CN106065162B - A kind of Halogen-free antibacterial composition epoxy resin and application thereof - Google Patents
A kind of Halogen-free antibacterial composition epoxy resin and application thereof Download PDFInfo
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- CN106065162B CN106065162B CN201610562103.6A CN201610562103A CN106065162B CN 106065162 B CN106065162 B CN 106065162B CN 201610562103 A CN201610562103 A CN 201610562103A CN 106065162 B CN106065162 B CN 106065162B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
- B32B2307/7145—Rot proof, resistant to bacteria, mildew, mould, fungi
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
The invention discloses a kind of Halogen-free antibacterial composition epoxy resin and application thereof, the Halogen-free antibacterial composition epoxy resin is prepared by the raw material of following weight parts：45 55 parts of phosphorous epoxy resin, 15 25 parts of rubber modified epoxy resin, 23 33 parts of phenol type novolac epoxy resin, 10 20 parts of amine terminated polyether, 15 parts of 1 amino, 5 naphthols, 15 45 parts of propylene glycol methyl ether acetate, 0.01 1 parts of curing accelerator, 1 10 parts of inorganic antiseptic.The Halogen-free antibacterial composition epoxy resin of the present invention, by reasonably matching, preferably goes out the type and dosage of suitable inorganic antiseptic, curing accelerator, anti-microbial property and peel strength are improved, comprehensive performance is very excellent, and filler dispersion effect is good, it is of low cost, it is environment friendliness.
Description
Technical field
The present invention relates to chemical technology fields more particularly to a kind of Halogen-free antibacterial composition epoxy resin and application thereof.
Background technology
With the developing trend multifunction of electronic product, the parts of electronic product are also constantly to light, thin, short, small etc.
Aspect develops, the especially extensive use of high density integrated circuit technology, and high performance, highly reliable is proposed to consumer electronic product
The requirement of property and high security；, low cost good to industrial electronic product proposition technical performance, the requirement of low energy consumption.Therefore
The base material copper-clad plate face of the core material of electronic product --- printed circuit board (Printed Circuit Board, abbreviation PCB)
Face higher technology requirement, severeer use environment and higher environmental requirement.
Copper-clad plate (Copper Clad Laminate, abbreviation CCL) is with fiber mainly for the production of printed circuit board
Paper, glass fabric or glass fibre non-woven (being commonly called as glass felt) etc. are used as reinforcing material, soak with resin, single or double covers
With copper foil, a kind of product formed through hot pressing.Existing copper-clad plate is due to manufacture raw material and the otherness of manufacture structure, CCL
The technical performance of base material is different.
Resin liquid in copper-clad plate generally uses compositions of thermosetting resin.Thermosetting resin refers to that resin is being heated, added
It depresses or under curing agent, action of ultraviolet light, is chemically reacted, crosslinking curing becomes the major class synthesis tree of non-fusant matter
Fat.Common thermosetting resin have phenolic resin, Lauxite, melamine formaldehyde resin, epoxy resin, unsaturated-resin,
Polyurethane, polyimides etc..Thermosetting resin and curing agent, accelerating agent, filler etc. form compositions of thermosetting resin, then through adjusting
Resin liquid is made for use in metal-clad foil plate.In order to make metal-clad foil plate that there is preferable insulation performance, usually in resin
Filler can be added in liquid.
Epoxy resin refers to containing two or more epoxy groups in molecule, with aliphatic, alicyclic or aromatic series
It is skeleton to wait organic compounds, and can react generation three in the presence of appropriate chemical reagent (curing agent) by epoxy group
Tie up the general name of the compound of netted solidfied material.Epoxy resin is due to good chemical stability, electrical insulating property, corrosion-resistant
Property, caking property and mechanical strength, are widely used in as binding agent in the material of printed circuit board (PCB).
Therefore, those skilled in the art be dedicated to developing a kind of comprehensive technical performance it is excellent, but also with compared with high-vitrification
Transition temperature and the antimicrobial composite material compared with high-peeling strength.
Invention content
For above-mentioned deficiency in the prior art, the technical problems to be solved by the invention are to provide a kind of Halogen and resist
Collarium epoxy resin composition and application thereof.
The present invention seeks to what is be achieved through the following technical solutions：
A kind of Halogen-free antibacterial composition epoxy resin, is prepared by the raw material of following weight parts：Phosphorous epoxy resin 45-
55 parts, 15-25 parts of rubber modified epoxy resin, 23-33 parts of phenol type novolac epoxy resin, 10-20 parts of amine terminated polyether, 1- ammonia
1-5 parts of base -5- naphthols, 15-45 parts of propylene glycol methyl ether acetate, 0.01-1 parts of curing accelerator, 1-10 parts of inorganic antiseptic.
