CN106125213A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN106125213A CN106125213A CN201610739389.0A CN201610739389A CN106125213A CN 106125213 A CN106125213 A CN 106125213A CN 201610739389 A CN201610739389 A CN 201610739389A CN 106125213 A CN106125213 A CN 106125213A
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- China
- Prior art keywords
- chip
- adapter
- optical
- flexible board
- optical module
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of optical module, including circuit board, flexible board, and for connecting the adapter of circuit board and flexible board；Adapter is fixing on circuit boards, and snaps connection with flexible board；Being provided with optical assembly on flexible board, be provided with optical chip in optical assembly, optical chip is electrically connected with adapter by the electrical interface on flexible board；Driving chip it is provided with on circuit board, drive circuit and the configurable depositor of drive circuit periphery it is provided with in driving chip, configurable depositor is for adjusting the driving electric current of drive circuit output, and driving chip provides the driving electric current after adjusting by adapter to optical chip.Configurable depositor is integrated in inside driving chip, adjust the driving electric current of drive circuit, circuit board is made to become unitized drive circuit board, by fixing adapter on circuit boards, realize changing flexibly the laser instrument of different size, by configuring the configuration parameter of configurable depositor, complete mating between drive circuit board with laser instrument.
Description
Technical field
The present embodiments relate to technical field of photo communication, particularly relate to a kind of optical module.
Background technology
Country builds 4G high-speed communicating network the most energetically at present, and 4G high speed networking provides the user brand-new interaction entertainment
Mode and lived experience, provide comprehensively service for enterprise, trade company.The either construction of broadband China engineering, or 4G is at a high speed
Network Development, is required for the support of optical communication industry behind.
The cardinal principle of fiber optic communication is: first has to the information transmitted to be changed into the signal of telecommunication at transmitting terminal, then modulates
On the laser beam that optical module laser instrument sends, and gone out by fiber-optic transfer；At receiving terminal, receive light by pairing optical module and believe
After reconvert becomes telecommunications after number, it is demodulated recovery prime information.Optical module occupies very important effect in fiber optic communication.Light
Module is mainly made up of three parts: construction package, surface-mounted integrated circuit (drive circuit) and laser instrument.Construction package is mainly used to solid
Determine optical module and ensure to be connected light path between laser instrument and Transmission Fibers.Surface-mounted integrated circuit is mainly the drive circuit of optical module,
It is mainly responsible for the signal of telecommunication waiting for transmission being converted to the operating current of laser instrument or by the sensing photoelectric current amplification of laser instrument
Become the signal of telecommunication of certain amplitude.Laser instrument is mainly responsible for producing or receiving the optical signal comprising corresponding information.
Light-emitting component in emitting laser is laser diode (LD, Laser diode).LD is a current elements device
Part, in order to make LD luminous, only when the forward current that it passes through exceedes threshold current Ith, it sends laser.
At present, the drive circuit of LD is with the form of SMT (Surface Mount Technology, surface mounting technology)
Directly each components and parts paster is welded on pcb board, is called for short PCBA..Owing to the peripheral coupling capacitance-resistance in the drive circuit of LD is first
Device is generally made up of definite value components and parts, and after paster welding, resistor-capacitor unit cannot be changed easily, and institute is for driving type-A LD
PCBA cannot be used directly to drive B type LD.A kind of one is can be described as between PCBA and LD type after paster completes at present
One corresponding relation, optical module inner laser device is mainly with the connected mode between pcb board will be sharp by the way of directly welding
Light device is attached with pcb board.
At present, this singular association relation between laser instrument and pcb board, limit the range of application of optic module PCB plate,
Cause laser instrument in optical module because of fault or other reasons need to change when, it is necessary to by laser instrument weldering except afterwards, will be new
Laser instrument be welded on pcb board, or the optical module more renewed.
To sum up, the fixing annexation between laser instrument of the prior art and pcb board, the use causing optical module is inadequate
Flexibly.
