CN106084664A - A kind of preparation method of graphene coated inorganic filler composite resin glue material - Google Patents

A kind of preparation method of graphene coated inorganic filler composite resin glue material Download PDF

Info

Publication number
CN106084664A
CN106084664A CN201610477812.4A CN201610477812A CN106084664A CN 106084664 A CN106084664 A CN 106084664A CN 201610477812 A CN201610477812 A CN 201610477812A CN 106084664 A CN106084664 A CN 106084664A
Authority
CN
China
Prior art keywords
inorganic filler
graphene
composite resin
resin
graphene oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610477812.4A
Other languages
Chinese (zh)
Inventor
俞国宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YIWU YUNTUO OPTOELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
YIWU YUNTUO OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YIWU YUNTUO OPTOELECTRONIC TECHNOLOGY Co Ltd filed Critical YIWU YUNTUO OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201610477812.4A priority Critical patent/CN106084664A/en
Publication of CN106084664A publication Critical patent/CN106084664A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention relates to the preparation method of a kind of graphene coated inorganic filler composite resin glue material, include following components according to weight fraction meter: resin matrix 20 35 parts, the inorganic filler of graphene coated 40 60 parts, 20 30 parts of firming agent.This composite resin glue have employed composite resin matrix, compound inorganic filler and composite curing agent, it can be with effective constitution heat conduction via and conductive network, the product of the present invention has high heat conductivility and certain fire resistance, the heat conductivity of the final composite resin glue prepared is more than 37 S/m more than 9.0 W/mK, electrical conductivity;Heat resistance is good, and has certain corrosion resistance.Can extensively apply radiating element, Electronic Packaging, electronic equipment, the chemical industry energy, the field such as auto industry and Aero-Space.

