CN1061144C - Optical-fiber bundle array device and its making technique - Google Patents
Optical-fiber bundle array device and its making technique Download PDFInfo
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- CN1061144C CN1061144C CN 98113444 CN98113444A CN1061144C CN 1061144 C CN1061144 C CN 1061144C CN 98113444 CN98113444 CN 98113444 CN 98113444 A CN98113444 A CN 98113444A CN 1061144 C CN1061144 C CN 1061144C
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Abstract
The present invention relates to an optical fiber beam array device. A base layer substrate and a bottom layer substrate stuck on the base layer substrate are horizontally placed; two side substrates are perpendicular to the base layer substrate; the side faces of the two side substrates are stuck on both sides of the bottom layer substrate; optical fibers are arranged in the groove-shaped space in the mode without intervals one by one and layer by layer. A manufacture technology comprises: establishing two beams of orthogonal laser beams; manufacturing optical fiber positioning grooves by using the orthogonal laser beams as reference; arranging optical fibers in the grooves. The high-precision high-density array device provided by the present invention has the advantages of simple technology and low cost. The center distance of horizontal optical fibers is 125 mum, and the center distance of perpendicular optical fibers can be 125 mum or multiples thereof. The present invention can be applied to the photoelectron technology, the optical communication technology, the information processing technology and the optical fiber coupling technology.
Description
The present invention is optical element and manufacturing process thereof, can be used for message areas such as photoelectron, optical communication and computer system.
Because broadband, the professional sharply increase of high speed communication, various communications and messaging device high speed developments such as broadband, jumbo exchange system, parallel processing high-performance computer system need hundreds and thousands of optical fiber arrangements to become one dimension or two-dimentional optical arrays battle array device as the input and output interface.Therefore, high density, high-precision optical-fiber bundle array device become one of Primary Component of these equipment.Taked two kinds of methods to develop this type of device at present.One, on the silicon chip of particular crystal orientation direction, adopt the equally spaced serrate grooves of technology etching such as plate-making, photoetching, corrosion, to expose cladded-fiber and be arranged in the serrate groove, the surface keeps flat a substrate, uses adhesive curing, see paper " A fiber optic-cable connector " C.M.Miller, Bellsyst.Tech.J.1975 Vol.54, No.9,1547-1555.When making the two dimensional optical fiber array, the one-dimension optical-fiber array that need will discharge is piled up in vertical direction blocks ofly and is formed, see paper " High precision two dimensional fiber-array in silicon V-groovetechnique " U. Danzer, P. Kipfer, K. zurl, J. Lindolf and J. Schwider, Annualrepost, Angewandte Cptik, physikalisches Insttitute der University Erlangcn (1992).Utilize too difficulty of this method silicon chip thin type processing, so vertical direction optical fiber spacing is bigger, positioning error is also big between every layer, is difficult for realizing the two dimensional optical fiber array.They are two years old, on certain thickness substrate, punch the footpath with the circular hole two-dimensional array of 200 μ m-250 μ m with laser beam or beam-plasma, in one one ground of optical fiber patchhole, solidify the location with the UV ultraviolet glue, see paper " Fabricationof fiberbundle arrays for free-space photoric switching system ", Jose M.sasian, Robert A. Novotry, Martin G. Beckman, sonya L. walker, Mickacl J.Wojcik, stepfen J. Hinterlong, Optical Engineering 1994, vol. 33, No. 9,2979-2985.Because the thickness of substrate, the method angle error is bigger, and the single-mode fiber two-dimensional array is difficult to reach requirement.
The objective of the invention is to make high precision, a highdensity peacekeeping two dimensional optical fiber array device proposes the optical fiber novel fiber bundle array device that discharge by root in no gap in the rectangle locating slot for this reason, and proposes to make the technology of this device.
Optical-fiber bundle array device of the present invention is made of substrate and optical fiber, it is characterized in that:
(1) described substrate comprises basic unit's substrate, bottom substrate and two side substrates, and each substrate is writing board shape,
(2) basic unit's substrate level is placed, bottom substrate is placed horizontally on basic unit's substrate, and two side substrate vertical sides stand on basic unit's substrate, their side be fitted in the bottom substrate both sides and with basic unit's substrate and the bonding location of bottom substrate, constitute the fiber orientation groove,
(3) discharge by root in optical fiber no gap in above-mentioned fiber orientation groove.
2. optical-fiber bundle array device as claimed in claim 1, it is characterized in that described fiber orientation groove inner close fitting ground floor fibre bundle horizontal positioned middle level substrate, be close to the middle level substrate upper surface and do not have the gap by root discharging second layer optical fiber, can form M layer fiber array by this structure, M 〉=2 constitute two dimensional optical fiber bundle array.
