CN106129748B

CN106129748B - Earphone patch cord

Info

Publication number: CN106129748B
Application number: CN201610686394.XA
Authority: CN
Inventors: 于立成; 吴锋辉; 王志城
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2016-08-18
Filing date: 2016-08-18
Publication date: 2020-03-03
Anticipated expiration: 2036-08-18
Also published as: CN106129748A

Abstract

The disclosure discloses an earphone patch cord, and belongs to the technical field of patch cords. The earphone patch cord includes: the earphone comprises an earphone socket, a Universal Serial Bus (USB) head and a connecting wire for connecting the earphone socket and the USB head; the earphone socket comprises n welding feet which are positioned in the same plane, one end of the connecting wire is welded on the welding feet, and n is a positive integer. The problem that in the related technology, the connecting wires need to be welded in the upper and lower rows of welding feet respectively twice, and the welding efficiency is low is solved; the effect of improving the welding efficiency is achieved.

Description

Earphone patch cord

Technical Field

The present disclosure relates to patch cord technologies, and in particular, to an earphone patch cord.

Background

When the headset model does not match the terminal, the user can connect the headset to the terminal through the headset patch cord.

A related earphone patch cord includes an earphone socket, a USB (Universal Serial Bus) head, and a connection cord connecting the earphone socket and the USB head. Wherein, the one end of being connected with the USB head in the earphone socket is provided with two rows of leg from top to bottom, and every leg passes through welded connection with the connecting wire.

Disclosure of Invention

In order to overcome the problems in the related art, the embodiments of the present disclosure provide a headphone patch cord. The technical scheme is as follows:

according to a first aspect of the embodiments of the present disclosure, there is provided a headset patch cord, including: the earphone comprises an earphone socket, a Universal Serial Bus (USB) head and a connecting wire for connecting the earphone socket and the USB head;

the earphone socket comprises n welding feet which are positioned in the same plane, one end of the connecting wire is welded on the welding feet, and n is a positive integer.

Optionally, the earphone socket comprises a single row of the n solder feet.

Optionally, the earphone jack includes n solder legs distributed in m rows in the same plane, where m is an integer greater than or equal to 2.

Optionally, if n/m is an integer, the number of the solder tails in each row of the m rows is n/m;

if n/m is a small number, the number of the welding feet contained in the row with the largest number of the welding feet in the m rows is a target number, and the target number is the minimum integer which is larger than or equal to n/m.

Optionally, the earphone socket further comprises a printed circuit board PCB, and the PCB and an opposite surface of the PCB in the earphone socket form a cavity;

one side of each of the n welding feet is welded on the PCB, and the other side of each of the n welding feet is welded at one end of the connecting wire.

Optionally, the n solder feet include a left sound channel, a right sound channel, a ground terminal, two contacts of the switch, and a solder foot corresponding to the microphone.

Optionally, n is an integer greater than or equal to 6.

Optionally, a headset jack with a diameter of 3.5mm is arranged in the headset socket.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the welding pins at one end connected with the connecting wire are arranged in the same plane, so that the connecting wire can be quickly welded when being welded to the welding pins, and the problem that the connecting wire needs to be welded in the upper and lower rows of welding pins twice respectively in the related art, and the welding efficiency is low is solved; the effect of improving the welding efficiency is achieved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1A is a schematic diagram illustrating a configuration of a headset patch cord according to an exemplary embodiment;

FIG. 1B is a schematic diagram of a headset jack, according to an exemplary embodiment;

fig. 2A is a schematic diagram illustrating a configuration of a headset patch cord according to another exemplary embodiment;

fig. 2B is a schematic diagram illustrating a configuration of solder tails in an earphone jack, according to another exemplary embodiment;

fig. 2C is a schematic diagram of another configuration of solder tails in an earphone jack, according to another exemplary embodiment;

fig. 2D is a schematic diagram illustrating yet another configuration of solder tails in a headphone jack, according to another exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

Referring to fig. 1A, a schematic structural diagram of a headset patch cord provided in an exemplary embodiment of the present disclosure is shown, and as shown in fig. 1A, the headset patch cord includes: a headphone socket 110, a USB head 120, and a connecting line 130 for connecting the headphone socket 110 and the USB head 120.

Referring to fig. 1B (a schematic diagram of an internal structure of the earphone socket 110), the earphone socket 110 includes n solder legs 111 in the same plane, one end of the connecting wire 130 is soldered on the solder leg 111, and n is a positive integer.

Note that fig. 1B schematically illustrates only n is 6, and n fillets 111 are in the same row.

In summary, in the earphone patch cord provided in this embodiment, the soldering legs at the end connected to the connection line are disposed in the same plane, so that the connection line can be soldered to the soldering legs quickly, and the problem of low soldering efficiency caused by the fact that the connection line needs to be soldered to the soldering legs in the upper and lower rows twice in the related art is solved; the effect of improving the welding efficiency is achieved.

Referring to fig. 2A, a schematic structural diagram of a headset patch cord according to an exemplary embodiment of the present disclosure is shown, and as shown in fig. 2A, the headset patch cord includes: a headphone socket 110, a USB head 120, and a connecting line 130 for connecting the headphone socket 110 and the USB head 120.

The earphone socket 110 includes n solder legs 111 in the same plane, one end of the connection wire 130 is soldered to the solder leg 111, and n is a positive integer.

Fig. 2A schematically illustrates only n — 6, and n fillets 111 are in the same row.

In a possible implementation manner of the present embodiment, the earphone socket 110 may include n solder legs 111 arranged in a single row.