Preferably, the inorganic antiseptic is mixtures one or more in wolframic acid silver, silver iodide, silver orthophosphate.
It is highly preferred that the inorganic antiseptic is mixed by wolframic acid silver, silver iodide, silver orthophosphate, the wolframic acid silver, iodine
Change silver, the mass ratio of silver orthophosphate is (1-3)：(1-3)：(1-3).
Preferably, the curing accelerator for 4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (β -
Ethoxy) mixture one or more in -2-methylimidazole.
It is highly preferred that the curing accelerator is by 4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1-
(beta-hydroxyethyl) -2-methylimidazole mixes, the 4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (β -
Ethoxy) -2-methylimidazole mass ratio be (1-3)：(1-3)：(1-3).
Preferably, the grain size of the inorganic antiseptic is 0.01-20 μm.
Preferably, commercially available rivers and mountains Jiang Huanhua Industrial Co., Ltd production may be used in the phosphorous epoxy resin
The phosphorous epoxy resin of model G-24, epoxide equivalent 340g/eq, phosphorus content 2.4wt%.
Preferably, commercially available Hexion Specialty may be used in the rubber modified epoxy resin
The rubber modified epoxy resin of the model Epon Resin58005 of Chemicals, Inc. production, elastomer content 40wt%.
Preferably, commercially available Taiwan Changchun artificial resin factory production may be used in the phenol type novolac epoxy resin
Phenol type novolac epoxy resin of the trade mark for PNE177, epoxide equivalent 177g/eq.
Preferably, the amine terminated polyether may be used what commercially available HUNTSMAN companies provided
T3000 amine terminated polyethers, relative molecular mass 3000.
The present invention also provides application of the above-mentioned Halogen-free antibacterial composition epoxy resin in copper-clad plate is prepared.
The preparation method of copper-clad plate can be：By glass fabric in the Halogen-free antibacterial composition epoxy resin of the present invention
Dipping, is then dried at a certain temperature, is removed solvent and is carried out semi-solid preparation, obtains prepreg；Then above-mentioned prepreg is taken
One or more is superimposed together according to certain sequence, copper foil is covered respectively in the prepreg both sides being superimposed with each other, in hot pressing
Cure in machine and copper-clad plate is made.
The present invention Halogen-free antibacterial composition epoxy resin, by reasonably matching, preferably go out suitable inorganic antiseptic,
The type and dosage of curing accelerator, improve anti-microbial property and peel strength, and comprehensive performance is very excellent, filler dispersion effect
It is good, it is of low cost, it is environment friendliness.
Specific embodiment
With reference to embodiment, the present invention is described further, as described below, is only the preferable implementation to the present invention
Example, not limits the present invention, any person skilled in the art is possibly also with the disclosure above
Technology contents be changed to the equivalent embodiment changed on an equal basis.Without departing from the concept of the present invention, according to the present invention
Any simple modification for being made to following embodiment of technical spirit or equivalent variations, all fall in protection scope of the present invention.
Each raw material introduction in embodiment：
Phosphorous epoxy resin, using the phosphorous asphalt mixtures modified by epoxy resin of the model G-24 of rivers and mountains Jiang Huanhua Industrial Co., Ltd production
Fat, epoxide equivalent 340g/eq, phosphorus content 2.4wt%.
Rubber modified epoxy resin, using Hexion Specialty Chemicals, the model Epon of Inc. productions
The rubber modified epoxy resin of Resin58005, elastomer content 40wt%.
Phenol type novolac epoxy resin uses phenol type phenol of the trade mark that Taiwan Changchun artificial resin factory produces for PNE177
Formaldehyde epoxy resin, epoxide equivalent 177g/eq.
Amine terminated polyether is provided using HUNTSMAN companiesT3000 amine terminated polyethers, opposite point
Protonatomic mass is 3000.
1- amino -5- naphthols, No. CAS：83-55-6.
Propylene glycol methyl ether acetate, No. CAS：108-65-6.
Wolframic acid silver, No. CAS：13465-93-5,0.1 μm of grain size.
Silver iodide, No. CAS：7783-96-2,0.1 μm of grain size.
Silver orthophosphate, No. CAS：7784-09-0,0.1 μm of grain size.
4- methyl -2- phenylimidazoles, No. CAS：827-43-0.
1- 1-cyanoethyl-2-methylimidazoles, No. CAS：23996-55-6.
1- (beta-hydroxyethyl) -2-methylimidazole, No. CAS：1615-15-2.
Embodiment 1
Halogen-free antibacterial composition epoxy resin raw material (parts by weight)：50 parts of phosphorous epoxy resin, rubber modified epoxy resin
20 parts, 28 parts of phenol type novolac epoxy resin, 15 parts of amine terminated polyether, 2.5 parts of 1- amino -5- naphthols, propylene glycol monomethyl ether acetic acid
20 parts of ester, 0.3 part of curing accelerator, 3 parts of inorganic antiseptic.