Summary of the invention
The embodiment of the present invention provides a kind of optical module, in order to solve present in prior art between laser instrument and pcb board
Fixing annexation, cause the use underaction problem of optical module.
The embodiment of the present invention provides a kind of optical module, including: circuit board, flexible board, and be used for connecting described circuit board
Adapter with described flexible board；Described adapter is fixed on described circuit board, and snaps connection with described flexible board；
Being provided with optical assembly on described flexible board, be provided with optical chip in described optical assembly, described optical chip is by described
Electrical interface on flexible board is electrically connected with described adapter；
It is provided with driving chip on described circuit board, in described driving chip, is provided with drive circuit and described drive circuit
Peripheral configurable depositor, described configurable depositor for adjusting the driving electric current of described drive circuit output, described in drive
Dynamic chip provides the driving electric current after adjusting by described adapter to described optical chip.
In above-mentioned optical module, by being integrated in inside driving chip by configurable depositor, adjust driving of drive circuit
Streaming current, makes circuit board become unitized drive circuit board, fixes adapter on circuit boards, can realize changing flexibly not
The laser instrument of same model different size, has only to the configurable depositor of configuration driven chip internal, i.e. after changing laser instrument
Mating between drive circuit board with laser instrument can be completed.
Accompanying drawing explanation
Accompanying drawing is for providing a further understanding of the present invention, and constitutes a part for description, implements with the present invention
Example is used for explaining the present invention together, is not intended that limitation of the present invention.In the accompanying drawings:
Fig. 1 a is the schematic diagram of the threshold current of different types of chip of laser of the prior art；
Fig. 1 b is the structural representation of the drive circuit of a kind of chip of laser in prior art；
The electrical block diagram of a kind of PCBA that Fig. 1 c provides for the embodiment of the present invention；
The electrical block diagram of a kind of PCBA that Fig. 1 d provides for the embodiment of the present invention；
The structural representation of a kind of optical module that Fig. 2 to Fig. 3 provides for the embodiment of the present invention；
The laser instrument of a kind of optical module that Fig. 4 provides for the embodiment of the present invention and the assembling schematic diagram of flexible board；
A kind of adapter that Fig. 5 provides for the embodiment of the present invention and the assembling schematic diagram of flexible board；
The structural representation connecting terminal of a kind of adapter that Fig. 6 provides for the embodiment of the present invention；
A kind of adapter that Fig. 7 provides for the embodiment of the present invention and the annexation schematic diagram of flexible board；
The schematic diagram of the connection procedure of a kind of adapter that Fig. 8 provides for the embodiment of the present invention and flexible board.
Detailed description of the invention
In order to make technical problem solved by the invention, technical scheme and effective clearer, below in conjunction with
The preferred embodiments of the present invention are illustrated by Figure of description, it will be appreciated that preferred embodiment described herein is only used for
The description and interpretation present invention, is not intended to limit the present invention.And in the case of not conflicting, the embodiment in the application and reality
Execute the feature in example can be mutually combined.
Connected mode between optical module inner laser device and pcb board at present, mainly by the way of welding, by laser
Device is fixed on pcb board.This is because the drive circuit of existing optical module inner laser device and chip of laser are one_to_one corresponding
, the most corresponding a kind of PCBA that driving electric current is provided of the most a laser instrument.Owing to being used for driving type-A laser instrument in optical module
PCBA, it is impossible to be used directly to drive B type laser instrument, when the laser instrument of usual type-A breaks down, need to swash fault
Light device solves postwelding from pcb board, is again welded on optical module by the laser instrument of same type, driving based on existing optical module
Characteristic, is not connected to laser instrument on PCB by movable connection method.Because of in prior art, for driving type-A LD's
PCBA, it is impossible to be used directly to drive the LD of B type, and laser instrument is the annexation directly welded with PCBA, directly welds
After want to change laser instrument and only use the welding equipment of specialty to realize.Want to realize the laser instrument of type-A is replaced with B
The laser instrument of type, except by the laser instrument of type-A tip-off from optical module, being again welded on optical mode by the laser instrument of B type
Outside on block, in addition it is also necessary to drive the PCBA of type-A laser instrument, entirety to replace to drive B type to swash by being used on circuit board
The PCBA of light device.