When the earphone signal is transmitted, a left channel, a right channel, a ground terminal, a switch, and a plurality of signal lines of the microphone are required, so the n solder pins 111 in the earphone socket 110 may include a solder pin corresponding to each signal line, and the connection line 130 includes the signal lines. In practice, to ensure the sound quality, the two contacts of the switch are usually separated from two signal lines, so that the n solder pins 111 in the earphone socket 110 may include 6 solder pins corresponding to the above signal lines, and similarly, the connecting line 130 may include 6 signal lines. Wherein each signal wire is welded on each welding foot.

Alternatively, at least one of the left channel, the right channel, the ground terminal, and the microphone may be implemented by a plurality of signal lines, and thus n may also be an integer greater than 6. For example, if the left channel is implemented by two signal lines, n is 7.

In this embodiment, the total width of the n solder fillets 111 is not limited, and the distance between two adjacent solder fillets is also not limited. Also, in order to reduce the width of the earphone socket 110, the width of the n solder legs 111 may be smaller than a first threshold value; in order to facilitate the soldering of each signal line in the connection line 130 on the solder foot, the distance between two adjacent solder feet is greater than the second threshold. In addition, since the n solder tails 111 occupy a certain width when arranged in a single row, in order to reduce the height of the earphone socket 110, each component in the earphone socket 110 may be distributed along the arrangement direction of the n solder tails 111, which is not limited in this embodiment.

In another possible implementation manner of the present embodiment, the n solder fillets 111 may also be distributed in m rows in the same plane. Wherein m is an integer greater than or equal to 2, and the n solder fillets are similar to the solder fillets described in the first implementation manner, and are not described herein again in this embodiment.

Optionally:

if n/m is an integer, the number of solder tails in each of the m rows is n/m.

For example, n is 6, and m is 2, and the n fillets may be distributed as shown in fig. 2B. Alternatively, fig. 2B only illustrates the solder tails in each row being arranged side by side, and optionally, the solder tails in each row may also be arranged in a staggered manner. For example, please refer to fig. 2C, which shows another possible distribution.

If n/m is a small number, the number of the solder tails included in the row with the largest number of the solder tails in the m rows is a target number, and the target number is the smallest integer which is larger than or equal to n/m.

If n/m is a small number, the number of the solder tails included in one row having the largest number of solder tails in m rows is the target number in order to reduce the width corresponding to n solder tails and thus reduce the width of the earphone socket 110.

For example, if n is 8 and m is 3, the number of fillets included in the row having the largest number of fillets in 3 rows is 3. For example, please refer to fig. 2D, which shows a possible distribution. Moreover, similar to the implementation when n/m is an integer, fig. 2D also only takes the example that the solder tails in each row are distributed in parallel, and optionally, the solder tails in each row may also be distributed in a staggered manner, which is not described herein again.

In practical implementation, referring to fig. 2A, the earphone socket 110 may further include a PCB112(Printed circuit board), where the PCB112 forms a cavity with an opposite surface of the PCB112 in the earphone socket, and other components in the earphone socket 110 may be in the cavity. Alternatively, referring to fig. 2A, one side of the n solder legs 111 is soldered in the PCB112, and the other side of the n solder legs 111 is soldered with one end of the connecting wire 130.

In this embodiment, only a part of the structure of the earphone patch cord is described, and in actual implementation, the earphone patch cord may further include other special structures. For example, the earphone jack 110 may be provided therein, and the earphone jack may be an earphone jack having a diameter of 3.5 mm. Of course, in order to adapt to other types of earphones, earphone jacks with other diameters may also be disposed in the earphone socket 110, which is not limited in this embodiment.

In addition, the USB header 120 may be a TYPE-C interface, which is not limited in this embodiment. And, in practical implementation, the USB head 120 is used to be plugged into a jack in the terminal, and an earphone is plugged into an earphone jack of the earphone socket 110, after which, a user can listen to audio and video in the terminal by using an earphone not matched with the terminal.

When n fillets can not be uniformly arranged in m rows, the number of the fillets contained in one row with the largest number of the fillets in the m rows is set as the target number, so that the width of each row in the m rows can be fully utilized, the total width required by the n fillets is further reduced, and the width of the earphone socket is also reduced.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A headset patch cord, the headset patch cord comprising: the earphone comprises an earphone socket, a Universal Serial Bus (USB) head and a connecting wire for connecting the earphone socket and the USB head;

the earphone socket comprises n welding feet which are positioned in the same plane, one end of the connecting wire is welded on the welding feet, and n is a positive integer;

wherein the earphone socket comprises n welding feet distributed in m rows in the same plane, and m is an integer greater than or equal to 2;

if n/m is an integer, the number of the welding feet in each row of the m rows is n/m;

if n/m is a decimal number, the number of the welding feet contained in the row with the largest number of the welding feet in the m rows is a target number, and the target number is a minimum integer which is more than or equal to n/m;

the width of the n welding feet is smaller than a first threshold value, the distance between two adjacent welding feet in the n welding feet is larger than a second threshold value, and the welding feet in each row of the m rows are distributed in a staggered mode;

the earphone socket also comprises a Printed Circuit Board (PCB), the PCB and the opposite surface of the PCB in the earphone socket form a cavity, and other components in the earphone socket are distributed in the cavity along the arrangement direction of the n welding pins;

2. The headset patch cord of claim 1, wherein the headset receptacle includes a single row of the n solder tails.

3. The headset patch cord of any one of claims 1 to 2, wherein the n solder feet comprise a left audio track, a right audio track, a ground terminal, two contacts of a switch, and a solder foot corresponding to a microphone.

4. The earphone patch cord of any one of claims 1 to 2, wherein n is an integer greater than or equal to 6.

5. A headset patch cord according to any one of claims 1 to 2, wherein a headset jack having a diameter of 3.5mm is provided in the headset receptacle.