CN106118585A - A kind of casting glue for LED and preparation method thereof - Google Patents

A kind of casting glue for LED and preparation method thereof Download PDF

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CN106118585A
CN106118585A CN201610625439.2A CN201610625439A CN106118585A CN 106118585 A CN106118585 A CN 106118585A CN 201610625439 A CN201610625439 A CN 201610625439A CN 106118585 A CN106118585 A CN 106118585A
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led
casting glue
parts
preparation
polymethyl methacrylate
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代长华
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The invention provides a kind of casting glue for LED and preparation method thereof.Preparation method is as follows: nano silicon and ethyl acetate are mixed dispersion by (1), adds γ aminopropyl trimethoxysilane and vinyltrimethoxy silane continues ultrasonic disperse；(2) temperature reaction, cooled and filtered is washed, and is dried；(3) add containing hydrogen silicone oil, end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, poly dimethyl methyl vinyl silicone, rosin resin, BTA and triphenyl phosphite and stir to obtain mixture A；(4) end-vinyl Polymethyl methacrylate, dimethicone, poly dimethyl methyl vinyl silicone, platinum catalyst and absolute ethyl alcohol and stirring are obtained mixture B；(5) dispersion, deaeration and get final product are sheared in above-mentioned A and B mixing.The casting glue for LED of the present invention is short for hardening time, good mechanical properties, and thermal conductivity is high, and excellent in heat dissipation effect has good insulating properties simultaneously.

Description

A kind of casting glue for LED and preparation method thereof
Technical field
The present invention relates to field of electronic materials, be specifically related to a kind of casting glue for LED and preparation method thereof.
Background technology
Casting glue is mainly used in bonding, sealing, embedding and the coating protection of electronic devices and components.Casting glue before uncured in Liquid, there is mobility, glue viscosity according to the material of product, performance, the difference of production technology and otherwise varied.Casting glue Its use value could be realized after being fully cured, can play after solidification waterproof and dampproof, dust-proof, insulation, heat conduction, maintain secrecy, anti- The resistance to gentleness of burn into is shockproof waits effect.In recent years, along with the development of science and technology, energy problem more serious, and with low energy consumption, height The green light source of efficiency is that the light emitting diode (LED) that synonym occurs has obtained people and pays close attention to widely, it be a kind of can be straight Connect the light emitting semiconductor device converting electric energy to luminous energy, possess simple in construction, energy-conservation, life-span length, environmental protection, luminous efficiency high and The advantage such as abundant bright in luster, is expected to become forth generation lighting source.And the performance of the casting glue that LED is used is to LED device Brightness, luminous efficiency and service life suffer from important impact.Traditional epoxy resin embedding adhesive cannot meet performance The development of the highest LED, therefore, the research and development casting glue that mechanical property is good, heat conductivity good and insulating properties is good is for LED Development have great importance.
Summary of the invention
Solve the technical problem that: it is an object of the invention to provide a kind of casting glue for LED, hardening time is short, power Learning functional, thermal conductivity is high, and excellent in heat dissipation effect has good insulating properties simultaneously.
Technical scheme: a kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 1-3 part, containing hydrogen silicone oil 5-10 part, end-vinyl Polymethyl methacrylate 20-40 part, dimethyl hydroxyl silicon oil 2-4 part, two Methyl-silicone oil 1-2 part, poly dimethyl methyl vinyl silicone 10-15 part, γ-aminopropyltrimethoxysilane 1-2 part, ethylene Base trimethoxy silane 1-3 part, rosin resin 3-6 part, BTA 1-3 part, triphenyl phosphite 1-2 part, platinum catalyst 0.001-0.002 part, dehydrated alcohol 10-20 part, ethyl acetate 60-80 part.
It is further preferred that described a kind of casting glue for LED, following component it is prepared from weight portion: receive Rice silica 1 .5-2.5 part, containing hydrogen silicone oil 6-9 part, end-vinyl Polymethyl methacrylate 25-35 part, dimethyl hydroxyl Base silicone oil 2.5-3.5 part, dimethicone 1.2-1.7 part, poly dimethyl methyl vinyl silicone 11-14 part, γ-aminopropyl Trimethoxy silane 1.3-1.8 part, vinyltrimethoxy silane 1.5-2.5 part, rosin resin 4-5 part, BTA 1.5-2.5 part, triphenyl phosphite 1.3-1.7 part, platinum catalyst 0.0013-0.0017 part, dehydrated alcohol 13-18 part, acetic acid Ethyl ester 65-75 part.