It is adapted to multiple different types of laser instrument, to increase the use spirit of optical module to realize one PCBA of optical module
Activity, the present inventor proposes a kind of inventive concept, first, it is provided that a kind of can compatible dissimilar laser instrument general
PCBA, secondly, based on a general PCBA, laser instrument and the assembling of PCBA, need laser instrument with PCBA's for convenience
Connected mode is adjusted to flexible connection by fixing connection.
Inventor finds, general to realize a PCBA, needs to consider the impedance operator of different types of laser instrument
Enter, because the laser instrument of different size, launch wavelength and optical transport speed is the most different, the driving laser instrument that PCBA provides
Luminous driving electric current is the most different, and the impedance operator essentially consisting in various lasers is different.For different types of laser
The LD of device is different due to impedance operator, causes also having between threshold current Ith larger difference, as shown in Figure 1a, the threshold of type-A LD
Value electric current IthA is more than the threshold current IthB of B type LD.Identical transporting is reached to two different for Ith LD chips
Can, it is necessary to change the resistance in LD current path (such as the R in Fig. 1 bD、LB) etc. parameter, regulate and flow through the electric current of LD chip
Can realize.
Additionally, due to the most inevitably there is lead resistance, inductance and electric capacity in any transmission line.Pulse signal is through relatively
After long lead transmission, easily producing upper punch and ringing, Resistance Influence pulse amplitude, inductance and electric capacity cause upper punch and shake
Bell, the biggest upper punch of inductance and ring are the most serious, and between the biggest signal of electric capacity 0 and 1 signal, the time of change is the longest.
In order to compensate LD encapsulation within wiring parasitic parameter, drive circuit can the negative electrode of LD arrange resistance-capacitance network (as
RF and CF in Fig. 1 b) compensate the wiring parasitic inductance within LD, reduce, with this, upper punch and the ring that stray inductance causes.
IEEE802.3ae agreement has carried out clear and definite regulation to the emitting performance of different rates, different application scene light module, the most right
The Magnitude Difference of pulse in transmitting procedure, the index such as rise and fall time between 0 signal and 1 signal has clear stipulaties.
For certain a specific LD chip, according to the above-mentioned design of the present invention, if general PCBA and a laser instrument
Coupling, need to use LD as illustrated in figure 1 c to drive network, need to the resistance in peripheral circuit rectangle frame, capacitance be arranged and this
The special parameter that the capacitance-resistance performance of type LD matches, controls well to flow through the electric current of LD chip and reduce LD endophyte parameter and draws
That rises crosses the undesirable features such as punching, ring, just can ensure that its emitting performance meets agreement regulation.
Accordingly, it is considered to arrive capacitance-resistance performance and the stray inductance characteristic of dissimilar laser instrument, lead to realize a PCBA
With, need to increase the capacitance-resistance for compensating dissimilar laser instrument in the circuit pathways driving electric current that driving chip provides
Can with the peripheral circuit of stray inductance, and be used for compensating capacitance-resistance performance and needing in the peripheral circuit compensate stray inductance
Configuration adjustable resistance and conditioned circuit, by adjusting adjustable resistance and the value of tunable capacitor, realize a general PCBA with
Different types of laser instrument mates.
Above-mentioned discovery based on inventor, in the case of not considering component package size, if by drive circuit
Peripheral coupling capacitance resistance component is become rheostat and variable condenser such variable elements device from definite value components and parts, then
A PCBA being originally used for driving type-A laser instrument can reach regulation by regulation rheostat, variable condenser
Flow through the electric current of LD chip and the next adaptive B type laser of different resistance-capacitance network is set.Such one piece uses variable elements device to make
PCBA for periphery coupling just can be used to drive different types of LD, it is only necessary to changing different laser instrument can become different
Speed, the optical module of different temperatures grade, thus need can be connected easily or change between PCBA with laser instrument.