Description

A kind of preparation method of graphene coated inorganic filler composite resin glue material
Technical field
The invention belongs to field of polymer composite material, be specifically related to a kind of high heat-conductivity conducting graphene coated inorganic filler Composite resin glue material and preparation method thereof.
Background technology
Graphene (Graphene) is the only one layer of atomic thickness being stripped out from graphite material, being made up of carbon atom Two dimensional crystal.This giving the hot property that Graphene is unique, existing document report, at normal temperatures by confocal elliptical waveguide light Spectrum measures, and in the face of single-layer graphene, thermal conductivity has reached the scope of 4800-5300 W/mk.The thinnest, strong as have now been found that A kind of novel nano-material that degree is maximum, electrical and thermal conductivity performance is the strongest, Graphene is referred to as " dark fund ".Therefore, Graphene by with In the electrical and thermal conductivity performance strengthening polymer.
High performance electronics uses the material with high thermal conductivity to carry out heat dissipation, to prevent too much heat to electricity Subsystem damages.But, although polymer has many good qualities compared to for other materials, but individually epoxide-resin glue Thermal conductivity the lowest, only only have about about 0.2 W/mK.This have impact on epoxide-resin glue on many-sided and field Application.
High-thermal-conductivity epoxy resin compound adhesive is that one can meet Electronic Packaging, thermal management device and electronic device to material The thermal interfacial material that heat dispersion requires.Metal, metal-oxide and metal nitride particles are employed as heat filling In the thermal conductivity improving epoxy resin compound adhesive.But, these high heat fillings are to the heat conductivility of epoxy resin compound adhesive Promote the most notable.This is caused by several factors, including filling kind, granular size and geometry to heat conduction path Impact, filler shadow of hot interface resistance between scattered impact and epoxy resin-base and filler in epoxy resin-base Ring.
The more important thing is, simple epoxy resin-base itself there is also the defect in performance, and resin matrix and filler The compatibility the biggest on the impact of the thermal conductance conductivity of composite resin glue.Therefore, resin improvement substantially itself and filler this The improvement of body is critically important for composite resin glue.
Summary of the invention
The technical problem to be solved is, overcomes the defect that current single epoxy resin-base exists, Er Qieyi Determine under loading, Graphene and the very difficult composite resin glue that is uniformly added to of inorganic filler, thus unmanageable weak point, There is provided a kind of with low cost, it is easy to the high heat-conductivity conducting of industrialized production, there is again the graphene coated of certain fire resistance Inorganic filler composite resin glue material and preparation technology thereof.
In the present invention, utilize crystal whisker-shaped or nanometer wire inorganic filler to the basic conducting pathway building in epoxy resin-base Footpath, the graphene oxide of lamellar is coated on the crystal whisker-shaped by surface modifying agent or nanometer wire inorganic matter to strengthen filling out Directly contact between material.Then, inorganic matter whisker or the nano wire of graphene oxide cladding is entered by different reduction means Row reduction joined after (including electronation, ultraviolet reduction and high-temperature process) prepares high heat-conductivity conducting stone in epoxy resin-base Ink alkene coated inorganic filling epoxy resin compound adhesive.
The technical solution adopted in the present invention is:
A kind of graphene coated inorganic filler composite resin glue material, it is characterised in that include following group according to weight fraction meter Point: resin matrix 20-35 part, inorganic filler 40-60 part of graphene coated, firming agent 20-30 part.
Further, described resin matrix is according to matter by epoxy resin, polysulfones, polyimide resin and furfural resin The hybrid resin matrix that amount mixes than the ratio for 10:5:2:1;
Described epoxy resin-base is that glycidyl ester epoxy resin and glycidyl amine epoxy resin are according to mass ratio The mixture mixed for 1:1;Wherein, described glycidyl ester epoxy resin is adipic acid 2-glycidyl ester, institute The glycidyl amine epoxy resin stated is MDA four glycidyl amine and diglycidyl para-aminophenol It is that 2:1 mixes according to mass ratio;Described polysulfones is bisphenol-a polysulfone (PSU);Described polyimide resin is span Carry out acid imide.
Further, the inorganic filler of described graphene coated is crystal whisker-shaped or the zinc oxide of nanometer wire and copper oxide And nano silver wire mixes according to the ratio that mass ratio is 3:3:1.
Further, described Graphene is single-layer graphene, or few layer graphene microplate.
Further, described firming agent is thiorubber., polybutylene terephthalate (PBT) (PBT) and flame-proof ethylene base Resin is according to the composite curing agent that mass ratio is that 20:15:7 mixes.
Present invention also offers the preparation method of a kind of graphene coated inorganic filler composite resin glue material, its feature exists In: comprise the steps of:
(1) 5g graphite and 5gNaNO3 are put in flask, and add 150ml sulphuric acid, then 15gKMnO4 is added in flask, Maintain the temperature at 30 oC and be sufficiently stirred for 10 h, after having reacted, 200ml deionized water will be added in flask and make temperature increase Keep 30 minutes to 90 oC, then after solution is cooled to room temperature, and inject hydrogen peroxide and the 700ml of 30ml30% mass concentration Deionized water, then after washing and pickling twice, take out product, after being placed in 60 DEG C of dry 3h of vacuum drying oven, obtain oxygen Functionalized graphene;Described graphene oxide is single-layer graphene, or few layer graphene microplate;
(2) first 20g crystal whisker-shaped or nanometer wire inorganic filler are placed on 130 oC in vacuum drying oven and are dried 2 h, be then placed in In flask containing 200ml dimethylbenzene, reflux condensate device is installed, surface modifier is added flask, and stirs 4 at 150 oC H, product through ethanol purge and centrifugal after put into 60 DEG C of dry 3h of vacuum drying oven after, obtain the crystalline substance of surface modifier modified Must shape or nanometer wire inorganic filler;
(3) take the graphene oxide 1g that step (1) prepares to be dissolved in 200ml ethanol and stirring, the most ultrasonic 1.5 H, adds crystal whisker-shaped or the nanometer wire inorganic filler of surface modifier modified obtained by step (2), at the uniform velocity stirs 5 H, afterwards, puts into tube furnace logical nitrogen under 1000 DEG C of high temperature by the inorganic filler that the above-mentioned graphene oxide stirred is coated with Make annealing treatment 1 h;Or the inorganic filler of the above-mentioned graphene oxide stirred cladding is added containing reproducibility chemical substance Heated in water solution reduce to 90 DEG C, after keeping 3 h, filtration drying, finally give graphene oxide cladding inorganic Filler;