The above-mentioned preparation method for the casting glue of LED comprises the following steps:
(1) nano silicon and ethyl acetate are mixed, disperse 30-40 minute in ultrasonic disperse instrument, add γ-ammonia third Base trimethoxy silane and vinyltrimethoxy silane, continue ultrasonic disperse 5-10 minutes；
(2) loading in reflux condensation mode there-necked flask, be warming up to 90-95 DEG C and react 5-6 hour, cooled and filtered is washed, and puts into Baking oven is dried；
(3) containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, the poly-diformazan of half are added Ylmethyl vinylsiloxane, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed 200-300r/ Stir 25-30 minute under min, obtain mixture A；
(4) will residue end-vinyl Polymethyl methacrylate, dimethicone, residue poly dimethyl methyl ethylene silicon Oxygen alkane, platinum catalyst and dehydrated alcohol mixing, stir 25-30 minute under rotating speed 200-300r/min with blender, obtain mixing Thing B；
(5) being mixed with mixture B by mixture A, high speed shear is disperseed 5-10 minute, puts into vacuum in vacuum drying oven and carries out Deaeration 10-15 minute and get final product, wherein, vacuum is-0.1MPa, and temperature is 30-40 DEG C.
Further, the preparation method of described a kind of casting glue for LED, in described step (2), temperature is 91- 94 DEG C, the response time is 5.5 hours.
Further, the preparation method of described a kind of casting glue for LED, described step (3) medium speed is 250r/min, mixing time is 28 minutes.
Further, the preparation method of described a kind of casting glue for LED, described step (4) medium speed is 250r/min, mixing time is 28 minutes.
Further, the preparation method of described a kind of casting glue for LED, jitter time in described step (5) For 6-9 minute, inclined heated plate was 11-14 minute, and temperature is 35 DEG C.
Beneficial effect: the casting glue for LED of present invention hardening time at 100 DEG C is 14-18 minute, hardening time Short, its shore hardness A reaches as high as 38, and hot strength is also up to 0.63MPa, and elongation at break is 225%, has good power Learning performance, its thermal conductivity is up to 0.326W m-1·K-1, thermal conductivity is high, and excellent in heat dissipation effect, its specific insulation is 1.8 simultaneously ×1015-1.9×1015Ω cm, has good insulating properties.
Detailed description of the invention
Embodiment 1
A kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 1 part, containing hydrogen silicone oil 5 Part, end-vinyl Polymethyl methacrylate 20 parts, dimethyl hydroxyl silicon oil 2 parts, dimethicone 1 part, poly dimethyl first Base vinylsiloxane 10 parts, γ-aminopropyltrimethoxysilane 1 part, vinyltrimethoxy silane 1 part, rosin resin 3 Part, BTA 1 part, triphenyl phosphite 1 part, platinum catalyst 0.001 part, dehydrated alcohol 10 parts, ethyl acetate 60 parts.
The preparation method of the above-mentioned casting glue for LED is: nano silicon and ethyl acetate are mixed by (1), super Sound separating apparatus disperses 30 minutes, adds γ-aminopropyltrimethoxysilane and vinyltrimethoxy silane, continue ultrasonic Disperse 5 minutes；(2) loading in reflux condensation mode there-necked flask, be warming up to 90 DEG C and react 5 hours, cooled and filtered is washed, and puts into Baking oven is dried；(3) containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, half are added Poly dimethyl methyl vinyl silicone, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed Stir 25 minutes under 200r/min, obtain mixture A；(4) will residue end-vinyl Polymethyl methacrylate, dimethyl-silicon Oil, residue poly dimethyl methyl vinyl silicone, platinum catalyst and dehydrated alcohol mixing, with blender at rotating speed 200r/min Lower stirring 25 minutes, obtains mixture B；(5) being mixed with mixture B by mixture A, high speed shear is disperseed 5 minutes, puts into vacuum and does In dry case, vacuum carries out deaeration 10 minutes and get final product, and wherein, vacuum is-0.1MPa, and temperature is 30 DEG C.