Such as, in optical module structure as shown in Figure 1 d, laser instrument uses the mode of welding to fix on circuit boards, laser
Having drive circuit in the driving chip of device, drive circuit is for providing driving electric current to chip of laser, in order to realize driving electricity
The adjustable on road, is arranged in the peripheral circuit of driving chip, for compensating the compensation circuit driving electric current and posting for compensation
The compensation circuit of raw inductance, adjusts the driving electric current of various lasers chip.As shown in Figure 1 d, the driving of driving chip output
Electric current is differential signal, compensates circuit and arranges two groups, and first group compensates circuit and be used for adjusting driving electric current Iout-, second group of benefit
Repay circuit for adjusting driving electric current Iout+.Wherein, first group of compensation circuit includes that the first compensation circuit 11 and second compensates electricity
Road 21, first compensates circuit 11 is used for compensating the difference of the capacitance-resistance characteristic of various lasers chip, and second compensates circuit 21 is used for
Compensate the difference of stray inductance of various lasers chip, drive the of the outfan of electric current Iout-and the first compensation circuit 11
One end connects, and the first the second end and second compensating circuit 11 compensates the first end of circuit 21 and connects, and second compensates circuit 21
First end is connected with the positive pole LD+ of chip of laser, and second compensates the second end ground connection of circuit 21；Wherein, first circuit is compensated
11 include an adjustable resistance；Second compensates an adjustable resistance and the tunable capacitor that circuit 21 includes being connected in series.The
Two groups compensate circuit and include that the 3rd compensation circuit 12 and the 4th compensates circuit 22, and the 3rd compensates circuit 12 is used for compensating different laser
The difference of the capacitance-resistance characteristic of device chip, the 4th compensates circuit 22 is used for compensating the difference of the stray inductance of various lasers chip,
The outfan driving electric current Iout+ connects with the 3rd the first end compensating circuit 12, second end and the of the 3rd compensation circuit 12
Four the first ends compensating circuit 22 connect, and the 4th the first end compensating circuit 22 is connected with the positive pole LD+ of chip of laser, the
Four the second end ground connection compensating circuit 22；Wherein, the 3rd compensation circuit 12 includes an adjustable resistance；4th compensates circuit 22 wraps
Include the adjustable resistance and a tunable capacitor being connected in series.Above-mentioned two groups of adjustable resistances compensated in circuit and tunable capacitor
Can manual setting so that driving chip on circuit board and the peripheral circuit that compensates of driving chip constitute a general PCBA,
When PCBA connects different types of laser instrument, each adjustable resistance and the resistance of tunable capacitor in compensation circuit only need to be manually adjusted
It is worth.But, for above-mentioned compensation circuit, pcb board needing weld the bigger variable resistance of volume and variable capacitance, this is just
The optical module volume caused is uncontrollable, and this is less desirable in the application of optical module.
Based on foregoing invention conceive, inventor by a kind of new by the way of, realize various lasers chip driving electricity
The adjustable of stream, central scope is to be integrated in inside driving chip by adjustable resistance peripheral for driving chip, tunable capacitor, passes through
Integrated circuit within driving chip realizes the change of resistance value and capacitance, and then provides not for different chip of laser
Same driving electric current.Each component parameters of integrated circuit within driving chip is controlled by can configure depositor, to reach
Adjusting resistance value and the effect of capacitance, and then make driving chip export different driving electric currents.Thus avoid at pcb board
Variable resistance that upper welding volume is bigger and the optical module volume that variable capacitance causes are uncontrollable.It addition, inside current optical module
Connected mode between laser instrument with pcb board is mainly by the way of directly welding, and is attached with pcb board by laser instrument.
