CN106086417A - A kind of method extracting copper and gold from waste mobile phone circuit board - Google Patents

A kind of method extracting copper and gold from waste mobile phone circuit board Download PDF

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Publication number
CN106086417A
CN106086417A CN201610496735.7A CN201610496735A CN106086417A CN 106086417 A CN106086417 A CN 106086417A CN 201610496735 A CN201610496735 A CN 201610496735A CN 106086417 A CN106086417 A CN 106086417A
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CN
China
Prior art keywords
gold
circuit board
mobile phone
waste mobile
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610496735.7A
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Chinese (zh)
Inventor
徐鹤
刘宇
刘俊利
路原野
康家慧
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Nankai University
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Nankai University
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Publication date
Application filed by Nankai University filed Critical Nankai University
Priority to CN201610496735.7A priority Critical patent/CN106086417A/en
Publication of CN106086417A publication Critical patent/CN106086417A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/006—Wet processes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/04—Obtaining noble metals by wet processes
    • C22B11/042—Recovery of noble metals from waste materials
    • C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0065—Leaching or slurrying
    • C22B15/0067—Leaching or slurrying with acids or salts thereof
    • C22B15/0073—Leaching or slurrying with acids or salts thereof containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0084—Treating solutions
    • C22B15/0089—Treating solutions by chemical methods
    • C22B15/0091—Treating solutions by chemical methods by cementation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Abstract

The present invention is a kind of method extracting copper and gold from waste mobile phone circuit board, belongs to resources circulation field.It is computer main board currently for the extraction main object of metal in circuit board, and little for the extracting method of metal in circuit board of mobile phone, and the method that this patent provides can solve this problem.Meanwhile, being applied to, for conventional thiourea method, the problem that Au plasma exists, the parameter after the optimization that this patent provides can solve this problem.This patent mainly completes copper and Au plasma by " nitrate method thiourea method " two-step method, can obtain high copper, golden leaching efficiency by the method.This method may be used for the metal in resources circulation business processes waste mobile phone circuit board.