Above-mentioned optical-fiber bundle array device for the requirement of substrate can be:
(1) basic unit's substrate upper and lower surface depth of parallelism≤2 ＇,
(2) bottom substrate and the side substrate two surperficial depth of parallelisms＜1 ＇, side and two Surface Vertical degree are 90 ° ± 20 ",
(3) the bottom substrate width is N * 125 μ m ± 2 μ m, and N is that natural number requires to decide according to reality,
(4) the same bottom substrate of middle level substrate width, the two surperficial depth of parallelism＜2 ", thickness error≤0.2 μ m,
(5) each substrate surface polishing degree 〉=2 grades.
5. the manufacturing process of the described optical-fiber bundle array device of claim 1 the steps include:
(1) sets up orthogonal lower horizontal laser beam and laser beam vertically downward
A, a collimated laser light bundle of horizontal support device, laser beam is through λ/2 wave plates and ahrens prism, is divided into lower horizontal laser beam and laser beam vertically upward, places two below apertures on the lower horizontal laser beam travel path, in order to location lower horizontal laser beam
B, first completely reflecting mirror is set above ahrens prism, make that laser beam reflects to form upper horizontal laser beam, parallel with the lower horizontal laser beam vertically upward, place two top apertures up on the horizontal laser beam travel path, in order to location upper horizontal laser beam
C, hang two vertical fine rules on horizontal laser beam and the lower horizontal laser beam direction of propagation up, adjust first completely reflecting mirror, make the spot center axis of symmetry of described two bundle horizontal laser beams pass through two vertical fine rules simultaneously, guarantee that two bundle horizontal laser beams are on the same vertical plane, fix the first completely reflecting mirror locus this moment, remove two vertical fine rules
Place second completely reflecting mirror on D, the upper horizontal laser beam travel path after the two top apertures, reflecting to form the upper horizontal laser beam vertically downward, laser beam and lower horizontal laser beam intersect, three-dimensional rotatable chain-wales is set below this intersection point, places pentagonal prism on it
E, adjustment second completely reflecting mirror, the lower horizontal laser beam is reflected vertically upward by pentagonal prism, behind second completely reflecting mirror, pass through two top apertures, and make laser beam horizontal direction outgoing behind the pentagonal prism secondary reflection vertically downward fix the second completely reflecting mirror locus at this moment, withdraw pentagonal prism by two below apertures;
(2) make the fiber orientation groove
A, basic unit's substrate is positioned on the rotatable chain-wales of described three-dimensional, allows vertically downward laser beam incident adjust chain-wales in basic unit substrate center position, allow basic unit's substrate upper surface reflected light through second completely reflecting mirror by two top apertures,
B, on basic unit's substrate parallel placement bottom substrate, two substrate center lines roughly overlap, move into U font adjustment rack, gently be pressed in the adjustment screw-tipped on its two arm on the bottom substrate, adjust two screws make vertically downward laser beam bottom substrate upper surface reflected light through second completely reflecting mirror by two above the former road of aperture return, with glue bottom substrate and basic unit's substrate are solidified the location.
C, a slice side substrate side is stood on basic unit's substrate; The side is fitted in bottom substrate one side fully; Rotate described three-dimensional chain-wales; The reverberation that keeps bottom substrate; By two top apertures; And gently be pressed in the upper end, side of this limit substrate with the adjustment screw-tipped of U font adjustment rack; Adjust the upper end, side that two screws make this side substrate; Adjusting two screws makes this side substrate inner surface pass through the little diaphragm in two belows to the light of upper horizontal laser beam; Then with this side substrate and basic unit's substrate and the complete bonding location of bottom substrate
D, the described same process of usefulness C form the fiber orientation groove with another sheet side substrate and basic unit's substrate and the complete bonding location of bottom substrate,
(3) discharging fibre bundle
A, fix a foreground terrace and a backstage terrace before and after described fiber orientation groove, their width are slightly larger than fiber orientation well width, upper surface and all spread one deck double faced adhesive tape, and make their surface elevations a little less than the bottom substrate upper surface,
B, wait to discharge fibre bundle one end and divest plastic outer layer, each optical fiber all has exposed clad section,
C, on X, Y, Z pitching and the five adjustable dimensional scaffolds that swing the fixing optical fiber duct of clamping optical fiber, this optical fiber duct is parallel with bottom substrate with described fiber orientation groove side substrate, then with an optical fiber clamping in optical fiber duct, with five dimensional scaffold adjustment, allow the parallel top that moves on to bottom substrate relevant position, exposed covering of the exposed clad section of optical fiber exceed the backstage terrace, vertically down discharging again, the optical fiber that will expose covering at last is fitted on the double faced adhesive tape of front and back terrace and backstage terrace
