CN106079826A - A kind of electrokinetic cell epoxy plate heating film process for pressing method - Google Patents
A kind of electrokinetic cell epoxy plate heating film process for pressing method Download PDFInfo
- Publication number
- CN106079826A CN106079826A CN201610564461.0A CN201610564461A CN106079826A CN 106079826 A CN106079826 A CN 106079826A CN 201610564461 A CN201610564461 A CN 201610564461A CN 106079826 A CN106079826 A CN 106079826A
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- Prior art keywords
- pressing
- epoxy plate
- chip
- heating film
- base material
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of electrokinetic cell epoxy plate heating film process for pressing method, comprise the following steps: process for pressing: (1) epoxy plate base material pressing steel disc, use 0.2MM thickness FR4 base material and 0.06 steel disc (SU304) pressing, board laminate is put into after Multi-stacking compaction, pressurize 1000 1500kg, pressurize 20 30 minutes after being warmed up to 170 180 DEG C, then cooling down to about 40 DEG C pine board pressing plate；(2) chip pressing epoxy plate: clean chip, piece together 1000X1200MM size by size, stacks neat, the hole correction of alignment location, put into lamination board pressure by the first step after laminating neatly to carve, then before split, at chip wire outlet position pad, rubberizing to be done processes, it is simple to process bonding wire hole below；(3) chip cutting of pressing secondary: alignment location hole correction on board, by product drawing dimensioned heating film housing.The present invention uses and forms an entirety after hot pressing at two-layer epoxy plate and middle euthermic chip, good reliability, life-span length, can realize mechanized production, low cost.
Description
Technical field
The present invention relates to batteries of electric automobile technical field, particularly relate to a kind of electrokinetic cell epoxy plate heating film pressing work
Process.
Background technology
At present, the energy and environment problem in the whole world is serious, and the development and utilization of new forms of energy receives more and more attention, newly
The most of greatest concern in energy field is New-energy electric vehicle, and each cart enterprise invests heavily in New energy electric vapour one after another
Car.Vehicular energy system is one of three big core technologies of electric automobile, is equivalent to the electromotor of traditional combustion engine, is electronic vapour
The unique power resources of car, are also the hearts of electric automobile.Its proportion in electric automobile whole cost is 1/3.
At present ferric phosphate lithium cell is most popular, has life-span length, charge-discharge magnification is big, safety good, high temperature
The property plurality of advantages such as good, element is harmless, low cost, unique shortcoming is exactly that cryogenic property attenuation ratio is bigger.It is currently mainly used
Battery performance degradation the biggest under some low temperature environments.In order to solve asking of the above-mentioned low temperature discharge and recharge of electrokinetic cell
Topic, is limited by battery material at present, and feasible solution is to use heating film heating.Automobile power cell heating film at present
Specifically include that PI heating film, silica gel heating film and epoxy plate heating film three major types.The current technique of epoxy plate heating film is two-layer
With two-layer double faced adhesive tape, euthermic chip being bonded together in the middle of epoxy plate, so making has individual drawback is exactly that reliability is bad, adds
The heat middle double faced adhesive tape of time length can go bad and not have viscosity, and manual manufacture labor intensity is big, and cost is high.
Summary of the invention
The technical problem existed based on background technology, the present invention proposes a kind of electrokinetic cell epoxy plate heating film pressing work
Process.
A kind of electrokinetic cell epoxy plate heating film process for pressing method that the present invention proposes, comprises the following steps:
S1: process for pressing: (1) epoxy plate base material pressing steel disc, uses 0.2MM thickness FR4 base material and 0.06 steel disc (SU304) pressure
Closing, put into board laminate after Multi-stacking compaction, pressurize 1000-1500kg, pressurize 20-30 minute after being warmed up to 170-180 DEG C, then drops
Temperature is cooled to about 40 DEG C pine board pressing plates；(2) chip pressing epoxy plate: clean chip, piece together by size
1000X1200MM size, stacks neat, the hole correction of alignment location, puts into lamination board pressure by the first step and carve after laminating neatly, then
Before split, at chip wire outlet position pad, rubberizing to be done processes, it is simple to processing bonding wire hole below；(3) chip cutting of pressing secondary:
Alignment location hole correction on board, by product drawing dimensioned heating film housing；
S2: processing technology thereof: (1) processes wire casing according to drawing outlet position on board, adds the chi noting hole slot man-hour
Very little size, outward appearance and the degree of depth, do not damage chip；(2) pad adds stannum: with rustless steel special solder stick, product is added stannum；(3) weldering
Line: can not be with there being the solder stick (hollow) of auxiliary agent, with solid solder stick, bonding wire auxiliary agent weld-aiding cream, after being soldered and clear
Clean process is clean, and remaining points for attention is identical in Section 7；(4) some glue: as other products, it is desirable to put in order under the most online
Wire, then large area point glue (silica gel) on solder joint is flattened after glue；(5) test: resistance test, voltage-withstand test, Insulation test, produces
Product complete；
Preferably, described epoxy plate base material pressing steel disc needs to carry out steel disc substrate etch (metal etching process) after completing.