Directly wanting to change laser instrument after welding only uses the welding equipment of specialty to realize.So the mode of the most directly welding
Generalization PCBA cannot be met and the most frequently change the demand of laser instrument.The replacing of various lasers, the present invention couple for convenience
Laser instrument is improved with the connected mode of pcb board, can realize a pcb board by a flexible board and flexible board connector
Connection electrically and mechanically is carried out flexibly from different laser instrument.The novel the optical module below embodiment of the present invention provided
It is described in detail.
The embodiment of the present invention provides a kind of optical module, as in figure 2 it is shown, include: circuit board, flexible board, and is used for connecting
Circuit board and the adapter of flexible board；Adapter is fixing on circuit boards, and snaps connection with flexible board；
Being provided with optical assembly on flexible board, be provided with optical chip in optical assembly, optical chip is by the electrical interface on flexible board
It is electrically connected with adapter；
It is provided with driving chip on circuit board, in driving chip, is provided with drive circuit and peripheral can configure of drive circuit
Depositor, configurable depositor is for adjusting the driving electric current of drive circuit output, and driving chip passes through adapter to optical chip
Driving electric current after adjusting is provided.
What deserves to be explained is, the optical assembly in the above-mentioned optical module of the present invention is not limited to laser instrument, it is also possible to be detector,
Optical chip is not limited to chip of laser, it is also possible to be detector chip (also referred to as receiving chip).
For the configurable depositor in above-mentioned driving chip, specifically include by peripheral build-out resistor and peripheral matching capacitance
The integrated circuit constituted.Because configurable depositor is connected with drive circuit, by controlling the integrated circuit in configurable depositor
Resistance and the change of capacitance, come whole drive circuit produce driving electric current.Electricity in integrated circuit in configurable depositor
Resistance and the change of capacitance, be mainly used to the size driving electric current and the wiring parasitic inductance of optical chip adjusting in optical chip.
In the embodiment of the present invention, can be by configuring the peripheral build-out resistor in configurable depositor and peripheral matching capacitance
Configuration parameter, adjusts the size driving electric current in optical chip and the wiring parasitic inductance of optical chip.Particular by outside
Software configures the peripheral build-out resistor in configurable depositor and the configuration parameter of peripheral matching capacitance.In configurable depositor
Peripheral build-out resistor and peripheral matching capacitance be multiple, the peripheral build-out resistor in configurable depositor and peripheral matching capacitance
Configuration parameter configure with the form of parameter sets.
Such as, if above-mentioned flexible board is the first flexible board, when optical assembly is the first optical assembly, the periphery of configurable depositor
Build-out resistor and peripheral matching capacitance are configured to the first parameter sets；
If flexible board is the second flexible board, when optical assembly is the second optical assembly, the peripheral build-out resistor of configurable depositor
It is configured to the second parameter sets with peripheral matching capacitance.
In above-mentioned optical module, by being integrated in inside driving chip by configurable depositor, adjust driving of drive circuit
Streaming current, makes circuit board become unitized drive circuit board, fixes adapter on circuit boards, can realize changing flexibly not
The laser instrument of same model different size, has only to the configurable depositor of configuration driven chip internal, i.e. after changing laser instrument
Mating between drive circuit board with laser instrument can be completed.
By the improvement of above-mentioned driving chip, can be that different chip of laser provides different driving electric currents, in order to
Further reduce the stray inductance of various lasers chip, can be by the path ground between driving chip and adapter, such as Fig. 2
Shown in Fig. 3, drive differential signal line Iout-and the Iout+ ground connection of electric current.
In above-mentioned optical module, the electrical connection between driving chip and adapter, including herein below, can refer to figure
3:
Driving chip is connected by differential signal line with before adapter；The electrical interface of adapter includes the first differential interface
With the second differential interface；
Two holding wires that drive current through of driving chip output transmit；First holding wire is connected to the of adapter
One differential interface, second holding wire is connected to the second differential interface of adapter；
Wherein, the first differential interface is corresponding with the first electrode of optical chip, and the second differential interface is electric with the second of optical chip
Extremely corresponding.