D, under monitoring, high-power microscope do not have gap discharging optical fiber by root from left to right or from right to left by the described method of C, when last optical fiber of discharging,, then need reselect last several optical fiber if last optical fiber can have the gap discharging, and be discharged into whole optical fiber again and do not have gap discharging
E, the middle level substrate is lain in ground floor optical fiber surface in the fiber orientation groove, gently press the middle level substrate with U font adjustment rack two arm screw-tipped, adjust two screws, allow aperture above laser beam returns two on the former way of the reflected light of middle level substrate surface vertically downward, at this moment from end, locating slot front and back injecting glue, after treating adhesive curing, block ground floor optical fiber along the locating slot front end
F, the double faced adhesive tape of residue optical fiber head on the terrace before and after removing, good paper and the double faced adhesive tape of lay hardness on the fibre bundle surface of the exposed covering of foreground terrace and backstage terrace then, make their height be lower than the middle level substrate upper surface slightly, operation according to ground floor discharging optical fiber, the discharging second layer to the M layer, install the top layer substrate additional by the described step of E, at last, the multilayer fibers array device is solidified reinforcing, its front end face is roughly ground, fine grinding, polishing, and keep polished end faces perpendicular to the middle level substrate promptly perpendicular to the shaft axis of optic fibre that is emitted in the locating slot
G, also can be after the described step of D, the ground floor optical fiber surface that in the fiber orientation groove, has sequenced, put one deck double faced adhesive tape setoff paper earlier, on setoff paper, keep flat a slice middle level substrate, gently press the middle level substrate with U font adjustment rack two arm screw-tipped, adjust two screws, allow aperture above laser beam returns two on the former way of the reflected light of middle level substrate surface vertically downward, this moment is from fiber orientation groove rear and front end injecting glue, allow glue evenly infiltrate along recess between the adjacent fiber, solidify, remove middle level substrate and setoff paper then, discharge the operation of optical fiber again according to ground floor, the discharging second layer to the M layer installs the top layer substrate at last additional, make optical-fiber bundle array device by the described step of F.
Above-mentioned optical-fiber bundle array device manufacturing process is not when having the gap and discharge each layer optical fiber by root, can after being disposed to second from the bottom optical fiber, detect once: a middle level substrate parallel is laid in the locating slot, its lower surface is close to the fibre bundle that has discharged, observe vertical incidence aperture above the reflected light of laser beam vertically downward of middle level substrate upper surface should pass through two, if can return on former way, then take out this middle level substrate, discharge last optical fiber, if middle level substrate upper surface reflected light can not return on former way, overlapping appears in the fibre bundle that has then discharged, needs to check this situation of eliminating, again discharge last optical fiber again after detection is passed through.
In aforementioned optical-fiber bundle array device manufacturing process, can adopt following data:
(1) described two below apertures are at a distance of 1.0-1.5m, and described two top apertures are 1.0-1.5m apart,
(2) described two vertical wire diameter≤15 μ m, at a distance of 1.5-2.0m,
(3) described pentagonal prism error≤2 ",
(4) behind the double faced adhesive tape of described foreground terrace and backstage terrace shop, surface elevation is lower than bottom substrate upper surface 5-10 μ m,
(5) optical fiber concentricity to be discharged＜0.6%, its cladding diameter are 124.9 ± 0.1 μ m,
(6) described optical fiber duct aperture 250 μ m, plus tolerance 1 μ m
(7) during the later optical fiber of discharging ground floor, behind described foreground terrace shop paper and the double faced adhesive tape, surface elevation is lower than last middle level substrate upper surface or preceding one deck fibre bundle surface 5-10 μ m.
The present invention is high precision, high-density optical-fiber bundle array device, and manufacture craft is simple relatively or this is low, and the fiber optic hub spacing of level * direction can be 125 μ m, and the fiber optic hub spacing of vertical Z direction can be equidistant for 125 μ m, 250 μ m, 500 μ m.On the optical-fiber bundle array device end face, less than 2 μ m, the angle error is less than 0.02 ° with respect to the error of ideal position for every optical fiber.Optical-fiber bundle array device structure of the present invention and manufacture craft are fit to make one dimension or two-dimentional single-mode fiber bundle and multimode fiber-optic bundle array device, can be applicable to various device and various array formula one peacekeeping two dimensional optical fiber coupling techniques such as electronics, optical communication, parallel processing computer.
Fig. 1 represents the structure of two dimensional optical fiber bundle array device.
Fig. 2 represents the adjustment of the orthogonal laser beam of two bundles.
Fig. 3 represents the manufacture craft of fiber orientation groove.
Fig. 4 represents to discharge the operation of fibre bundle.
