustrates the structure of the chamber being applied to glass thinning equipment according to the embodiment of the present invention；
Fig. 2 is the axonometric chart of glass thinning equipment according to the embodiment of the present invention；
Fig. 3 is the front view of Fig. 2；
Fig. 4 and Fig. 5 is for the thickness measurement equipment in glass thinning equipment according to the embodiment of the present invention is described
Arrange and the schematic diagram of operation；And
Fig. 6 is for illustrating method thinning for glass in glass thinning equipment according to the embodiment of the present invention
Process view.
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings describe have problem above, solution and effect according to the present invention for
Etching process adds the illustrative embodiments of the cassette (cassette) of carried base board.
In order to describe clear and convenient for the sake of, can exaggerate the size of the element shown in accompanying drawing, shape etc..It addition,
The term being specifically defined in the case of in view of being construction and operation of of the present invention can be according to user and operator
It is intended to or puts into practice and change.Definition about this term must be based on the content provided in whole description below.
Chamber 10 according to the embodiment of the present invention can be wherein loading zone or unloading district (L or U) 11a or
The chamber that 11b, rinsing area (R) 13 and etching region (E) 15 are linked in sequence as shown in (a) of Fig. 1.At this
In the case of Zhong, vertically it is contained in the sheet glass in the holding meanss such as cassette or multiple sheet glass is loaded into loading zone (L)
In 11a, it is cleaned in rinsing area (R) 13 and experiences thinning process in etching region (E) 15.Then,
Treated glass moves (that is, towards rinsing area (R) 13) in backward directions and processes with experience cleaning and lead to
Cross unloading district (U) 11b and be discharged into outside.
Chamber 10 according to the embodiment of the present invention can be wherein loading zone (L) 11a, rinsing area (R) 13,
Etching region (E) 15, rinsing area (R) 13 and unloading district (U) 11b are linked in sequence as shown in (b) of Fig. 1
Chamber.In this case, vertically it is contained in the sheet glass in the holding meanss such as cassette or multiple sheet glass is loaded
In loading zone (L) 11a, it is cleaned in rinsing area (R) 13 and experience becomes in etching region (E) 15
Thin process.Then, treated glass moves (that is, towards rinsing area (R) 13) with experience in forward direction
Cleaning processes and is discharged into outside by unloading district (U) 11b.
In short, chamber 10 the most according to the embodiment of the present invention is configurable to include: load
District 11a and rinsing area 13, described loading zone and described rinsing area are arranged in glass and move towards etching region 15 and passed through
Path in (that is, in load path LP)；Etching region, to along loading what passage loaded in described etching region
Glass applies reduction processing；And rinsing area 13 and unloading district 11b, described rinsing area and described unloading district are arranged in
In the UP of relief passage, relief passage UP live through corresponding to unloading the glass of reduction processing the passage of process.
Hereinafter, by it is assumed hereinafter that under be described: at least one sheet glass being vertically contained in cassette have as
Reduction processing is experienced while moving in the chamber 10 of structure shown in (a) of Fig. 1.But, below describing can be same
Etc. ground be applied to use the situation of chamber and a sheet glass shown in (b) of Fig. 1 to experience thinning while movement
Situation about processing.
As shown in Figures 2 and 3, glass thinning equipment according to the embodiment of the present invention includes: chamber 10,
In the cavity glass 1 is applied reduction processing；Cassette 30, this cassette moves also in being arranged in chamber 10
And at least one sheet glass 1 of reduction processing to be subjected is vertically contained in this cassette；Main thickness measurement equipment 50, should
Main thickness measurement equipment measures the thickness of the glass experiencing reduction processing in the etching region 15 of chamber 10 in real time；And control
Device (not shown) processed, this controller controls the operation for reduction processing, at the glass recorded by main thickness measurement equipment 50
Stop the reduction processing that glass is carried out when glass thickness reaches target thickness, and control cassette 30 along relief passage
UP moves.