Description

A kind of method extracting copper and gold from waste mobile phone circuit board
[technical field]
The invention belongs to resources circulation field.
[background technology]
Currently, the research of METAL EXTRACTION in waste and old circuit board is focused mostly on greatly computer circuits plate, for circuit board of mobile phone The research of middle METAL EXTRACTION is less.
For the method for the extraction of metal in waste and old circuit board specifically include that wet method, pyrogenic process, microbial method and some Emerging method such as supercritical oxidation process, using more in these methods is wet method, because it returns for metal step by step arithmetic Receipts are easier to realization and effect on environment is relatively small.
The method reclaiming copper conventional in wet method includes: nitrate method, Sulfuric-acid-hydrogen-peroxide method, tri-chlorination iron processes, ammonia process Deng.Although wherein Sulfuric-acid-hydrogen-peroxide method more cleans, but relative complex；Tri-chlorination iron processes and ammonia process are for gold afterwards Leaching recovery adversely affects；Nitrate method is a kind of simple, economic method, causes shadow also will not to process afterwards Ring.
The method reclaiming gold conventional in wet method includes: cyaniding, chloroazotic acid method, thiosulfate technique, halogen process, thiourea Method.Though the leaching effect that cyaniding has had is used to metallurgy the most always, but the toxic articles of danger；Chloroazotic acid method is due to its acid Property, oxidisability are extremely strong higher to equipment requirements；Thiosulfate technique and halogen process are owing to reagent consumption is big or reagent price is held high Expensive the most less desirable；Thiourea method compares that additive method is nontoxic, strong for the selectivity of gold, leaching gold efficiency is high, gets a good chance of replacing Cyaniding, but there is unstable problem in thiourea self, is susceptible to decompose the continuation of the gold such as the impurity effect that produces sulfur simple substance Leaching.This patent carries out parameter optimization for this problem to the process of Leaching In Thiourea Solutions depletion, can solve Problems Existing.
[summary of the invention]
1. to solve the technical problem that:
Current treatment technology focuses primarily upon the extraction of metal in waste computer circuit board, and waste mobile phone circuit board by It is difficult in its small volume, recovery and is ignored by people, therefore lack the treatment technology for this special object, need to solve It is specifically designed for the technical problem of METAL EXTRACTION in waste mobile phone circuit board.Meanwhile, because the problem of thiourea self instability so that It is undesirable that thiourea method extracts gold in use effect, it is therefore desirable to thiourea method is extracted the optimal ginseng of gold in circuit board of mobile phone Number is studied.
2. technical scheme:
The first step is by sample and nitric acid reaction, fully leaches copper therein and filters.Solution after filtration passes through The displacement reaction reduction of zinc powder obtains metallic copper, filtering residue carries out abundant being dried simultaneously and carries out next step reaction.Relate to is anti- Should be as follows:
3Cu+8HNO3→3Cu(NO3)2+2NO+4H2O
Cu+4HNO3→Cu(NO3)2+2NO2+2H2O
NaOH+HNO3→NaNO3+H2O
Zn+Cu2+→Zn2++Cu
Zn+H2SO4→ZnSO4+H2↑
Second step is the reaction that dried filtering residue carries out thiourea gold extraction.Filtering residue and thiourea, iron sulfate are at acid condition Lower reaction, makes gold form Gold Thiourea and is dissolved in solution, electrolytic recovery gold afterwards.The reaction related to is as follows:
Au+Fe3++2SCN2H4→Au(SCN2H4)2++Fe2+
The present invention extracts copper and the method for gold from waste mobile phone circuit board, and waste mobile phone circuit board pretreatment is obtained sample Wet-milling processing is carried out after product 1；Filtering afterwards, filtrate 1 carries out going back native copper, and filtering residue 1 carries out filtering residue wet gold extraction, reacted solution Filtering, filtrate 2 reduces gold.
Described pretreatment, uses instrument manual the removal aluminum hull of waste mobile phone circuit board surface, resistance element；To tearing open Waste mobile phone circuit board after solution carries out crushing, grinding, and reaches 20～200 mesh, obtain sample 1 after sieving.
Described wet-milling processing, is mixed in sample 1 in reactor with salpeter solution and reacts；Concentration of nitric acid 4.5～ 5.5mol/L, in the response time 40～60min, reaction temperature 45～55 DEG C, the mass/volume of solid-liquid is than 1:15～1:25, stirring Speed 300～400r/min；Filter, obtain filtrate 1, filtering residue 1.
Described goes back native copper, by filtrate 1 with dilute NaOH solution regulation pH to 1.5, in 300～400r/min mixing speeds The lower excess zinc powder that adds, removes unnecessary zinc powder with dilution heat of sulfuric acid afterwards, and after solution filters, filtering residue 2 washs, is dried to obtain also Native copper.
Described filtering residue wet gold extraction, is dried the raw material as gold lixiviation using filtering residue 1, and it mixes with thiourea, iron sulfate After conjunction, react in the solution regulate pH；Response parameter is: thiourea concentration 9～15g/L, Fe3+Concentration 4～7g/L, during reaction Between 45～90min, reaction temperature 30～45 DEG C, pH is 1.5～3, mixing speed 300～400r/min, solid-liquid mass/volume ratio For 1:20；Filter, obtain filtrate 2.
Described reduction gold, is electrolysed filtrate 2, and reclaims the gold being deposited on electrode.
3. advantages of the present invention and good effect:
The present invention is for the higher extraction rate of the copper in waste mobile phone circuit board and Jin Douyou, and for the metal after extracting There is higher percent reduction.
[accompanying drawing explanation]
Fig. 1 is to extract copper and the techniqueflow chart of gold in this technology.
[detailed description of the invention]
Embodiment 1:
In nitrate leaching copper step, employing parameter: concentration of nitric acid 4.5mol/L, response time 40min, reaction temperature 45 DEG C, solid-to-liquid ratio (mass/volume) 1:15, mixing speed 400r/min, obtain the copper extraction rate of 97.95%.
Embodiment 2:
In nitrate leaching copper step, employing parameter: concentration of nitric acid 5.5mol/L, response time 60min, reaction temperature 55 DEG C, solid-to-liquid ratio (mass/volume) 1:25, mixing speed 400r/min, obtain the copper extraction rate of 94.75%.
Embodiment 3:
In Leaching In Thiourea Solutions depletion step, employing parameter: thiourea concentration 9g/L, Fe3+Concentration 4g/L, response time 45min, instead Answering temperature 30 DEG C, pH is 1.5, mixing speed 400r/min, solid-to-liquid ratio (mass/volume) 1:20, obtains the gold leaching of 95.88% Take rate.
Embodiment 4:
In Leaching In Thiourea Solutions depletion step, employing parameter: thiourea concentration 15g/L, Fe3+Concentration 7g/L, response time 90min, Reaction temperature 45 DEG C, pH is 3, mixing speed 400r/min, solid-to-liquid ratio (mass/volume) 1:20, obtains the gold leaching of 96.61% Take rate.

Claims (6)