Preferably, the pressing order of institute's epoxy plate base material pressing steel disc: steel plate → FR4 base material epoxy plate → steel disc
(0.06MM) → steel plate.
Preferably, the order of described chip pressing epoxy plate pressing: steel plate → 0.2MM FR4 base material → chip → 0.2MM
FR4 base material → steel plate.
Preferably, described pad notes flatiron temperature (270-300 DEG C) and flatiron standing time when adding stannum during adding stannum
The assurance of (2-3 second), temperature is too high or the chip pressed can be scalded and be bubbled by overlong time, and Jia Xishixi point is the most reliable.
In the present invention, this electrokinetic cell epoxy plate heating film process for pressing method, use and send out with middle at two-layer epoxy plate
Hot chip forms an entirety after hot pressing, good reliability, life-span length, can realize mechanized production, low cost and other advantages.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is explained orally further.
Embodiment one
The present embodiment proposes a kind of electrokinetic cell epoxy plate heating film process for pressing method, comprises the following steps:
S1: process for pressing: (1) epoxy plate base material pressing steel disc, uses 0.2MM thickness FR4 base material and 0.06 steel disc (SU304) pressure
Closing, put into board laminate after Multi-stacking compaction, pressurize 1000-1500kg, pressurize 20-30 minute after being warmed up to 170-180 DEG C, then drops
Temperature is cooled to about 40 DEG C pine board pressing plates；(2) chip pressing epoxy plate: clean chip, piece together by size
1000X1200MM size, stacks neat, the hole correction of alignment location, puts into lamination board pressure by the first step and carve after laminating neatly, then
Before split, at chip wire outlet position pad, rubberizing to be done processes, it is simple to processing bonding wire hole below；(3) chip cutting of pressing secondary:
Alignment location hole correction on board, by product drawing dimensioned heating film housing；
S2: processing technology thereof: (1) processes wire casing according to drawing outlet position on board, adds the chi noting hole slot man-hour
Very little size, outward appearance and the degree of depth, do not damage chip；(2) pad adds stannum: with rustless steel special solder stick, product is added stannum；(3) weldering
Line: can not be with there being the solder stick (hollow) of auxiliary agent, with solid solder stick, bonding wire auxiliary agent weld-aiding cream, after being soldered and clear
Clean process is clean, and remaining points for attention is identical in Section 7；(4) some glue: as other products, it is desirable to put in order under the most online
Wire, then large area point glue (silica gel) on solder joint is flattened after glue；(5) test: resistance test, voltage-withstand test, Insulation test, produces
Product complete.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention is not limited thereto,
Any those familiar with the art in the technical scope that the invention discloses, according to technical scheme and
Inventive concept equivalent or change in addition, all should contain within protection scope of the present invention.