With reference to Fig. 2 and Fig. 3, load/unload district 11a, 11b are corresponding to for by cassette 30 (reduction processing to be subjected
Glass 1 be vertically contained in this cassette) be loaded in chamber space or for (living through thinning by cassette 30
The glass 1 processed vertically is contained in this cassette) it is unloaded to the space outside chamber 10.Rinsing area 13 is corresponding to using
The space of afterflush glass out before moving to etching region 15 at glass or from etching region 15.In this feelings
Under condition, loading passage LP and include loading zone 11a and rinsing area 13, relief passage UP includes rinsing area 13 and unloading
District 11b.
Certainly, in the chamber shown in (b) of Fig. 1, glass is same move forward continuously in straight direction
Shi Jingli process, contrary with the chamber shown in (a) of Fig. 1 and Fig. 2.
Cassette 30 according to the embodiment of the present invention accommodates etch processes to be subjected, reduction processing or thin glass preparation
At least one sheet glass of process, and the loading space being installed in chamber 10.Such as, such as Fig. 2 and Fig. 3
Shown in, first cassette 30 is installed in loading zone 11a.
Cassette 30 moves back and forth in being arranged in chamber 10, vertically accommodates at least one glass of reduction processing to be subjected
Glass sheet 1.It addition, cassette 30 is configured under the effect of transfer device (not shown) unload at loading zone 11a/
Move back and forth between district 11b and etching region 15.
At least one sheet glass 1 being vertically contained in cassette 30 is placed in loading zone 11a/ unloading district 11b,
Rinsing area 13 is rinsed, moves to etching region 15, the reduction processing carried out based on etching liquid with experience.When
In being arranged in etching region 15, the etching liquid of the etching liquid nozzle (not shown) injection of upside is along the two of glass
When individual surface flows downward, perform reduction processing.
At least one sheet glass 1 living through reduction processing in etching region 15 is rinsed in rinsing area 13 again
And it is outside to be discharged into chamber 10 by unloading district 11b.
After the sheet glass 1 living through reduction processing is discharged into chamber 10 outside, by accommodate sheet glass next
Individual cassette is loaded in chamber 10 by loading zone 11a and experiences reduction processing as described above.
By above operation, sheet glass sequentially experiences reduction processing.By the way, it is discharged into chamber at glass 1
Before 10 outsides, measure with the main thickness measurement equipment 50 being arranged on etching region 15 inwall and live through in etching region 15
The thickness of the glass 1 of reduction processing.
Specifically, main thickness measurement equipment 50 measures the glass experiencing reduction processing in the etching region 15 of chamber 10 in real time
The thickness of glass.It is to say, main thickness measurement equipment 50 is loaded into erosion in the cassette 30 accommodating at least one sheet glass
After carving district 15 with etching liquid by thinning for glass or thinning while measure the thickness of glass in real time, and will close
It is sent to controller (not shown) in the information recording thickness.
Controller determines whether the thickness of the glass from the reception of main thickness measurement equipment 50 reaches target thickness in real time.If
Determine that thickness of glass reaches target thickness, then controller stops the reduction processing that carries out glass and controls cassette 30
Move along relief passage UP.
In other words, when during reduction processing, thickness of glass reaches target thickness, controller stops supply etching solution
The reduction processing of body etc. and control the cassette having accommodated thinning glass and move and by institute along relief passage UP
State cassette to take out.
Then, along with the rinsing area 13 arranged in the relief passage UP loaded on the contrary direction of passage LP and
Unloading district 11b takes out cassette 30.Certainly, if chamber 10 has the structure as shown in (b) of Fig. 1, can
In the rinsing area 13 arranged in the relief passage UP on the direction identical with loading passage LP and unloading district
11b takes out the cassette 30 having accommodated thinning glass.
As shown in Figures 2 and 3, main thickness measurement equipment 50 is arranged in the adjacent sidewalls of etching region 15, and does not hamper
Hinder the cassette 30 of movement in chamber 10.Glass experience in etching region 15 use etching liquid carry out thinning
During process, measure the thickness of glass with main thickness measurement equipment 50.Main thickness measurement equipment 50 measures thickness of glass also in real time
And controller will be sent to about the information recording thickness.