Embodiment 2
A kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 1.5 parts, containing hydrogen silicone oil 6 parts, end-vinyl Polymethyl methacrylate 25 parts, dimethyl hydroxyl silicon oil 2.5 parts, dimethicone 1.2 parts, poly-diformazan Ylmethyl vinylsiloxane 11 parts, γ-aminopropyltrimethoxysilane 1.3 parts, vinyltrimethoxy silane 1.5 parts, pine 4 parts of balsam, BTA 1.5 parts, triphenyl phosphite 1.3 parts, platinum catalyst 0.0013 part, dehydrated alcohol 13 parts, second Acetoacetic ester 65 parts.
The preparation method of the above-mentioned casting glue for LED is: nano silicon and ethyl acetate are mixed by (1), super Sound separating apparatus disperses 35 minutes, adds γ-aminopropyltrimethoxysilane and vinyltrimethoxy silane, continue ultrasonic Disperse 8 minutes；(2) loading in reflux condensation mode there-necked flask, be warming up to 91 DEG C and react 5.5 hours, cooled and filtered is washed, and puts into Baking oven is dried；(3) containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, half are added Poly dimethyl methyl vinyl silicone, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed Stir 28 minutes under 250r/min, obtain mixture A；(4) will residue end-vinyl Polymethyl methacrylate, dimethyl-silicon Oil, residue poly dimethyl methyl vinyl silicone, platinum catalyst and dehydrated alcohol mixing, with blender at rotating speed 250r/min Lower stirring 28 minutes, obtains mixture B；(5) being mixed with mixture B by mixture A, high speed shear is disperseed 6 minutes, puts into vacuum and does In dry case, vacuum carries out deaeration 11 minutes and get final product, and wherein, vacuum is-0.1MPa, and temperature is 35 DEG C.
Embodiment 3
A kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 2 parts, containing hydrogen silicone oil 7.5 parts, end-vinyl Polymethyl methacrylate 30 parts, dimethyl hydroxyl silicon oil 3 parts, dimethicone 1.5 parts, poly-diformazan Ylmethyl vinylsiloxane 12.5 parts, γ-aminopropyltrimethoxysilane 1.5 parts, vinyltrimethoxy silane 2 parts, pine 4.5 parts of balsam, BTA 2 parts, triphenyl phosphite 1.5 parts, platinum catalyst 0.0015 part, dehydrated alcohol 15 parts, second Acetoacetic ester 70 parts.
The preparation method of the above-mentioned casting glue for LED is: nano silicon and ethyl acetate are mixed by (1), super Sound separating apparatus disperses 35 minutes, adds γ-aminopropyltrimethoxysilane and vinyltrimethoxy silane, continue ultrasonic Disperse 7 minutes；(2) loading in reflux condensation mode there-necked flask, be warming up to 92 DEG C and react 5.5 hours, cooled and filtered is washed, and puts into Baking oven is dried；(3) containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, half are added Poly dimethyl methyl vinyl silicone, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed Stir 28 minutes under 250r/min, obtain mixture A；(4) will residue end-vinyl Polymethyl methacrylate, dimethyl-silicon Oil, residue poly dimethyl methyl vinyl silicone, platinum catalyst and dehydrated alcohol mixing, with blender at rotating speed 250r/min Lower stirring 27 minutes, obtains mixture B；(5) being mixed with mixture B by mixture A, high speed shear is disperseed 7 minutes, puts into vacuum and does In dry case, vacuum carries out deaeration 12 minutes and get final product, and wherein, vacuum is-0.1MPa, and temperature is 35 DEG C.