(4) inorganic filler and the firming agent of graphene oxide cladding composite resin matrix, step (3) prepared is used by proportioning Planetary vacuum stirring deaeration machine adds after stirring 15 min under the rotation rotating speed of 2000 rpm revolution rotating speeds and 1000 rpm In mould, flat-bed press is heated to 100 oC, solidifies 3 h, then solidify 2 h after temperature is increased to 130 oC, obtain Graphene coated inorganic filler composite resin glue material.
Further, the surface modifier in described step (2) is titanate coupling agent, calculates according to volume fraction, institute State addition is described organic solvent dimethylbenzene the 2% of titanate coupling agent.
Further, step (3) described reproducibility chemical substance is hydrazine hydrate, described hydrazine hydrate and the matter of graphene oxide Amount ratio is 10:7.
Further, the content of each component in step 1-4 is increased or decreased simultaneously in the same scale.
Compared to prior art, the present invention has a following beneficial effect:
(1) present invention employs the resin matrix of mixed type, the epoxy resin wherein selected comprises (+)-2,3-Epoxy-1-propanol esters asphalt mixtures modified by epoxy resin Fat and glycidyl amine epoxy resin, the combination of the epoxy resin of both types makes resin matrix have reactivity Height, bonding force are higher than general purpose epoxy resin, and solidfied material mechanical property is good, and against weather is good, and has good resistance to ultralow temperature Property, under condition of ultralow temperature, still there is the adhesion strength higher than other type of epoxy resin.It addition, the bismaleimide selected Amine has the mobility close with epoxy resin and mouldability especially, and the available conventional method similar with epoxy resin adds Work molding, the resin of both types has the good compatibility, and BMI has excellent electrical property, this resin The addition of matrix overcomes the shortcoming that epoxy resin thermostability is relatively low.
Polysulfones itself is the thermoplastic resin in molecular backbone containing chain link, the bisphenol-a polysulfone selected by the present invention (PSU) first, excellent in mechanical performance, high intensity, impact resistance, and there is good dimensional stability and prominent creep resistant Property, molding shrinkage is little, can do accurate product, but easily stress cracking.Secondly, chemically from the point of view of performance, PSU is to general nothing Machine acid, alkali, salt and aliphatic hydrocarbon, alcohols and oils are the most stable;The hot strength of the 3rd, PSU mechanical property and bending strength It is better than equal general engineering plastic;And PSU has good heatproof oxidation performance, when 150 degree through the thermo-oxidative ageing of 2 years, draw Stretch intensity and heat distortion temperature does not drop and increases on the contrary, there is good electric property simultaneously.The most comprehensive performance The most excellent resin.
Furfural resin refers to that a kind of furane resins obtained for primary raw material by polycondensation or copolymerization with furfuryl alcohol or furfural are gathered Compound.Furfuryl alcohol or furfural are initially formed line polymer under acid catalysis, then proceed to occur in presence of an acid double-bond polymerization, are formed Cross-linking agent insoluble, insoluble.Furfural resin is high temperature resistant, chemical proofing and electrical insulating property excellent, but single furfural tree Fat glue bond is poor, property is crisp, his application of this characteristic strong influence, and utilizes furfural resin and epoxy resin and gather Imide resin and polysulfones are used in combination, and overcome and have fallen the problem that the caking property of furfural resin own is poor and property is crisp, the biggest Improve greatly the temperature applicable range of composite resin, and improve the various mechanics such as resin entirety shock resistance, wet and heat ageing resistant Performance.
(2) present invention method by chemical modification, is coated with graphene oxide on crystal whisker-shaped or nanometer wire inorganic matter Or after Graphene basis, add resin matrix and can be obtained by the composite resin heat-conductivity conducting glue of high electrical conductivity, preparation method letter Single, the large-scale production of filler and composite resin can be realized.
(3) present invention has selected compound inorganic filler, and the zinc oxide of the one-dimentional structure of crystal whisker-shaped or nanometer wire has Unique electron transport ability and good electric property;The copper dioxide of one-dimentional structure aboundresources especially, with low cost, ring Border is friendly, has more preferable electric property by providing more high-specific surface area and shorter diffusion length.Nano silver wire Belong to pure metal class nano wire, there is optimal performance electrically and thermally, nano silver wire in addition to there is the excellent electric conductivity of silver, Due to the dimensional effect of Nano grade, also there is the light transmission of excellence, flexible resistance.Make it at the aspect such as conducting resinl, heat-conducting glue Application in also there is prominent advantage.From performance, from the point of view of cost etc. is comprehensive, what the present invention used compound inorganic fills out Material can be greatly improved the electric property of composite resin glue of the present invention.
(4) firming agent that graphene coated inorganic filler composite resin glue material of the present invention is selected is thiorubber., poly-right Benzene dicarboxylic acid butanediol ester (PBT) and flame-proof ethylene base resin are the composite curing agent that 20:15:7 mixes according to mass ratio. The selection of this firming agent has fabulous solidification effect for the resin system of the present invention.
Thiorubber. is a kind of low-molecular weight polymer, and it has the excellences such as low-temperature flexibility, solvent resistance, stress relaxation Performance.After thiorubber. mixes with epoxy resin, the mercapto of end and epoxy resin generation chemical reaction, hence into solid In epoxy resin structural after change, impart the good pliability of the epoxy resin after crosslinking, high shear strength and peel off strong Degree.