As shown in Figures 4 and 5, main thickness measurement equipment 50 is adjacent with the inwall of etching region 15, and has slip
Structure is to move near the outermost glass among the sheet glass 1 being vertically contained in cassette 30.Specifically, for
Avoid hindering the movement of cassette 30, main thickness measurement equipment 50 to keep with the inwall of etching region 15 adjacent, except when
When main thickness measurement equipment 50 measures thickness of glass.
If cassette 30 moves to etching region and rests on etching region so that glass experience reduction processing, then controlling
Under the control of device, main thickness measurement equipment 50 slides into the outermost glass among the sheet glass being vertically contained in cassette 30
Near glass (that is, near the glass of thickness measurement equipment).
Then, under the control of the controller, main thickness measurement equipment 50 is measured in real time by launching laser beam to glass
Thickness of glass and glass just experiencing slip process while will be sent to controller about the information recording thickness.
Main thickness measurement equipment 50 can construct in every way, as long as it can measure thickness of glass by launching laser beam.
Such as, main thickness measurement equipment comprises the steps that emitter, and it is used for launching laser beam；Receptor, it is for receiving by glass
The light beam of glass reflection；And analyzer, it is for analyzing the light beam received in receptor and calculating thickness of glass.
It addition, main thickness measurement equipment 50 includes air ejector, for air being ejected into being exposed to of glass
From the part of the laser beam that emitter is launched.Before launching laser beam by emitter, main thickness measurement equipment 50
Control air ejector, the predetermined portions of laser beam the most instantaneous will be exposed to for what air was ejected into glass
Remove etching liquid.So, after removing etching liquid with air ejector, measure thickness of glass so that can be more
Accurately measure thickness of glass.
Use this structure, send the information about thickness of glass in real time to controller from main thickness measurement equipment 50.Then,
During reduction processing, controller in real time by default target thickness with receive from main thickness measurement equipment 50 record glass
Glass thickness compares.
If it is determined that the thickness of glass that records from the reception of main thickness measurement equipment 50 reaches target thickness, then controller stops
The reduction processing etc. of injection etching liquid processes, and control the cassette accommodating the sheet glass living through reduction processing along
Relief passage UP moves.
When the thickness of glass only recorded in real time in etching region 15 when main thickness measurement equipment 50 reaches target thickness, edge
Relief passage UP (that is, by rinsing area and unloading district) and take out the sheet glass being contained in cassette.Therefore, accurate
Really increase and treat thinning thickness of glass.
According to the embodiment of the present invention, the sheet glass of the reduction processing living through glass thinning equipment can have in tolerance
In the range of desired thickness or target thickness, unless the main thickness measurement equipment 50 in etching region 15 cannot correctly work.
Main thickness measurement equipment 50 can be malfunctioning due to himself defect, or when because of the hindering factor (example in etching region 15
Such as, etching liquid etc.) can not correct measurement thickness of glass time abnormal operation.
So, if main thickness measurement equipment 50 abnormal operation or incorrect measurement thickness of glass, then logical along unloading
The thickness of the glass that road UP takes out is beyond the margin of tolerance of target thickness.Result, it is impossible to make normal thinning sheet glass.
In order to solve this problem, glass thinning equipment according to the embodiment of the present invention includes that the first auxiliary thickness is surveyed
Amount instrument (not shown), the first auxiliary thickness measurement equipment is arranged in the UP of relief passage the rinsing area 13 arranged and unloading
In in district one and again measure the thickness of the glass living through reduction processing.
It is to say, the first auxiliary thickness measurement equipment is arranged in relief passage (such as, the rinsing area or unload, district arranged
Carry district) in one in, thus again measure the thickness of the glass living through reduction processing in etching region 15
And thickness of glass will be recorded and be sent to controller.
Controller determines based on the first auxiliary thickness of glass of recording of thickness measurement equipment and the most normally performs in etching region
Reduction processing or main thickness measurement equipment the most correctly work.It is to say, when receiving from the first auxiliary thickness measurement equipment
The thickness of glass in the margin of tolerance of target thickness time, controller controls to take out cassette.
On the other hand, if exceed the tolerance model of target thickness from the thickness of the glass of the first auxiliary thickness measurement equipment reception
Enclose, then controller determines that main thickness measurement equipment cannot correctly work or normally perform thinning place in etching region
Reason.In this case, controller sends alarm to notify manager, and main thickness measurement equipment is malfunctioning or in etching region
Reduction processing abnormal.