If the first differential interface is connected with Iout-, the second differential interface is connected with Iout+, then the first electrode is LD+, the
Two electrodes are LD-.Or, the first differential interface is connected with Iout+, and the second differential interface is connected with Iout-, then the first electrode is
LD-, the second electrode is LD+.
Additionally, generally driving chip also includes biasing circuit, in order to make the light power stabilising of light that chip of laser sends,
Need the bias current of different chip of laser is adjusted, as it is shown on figure 3, except drive circuit and can in driving chip
Outside configuration register, also including biasing circuit, the embodiment of the present invention adjusts biasing circuit output by peripheral circuit 13
Bias current, wherein, peripheral circuit 3 is made up of the adjustable resistance being connected in series and controllable impedance, the first end of peripheral circuit 13
Being connected with the bias current outfan of biasing circuit, the second end of peripheral circuit 13 connects with the second electrode LD-of chip of laser
Connect.
Based on above-mentioned optical module, embodiments provide circuit board and carry out connection electrically and mechanically with laser instrument
Mode.
First, laser instrument is connected with flexible board, as shown in Figure 4, flexible board is provided with installing hole, laser instrument is provided with
Mounting post, when laser instrument is connected with flexible board, only needs the mounting post of laser instrument to be inserted in the installing hole of correspondence, wherein,
Flexible board is flexible printing plate (FPC plate), the electrical interface of flexible board, for the connection terminal with adapter to inserting, for flexibility
The electrical interface of plate connects, with adapter, the electrical contact that terminal keeps good, and electrical interface one end of flexible board is designed to straight
Shape, with reference to Fig. 5, Fig. 7 and Fig. 8.Then, re-use adapter and connect circuit board (PCB) and FPC plate, make the laser instrument on FPC plate
Connection mechanically and electrically is realized by adapter with circuit board.
Wherein, adapter is FPC connector, and one end of adapter is weldingly connected with PCB and connects (many employing SMT weld), even
Connect the other end of device with FPC plate to inserting, and be designed with buckling and locking device on adapter and make FPC plate and connector locking, keep certain
Contact reliability.
Concrete, the adapter of the embodiment of the present invention, as it is shown in figure 5, include: plastic body and multiple connection terminal；Multiple
Connection terminal package, in plastic body, connects terminal and includes weld part and connecting portion；The connecting portion connecting terminal is that lamellar is every orchid
Structure (sees Fig. 6), and the weld part connecting terminal is straight without curling, sees Fig. 7.The weld part of multiple connection terminals is welded on electricity
On the plate of road, and connecting with the electrical interface of adapter, the electrical interface of adapter refers to the differential interface being connected with differential signal line；Many
The connecting portion of individual connection terminal is electrically connected with the electrical interface of flexible board.
Wherein, as shown in Figure 6 and Figure 7, it is equally spaced lamellar jube structure inside plastic body, makes connection terminal assemble
After, the link portions of multiple connection terminals keeps closely spaced arrangement and provides certain retentivity.Use requirement according to product,
Plastic body to have enough intensity and toughness, all can not have and stick up before and after adapter is welded to circuit board by SMT mode formula
Bent deformation.
Connect the contact component that terminal is FPC connector, in order to reach the highdensity arrangement of adapter and more stable connecing
Touching performance, the terminal that connects of adapter uses the way of contact of arrow gauge formula.
Wherein, the electrical interface of flexible board is straight lamellar, and the connecting portion of multiple connection terminals is electric with the electrical interface of flexible board
Property the schematic diagram that connects see him 7 and Fig. 8.
Fig. 7 illustrates connection terminal, plastic body, the position relationship of latching structure, and connects terminal and flexible board
Electrical interface is straight lamellar to slotting annexation, the electrical interface of flexible board, be inserted into connection terminal in, and with the chain being connected terminal
Connecing portion's electrical connection, latching structure is for locking flexible board on the connectors.