Polybutylene terephthalate (PBT) PBT main chain is to be rigidity phenyl ring by each repetitive and flexible fatty alcohol connects The saturated linear molecular composition got up, it is strong that the height geometrical regularity of molecule and rigid element make polymer have high machinery Degree, prominent chemical reagent resistance, thermostability and excellent electrical property;Molecule does not has side chain, symmetrical configuration, meets compact reactor The requirement built, so that this polymer has crystalline and the high-melting-point of height, the structures shape of molecule PBT has good Combination property.The more important thing is, due to the excellent system energy of PBT itself, they can be with polysulfones, polyamide, epoxy resin etc. Plastics are used in combination jointly, various mechanical performances and the electric property of material can be greatly improved, can make again material There is higher chemical stability.Flame-proof ethylene base resin has higher heat stability.After resin solidification, crosslink density is big. Its heat distortion temperature reaches 120-135 DEG C, can extend the service life of final material and have excellent corrosion resistance, and resistance Combustion performance.PBT is also a kind of fire proofing simultaneously, owing to performance affine with fire retardant is good, so with the flame-proof ethylene base added Resin has more preferable associativity, it is possible to preferably play the flame retardant effect of material.In general, the composite solid that the present invention selects Agent can effectively save the time of curing reaction, simultaneously can for composite resin system realize optimal solidification effect with And flame retardant effect.
(5) product of the present invention has high heat conductivility, and high thermal conductivity coefficient is more than 9.0 W/mK, high conductivity More than 37 S/m;Heat resistance is good, and has certain corrosion resistance, can use under acid or alkaline conditions.
(6) low raw-material cost that the present invention selects, environmental protection, simple operation, it is easy to industrialized production, is a kind of excellent Thermal interfacial material, can extensively apply radiating element, electronic equipment, the chemical industry energy, the field such as auto industry and Aero-Space.
Detailed description of the invention
The invention discloses a kind of graphene coated inorganic filler composite resin glue material and preparation method thereof, below by The present invention is specifically described by several embodiments.
Embodiment 1
(1) 5g graphite and 5gNaNO3 are put in flask, and add 150ml sulphuric acid, then 15gKMnO4 is added in flask, Maintain the temperature at 30 DEG C and be sufficiently stirred for 10 h, after having reacted, 200ml deionized water will be added in flask and make temperature rise to 90 DEG C keep 30 minutes, then after solution is cooled to room temperature, and inject the hydrogen peroxide of 30ml30% mass concentration and 700ml goes Ionized water, then after washing and pickling twice, take out product, after being placed in 60 DEG C of dry 3h of vacuum drying oven, aoxidized Graphene;Graphene is single-layer graphene, or few layer graphene microplate.
(2) first 20g crystal whisker-shaped or nanometer wire inorganic filler are placed on 130 oC in vacuum drying oven and are dried 2 h, then Put in the flask containing 200ml dimethylbenzene, reflux condensate device is installed, by 4ml titanate coupling agent addition flask, and 150 DEG C of stirring 4 h, product through ethanol purge and centrifugal after put into 60 DEG C of dry 3h of vacuum drying oven after, obtain surface modification The crystal whisker-shaped of agent modified or nanometer wire inorganic filler;The inorganic filler of graphene coated is crystal whisker-shaped or the two of nanometer wire Zinc oxide and copper oxide and nano silver wire mix according to the ratio that mass ratio is 3:3:1.
(3) take the graphene oxide 1g that step (1) prepares to be dissolved in 200ml ethanol and stirring, then surpass Sound 1.5 h, adds crystal whisker-shaped or the nanometer wire inorganic filler of surface modifier modified obtained by step (2), at the uniform velocity Stir 5 h, afterwards, the inorganic filler that the above-mentioned graphene oxide stirred is coated with is put into tube furnace under 1000 DEG C of high temperature Logical n 2 annealing processes 1 h;Or the inorganic filler of the above-mentioned graphene oxide stirred cladding is added containing reproducibility The heated in water solution learning material is reduced to 90 DEG C, after keeping 3 h, and filtration drying, finally give graphene oxide cladding Inorganic filler;Wherein, reproducibility chemical substance is hydrazine hydrate, and hydrazine hydrate is 10:7 with the mass ratio of graphene oxide.
(4) the inorganic filler 60g graphene oxide that composite resin matrix 35g, step (3) prepare being coated with and firming agent 30g uses planetary vacuum stirring deaeration machine to stir under the rotation rotating speed of 2000 rpm revolution rotating speeds and 1000 rpm by proportioning Add in mould after 15 min, flat-bed press is heated to 100 DEG C, solidify 3 h, more solid after temperature is increased to 130 DEG C Change 2 h, obtain graphene coated inorganic filler composite resin glue material.
Wherein, described resin matrix is according to mass ratio by epoxy resin, polysulfones, polyimide resin and furfural resin The hybrid resin matrix mixed for the ratio of 10:5:2:1;
Described epoxy resin-base is that glycidyl ester epoxy resin and glycidyl amine epoxy resin are according to mass ratio The mixture mixed for 1:1;Wherein, described glycidyl ester epoxy resin is adipic acid 2-glycidyl ester, institute The glycidyl amine epoxy resin stated is MDA four glycidyl amine and diglycidyl para-aminophenol It is that 2:1 mixes according to mass ratio;Described polysulfones is bisphenol-a polysulfone (PSU);Described polyimide resin is span Carry out acid imide.
Firming agent is that thiorubber., polybutylene terephthalate (PBT) (PBT) and flame-proof ethylene base resin are according to mass ratio The composite curing agent mixed for 20:15:7.
Through test, the thermal conductivity of the final composite resin glue prepared is 9.5W/mK, and electrical conductivity is 38S/m.
Embodiment 2
(1) 5g graphite and 5gNaNO3 are put in flask, and add 150ml sulphuric acid, then 15gKMnO4 is added in flask, Maintain the temperature at 30 DEG C and be sufficiently stirred for 10 h, after having reacted, 200ml deionized water will be added in flask and make temperature rise to 90 DEG C keep 30 minutes, then after solution is cooled to room temperature, and inject the hydrogen peroxide of 30ml30% mass concentration and 700ml goes Ionized water, then after washing and pickling twice, take out product, after being placed in 60 DEG C of dry 3h of vacuum drying oven, aoxidized Graphene;Graphene is single-layer graphene, or few layer graphene microplate.
(2) first 20g crystal whisker-shaped or nanometer wire inorganic filler are placed on 130 oC in vacuum drying oven and are dried 2 h, then Put in the flask containing 200ml dimethylbenzene, reflux condensate device is installed, by 4ml titanate coupling agent addition flask, and 150 DEG C of stirring 4 h, product through ethanol purge and centrifugal after put into 60 DEG C of dry 3h of vacuum drying oven after, obtain surface modification The crystal whisker-shaped of agent modified or nanometer wire inorganic filler;The inorganic filler of graphene coated is crystal whisker-shaped or the two of nanometer wire Zinc oxide and copper oxide and nano silver wire mix according to the ratio that mass ratio is 3:3:1.