Then, main thickness measurement equipment is malfunctioning or reduction processing in etching region abnormal be probably temporary transient.Therefore, control
Device processed controls cassette when the thickness of glass received from the first auxiliary thickness measurement equipment is beyond the margin of tolerance of target thickness
Return to etching region, and control glass and in etching region, again experience reduction processing, to have target thickness.
In short, work as the difference of the first thickness of glass assisting thickness measurement equipment to record and target thickness beyond the margin of tolerance
Time, controller sends alarm or control cassette 30 moves back in etching region 15 so that glass can again experience and subtract
Thin process.
While again performing reduction processing, the main thickness measurement equipment 50 in etching region measures the thickness of glass in real time
And thickness will be recorded and be sent to controller.If recording thickness of glass to reach target thickness, then controller stops injection
Reduction processing of etching liquid etc. and control to accommodate the cassette of the glass again living through reduction processing so that it is by unloading
Carry passage UP to be removed.
While taken out the glass again living through reduction processing by relief passage UP, it is auxiliary that controller controls first
Help thickness measurement equipment to measure the most again to live through the thickness of reduction processing.
If recording thickness of glass in the margin of tolerance of target thickness, then controller controls to take out to accommodate and again lives through
The cassette of reduction processing, then will accommodate the next cassette of the glass of reduction processing to be subjected by loading passage LP
It is loaded in etching region.
On the other hand, if recording thickness of glass beyond the margin of tolerance of target thickness, then controller send alarm and
Control to take out and accommodate the cassette again living through reduction processing, thus stop the integrated operation of glass thinning equipment.Therefore,
Manager can check that main thickness measurement equipment 50 is the most abnormal, whether there is hindering factor etc. in etching region.
The the first auxiliary thickness measurement equipment arranged in the UP of relief passage has to be surveyed with the main thickness of setting in etching region 15
Measure the structure of instrument 50 and operate identical structure and operation, therefore will avoid repeated description.
It addition, the second auxiliary thickness measurement equipment (not shown) may be provided at and is arranged in the loading zone loaded in passage LP
In 11a or rinsing area 13, separate with the first auxiliary thickness measurement equipment.It is to say, the second auxiliary thickness measurement equipment
(not shown) may be provided in be arranged in the loading zone 11a and rinsing area 13 loaded in passage LP, carries
The thickness of the glass of pre-test reduction processing to be subjected and controller will be sent to about the information recording thickness.
The main thickness measurement equipment 50 being used in etching region 15 measures multiple thickness, a correspondence among these multiple thickness
In actual glass thickness.Therefore, controller is selecting reality among multiple thickness that main thickness measurement equipment 50 receives
Thickness of glass aspect is had any problem, and mistake thickness may be selected as actual glass thickness.In order to solve this problem,
Glass thinning equipment according to the embodiment of the present invention is included in the loaded in the loading zone of passage LP or rinsing area
Two auxiliary thickness measurement equipment (not shown).
Therefore, controller control the second auxiliary thickness measurement equipment is measured in advance along loading the glass that passage LP moves
Thickness, and based on from second auxiliary thickness measurement equipment receive record thickness of glass in advance, from the reduction processing phase
Between select actual glass thickness among multiple thickness of being recorded by main thickness measurement equipment 50.
The glass thinning method using above glass thinning equipment will be schematically described with reference to Fig. 6.
First, in the structure of the chamber 10 shown in (a) of Fig. 1, the cassette 30 vertically accommodating glass loads
In chamber 10, it is delivered to etching region along loading passage LP, and in etching region 15, experiences reduction processing (ginseng
See (a) of Fig. 6).During carrying out reduction processing in etching region 15, main thickness measurement equipment 50 measures thickness of glass
And controller will be sent in real time about the information recording thickness.
When recording thickness of glass and reaching goal-selling thickness, controller stops at and sprays subtracting of etching liquid in etching region
Thin process, and control to take out cassette 30 (seeing (b) of Fig. 6) by relief passage UP.