Below further specify enforcement state of the present invention.
Among Fig. 1, two dimensional optical fiber bundle array device by the substrate A of basic unit, bottom substrate B, some middle level substrate M1, M2 ... Mi and side substrate S1, S2 form, and each substrate all is high-precision 2 grades of surface polishings.The substrate A of basic unit: length is about 22mm, and thickness is about 2mm, and width is greater than N * 0.125mm+ side substrate S1 and S2 thickness, and the upper and lower surface depth of parallelism is about 1, and N is the fiber count of every layer of one dimension array.Side substrate S1 and S2: length is 10-15mm, thickness is about 2mm, width is greater than (M * h+ bottom substrate A thickness)+2mm, M is the number of plies of vertical Z direction optical fiber, h is the center distance of optical fiber in the vertical Z direction, the depth of parallelism on two surfaces＜20 ", the verticality on side and two surfaces is 90 ° ± 20 ".Bottom substrate B: thickness 2-3mm, width N * 125 μ m, error＜2 μ m, length is identical with side substrate S1 and S2, is 10-15mm, and the Z direction optical fiber number of plies is got 15mm for a long time, the number of plies is got 10mm after a little while, the depth of parallelism on two surfaces＜20 ", the verticality on side and surface is 90 ° ± 20 ".Middle level substrate M1, M2 ... Ni, width N * 125 μ m, error＜2 μ m, thickness can be 375 μ m, or the integral multiple of 125 μ m, multiple＞3, error＜0.2 μ m, length can change at 10-15mm, and bottom M1 gets 15mm, the upper strata is convenient to the optical fiber tail end and is fixed than the little 0.3-0.5mm of middle level substrate length of lower floor.When processing the middle level substrate, three wafer are placed as accompanying sheet to process together in about 120 ° of positions that are separated by around this substrate, and with the method detection middle level substrate thickness that detects the wafer phase change, this job operation can be controlled at its thickness error in the 0.2 μ m.
The manufacturing process of optical-fiber bundle array device of the present invention can be by Fig. 2, Fig. 3 and Fig. 4 explanation.The adjustment of the mutual vertical beam of light of two bundles that Fig. 2 represents to be used to calibrate.The helium-neon laser He-Ne Laser emission of lasering beam of level support is divided into orthogonal lower horizontal laser beam H and laser beam V1 vertically upward through λ/2 wave plates and ahrens prism, lower horizontal laser beam H strictness is parallel to the levelling bench surface, aperture P1 and P2 below apart the 1.2m part is placed two on the H travel path also detect its variation at any time in order to location H.Laser beam V1 reflects to form upper horizontal laser beam V2 by the first completely reflecting mirror R1 vertically upward, on the H and the V2 direction of propagation, hang two vertical fine rule W1 and W2 that diameter is 15 μ m at a distance of the 18m part, adjust R1, allow the spot center axis of symmetry of H and V2 simultaneously by W1 and W2, and on diffraction pattern thereafter, can be observed the bright fringes of a concealed wire and symmetrical distribution, in other words, V2 is on the same vertical plane simultaneously with H.On the V2 travel path, place two top aperture P3 and P4 at a distance of 1.2m, be parallel to lower horizontal laser beam H in order to detect and to locate the V2 strictness.V2 reflects to form laser beam V3 vertically downward through the second completely reflecting mirror R2, and intersect at the O point with H, below the O point, be placed with pentagonal prism K on the three-dimensional rotatable chain-wales M, adjusting R2 makes H pass through K to reflect vertically upward, pass through two top aperture P4 and P3 again after the R2 reflection, and the horizontal direction outgoing is by two below aperture P2 and P1 behind the K secondary reflection to make V3, at this moment V3 is strict vertical mutually with H, and on same vertical plane, intersect at the O point.Can withdraw pentagonal prism K this moment.