Claims (5)
1. an electrokinetic cell epoxy plate heating film process for pressing method, it is characterised in that comprise the following steps:
S1: process for pressing: (1) epoxy plate base material pressing steel disc, uses 0.2MM thickness FR4 base material and 0.06 steel disc (SU304) pressure
Closing, put into board laminate after Multi-stacking compaction, pressurize 1000-1500kg, pressurize 20-30 minute after being warmed up to 170-180 DEG C, then drops
Temperature is cooled to about 40 DEG C pine board pressing plates；(2) chip pressing epoxy plate: clean chip, piece together by size
1000X1200MM size, stacks neat, the hole correction of alignment location, puts into lamination board pressure by the first step and carve after laminating neatly, then
Before split, at chip wire outlet position pad, rubberizing to be done processes, it is simple to processing bonding wire hole below；(3) chip cutting of pressing secondary:
Alignment location hole correction on board, by product drawing dimensioned heating film housing；
S2: processing technology thereof: (1) processes wire casing according to drawing outlet position on board, adds the chi noting hole slot man-hour
Very little size, outward appearance and the degree of depth, do not damage chip；(2) pad adds stannum: with rustless steel special solder stick, product is added stannum；(3) weldering
Line: can not be with there being the solder stick (hollow) of auxiliary agent, with solid solder stick, bonding wire auxiliary agent weld-aiding cream, after being soldered and clear
Clean process is clean, and remaining points for attention is identical in Section 7；(4) some glue: as other products, it is desirable to put in order under the most online
Wire, then large area point glue (silica gel) on solder joint is flattened after glue；(5) test: resistance test, voltage-withstand test, Insulation test, produces
Product complete.
A kind of electrokinetic cell epoxy plate heating film process for pressing method the most according to claim 1, it is characterised in that described
Epoxy plate base material pressing steel disc needs after completing to carry out steel disc substrate etch (metal etching process).
A kind of electrokinetic cell epoxy plate heating film process for pressing method the most according to claim 1, it is characterised in that described
The pressing order of epoxy plate base material pressing steel disc: steel plate → FR4 base material epoxy plate → steel disc (0.06MM) → steel plate.
A kind of electrokinetic cell epoxy plate heating film process for pressing method the most according to claim 1, it is characterised in that described
The order of chip pressing epoxy plate pressing: steel plate → 0.2MM FR4 base material → chip → 0.2MM FR4 base material → steel plate.
A kind of electrokinetic cell epoxy plate heating film process for pressing method the most according to claim 1, it is characterised in that described
Pad notes flatiron temperature (270-300 DEG C) and the assurance of flatiron standing time (2-3 second), temperature mistake when adding stannum during adding stannum
The chip pressed can be scalded and be bubbled by high or overlong time, and Jia Xishixi point is the most reliable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610564461.0A CN106079826A (en) | 2016-07-18 | 2016-07-18 | A kind of electrokinetic cell epoxy plate heating film process for pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610564461.0A CN106079826A (en) | 2016-07-18 | 2016-07-18 | A kind of electrokinetic cell epoxy plate heating film process for pressing method |
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| CN106079826A true CN106079826A (en) | 2016-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610564461.0A Pending CN106079826A (en) | 2016-07-18 | 2016-07-18 | A kind of electrokinetic cell epoxy plate heating film process for pressing method |
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| CN (1) | CN106079826A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234182A (en) * | 2019-07-29 | 2019-09-13 | 惠州市正胜精工科技有限公司 | A kind of production process technique of fever tablet |
| CN111447697A (en) * | 2020-03-13 | 2020-07-24 | 广东力王新材料有限公司 | Method for manufacturing silica gel heating sheet |
| CN113224340A (en) * | 2021-04-29 | 2021-08-06 | 华能国际电力股份有限公司 | Molten carbonate fuel cell diaphragm and preparation method thereof |
-
2016
- 2016-07-18 CN CN201610564461.0A patent/CN106079826A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234182A (en) * | 2019-07-29 | 2019-09-13 | 惠州市正胜精工科技有限公司 | A kind of production process technique of fever tablet |
| CN111447697A (en) * | 2020-03-13 | 2020-07-24 | 广东力王新材料有限公司 | Method for manufacturing silica gel heating sheet |
| CN111447697B (en) * | 2020-03-13 | 2022-05-06 | 广东力王新材料有限公司 | Method for manufacturing silica gel heating sheet |
| CN113224340A (en) * | 2021-04-29 | 2021-08-06 | 华能国际电力股份有限公司 | Molten carbonate fuel cell diaphragm and preparation method thereof |
| CN113224340B (en) * | 2021-04-29 | 2022-11-15 | 华能国际电力股份有限公司 | Molten carbonate fuel cell diaphragm and preparation method thereof |
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| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161109 |
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| WD01 | Invention patent application deemed withdrawn after publication |