It addition, in the structure of chamber 10 shown in (b) of Fig. 1, the cassette 30 vertically accommodating glass loads
In chamber 10, it is delivered to etching region along loading passage LP, and in etching region 15, experiences reduction processing (ginseng
See (c) of Fig. 6).During carrying out reduction processing in etching region 15, main thickness measurement equipment 50 measures thickness of glass
And controller will be sent in real time about the information recording thickness.
When recording the target thickness that thickness of glass reaches default, controller stops at and sprays etching liquid in etching region
Reduction processing, and control to take out cassette 30 (seeing (d) of Fig. 6) by relief passage UP.
As it has been described above, the second auxiliary thickness measurement equipment may be provided in loading passage LP or the first auxiliary thickness measure
Instrument may be provided in the UP of relief passage.First auxiliary thickness measurement equipment and second auxiliary thickness measurement equipment operation with
The operation of upper description is identical, therefore will avoid repeated description.
According to the embodiment of the present invention, glass thinning equipment includes that main thickness measurement equipment, main thickness measurement equipment are arranged on
Wherein glass applied in the etching region of reduction processing and measure thickness of glass in real time so that glass can have more accurately
There is target thickness.
It addition, the first auxiliary thickness measurement equipment is additionally arranged in relief passage, and measurement lives through thinning place again
The thickness of the glass of reason, therefore can check whether the main thickness measurement equipment being arranged in etching region cannot correctly work,
And the ratio of defects making thinning glass is down to minimum.
It addition, the second auxiliary thickness measurement equipment is additionally arranged in loading passage, and measure thinning place to be subjected in advance
The thickness of the glass of reason, therefore can check whether the main thickness measurement equipment being arranged in etching region cannot correctly work.
While there has been shown and described that some illustrative embodiments of the present invention, but those skilled in the art should
Understand, without departing from the principles and spirit of the present invention, these embodiments can be changed, the present invention
Scope limit in following claims and equivalent thereof.
Claims (5)
1. a glass thinning equipment, this glass thinning equipment includes:
Chamber, this chamber includes: the loading zone arranged in loading passage and rinsing area；Etching region, in described etching
District applies reduction processing to the glass loaded along described loading passage；And in relief passage arrange rinsing area
With unloading district, taken out the glass living through reduction processing by described relief passage；
Cassette, this cassette is arranged at described chamber indoor moving, and this cassette vertically accommodates at least one sheet glass；
Main thickness measurement equipment, this main thickness measurement equipment is arranged in the described etching region of described chamber and measures warp in real time
Go through the thickness of the glass of reduction processing；And
Controller, if the thickness of glass recorded by described main thickness measurement equipment reaches target thickness, the most described controller
Stop reduction processing that glass being carried out and control described cassette and move along described relief passage.
Glass thinning equipment the most according to claim 1, wherein, described main thickness measurement equipment and described etching
The inwall in district is adjacent, and has slide construction, to move to vertically be contained near the glass in described cassette.
Glass thinning equipment the most according to claim 1 and 2, described glass thinning equipment also includes that first is auxiliary
Help thickness measurement equipment, described first auxiliary thickness measurement equipment be arranged in described relief passage the described rinsing area arranged and
In in described unloading district one, and again measure the thickness of the glass living through reduction processing.
Glass thinning equipment the most according to claim 3, wherein, when by described first auxiliary thickness measurement equipment
When difference between the thickness of glass and the described target thickness that record is beyond the margin of tolerance, described controller sends alarm,
Or control described cassette and move in described etching region so that glass can experience reduction processing again.