Fig. 3 illustrates the making of fiber orientation groove.Before making the fiber orientation groove, all substrates that need in the subsequent handling are put into acetone liquid and are cleaned, and the ultrasonic sulculus of putting into deionized water again cleans up standby.Then, the substrate A of basic unit is positioned on the three-dimensional rotatable chain-wales M with double faced adhesive tape, allows laser beam V3 be incident on the A center, adjust M and allow A upper surface reflected light return by P4 and the former road of P3 through R2.Parallel placement bottom substrate B on A, its front end and substrate A alignment, two substrate center line of symmetries roughly overlap, U font adjustment rack F is moved into, two adjustable screws are up and down arranged on V font two arms, screw-tipped gently is pressed on the B, adjusts two screws, make V3 return by P4 and the former road of P3 through R2 at B upper surface reflected light.Infiltrate from substrate B rear end with very a spot of 502 glue or UV ultraviolet glue, solidify the location.S1 is edge-on on A with the side substrate, the side is fitted in substrate B one side fully, rotation chain-wales M, the reflected light of noting observation and maintenance substrate B is by P4 and P3, whether observation S1 surfaces externally and internally overlaps two hot spots of two reflected light on aperture P2 of laser beam H, if do not overlap, be used in the method that the S1 outside surface is blown, recognize the flare (the outside surface hot spot has from fuzzy to change procedure clearly) of surfaces externally and internally.Gently be pressed in the upper end, side of S1 with two screw-tipped of F, adjust reflected light that two screws make the S1 inside surface, inject 502 glue or UV ultraviolet glue from the S1 outside then, S1 and A and the complete bonding location of B by P2 and P1.With another side substrate S2 and A and the complete bonding location of B, this moment, two inside surfaces of fiber orientation groove both sides substrate S1 and S2 were parallel fully with above-mentioned same method, and its spacing is decided by the width of bottom substrate B.With the front end face of charge coupled device ccd observation fiber orientation groove, check whether the gummed place meets the demands, and is coated with one deck epoxide-resin glue at S1 and S2 outer ledge at last, solidify and reinforce.
Fig. 4 illustrates the operation of discharging fibre bundle.At first select optical fiber quality and good uniformity and the concentricity fiber products less than 0.6% laser-bounce light, its cladding diameter is the optical fiber of 124.9 μ m errors less than 0.1 μ m, and the optical fiber that the equipment that many producers upgrade in the recent period draws can both satisfy above-mentioned requirements.Optical fiber is cut down 1-2m length, glue sequence indicia.One end divests the about 60mm of plastic outer layer, and all the have an appointment covering exposed part of 60mm of each bar optical fiber successively cleans up the covering exposed part standby with acetone soln and deionized water.The front of locating slot is placed charge coupled device ccd supervision is observed in the imaging of locating slot front end, and illumination light is thrown light on from top to down, and also a bulb can be placed in the microscopic examination tube provides illumination light, observes with another inspection section.The discharging two dimensional optical fiber is from bottom to up in layer, discharges by root optical fiber from left to right or from right to left.Convenient in order to discharge optical fiber, before and after the fiber orientation groove, place predispersed fiber location foreground terrace D and backstage terrace C, backstage terrace C is a glass substrate, be fixed on the substrate A with 502 glue (or UV glue), parallelly be placed on about 4mm place behind the substrate B, width is slightly larger than width+2 * substrate S thickness sum of substrate B.Small stair C upper berth one deck double faced adhesive tape, the C surface elevation is a little less than substrate B surface elevation 5 μ m-10 μ m, and length is approximately 8mm-10mm.Small stair D is fixed on the chain-wales M, is positioned at the about 2mm-4mm in locating slot front, the about 8mm-10mm of length, and width is identical with small stair C, its upper surface shop one deck double faced adhesive tape, height is a little less than substrate B upper level 5 μ m-10 μ m.The aperture is that the optical fiber duct L of the clamping optical fiber of 125 μ m, plus tolerance 1 μ m is fixed on accurate x, y, z, up and down on the pitching and the five adjustable dimension bracing frames that swing.The clamping optical fiber duct is parallel to fiber orientation groove side substrate and bottom substrate B, sees Fig. 4.Arrange before the optical fiber, note close inspection and adjust the laser beam V that is incident on bottom substrate B upper surface
3Pass through aperture P respectively with the reflected light of the laser beam H that is incident on side substrate inside surface
4And P
3, P
2And P
1Then with an optical fiber clamping in optical fiber duct, allow top about 2mm-4mm after small stair of exposed covering, with five dimensional scaffold adjustment, allow exposed cladded-fiber partial parallel move on to ideal position on the substrate B, vertically down discharging is fitted in optical fiber on the double faced adhesive tape of pre-determined bit small stair C and D at last again.Discharge optical fiber in the no gap, a ground of next root of supervision of high-power microscope MIC as stated above.After being disposed to second from the bottom optical fiber, note doing one-time detection.With middle level substrate M
1Laid in parallel is discharged good optical fiber top in locating slot, add certain pressure gently, allows the optical fiber that has discharged be close to substrate B upper surface and middle level substrate M
1(but firmly can not excessively cause chain-wales to change) observes vertical incidence at middle level substrate M between the lower surface
1The laser beam V of upper surface
3Reflected light should pass through aperture P
4And P
3If, can return on the way, illustrate that the N-1 bar optical fiber that is emitted on substrate B surface is completely parallel.And then discharge last root optical fiber, and if last root optical fiber can have the gap discharging, then the diameter of last several optical fiber need be reselected, being discharged into whole optical fiber does not again have the gap discharging.And then again with middle level substrate M
1Lie in the ground floor one-dimension optical-fiber top in the locating slot.U font locating rack two arm screw end points gently are pressed in middle level substrate M
1The surface.Adjust the pressure of two screws, allow vertical incidence at substrate M
1The laser beam V on surface
3The former way of reflected light return aperture P
4And P
3At this moment successively before and after the locating slot end inject and seldom permitted 502 glue (or UC ultraviolet glue), can be observed in glue goes into along the optical fiber longtitudinal dispersion.After treating adhesive curing, along the about 2mm of locating slot front end place, block ground floor optical fiber with diamant, remove the double faced adhesive tape that small stair D goes up the residue optical fiber head, observe the optical fiber emission behaviour of locating slot leading section with CCD, whether the upper and lower top that can detect ground floor one-dimension optical-fiber array is fully and bottom substrate B upper surface and middle level substrate M
1Lower surface is fitted, and whether does not have the gap between the adjacent fiber fully.If meet the requirements fully, then can be at middle level substrate M
OnDischarging second layer optical fiber.