Adapter also includes latching structure, as it is shown in fig. 7, one end of latching structure is fixed on plastic body, and latching structure
The other end be movable kayser, in flexible board is inserted into the plastic body of adapter so that the electrical interface of flexible board and multiple companies
When the connecting portion of connecting terminal is electrically connected with, movable kayser is by flexible board buckle on the connectors.Latching structure matches with plastic body
Close, after the electrical interface of flexible board inserts and connects terminal, utilize latching structure to lock flexible board, make flexible board and latching structure
Keep certain contact force.
Fig. 8 illustrates the process that flexible board is connected with the kayser of adapter, mainly includes 3 steps, step 1, pulls open
The movable kayser of the latching structure of adapter, step 2, by the electrical interface of flexible board, the most straight lamellar is inserted in connection terminal,
Step 3, locks the movable kayser of latching structure.
Adapter also includes welding sheet, as it is shown in figure 5, welding sheet is positioned at the bottom of the both sides of plastic body, welding sheet is used for
Adapter is fixed on circuit boards.Welding sheet is used for the connectivity robustness strengthening between adapter and PCB, and can avoid
Excessive and damage and connect welding of terminal and PCB because connecting the stress born on terminal.Connecting the less adapter of number of terminals
In, welding sheet part optionally.
In the embodiment of the present invention, the first optical assembly is the first light emission component, and the optical chip in the first optical assembly is first
Chip of laser；Second optical assembly is the second light emission component, and the optical chip in the second optical assembly is second laser chip.
In the above-mentioned optical module structure that the embodiment of the present invention provides, periphery is mated components and parts and is integrated into chip internal by use
Driving chip as the PCBA of drive circuit, the most a unitized drive circuit board.Drive in this generalization
On circuit board after integrated FPC connector parts, can easily change the laser instrument of different model, different size, change laser
Have only to configure chip internal corresponding registers after device and can complete mating between drive circuit board with laser instrument.
By the application of adapter, it is possible to achieve the modularity within optical module.By changing different luminescences etc. efficiently
Level, the laser instrument of different temperatures grade carry out the drive circuit board PCBA of adapting universal, can easily realize from a specification light
Module is changed to the optical module of other a model.
Laser instrument is fixed on flexible board, then by adapter, flexible board is electrically and mechanically connected with circuit board
Connect, both can realize being quickly connected between laser instrument with PCBA, can easily realize again the replacing of laser instrument, and can drop
Assembly cost in low module production process.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation
Property concept, then can make other change and amendment to these embodiments.So, claims are intended to be construed to include excellent
Select embodiment and fall into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and the modification essence without deviating from the present invention to the present invention
God and scope.So, if these amendments of the present invention and modification belong to the scope of the claims in the present invention and equivalent technologies thereof
Within, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. an optical module, it is characterised in that including: circuit board, flexible board, and it is soft with described to be used for connecting described circuit board
The adapter of property plate；Described adapter is fixed on described circuit board, and snaps connection with described flexible board；
Being provided with optical assembly on described flexible board, be provided with optical chip in described optical assembly, described optical chip is by described flexibility
Electrical interface on plate is electrically connected with described adapter；
It is provided with driving chip on described circuit board, is provided with drive circuit in described driving chip and described drive circuit is peripheral
Configurable depositor, described configurable depositor for adjust described drive circuit output driving electric current, described driving core
Sheet provides the driving electric current after adjusting by described adapter to described optical chip.
2. optical module as claimed in claim 1, it is characterised in that include in described configurable depositor by peripheral build-out resistor
The integrated circuit constituted with peripheral matching capacitance.
3. optical module as claimed in claim 2, it is characterised in that by configuring the peripheral coupling in described configurable depositor
Resistance and the configuration parameter of peripheral matching capacitance, adjust the size driving electric current in described optical chip and described optical chip
Wiring parasitic inductance.