(3) take the graphene oxide 1g that step (1) prepares to be dissolved in 200ml ethanol and stirring, then surpass Sound 1.5 h, adds crystal whisker-shaped or the nanometer wire inorganic filler of surface modifier modified obtained by step (2), at the uniform velocity Stir 5 h, afterwards, the inorganic filler that the above-mentioned graphene oxide stirred is coated with is put into tube furnace under 1000 DEG C of high temperature Logical n 2 annealing processes 1 h;Or the inorganic filler of the above-mentioned graphene oxide stirred cladding is added containing reproducibility The heated in water solution learning material is reduced to 90 DEG C, after keeping 3 h, and filtration drying, finally give graphene oxide cladding Inorganic filler;Wherein, reproducibility chemical substance is hydrazine hydrate, and hydrazine hydrate is 10:7 with the mass ratio of graphene oxide.
(4) the inorganic filler 40g graphene oxide that composite resin matrix 20g, step (3) prepare being coated with and firming agent 20g uses planetary vacuum stirring deaeration machine to stir under the rotation rotating speed of 2000 rpm revolution rotating speeds and 1000 rpm by proportioning Add in mould after 15 min, flat-bed press is heated to 100 DEG C, solidify 3 h, more solid after temperature is increased to 130 DEG C Change 2 h, obtain graphene coated inorganic filler composite resin glue material.
Wherein, described resin matrix is according to mass ratio by epoxy resin, polysulfones, polyimide resin and furfural resin The hybrid resin matrix mixed for the ratio of 10:5:2:1;
Described epoxy resin-base is that glycidyl ester epoxy resin and glycidyl amine epoxy resin are according to mass ratio The mixture mixed for 1:1;Wherein, described glycidyl ester epoxy resin is adipic acid 2-glycidyl ester, institute The glycidyl amine epoxy resin stated is MDA four glycidyl amine and diglycidyl para-aminophenol It is that 2:1 mixes according to mass ratio;Described polysulfones is bisphenol-a polysulfone (PSU);Described polyimide resin is span Carry out acid imide.
Firming agent is that thiorubber., polybutylene terephthalate (PBT) (PBT) and flame-proof ethylene base resin are according to mass ratio The composite curing agent mixed for 20:15:7.
Through test, the thermal conductivity of the final composite resin glue prepared is 9.3W/mK, and electrical conductivity is 39S/m.
Embodiment 3
(1) 5g graphite and 5gNaNO3 are put in flask, and add 150ml sulphuric acid, then 15gKMnO4 is added in flask, Maintain the temperature at 30 DEG C and be sufficiently stirred for 10 h, after having reacted, 200ml deionized water will be added in flask and make temperature rise to 90 DEG C keep 30 minutes, then after solution is cooled to room temperature, and inject the hydrogen peroxide of 30ml30% mass concentration and 700ml goes Ionized water, then after washing and pickling twice, take out product, after being placed in 60 DEG C of dry 3h of vacuum drying oven, aoxidized Graphene;Graphene is single-layer graphene, or few layer graphene microplate.
(2) first 20g crystal whisker-shaped or nanometer wire inorganic filler are placed on 130 oC in vacuum drying oven and are dried 2 h, then Put in the flask containing 200ml dimethylbenzene, reflux condensate device is installed, by 4ml titanate coupling agent addition flask, and 150 DEG C of stirring 4 h, product through ethanol purge and centrifugal after put into 60 DEG C of dry 3h of vacuum drying oven after, obtain surface modification The crystal whisker-shaped of agent modified or nanometer wire inorganic filler;The inorganic filler of graphene coated is crystal whisker-shaped or the two of nanometer wire Zinc oxide and copper oxide and nano silver wire mix according to the ratio that mass ratio is 3:3:1.
(3) take the graphene oxide 1g that step (1) prepares to be dissolved in 200ml ethanol and stirring, then surpass Sound 1.5 h, adds crystal whisker-shaped or the nanometer wire inorganic filler of surface modifier modified obtained by step (2), at the uniform velocity Stir 5 h, afterwards, the inorganic filler that the above-mentioned graphene oxide stirred is coated with is put into tube furnace under 1000 DEG C of high temperature Logical n 2 annealing processes 1 h;Or the inorganic filler of the above-mentioned graphene oxide stirred cladding is added containing reproducibility The heated in water solution learning material is reduced to 90 DEG C, after keeping 3 h, and filtration drying, finally give graphene oxide cladding Inorganic filler;Wherein, reproducibility chemical substance is hydrazine hydrate, and hydrazine hydrate is 10:7 with the mass ratio of graphene oxide.
(4) the inorganic filler 50g graphene oxide that composite resin matrix 30g, step (3) prepare being coated with and firming agent 25g uses planetary vacuum stirring deaeration machine to stir under the rotation rotating speed of 2000 rpm revolution rotating speeds and 1000 rpm by proportioning Add in mould after 15 min, flat-bed press is heated to 100 DEG C, solidify 3 h, more solid after temperature is increased to 130 DEG C Change 2 h, obtain graphene coated inorganic filler composite resin glue material.
Wherein, described resin matrix is according to mass ratio by epoxy resin, polysulfones, polyimide resin and furfural resin The hybrid resin matrix mixed for the ratio of 10:5:2:1;
Described epoxy resin-base is that glycidyl ester epoxy resin and glycidyl amine epoxy resin are according to mass ratio The mixture mixed for 1:1;Wherein, described glycidyl ester epoxy resin is adipic acid 2-glycidyl ester, institute The glycidyl amine epoxy resin stated is MDA four glycidyl amine and diglycidyl para-aminophenol It is that 2:1 mixes according to mass ratio;Described polysulfones is bisphenol-a polysulfone (PSU);Described polyimide resin is span Carry out acid imide.
Firming agent is that thiorubber., polybutylene terephthalate (PBT) (PBT) and flame-proof ethylene base resin are according to mass ratio The composite curing agent mixed for 20:15:7.
Through test, the thermal conductivity of the final composite resin glue prepared is 9.7W/mK, and electrical conductivity is 39S/m..
The composite resin glue that the present invention prepares has the characteristic of high heat conduction and high connductivity.By specific embodiment 1-3, Can illustrate to add the inorganic filler by Surface coating Graphene in composite resin matrix can be with the heat-conductivity conducting of effective constitution Network path, is greatly improved thermal conductivity and the conductivity of compound adhesive, and heat conductivity and the heat conductivity of material are significantly improved. Graphene improves the contact area between filler, enhances original thermal conducting path.Meanwhile, define along filler and effectively lead Electric network, greatly improves electrical conductivity.
Present invention employs the resin matrix of mixed type, the epoxy resin wherein selected comprises (+)-2,3-Epoxy-1-propanol esters asphalt mixtures modified by epoxy resin Fat and glycidyl amine epoxy resin, the combination of the epoxy resin of both types makes resin matrix have reactivity Height, bonding force are higher than general purpose epoxy resin, and solidfied material mechanical property is good, and against weather is good, and has good resistance to ultralow temperature Property, under condition of ultralow temperature, still there is the adhesion strength higher than other type of epoxy resin.It addition, the bismaleimide selected Amine has the mobility close with epoxy resin and mouldability especially, and the available conventional method similar with epoxy resin adds Work molding, the resin of both types has the good compatibility, and BMI has excellent electrical property, this resin The addition of matrix overcomes the shortcoming that epoxy resin thermostability is relatively low.