Embodiment 4
A kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 2.5 parts, containing hydrogen silicone oil 9 parts, end-vinyl Polymethyl methacrylate 35 parts, dimethyl hydroxyl silicon oil 3.5 parts, dimethicone 1.7 parts, poly-diformazan Ylmethyl vinylsiloxane 14 parts, γ-aminopropyltrimethoxysilane 1.8 parts, vinyltrimethoxy silane 2.5 parts, pine 5 parts of balsam, BTA 2.5 parts, triphenyl phosphite 1.7 parts, platinum catalyst 0.0017 part, dehydrated alcohol 18 parts, second Acetoacetic ester 75 parts.
The preparation method of the above-mentioned casting glue for LED is: nano silicon and ethyl acetate are mixed by (1), super Sound separating apparatus disperses 35 minutes, adds γ-aminopropyltrimethoxysilane and vinyltrimethoxy silane, continue ultrasonic Disperse 8 minutes；(2) loading in reflux condensation mode there-necked flask, be warming up to 94 DEG C and react 5.5 hours, cooled and filtered is washed, and puts into Baking oven is dried；(3) containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, half are added Poly dimethyl methyl vinyl silicone, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed Stir 28 minutes under 250r/min, obtain mixture A；(4) will residue end-vinyl Polymethyl methacrylate, dimethyl-silicon Oil, residue poly dimethyl methyl vinyl silicone, platinum catalyst and dehydrated alcohol mixing, with blender at rotating speed 250r/min Lower stirring 28 minutes, obtains mixture B；(5) being mixed with mixture B by mixture A, high speed shear is disperseed 9 minutes, puts into vacuum and does In dry case, vacuum carries out deaeration 14 minutes and get final product, and wherein, vacuum is-0.1MPa, and temperature is 35 DEG C.
Embodiment 5
A kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 3 parts, containing hydrogen silicone oil 10 Part, end-vinyl Polymethyl methacrylate 40 parts, dimethyl hydroxyl silicon oil 4 parts, dimethicone 2 parts, poly dimethyl first Base vinylsiloxane 15 parts, γ-aminopropyltrimethoxysilane 2 parts, vinyltrimethoxy silane 3 parts, rosin resin 6 Part, BTA 3 parts, triphenyl phosphite 2 parts, platinum catalyst 0.002 part, dehydrated alcohol 20 parts, ethyl acetate 80 parts.
The preparation method of the above-mentioned casting glue for LED is: nano silicon and ethyl acetate are mixed by (1), super Sound separating apparatus disperses 40 minutes, adds γ-aminopropyltrimethoxysilane and vinyltrimethoxy silane, continue ultrasonic point Dissipate 10 minutes；(2) loading in reflux condensation mode there-necked flask, be warming up to 95 DEG C and react 6 hours, cooled and filtered is washed, and puts into baking Case is dried；(3) addition containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, half are gathered Dimethyl methyl vinyl silicone, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed 300r/ Stir 30 minutes under min, obtain mixture A；(4) will residue end-vinyl Polymethyl methacrylate, dimethicone, residue Poly dimethyl methyl vinyl silicone, platinum catalyst and dehydrated alcohol mixing, stir under rotating speed 300r/min with blender 30 minutes, obtain mixture B；(5) being mixed with mixture B by mixture A, high speed shear is disperseed 10 minutes, puts into vacuum drying oven Middle vacuum carries out deaeration 15 minutes and get final product, and wherein, vacuum is-0.1MPa, and temperature is 40 DEG C.
Comparative example 1
The present embodiment is not contain containing hydrogen silicone oil and poly dimethyl methyl vinyl silicone with the difference of embodiment 5.Specifically Ground is said and is:
A kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 3 parts, end-vinyl are poly- Methyl vinyl silicone 40 parts, dimethyl hydroxyl silicon oil 4 parts, dimethicone 2 parts, γ-aminopropyltrimethoxysilane 2 Part, vinyltrimethoxy silane 3 parts, rosin resin 6 parts, BTA 3 parts, triphenyl phosphite 2 parts, platinum catalyst 0.002 part, dehydrated alcohol 20 parts, ethyl acetate 80 parts.