The inorganic antiseptic is 1 in mass ratio by wolframic acid silver, silver iodide, silver orthophosphate:1:1 is uniformly mixed
It arrives.
The curing accelerator by 4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (beta-hydroxyethyl) -
2-methylimidazole is 1 in mass ratio:1:1 is uniformly mixed to obtain.
It is prepared by Halogen-free antibacterial composition epoxy resin：
By phosphorous epoxy resin, rubber modified epoxy resin, amine terminated polyether, propylene glycol methyl ether acetate with 400 revs/min
Then stirring 5 minutes adds in phenol type novolac epoxy resin, 1- amino -5- naphthols, curing accelerator with 300 revs/min of stirrings 10
Minute, it is eventually adding inorganic antiseptic and is stirred 60 minutes with 300 revs/min.Obtain the Halogen-free antibacterial epoxy resin of the preparation of embodiment 1
Composition.
It is prepared by copper-clad plate：By glass fabric (the E grade glass fibers provided using Dongguan City Guang Hong composite materials Co., Ltd
Tie up cloth 106, grammes per square metre 25g/m2, thickness 0.03mm) and it is immersed in the Halogen-free antibacterial composition epoxy resin of the preparation of embodiment 1
Impregnated cloth is obtained, the content for controlling glass fabric is that (content of glass fabric is 10wt% to 10wt% i.e. in impregnated cloth, nothing
The content of halogen antibacterial composition epoxy resin is 90wt%), then dipping is arranged in 100 DEG C of baking oven, toasts 2h, removal
Solvent obtains prepreg；It is superimposed with each other to obtain substrate using five prepregs, 30 μ m-thicks is covered in two facing surfaces of substrate
Layers of copper (copper foil of model TU25 provided using the golden one hundred product of rubber and plastic factory of Dongguan City end of the bridge) is laminated, and applies pressure
400PSI, minimum temperature are 50 DEG C, and maximum temperature is 380 DEG C, is heated up by 3 DEG C/min of rate, after reaching 380 DEG C of maximum temperature
Keep 40min.Obtain the copper-clad plate of embodiment 1.
Embodiment 2
It is substantially the same manner as Example 1, it differs only in：The inorganic antiseptic by silver iodide, silver orthophosphate in mass ratio
It is 1:1 is uniformly mixed to obtain.Obtain Halogen-free antibacterial composition epoxy resin and the copper-clad plate of embodiment 2.
Embodiment 3
It is substantially the same manner as Example 1, it differs only in：The inorganic antiseptic by wolframic acid silver, silver orthophosphate in mass ratio
It is 1:1 is uniformly mixed to obtain.Obtain Halogen-free antibacterial composition epoxy resin and the copper-clad plate of embodiment 3.
Embodiment 4
It is substantially the same manner as Example 1, it differs only in：The inorganic antiseptic by wolframic acid silver, silver iodide in mass ratio
It is 1:1 is uniformly mixed to obtain.Obtain Halogen-free antibacterial composition epoxy resin and the copper-clad plate of embodiment 4.
Embodiment 5
It is substantially the same manner as Example 1, it differs only in：The curing accelerator is by 1- 1-cyanoethyl-2-methylimidazoles, 1-
(beta-hydroxyethyl) -2-methylimidazole is 1 in mass ratio:1 is uniformly mixed to obtain.Obtain the Halogen-free antibacterial epoxy of embodiment 5
Resin combination and copper-clad plate.
Embodiment 6
It is substantially the same manner as Example 1, it differs only in：The curing accelerator is by 4- methyl -2- phenylimidazoles, 1-
(beta-hydroxyethyl) -2-methylimidazole is 1 in mass ratio:1 is uniformly mixed to obtain.Obtain the Halogen-free antibacterial epoxy of embodiment 6
Resin combination and copper-clad plate.
Embodiment 7
It is substantially the same manner as Example 1, it differs only in：The curing accelerator is by 4- methyl -2- phenylimidazoles, 1- cyanogen
Ethyl-2-Methyl imidazoles is 1 in mass ratio:1 is uniformly mixed to obtain.Obtain the Halogen-free antibacterial epoxy resin group of embodiment 7
Close object and copper-clad plate.
Test case 1
The glass transition temperature of copper-clad plate, peel strength made from embodiment 1-7 are tested respectively.Test method
It is as follows：Glass transition temperature Tg：It is measured according to the DMA methods of IPC-TM-6502.4.24 defineds.Peel strength PS：
According to experiment condition " after thermal stress " in IPC-TM-6502.4.8 methods, the peel strength of plank is tested.Concrete outcome is shown in Table 1.