Before discharging second layer optical fiber, at first use ultramicroscopic observation locating slot mesonexine substrate M
1On whether pile up 502 glue vestiges arranged, if having, care should be used to is removed clean.At front and back small stair C and good paper and the double faced adhesive tape of the certain thickness hardness of lay above the D, make its upper surface that is lower than middle level substrate M1 highly slightly 5 μ m-10 μ m then.According to the operation of ground floor discharging optical fiber, the discharging second layer, the 3rd layer ... the m layer.And then at the top layer substrate M of locating slot
mUpper surface, both sides and front and back and rear portion fibre cladding exposed part are coated with one deck epoxide-resin glue, solidify to reinforce.At last, with the locating slot front end face of the multilayer fibers array that is cured roughly grind, fine grinding, polishing, and keep polished end faces perpendicular to the A lower surface.More than be that horizontal X direction spacing is 125 μ m.The vertical direction spacing is the manufacture craft process of the two dimensional optical fiber array device of 500 μ m.
Vertical Z direction spacing is the manufacture craft of the two dimensional optical fiber array of 250 μ m, with vertical Z direction spacing be that the two dimensional optical fiber array of 500 μ m is identical.Only having different is middle level substrate M
iMaterial and processing problems.This moment middle level substrate M
1Thickness be 125 μ m.This type of material can be selected hardness film production preferably, and thickness is 125 μ m.Good uniformity, error are 2 μ m.
Vertical Z direction spacing 125 μ m.Horizontal-direction pitch is that the two dimensional optical fiber array manufacture craft manufacturing process of 125 μ m and 2-D optical fibre array that the vertical direction spacing is 500 μ m are basic identical.Only difference does not have middle level substrate M
iSo, after racking up each layer optical fiber, in the fiber orientation groove, sequenced the top of optical fiber, it is identical with bottom substrate B to put one deck width earlier, and length is about the double faced adhesive tape setoff paper of 20mm, keeps flat a slice middle level substrate M on setoff paper
i, push down substrate M with U font locating rack two arm screw-tipped
1, allow vertical incidence substrate M
1The former way of the reflected light of the laser beam of upper surface is returned by aperture P
4And P
3At this moment, inject a little 502 glue from the locating slot rear and front end, allow 502 glue evenly infiltrate, solidify along the recess between the adjacent fiber.Remove substrate M
1With setoff paper, under high-power microscope, can be observed the fibre cladding back that has sequenced.Discharge the second layer again, the 3rd layer this moment ... the m layer.
Claims (7)
1. optical-fiber bundle array device that is made of substrate and optical fiber is characterized in that:
(1) described substrate comprises basic unit's substrate, bottom substrate and two side substrates, and each substrate is writing board shape,
(2) basic unit's substrate level is placed, bottom substrate is placed horizontally on basic unit's substrate, and two side substrate vertical sides stand on basic unit's substrate, their side be fitted in the bottom substrate both sides and with basic unit's substrate and the bonding location of bottom substrate, constitute the fiber orientation groove,
(3) discharge by root in optical fiber no gap in above-mentioned fiber orientation groove.
2. optical-fiber bundle array device as claimed in claim 1, it is characterized in that described fiber orientation groove inner close fitting ground floor fibre bundle horizontal positioned middle level substrate, be close to the middle level substrate upper surface and do not have the gap by root discharging second layer optical fiber, can form M layer fiber array by this structure, M 〉=2 constitute two dimensional optical fiber bundle array.
3. optical-fiber bundle array device as claimed in claim 1 is characterized in that described fiber orientation groove is close to the ground floor fibre bundle and do not have the gap and enter second layer optical fiber by root, can form M layer fiber array by this structure, and M 〉=2 constitute two dimensional optical fiber bundle array.