The preparation method of the above-mentioned casting glue for LED is: nano silicon and ethyl acetate are mixed by (1), super Sound separating apparatus disperses 40 minutes, adds γ-aminopropyltrimethoxysilane and vinyltrimethoxy silane, continue ultrasonic point Dissipate 10 minutes；(2) loading in reflux condensation mode there-necked flask, be warming up to 95 DEG C and react 6 hours, cooled and filtered is washed, and puts into baking Case is dried；(3) half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, rosin resin, benzo three are added Nitrogen azoles and triphenyl phosphite, stir 30 minutes under rotating speed 300r/min with blender, obtain mixture A；(4) by residue end second Thiazolinyl Polymethyl methacrylate, dimethicone, platinum catalyst and dehydrated alcohol mixing, with blender at rotating speed 300r/ Stir 30 minutes under min, obtain mixture B；(5) being mixed with mixture B by mixture A, high speed shear is disperseed 10 minutes, puts into true In empty drying baker, vacuum carries out deaeration 15 minutes and get final product, and wherein, vacuum is-0.1MPa, and temperature is 40 DEG C.
Comparative example 2
The present embodiment is not contain dimethyl hydroxyl silicon oil and dimethicone with the difference of embodiment 5.Specifically:
A kind of casting glue for LED, is prepared from weight portion by following component: nano silicon 3 parts, containing hydrogen silicone oil 10 Part, end-vinyl Polymethyl methacrylate 40 parts, poly dimethyl methyl vinyl silicone 15 parts, γ-aminopropyl front three TMOS 2 parts, vinyltrimethoxy silane 3 parts, rosin resin 6 parts, BTA 3 parts, triphenyl phosphite 2 parts, Platinum catalyst 0.002 part, dehydrated alcohol 20 parts, ethyl acetate 80 parts.
The preparation method of the above-mentioned casting glue for LED is: nano silicon and ethyl acetate are mixed by (1), super Sound separating apparatus disperses 40 minutes, adds γ-aminopropyltrimethoxysilane and vinyltrimethoxy silane, continue ultrasonic point Dissipate 10 minutes；(2) loading in reflux condensation mode there-necked flask, be warming up to 95 DEG C and react 6 hours, cooled and filtered is washed, and puts into baking Case is dried；(3) addition containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, half are gathered Dimethyl methyl vinyl silicone, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed 300r/ Stir 30 minutes under min, obtain mixture A；(4) will residue end-vinyl Polymethyl methacrylate, dimethicone, residue Poly dimethyl methyl vinyl silicone, platinum catalyst and dehydrated alcohol mixing, stir under rotating speed 300r/min with blender 30 minutes, obtain mixture B；(5) being mixed with mixture B by mixture A, high speed shear is disperseed 10 minutes, puts into vacuum drying oven Middle vacuum carries out deaeration 15 minutes and get final product, and wherein, vacuum is-0.1MPa, and temperature is 40 DEG C.
Casting glue of the present invention hardening time at 100 DEG C is 14-18 minute, and hardening time is short, and record after solidification is every Index see table, and its shore hardness A reaches as high as 38, and hot strength is also up to 0.63MPa, and elongation at break is 225%, has Good mechanical property, its thermal conductivity is up to 0.326W m-1·K-1, thermal conductivity is high, excellent in heat dissipation effect, simultaneously its volume resistance Rate is 1.8 × 1015-1.9×1015Ω cm, has good insulating properties.
Table 1 is for the partial properties index of the casting glue of LED
Name of product Shore A hardness Hot strength (MPa) Elongation at break (%) Thermal conductivity (W m-1·K-1) Specific insulation (Ω cm)
Embodiment 1 32 0.51 211 0.312 1.8×1015
Embodiment 2 35 057 214 0.317 1.8×1015
Embodiment 3 36 0.59 220 0.321 1.9×1015
Embodiment 4 38 0.63 225 0.326 1.8×1015
Embodiment 5 36 0.61 222 0.324 1.9×1015
Comparative example 1 28 0.42 201 0.315 1.5×1015
Comparative example 2 27 0.47 204 0.312 1.6×1015

Claims (7)

1. the casting glue for LED, it is characterised in that: it is prepared from weight portion by following component: nano silicon 1-3 part, containing hydrogen silicone oil 5-10 part, end-vinyl Polymethyl methacrylate 20-40 part, dimethyl hydroxyl silicon oil 2-4 part, two Methyl-silicone oil 1-2 part, poly dimethyl methyl vinyl silicone 10-15 part, γ-aminopropyltrimethoxysilane 1-2 part, ethylene Base trimethoxy silane 1-3 part, rosin resin 3-6 part, BTA 1-3 part, triphenyl phosphite 1-2 part, platinum catalyst 0.001-0.002 part, dehydrated alcohol 10-20 part, ethyl acetate 60-80 part.