Polysulfones itself is the thermoplastic resin in molecular backbone containing chain link, the bisphenol-a polysulfone selected by the present invention (PSU) first, excellent in mechanical performance, high intensity, impact resistance, and there is good dimensional stability and prominent creep resistant Property, molding shrinkage is little, can do accurate product, but easily stress cracking.Secondly, chemically from the point of view of performance, PSU is to general nothing Machine acid, alkali, salt and aliphatic hydrocarbon, alcohols and oils are the most stable;The hot strength of the 3rd, PSU mechanical property and bending strength It is better than equal general engineering plastic;And PSU has good heatproof oxidation performance, when 150 degree through the thermo-oxidative ageing of 2 years, draw Stretch intensity and heat distortion temperature does not drop and increases on the contrary, there is good electric property simultaneously.The most comprehensive performance The most excellent resin.
Furfural resin refers to that a kind of furane resins obtained for primary raw material by polycondensation or copolymerization with furfuryl alcohol or furfural are gathered Compound.Furfuryl alcohol or furfural are initially formed line polymer under acid catalysis, then proceed to occur in presence of an acid double-bond polymerization, are formed Cross-linking agent insoluble, insoluble.Furfural resin is high temperature resistant, chemical proofing and electrical insulating property excellent, but single furfural tree Fat glue bond is poor, property is crisp, his application of this characteristic strong influence, and utilizes furfural resin and epoxy resin and gather Imide resin and polysulfones are used in combination, and overcome and have fallen the problem that the caking property of furfural resin own is poor and property is crisp, the biggest Improve greatly the temperature applicable range of composite resin, and improve the various mechanics such as resin entirety shock resistance, wet and heat ageing resistant Performance.
The present invention method by chemical modification, is coated with graphene oxide or stone on crystal whisker-shaped or nanometer wire inorganic matter After ink alkene basis, adding resin matrix and can be obtained by the composite resin heat-conductivity conducting glue of high electrical conductivity, preparation method is simple, energy Realize the large-scale production of filler and composite resin.
The present invention has selected compound inorganic filler, and the zinc oxide of the one-dimentional structure of crystal whisker-shaped or nanometer wire has uniqueness Electron transport ability and good electric property;The copper dioxide of one-dimentional structure aboundresources especially, with low cost, environment is friendly Good, by providing more high-specific surface area and shorter diffusion length, there is more preferable electric property.Nano silver wire belongs to Pure metal class nano wire, has optimal performance electrically and thermally, nano silver wire in addition to there is the excellent electric conductivity of silver, due to The dimensional effect of Nano grade, also has the light transmission of excellence, flexible resistance.Make its answering at the aspect such as conducting resinl, heat-conducting glue Also there is in prominent advantage.From performance, from the point of view of cost etc. is comprehensive, the compound inorganic filler energy that the present invention uses Enough it is greatly improved the electric property of composite resin glue of the present invention.
The firming agent that graphene coated inorganic filler composite resin glue material of the present invention is selected is thiorubber., gathers benzene two Formic acid butanediol ester (PBT) and flame-proof ethylene base resin are the composite curing agent that 20:15:7 mixes according to mass ratio.This is solid The selection of agent has fabulous solidification effect for the resin system of the present invention.
Thiorubber. is a kind of low-molecular weight polymer, and it has the excellences such as low-temperature flexibility, solvent resistance, stress relaxation Performance.After thiorubber. mixes with epoxy resin, the mercapto of end and epoxy resin generation chemical reaction, hence into solid In epoxy resin structural after change, impart the good pliability of the epoxy resin after crosslinking, high shear strength and peel off strong Degree.
Polybutylene terephthalate (PBT) PBT main chain is to be rigidity phenyl ring by each repetitive and flexible fatty alcohol connects The saturated linear molecular composition got up, it is strong that the height geometrical regularity of molecule and rigid element make polymer have high machinery Degree, prominent chemical reagent resistance, thermostability and excellent electrical property;Molecule does not has side chain, symmetrical configuration, meets compact reactor The requirement built, so that this polymer has crystalline and the high-melting-point of height, the structures shape of molecule PBT has good Combination property.The more important thing is, due to the excellent system energy of PBT itself, they can be with polysulfones, polyamide, epoxy resin etc. Plastics are used in combination jointly, various mechanical performances and the electric property of material can be greatly improved, can make again material There is higher chemical stability.Flame-proof ethylene base resin has higher heat stability.After resin solidification, crosslink density is big. Its heat distortion temperature reaches 120-135 DEG C, can extend the service life of final material and have excellent corrosion resistance, and resistance Combustion performance.PBT is also a kind of fire proofing simultaneously, owing to performance affine with fire retardant is good, so with the flame-proof ethylene base added Resin has more preferable associativity, it is possible to preferably play the flame retardant effect of material.In general, the composite solid that the present invention selects Agent can effectively save the time of curing reaction, simultaneously can for composite resin system realize optimal solidification effect with And flame retardant effect.
The product of the present invention has high heat conductivility, and the heat conductivity of the final composite resin glue prepared is more than 9.0 W/mK, electrical conductivity is more than 37 S/m;Heat resistance is good, and has certain corrosion resistance, can be in acid or alkaline condition Lower use.
Above example has been shown and described the ultimate principle of the present invention and principal character and advantages of the present invention.The industry Skilled person will appreciate that, the present invention is not restricted to the described embodiments, described in above-described embodiment and description simply The principle of the present invention is described rather than limits the scope of the present invention by any way, without departing from the scope of the invention, The present invention also has various changes and modifications, and these changes and improvements both fall within claimed scope.