Table 1：Glass transition temperature, peel strength test result table
Comparing embodiment 1 and embodiment 2-4, embodiment 1 (wolframic acid silver, silver iodide, silver orthophosphate compounding) glass transition temperature
Degree, peel strength test result are substantially better than embodiment 2-4 (both arbitrary compounding in wolframic acid silver, silver iodide, silver orthophosphate)；Compare
Embodiment 1 and embodiment 5-7, embodiment 1 (4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (β-hydroxyl second
Base) -2-methylimidazole compounding) glass transition temperature, peel strength test result be substantially better than embodiment 5-7 (4- methyl -2-
Both arbitrary compounding in phenylimidazole, 1- 1-cyanoethyl-2-methylimidazoles, 1- (beta-hydroxyethyl) -2-methylimidazole).
Test case 2
The anti-microbial property of prepreg made from embodiment 1-7 is tested respectively.It is carried out by QB/T2591-2003 methods
It measures.Escherichia coli ATYCC 25922, staphylococcus aureus ATCC6538.Specific test result is shown in Table 2.
Table 2：Anti-microbial property test result table
Comparing embodiment 1 and embodiment 2-4, embodiment 1 (wolframic acid silver, silver iodide, silver orthophosphate compounding) anti-microbial property are apparent
Better than embodiment 2-4 (both arbitrary compounding in wolframic acid silver, silver iodide, silver orthophosphate)；Comparing embodiment 1 and embodiment 5-7 is implemented
Example 1 (4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (beta-hydroxyethyl) -2-methylimidazole compounding) antibiotic property
Embodiment 5-7 (4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (beta-hydroxyethyl) -2- methyl can be substantially better than
Both arbitrary compounding in imidazoles).
Test case 3
Embodiment 1 and the resistance to electric arc of copper-clad plate made from embodiment 5-7 are tested respectively.Resistance to electric arc：By standard Q/
GDSY6050-20122.5.1 is tested.Specific test result is shown in Table 3.
Table 3：Insulation performance test result table
| Sample | Resistance to electric arc, Kv |
| Embodiment 1 | 146 |
| Embodiment 5 | 135 |
| Embodiment 6 | 139 |
| Embodiment 7 | 138 |
Comparing embodiment 1 and embodiment 5-7, embodiment 1 (4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles,
1- (beta-hydroxyethyl) -2-methylimidazole compounding) insulation performance is substantially better than embodiment 5-7 (4- methyl -2- phenylimidazoles, 1- cyanogen
Both arbitrary compounding in Ethyl-2-Methyl imidazoles, 1- (beta-hydroxyethyl) -2-methylimidazole).
Claims (5)
1. a kind of Halogen-free antibacterial composition epoxy resin, it is characterised in that：It is prepared by the raw material of following weight parts：Phosphorous ring
45-55 parts of oxygen resin, 15-25 parts of rubber modified epoxy resin, 23-33 parts of phenol type novolac epoxy resin, amine terminated polyether 10-
20 parts, 1-5 parts of 1- amino -5- naphthols, 15-45 parts of propylene glycol methyl ether acetate, 0.01-1 parts of curing accelerator, inorganic antiseptic
1-10 parts；
The curing accelerator is by 4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (beta-hydroxyethyl) -2- first
Base imidazoles mixes, the 4- methyl -2- phenylimidazoles, 1- 1-cyanoethyl-2-methylimidazoles, 1- (beta-hydroxyethyl) -2- methyl
The mass ratio of imidazoles is (1-3)：(1-3)：(1-3).
2. Halogen-free antibacterial composition epoxy resin as described in claim 1, it is characterised in that：The inorganic antiseptic is tungsten
One or more mixture in sour silver, silver iodide, silver orthophosphate.
3. Halogen-free antibacterial composition epoxy resin as claimed in claim 2, it is characterised in that：The inorganic antiseptic is by tungsten
Sour silver, silver iodide, silver orthophosphate mix, the wolframic acid silver, silver iodide, silver orthophosphate mass ratio be (1-3)：(1-3)：(1-
3)。
4. the Halogen-free antibacterial composition epoxy resin as described in any one of claim 1-3, it is characterised in that：Described is inorganic
The grain size of antiseptic is 0.01-20 μm.
5. application of the Halogen-free antibacterial composition epoxy resin in copper-clad plate is prepared as described in any one of claim 1-4.
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Effective date of registration: 20180516 Address after: 221000 Pizhou City, Xuzhou, Jiangsu, 1 East of Binhu Road, three East Road. Applicant after: Jiangsu three dimensional new Mstar Technology Ltd Address before: 200092 302, 3 Lane 248 lane, Tianbao West Road, Hongkou District, Shanghai. Applicant before: Liu Shichao |
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