A kind of casting glue for LED the most according to claim 1, it is characterised in that: by following component with weight portion system Standby form: nano silicon 1.5-2.5 part, containing hydrogen silicone oil 6-9 part, end-vinyl Polymethyl methacrylate 25-35 part, Dimethyl hydroxyl silicon oil 2.5-3.5 part, dimethicone 1.2-1.7 part, poly dimethyl methyl vinyl silicone 11-14 part, γ-aminopropyltrimethoxysilane 1.3-1.8 part, vinyltrimethoxy silane 1.5-2.5 part, rosin resin 4-5 part, benzo Triazole 1.5-2.5 part, triphenyl phosphite 1.3-1.7 part, platinum catalyst 0.0013-0.0017 part, dehydrated alcohol 13-18 Part, ethyl acetate 65-75 part.
3. the preparation method of a kind of casting glue for LED described in any one of claim 1 to 2, it is characterised in that: include with Lower step:
(1) nano silicon and ethyl acetate are mixed, disperse 30-40 minute in ultrasonic disperse instrument, add γ-ammonia third Base trimethoxy silane and vinyltrimethoxy silane, continue ultrasonic disperse 5-10 minutes；
(2) loading in reflux condensation mode there-necked flask, be warming up to 90-95 DEG C and react 5-6 hour, cooled and filtered is washed, and puts into Baking oven is dried；
(3) containing hydrogen silicone oil, half end-vinyl Polymethyl methacrylate, dimethyl hydroxyl silicon oil, the poly-diformazan of half are added Ylmethyl vinylsiloxane, rosin resin, BTA and triphenyl phosphite, with blender at rotating speed 200-300r/ Stir 25-30 minute under min, obtain mixture A；
(4) will residue end-vinyl Polymethyl methacrylate, dimethicone, residue poly dimethyl methyl ethylene silicon Oxygen alkane, platinum catalyst and dehydrated alcohol mixing, stir 25-30 minute under rotating speed 200-300r/min with blender, obtain mixing Thing B；
(5) being mixed with mixture B by mixture A, high speed shear is disperseed 5-10 minute, puts into vacuum in vacuum drying oven and carries out Deaeration 10-15 minute and get final product, wherein, vacuum is-0.1MPa, and temperature is 30-40 DEG C.
The preparation method of a kind of casting glue for LED the most according to claim 3, it is characterised in that: described step (2) Middle temperature is 91-94 DEG C, and the response time is 5.5 hours.
The preparation method of a kind of casting glue for LED the most according to claim 3, it is characterised in that: described step (3) Medium speed is 250r/min, and mixing time is 28 minutes.
The preparation method of a kind of casting glue for LED the most according to claim 3, it is characterised in that: described step (4) Medium speed is 250r/min, and mixing time is 28 minutes.
The preparation method of a kind of casting glue for LED the most according to claim 3, it is characterised in that: described step (5) Middle jitter time is 6-9 minute, and inclined heated plate is 11-14 minute, and temperature is 35 DEG C.
CN201610625439.2A 2016-08-03 2016-08-03 A kind of casting glue for LED and preparation method thereof Withdrawn CN106118585A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109659419A (en) * 2018-10-30 2019-04-19 东莞市谷麦光学科技有限公司 A kind of LED light sealing printing technology
CN114196373A (en) * 2021-12-30 2022-03-18 江西师范大学 Non-hydrogel flexible electronic packaging material, and preparation method and application thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109659419A (en) * 2018-10-30 2019-04-19 东莞市谷麦光学科技有限公司 A kind of LED light sealing printing technology
CN114196373A (en) * 2021-12-30 2022-03-18 江西师范大学 Non-hydrogel flexible electronic packaging material, and preparation method and application thereof

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