4. as claim 1,2 or 3 described optical-fiber bundle array devices, it is characterized in that:
(1) basic unit's substrate upper and lower surface depth of parallelism≤2 ＇,
(2) bottom substrate and the side substrate two surperficial depth of parallelisms＜1 ＇, side and two Surface Vertical degree are 90 ° ± 20 ",
(3) the bottom substrate width is N * 125 μ m ± 2 μ m, and N is that natural number requires to decide according to reality,
(4) the same bottom substrate of middle level substrate width, the two surperficial depth of parallelism＜2 ", thickness error≤0.2 μ m,
(5) each substrate surface polishing degree 〉=2 grades.
5. the manufacturing process of the described optical-fiber bundle array device of claim 1 the steps include:
(1) sets up orthogonal lower horizontal laser beam and laser beam vertically downward
A, a collimated laser light bundle of horizontal support device, laser beam is through λ/2 wave plates and ahrens prism, is divided into lower horizontal laser beam and laser beam vertically upward, places two below apertures on the lower horizontal laser beam travel path, in order to location lower horizontal laser beam
B, first completely reflecting mirror is set above ahrens prism, make that laser beam reflects to form upper horizontal laser beam, parallel with the lower horizontal laser beam vertically upward, place two top apertures up on the horizontal laser beam travel path, in order to location upper horizontal laser beam
C, hang two vertical fine rules on horizontal laser beam and the lower horizontal laser beam direction of propagation up, adjust first completely reflecting mirror, make the spot center axis of symmetry of described two bundle horizontal laser beams pass through two vertical fine rules simultaneously, guarantee that two bundle horizontal laser beams are on the same vertical plane, fix the first completely reflecting mirror locus this moment, remove two vertical fine rules
Place second completely reflecting mirror on D, the upper horizontal laser beam travel path after the two top apertures, reflecting to form the upper horizontal laser beam vertically downward, laser beam and lower horizontal laser beam intersect, three-dimensional rotatable chain-wales is set below this intersection point, places pentagonal prism on it
E, adjustment second completely reflecting mirror, the lower horizontal laser beam is reflected vertically upward by pentagonal prism, behind second completely reflecting mirror, pass through two top apertures, and make laser beam horizontal direction outgoing behind the pentagonal prism secondary reflection vertically downward fix the second completely reflecting mirror locus at this moment, withdraw pentagonal prism by two below apertures;
(2) make the fiber orientation groove
A, basic unit's substrate is positioned on the rotatable chain-wales of described three-dimensional, allows vertically downward laser beam incident adjust chain-wales in basic unit substrate center position, allow basic unit's substrate upper surface reflected light through second completely reflecting mirror by two top apertures,
B, on basic unit's substrate parallel placement bottom substrate, two substrate center lines roughly overlap, move into U font adjustment rack, gently be pressed in the adjustment screw-tipped on its two arm on the bottom substrate, adjust two screws make vertically downward laser beam bottom substrate upper surface reflected light through second completely reflecting mirror by two above the former road of aperture return, with glue bottom substrate and basic unit's substrate are solidified the location.
C, a slice side substrate side is stood on basic unit's substrate, the side is fitted in bottom substrate one side fully, rotate described three-dimensional chain-wales, the reflected light that keeps bottom substrate is by two top apertures, and gently be pressed in the upper end, side of this side substrate with the adjustment screw-tipped of U font adjustment rack, adjust two screws and make this side substrate inside surface pass through the little diaphragm in two belows, then with this side substrate and basic unit's substrate and the complete bonding location of bottom substrate the reflected light of lower horizontal laser beam
D, the described same process of usefulness C form the fiber orientation groove with another sheet side substrate and basic unit's substrate and the complete bonding location of bottom substrate,
(3) discharging fibre bundle
A, fix a foreground terrace and a backstage terrace before and after described fiber orientation groove, their width are slightly larger than fiber orientation well width, upper surface and all spread one deck double faced adhesive tape, and make their surface elevations a little less than the bottom substrate upper surface,
B, wait to discharge fibre bundle one end and divest plastic outer layer, each optical fiber all has exposed clad section,
C, on X, Y, Z pitching and the five adjustable dimensional scaffolds that swing the fixing optical fiber duct of clamping optical fiber, this optical fiber duct is parallel with bottom substrate with described fiber orientation groove side substrate, then with an optical fiber clamping in optical fiber duct, with five dimensional scaffold adjustment, allow the parallel top that moves on to bottom substrate relevant position, exposed covering of the exposed clad section of optical fiber exceed the backstage terrace, vertically down discharging again, the optical fiber that will expose covering at last is fitted on the double faced adhesive tape of front and back terrace and backstage terrace