1. from waste mobile phone circuit board, extract copper and a method for gold, waste mobile phone circuit board pretreatment is obtained sample 1 After carry out wet-milling processing；Filtering afterwards, filtrate 1 carries out going back native copper, and filtering residue 1 carries out filtering residue wet gold extraction, reacted solution mistake Filter, filtrate 2 reduces gold.
The method extracting copper and gold from waste mobile phone circuit board the most according to claim 1, it is characterised in that: described Pretreatment, uses instrument manual the removal aluminum hull of waste mobile phone circuit board surface, resistance element；To the waste mobile phone after disassembling Circuit board carries out crushing, grinding, and reaches 20～200 mesh, obtain sample 1 after sieving.
The method extracting copper and gold from waste mobile phone circuit board the most according to claim 1, it is characterised in that: described Wet-milling processing, is mixed in sample 1 in reactor with salpeter solution and reacts；Concentration of nitric acid 4.5～5.5mol/L, during reaction Between 40～60min, reaction temperature 45～55 DEG C, the mass/volume of solid-liquid is than 1:15～1:25, mixing speed 300～400r/ min；Filter, obtain filtrate 1, filtering residue 1.
The method extracting copper and gold from waste mobile phone circuit board the most according to claim 1, it is characterised in that: described Also native copper, by filtrate 1 with dilute NaOH solution regulation pH to 1.5, adds excess zinc under 300～400r/min mixing speeds Powder, removes unnecessary zinc powder with dilution heat of sulfuric acid afterwards, and after solution filters, filtering residue 2 washs, is dried to obtain and goes back native copper.
The method extracting copper and gold from waste mobile phone circuit board the most according to claim 1, it is characterised in that: described Filtering residue wet gold extraction, is dried the raw material as gold lixiviation using filtering residue 1, after it mixes with thiourea, iron sulfate, in regulating pH Solution in react；Response parameter is: thiourea concentration 9～15g/L, Fe3+ concentration 4～7g/L, the response time 45～90min, instead Answering temperature 30～45 DEG C, pH is 1.5～3, mixing speed 300～400r/min, and solid-liquid mass/volume is than for 1:20；Filter, To filtrate 2.
The method extracting copper and gold from waste mobile phone circuit board the most according to claim 1, it is characterised in that described Reduction gold, is electrolysed filtrate 2, and reclaims the gold being deposited on electrode.
CN201610496735.7A 2016-06-27 2016-06-27 A kind of method extracting copper and gold from waste mobile phone circuit board Pending CN106086417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610496735.7A CN106086417A (en) 2016-06-27 2016-06-27 A kind of method extracting copper and gold from waste mobile phone circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610496735.7A CN106086417A (en) 2016-06-27 2016-06-27 A kind of method extracting copper and gold from waste mobile phone circuit board

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107400780A (en) * 2017-07-18 2017-11-28 四川长虹电器股份有限公司 A kind of method that gold, silver and bronze are extracted in the plate from cell phone lines
CN109943721A (en) * 2017-12-20 2019-06-28 北京有色金属研究总院 The technique of copper in a kind of Weak-acid leaching electronic waste
CN111315903A (en) * 2017-10-17 2020-06-19 敏特创新有限公司 Method for recovering metals from electronic scrap
CN112662885A (en) * 2021-01-07 2021-04-16 广州云伊科技有限公司 Device for extracting gold from batched waste memory cards
US11591669B2 (en) 2016-10-31 2023-02-28 Mint Innovation Limited Metal recovery process
US11634788B2 (en) 2016-11-03 2023-04-25 Mint Innovation Limited Process for recovering metal

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101230421A (en) * 2007-12-26 2008-07-30 东华大学 Method for extracting gold from waste circuit boards
CN101392325A (en) * 2008-10-21 2009-03-25 东华大学 Method for extracting gold from waste printed circuit board
US20100314242A1 (en) * 2009-04-02 2010-12-16 Atomic Energy Council-Institute Of Nuclear Energy Research Method for Recovering Gold, Silver, Copper and Iron from Plasma-Caused Slag Containing Valuable Metals

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101230421A (en) * 2007-12-26 2008-07-30 东华大学 Method for extracting gold from waste circuit boards
CN101392325A (en) * 2008-10-21 2009-03-25 东华大学 Method for extracting gold from waste printed circuit board
US20100314242A1 (en) * 2009-04-02 2010-12-16 Atomic Energy Council-Institute Of Nuclear Energy Research Method for Recovering Gold, Silver, Copper and Iron from Plasma-Caused Slag Containing Valuable Metals

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11591669B2 (en) 2016-10-31 2023-02-28 Mint Innovation Limited Metal recovery process
US11634788B2 (en) 2016-11-03 2023-04-25 Mint Innovation Limited Process for recovering metal
CN107400780A (en) * 2017-07-18 2017-11-28 四川长虹电器股份有限公司 A kind of method that gold, silver and bronze are extracted in the plate from cell phone lines
CN111315903A (en) * 2017-10-17 2020-06-19 敏特创新有限公司 Method for recovering metals from electronic scrap
US11608544B2 (en) 2017-10-17 2023-03-21 Mint Innovation Limited Process for recovering metal from electronic waste
CN109943721A (en) * 2017-12-20 2019-06-28 北京有色金属研究总院 The technique of copper in a kind of Weak-acid leaching electronic waste
CN109943721B (en) * 2017-12-20 2021-01-22 有研工程技术研究院有限公司 Process for leaching copper in electronic waste by low acid
CN112662885A (en) * 2021-01-07 2021-04-16 广州云伊科技有限公司 Device for extracting gold from batched waste memory cards
CN112662885B (en) * 2021-01-07 2022-07-01 深圳还珠科技有限公司 Device for extracting gold from batched waste memory cards

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Application publication date: 20161109