4. optical module as claimed in claim 3, it is characterised in that
Described flexible board is the first flexible board, when described optical assembly is the first optical assembly, and the periphery of described configurable depositor
Distribution resistance and peripheral matching capacitance are configured to the first parameter sets；
Described flexible board is the second flexible board, when described optical assembly is the second optical assembly, outside described configurable depositor
Enclose build-out resistor and peripheral matching capacitance is configured to the second parameter sets.
5. optical module as claimed in claim 1, it is characterised in that pass through difference before described driving chip and described adapter
Holding wire connects；The electrical interface of described adapter includes the first differential interface and the second differential interface；
Two holding wires that drive current through of described driving chip output transmit；First holding wire is connected to described adapter
The first differential interface, second holding wire is connected to the second differential interface of described adapter；
Wherein, described first differential interface is corresponding with the first electrode of described optical chip, described second differential interface and described light
Second electrode of chip is corresponding.
6. the optical module as according to any one of claim 1 to 5, it is characterised in that described adapter includes: plastic body is with many
Individual connection terminal；
The plurality of connection terminal package is in described plastic body, and described connection terminal includes weld part and connecting portion；
The weld part of the plurality of connection terminal is welded on described circuit board, and connects with the electrical interface of described adapter；
The connecting portion of the plurality of connection terminal is electrically connected with the electrical interface of described flexible board.
7. optical module as claimed in claim 6, it is characterised in that the connecting portion of described connection terminal be lamellar every blue structure,
The weld part of described connection terminal is straight without curling.
8. optical module as claimed in claim 6, it is characterised in that described adapter also includes latching structure, and described kayser is tied
One end of structure is fixed on described plastic body, and the other end of described latching structure is movable kayser, is inserted at described flexible board
In the plastic body of described adapter so that the electrical interface of described flexible board is electrically connected with the plurality of connecting portion being connected terminal
Time, described flexible board is buckled on described adapter by described movable kayser.
9. optical module as claimed in claim 6, it is characterised in that described adapter also includes welding sheet, described welding sheet position
In the bottom of the both sides of described plastic body, described welding sheet is for being fixed on described circuit board by described adapter.
10. optical module as claimed in claim 4, it is characterised in that described first optical assembly is the first light emission component, described
Optical chip in first optical assembly is the first chip of laser；
Described second optical assembly is the second light emission component, and the optical chip in described second optical assembly is second laser chip.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610739389.0A CN106125213B (en) | 2016-08-26 | 2016-08-26 | A kind of optical module |
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| CN201610739389.0A CN106125213B (en) | 2016-08-26 | 2016-08-26 | A kind of optical module |
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| CN106125213A true CN106125213A (en) | 2016-11-16 |
| CN106125213B CN106125213B (en) | 2018-08-17 |
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| CN108418636A (en) * | 2018-02-09 | 2018-08-17 | 青岛海信宽带多媒体技术有限公司 | Optical module and impedance matching methods |
| EP3573258A4 (en) * | 2017-02-28 | 2020-04-08 | Huawei Technologies Co., Ltd. | Passive optical network system, and optical component and matching impedance adjustment method therefor |
| CN111710958A (en) * | 2020-06-28 | 2020-09-25 | 西安易朴通讯技术有限公司 | Antenna assembly, electronic equipment and antenna switching method |
| CN113259011A (en) * | 2021-03-30 | 2021-08-13 | 武汉英飞光创科技有限公司 | Compatible circuit for changing rising and falling time of output electric signal for optical module |
| WO2022193734A1 (en) * | 2021-03-19 | 2022-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN113259011B (en) * | 2021-03-30 | 2022-09-02 | 武汉英飞光创科技有限公司 | Compatible circuit for changing rising and falling time of output electric signal for optical module |
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|---|---|
| CN106125213B (en) | 2018-08-17 |
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