Claims (4)

1. the preparation method of a graphene coated inorganic filler composite resin glue material, it is characterised in that: comprise the steps of:
Step 1, by 5g graphite and 5gNaNO3Put in flask, and add 150ml sulphuric acid, then by 15gKMnO4Add flask to In, maintain the temperature at 30oC is sufficiently stirred for 10 h, after having reacted, will add 200ml deionized water and make in temperature in flask It is raised to 90oC keeps 30 minutes, then after solution is cooled to room temperature, and inject 30ml30% mass concentration hydrogen peroxide and 700ml deionized water, then after washing and pickling twice, take out product, after being placed in 60 DEG C of dry 3h of vacuum drying oven, To graphene oxide;Described graphene oxide is single-layer graphene, or few layer graphene microplate;
Step 2, first 20g crystal whisker-shaped or nanometer wire inorganic filler are placed in vacuum drying oven 130oC is dried 2 h, then puts Enter in the flask containing 200ml dimethylbenzene, reflux condensate device is installed, surface modifier is added flask, and 150oC stirs Mix 4 h, product through ethanol purge and centrifugal after put into 60 DEG C of dry 3h of vacuum drying oven after, obtain surface modifier modified Crystal whisker-shaped or nanometer wire inorganic filler;
Step 3, take the graphene oxide 1g that step 1 prepares and be dissolved in 200ml ethanol and stirring, the most ultrasonic 1.5 h, add crystal whisker-shaped or the nanometer wire inorganic filler of surface modifier modified obtained by step 2, at the uniform velocity stir 5 H, afterwards, puts into tube furnace logical nitrogen under 1000 DEG C of high temperature by the inorganic filler that the above-mentioned graphene oxide stirred is coated with Make annealing treatment 1 h;Or the inorganic filler of the above-mentioned graphene oxide stirred cladding is added containing reproducibility chemical substance Heated in water solution reduce to 90 DEG C, after keeping 3 h, filtration drying, finally give graphene oxide cladding inorganic Filler;
Step 4, the inorganic filler of graphene oxide cladding composite resin matrix, step (3) prepared and firming agent are by proportioning After using planetary vacuum stirring deaeration machine to stir 15 min under the rotation rotating speed of 2000 rpm revolution rotating speeds and 1000 rpm Add in mould, flat-bed press is heated to 100oC, solidifies 3 h, then temperature is increased to 130o2 h are solidified after C, To graphene coated inorganic filler composite resin glue material.
The preparation method of graphene coated inorganic filler composite resin glue material the most according to claim 1, its feature exists In: the surface modifier in described step (2) is titanate coupling agent, calculates according to volume fraction, described titanate coupling agent Addition is described organic solvent dimethylbenzene 2%.
Preparation method the most according to claim 1 and 2, it is characterised in that: step (3) described reproducibility chemical substance is water Closing hydrazine, described hydrazine hydrate is 10:7 with the mass ratio of graphene oxide.
4. according to the preparation method described in claim 1 or 2 or 3, it is characterised in that: the content of each component in step 1-4 It is increased or decreased in the same scale simultaneously.
CN201610477812.4A 2016-06-27 2016-06-27 A kind of preparation method of graphene coated inorganic filler composite resin glue material Pending CN106084664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610477812.4A CN106084664A (en) 2016-06-27 2016-06-27 A kind of preparation method of graphene coated inorganic filler composite resin glue material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610477812.4A CN106084664A (en) 2016-06-27 2016-06-27 A kind of preparation method of graphene coated inorganic filler composite resin glue material