D, under monitoring, high-power microscope do not have gap discharging optical fiber by root from left to right or from right to left by the described method of C, when last optical fiber of discharging,, then need reselect last several optical fiber if last optical fiber can have the gap discharging, and be discharged into whole optical fiber again and do not have gap discharging
E, the middle level substrate is lain in ground floor optical fiber surface in the fiber orientation groove, gently press the middle level substrate with U font adjustment rack two arm screw-tipped, adjust two screws, allow aperture above laser beam returns two on the former way of the reflected light of middle level substrate surface vertically downward, at this moment from end, locating slot front and back injecting glue, after treating adhesive curing, block ground floor optical fiber along the locating slot front end
F, the double faced adhesive tape of residue optical fiber head on the terrace before and after removing, good paper and the double faced adhesive tape of lay hardness on the fibre bundle surface of the exposed covering of foreground terrace and backstage terrace then, make their height be lower than the middle level substrate upper surface slightly, operation according to ground floor discharging optical fiber, the discharging second layer to the M layer, install the top layer substrate additional by the described step of E, at last, the multilayer fibers array device is solidified reinforcing, its front end face is roughly ground, fine grinding, polishing, and keep polished end faces perpendicular to the middle level substrate promptly perpendicular to the shaft axis of optic fibre that is emitted in the locating slot
G, also can be after the described step of D, the ground floor optical fiber surface that in the fiber orientation groove, has sequenced, put one deck double faced adhesive tape setoff paper earlier, on setoff paper, keep flat a slice middle level substrate, gently press the middle level substrate with U font adjustment rack two arm screw-tipped, adjust two screws, allow aperture above laser beam returns two on the former way of the reflected light of middle level substrate surface vertically downward, this moment is from fiber orientation groove rear and front end injecting glue, allow glue evenly infiltrate along recess between the adjacent fiber, solidify, remove middle level substrate and setoff paper then, discharge the operation of optical fiber again according to ground floor, the discharging second layer to the M layer installs the top layer substrate at last additional, make optical-fiber bundle array device by the described step of F.
6. optical-fiber bundle array device manufacturing process as claimed in claim 5, when it is characterized in that not having the gap and discharging each layer optical fiber by root, detect once after being disposed to second from the bottom optical fiber: a middle level substrate parallel is laid in the locating slot, its lower surface is close to the fibre bundle that has discharged, observe vertical incidence aperture above the reflected light of laser beam vertically downward of middle level substrate upper surface should pass through two, if can return on former way, then take out this middle level substrate, discharge last optical fiber, if middle level substrate upper surface reflected light can not return on former way, overlapping appears in the fibre bundle that has then discharged, needs to check this situation of eliminating, again discharge last optical fiber again after detection is passed through.
As claim 5 or 6 described optical-fiber bundle array device manufacturing process, it is characterized in that:
(1) described two below apertures are at a distance of 1.0-1.5m, and described two top apertures are 1.0-1.5m apart,
(2) described two vertical wire diameter≤15 μ m, at a distance of 1.5-2.0m,
(3) described pentagonal prism error≤2 ",
(4) behind the double faced adhesive tape of described foreground terrace and backstage terrace shop, surface elevation is lower than bottom substrate upper surface 5-10 μ m,
(5) optical fiber concentricity to be discharged＜0.6%, its cladding diameter are 124.9 ± 0.1 μ m,
(6) described optical fiber duct aperture 250 μ m, plus tolerance 1 μ m
(7) during the later optical fiber of discharging ground floor, behind described foreground terrace shop paper and the double faced adhesive tape, surface elevation is lower than last middle level substrate upper surface or preceding one deck fibre bundle surface 5-10 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98113444 CN1061144C (en) | 1998-02-24 | 1998-02-24 | Optical-fiber bundle array device and its making technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98113444 CN1061144C (en) | 1998-02-24 | 1998-02-24 | Optical-fiber bundle array device and its making technique |
Publications (2)
| Publication Number | Publication Date |
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| CN1195111A CN1195111A (en) | 1998-10-07 |
| CN1061144C true CN1061144C (en) | 2001-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 98113444 Expired - Fee Related CN1061144C (en) | 1998-02-24 | 1998-02-24 | Optical-fiber bundle array device and its making technique |
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| CN (1) | CN1061144C (en) |
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| CN100354670C (en) * | 2005-12-29 | 2007-12-12 | 中国科学院上海光学精密机械研究所 | Method for manufacturing optical fiber connector |
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1998
- 1998-02-24 CN CN 98113444 patent/CN1061144C/en not_active Expired - Fee Related
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| CN1195111A (en) | 1998-10-07 |
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