Glass thinning equipment the most according to claim 1 and 2, described glass thinning equipment also includes that second is auxiliary
Help thickness measurement equipment, described second auxiliary thickness measurement equipment be arranged in described loading passage the described loading zone arranged and
In in described rinsing area one, measure in advance the glass of reduction processing to be subjected thickness and will be about recording thickness
Information be sent to described controller.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150024001A KR20160101760A (en) | 2015-02-17 | 2015-02-17 | apparatus for slimming glass |
| KR10-2015-0024001 | 2015-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106145689A true CN106145689A (en) | 2016-11-23 |
Family
ID=56885772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510138118.5A Pending CN106145689A (en) | 2015-02-17 | 2015-03-26 | Glass thinning equipment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20160101760A (en) |
| CN (1) | CN106145689A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109879601A (en) * | 2019-04-24 | 2019-06-14 | 合肥伟仕泰克电子材料有限公司 | A kind of glass thinning production line and application method |
| CN109896751A (en) * | 2019-04-24 | 2019-06-18 | 合肥伟仕泰克电子材料有限公司 | A kind of bottom supporting element and glass thinning jig |
| CN109942203A (en) * | 2019-04-24 | 2019-06-28 | 合肥伟仕泰克电子材料有限公司 | A kind of glass thinning equipment and application method |
| CN110304832A (en) * | 2019-06-27 | 2019-10-08 | 惠晶显示科技（苏州）有限公司 | Flexible OLEM, AMOLEM ultra-thin glass cover board thinning technique |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102244021B1 (en) * | 2019-09-25 | 2021-04-23 | 주식회사 진테크컴퍼니 | An automatic apparatus for etching the crystal for monitor sens0r |
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| JPH11251288A (en) * | 1998-02-27 | 1999-09-17 | Dainippon Screen Mfg Co Ltd | Apparatus for treating substrate |
| US20060191637A1 (en) * | 2001-06-21 | 2006-08-31 | John Zajac | Etching Apparatus and Process with Thickness and Uniformity Control |
| KR101150002B1 (en) * | 2010-09-09 | 2012-05-31 | 현대중공업 주식회사 | System for wet etching |
| CN103173766A (en) * | 2011-12-26 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | Advanced process control method of wet etching process |
| CN103187341A (en) * | 2011-12-27 | 2013-07-03 | 芝浦机械电子株式会社 | Substrate processing device and method |
| WO2014133792A1 (en) * | 2013-02-28 | 2014-09-04 | Solid State Equipment Llc | A system and method for performing a wet etching process |
| KR101469000B1 (en) * | 2013-07-17 | 2014-12-04 | 주식회사 엠엠테크 | apparatus for slimming glass and method for manufacturing thereof |
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2015
- 2015-02-17 KR KR1020150024001A patent/KR20160101760A/en active IP Right Grant
- 2015-03-26 CN CN201510138118.5A patent/CN106145689A/en active Pending
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| JPH11251288A (en) * | 1998-02-27 | 1999-09-17 | Dainippon Screen Mfg Co Ltd | Apparatus for treating substrate |
| US20060191637A1 (en) * | 2001-06-21 | 2006-08-31 | John Zajac | Etching Apparatus and Process with Thickness and Uniformity Control |
| KR101150002B1 (en) * | 2010-09-09 | 2012-05-31 | 현대중공업 주식회사 | System for wet etching |
| CN103173766A (en) * | 2011-12-26 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | Advanced process control method of wet etching process |
| CN103187341A (en) * | 2011-12-27 | 2013-07-03 | 芝浦机械电子株式会社 | Substrate processing device and method |
| WO2014133792A1 (en) * | 2013-02-28 | 2014-09-04 | Solid State Equipment Llc | A system and method for performing a wet etching process |
| KR101469000B1 (en) * | 2013-07-17 | 2014-12-04 | 주식회사 엠엠테크 | apparatus for slimming glass and method for manufacturing thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109879601A (en) * | 2019-04-24 | 2019-06-14 | 合肥伟仕泰克电子材料有限公司 | A kind of glass thinning production line and application method |
| CN109896751A (en) * | 2019-04-24 | 2019-06-18 | 合肥伟仕泰克电子材料有限公司 | A kind of bottom supporting element and glass thinning jig |
| CN109942203A (en) * | 2019-04-24 | 2019-06-28 | 合肥伟仕泰克电子材料有限公司 | A kind of glass thinning equipment and application method |
| CN110304832A (en) * | 2019-06-27 | 2019-10-08 | 惠晶显示科技（苏州）有限公司 | Flexible OLEM, AMOLEM ultra-thin glass cover board thinning technique |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160101760A (en) | 2016-08-26 |
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Application publication date: 20161123 |