Publications (1)

Publication Number Publication Date
CN106084664A true CN106084664A (en) 2016-11-09

Family

ID=57253113

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610477812.4A Pending CN106084664A (en) 2016-06-27 2016-06-27 A kind of preparation method of graphene coated inorganic filler composite resin glue material

Country Status (1)

Country Link
CN (1) CN106084664A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107878671A (en) * 2017-11-08 2018-04-06 沂水地下萤光湖旅游发展有限公司 High-strength safe drift boat
CN108102300A (en) * 2017-12-29 2018-06-01 深圳市汇北川电子技术有限公司 For the graphene epoxy composite material and preparation method of electric vehicle driving module
CN111363341A (en) * 2020-04-01 2020-07-03 青岛华世洁环保科技有限公司 Heat exchange base material, rotary wheel heat exchanger rotary core carrier, rotary wheel heat exchanger rotary core and preparation method thereof, and rotary wheel heat exchanger

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104861910A (en) * 2015-05-20 2015-08-26 北京化工大学 Graphene-coated inorganic filler and epoxy resin composite adhesive and preparation method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104861910A (en) * 2015-05-20 2015-08-26 北京化工大学 Graphene-coated inorganic filler and epoxy resin composite adhesive and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107878671A (en) * 2017-11-08 2018-04-06 沂水地下萤光湖旅游发展有限公司 High-strength safe drift boat
CN107878671B (en) * 2017-11-08 2020-04-24 沂水地下萤光湖旅游发展有限公司 High-strength safe canoe for drifting
CN108102300A (en) * 2017-12-29 2018-06-01 深圳市汇北川电子技术有限公司 For the graphene epoxy composite material and preparation method of electric vehicle driving module
CN111363341A (en) * 2020-04-01 2020-07-03 青岛华世洁环保科技有限公司 Heat exchange base material, rotary wheel heat exchanger rotary core carrier, rotary wheel heat exchanger rotary core and preparation method thereof, and rotary wheel heat exchanger
CN111363341B (en) * 2020-04-01 2022-03-08 青岛华世洁环保科技有限公司 Heat exchange base material, rotary wheel heat exchanger rotary core carrier, rotary wheel heat exchanger rotary core and preparation method thereof, and rotary wheel heat exchanger

Similar Documents

Publication Publication Date Title
CN106010403A (en) Graphene coated inorganic filler composite resin adhesive material
CN113462127B (en) Modified boron nitride, composite material containing modified boron nitride, and preparation method and application of modified boron nitride
Pan et al. Highly thermally conductive 3D BN/MWCNTs/C spatial network composites with improved electrically insulating and flame retardancy prepared by biological template assisted method
CN104262588B (en) A kind of epoxide resin conductive adhesive comprising graphite oxide thiazolinyl firming agent
CN104861910B (en) A kind of graphene coated inorganic filler epoxy resin compound adhesive and preparation method thereof
CN103849008B (en) Hybrid particulates, polymer matrix composite and preparation method and application
CN109337066B (en) Reactive and easily-soluble rigid chain polymer and preparation method and composition thereof
CN107629461A (en) A kind of efficient modification functionalization means for inactive surfaces
CN106084664A (en) A kind of preparation method of graphene coated inorganic filler composite resin glue material
Hong et al. Improvement of thermal conductivity of poly (dimethyl siloxane) using silica-coated multi-walled carbon nanotube
CN114854087B (en) Polyimide composite material with double heat-conducting networks and preparation method thereof
Fan et al. Thermal conductivity and mechanical properties of high density polyethylene composites filled with silicon carbide whiskers modified by cross-linked poly (vinyl alcohol)
Kausar Polyamide 1010/polythioamide blend reinforced with graphene nanoplatelet for automotive part application
Xiao et al. Dihydromyricetin modification of boron nitride micro-sheets and construction of multilayer thermal conduction pathways in glass fiber reinforced epoxy composites
Zhang et al. Cyanate ester composites containing surface functionalized BN particles with grafted hyperpolyarylamide exhibiting desirable thermal conductivities and a low dielectric constant
CN113088033A (en) Electric conduction/heat conduction graphene/shape memory polymer composite material based on in-situ polymerization, preparation method and application
Kim et al. Fabrication of covalently linked exfoliated boron nitride nanosheet/multi-walled carbon nanotube hybrid particles for thermal conductive composite materials
CN105885758A (en) Graphene-coated inorganic filler composite resin adhesive
CN109705312A (en) One kind is based on difunctional POSS high-temperature-resistant epoxy resin and its preparation and application
CN105542458B (en) A kind of high-strength and high ductility polyimide resin based composites and preparation method thereof
CN101891936A (en) Preparation method of composite material based on epoxy resin and phosphazene nanotubes
Bian et al. A strong soybean meal adhesive enhanced by aluminum hydroxide nanoparticles via a low-cost and simple organic-inorganic hybrid strategy
Xu et al. Healable carbon fiber reinforced epoxy composites: synchronous healing of matrix and interface damage
CN106751477A (en) A kind of high-molecular-weight epoxy Heat Conduction Material and preparation method thereof
Liu et al. Reprocessable thermal interface materials with optimized phonon transport based on Diels-Alder click chemistry

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20161109

WD01 Invention patent application deemed withdrawn after publication