CN106060735A - Miniature loudspeaker and miniature loudspeaker assembly method - Google Patents
Miniature loudspeaker and miniature loudspeaker assembly method Download PDFInfo
- Publication number
- CN106060735A CN106060735A CN201610644009.5A CN201610644009A CN106060735A CN 106060735 A CN106060735 A CN 106060735A CN 201610644009 A CN201610644009 A CN 201610644009A CN 106060735 A CN106060735 A CN 106060735A
- Authority
- CN
- China
- Prior art keywords
- voice coil
- sound
- sound film
- lower casing
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000001105 regulatory effect Effects 0.000 claims description 22
- 239000011324 bead Substances 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 12
- 230000004308 accommodation Effects 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 9
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The invention discloses a miniature loudspeaker and a miniature loudspeaker assembly method. The miniature loudspeaker comprises a shell, a voice diaphragm, a voice coil, a washer, a magnet and a PCB; the shell comprises an upper cover and a lower shell; the lower shell comprises a tone tuning hole; the upper cover comprises a pronunciation hole; the PCB is arranged on the bottom surface of the lower shell; the washer and the magnet are arranged over the bottom plate of the lower shell; the washer, the magnet and the lower shell form a magnetic loop; an annular containing space is formed among peripheries of the washer and the magnet and the side wall of the lower shell; the voice coil stretches into the containing space; the magnetic loop comprises a magnetic loop centre hole; the magnetic loop centre hole passes through the washer, the magnet and the middle part of the lower shell; and the lead of the voice coil is leaded out from the upper part of the inner ring of the voice coil, passes through the magnetic loop centre hole from top to bottom, and is connected with the PCB. The miniature loudspeaker disclosed by the invention is a few in process, convenient to assemble, difficult to damage the lead and high in product qualified ratio.
Description
[technical field]
The present invention relates to type electro-acoustic element, particularly relate to the assemble method of a kind of Microspeaker and Microspeaker.
[background technology]
Loudspeaker are the pronunciation devices that people commonly use, and traditional loudspeaker are by shell, installing iron core in the enclosure, are set in
Magnet on iron core, washer, be set in the voice coil loudspeaker voice coil outside Magnet, washer, is arranged on the sound film at voice coil loudspeaker voice coil top, pcb board composition, edge
Offering sound regulating hole on magnetic blow out centre axis, be equiped with tuning cloth bottom sound regulating hole, pcb board is being welded by this sound regulating hole
Time, it is susceptible to blocking, thus causes substantial amounts of defective products, reduce the qualification rate of product；In addition voice coil loudspeaker voice coil is set in Magnet, China
Department is outside, when manufacturing the loudspeaker of equal volume, needs bigger Magnet, washer, voice coil loudspeaker voice coil, sound film, is unfavorable for the miniature of loudspeaker
Change, it is impossible to accomplish when loudspeaker volume reduces, make that sound is apparent, more have levels sense, and bass effect is more prominent；Traditional loudspeaker
The lead-in wire of voice coil loudspeaker voice coil is to draw from housing exterior to be connected with pcb board, and the lead-in wire of voice coil loudspeaker voice coil is in use susceptible to disconnect,
Reduce the service life of loudspeaker.
The utility model of Patent No. CN201020026123.X discloses a kind of Microspeaker, including shell, also includes
T-shape iron core in the enclosure is set, is sequentially sleeved at the Magnet on T-shape iron core, washer, Magnet, washer and T-shape iron core
Forming an accommodation space, T-shape iron core top is arranged with voice coil loudspeaker voice coil, and voice coil loudspeaker voice coil stretches in accommodation space, and voice coil loudspeaker voice coil top is equiped with sound film,
The head clearance of shell offers sound hole corresponding with sound film, offers sound regulating hole, T-shape ferrum in the bottom of T-shape iron core
Being provided with the tuning cloth adapted with sound regulating hole bottom core, T-shape mandrel bottom is additionally provided with the lead-in wire of a pcb board, pcb board and voice coil loudspeaker voice coil
Connect.Thus under equivalent sound amount, the volume of loudspeaker can be greatly reduced, and sound can be made to analyse more clearly under equivalent sound amount,
More have levels sense, and bass effect is more prominent, moreover it is possible to improves the qualification rate of product, extends the service life of loudspeaker.
As it is shown in fig. 7, the lead-in wire 301 of tradition Microspeaker voice coil loudspeaker voice coil 3 is from sound film 2 outlet, need to beat fixing glue for lead-in wire
Operation, is not easy to assemble；And the outside extraction from horn housing 1 that goes between, it is easily damaged.
[summary of the invention]
The technical problem to be solved in the present invention is to provide simple and convenient, the good product performance of a kind of assembling.Life-span length miniature
Loudspeaker.
It is simple that the technical problem to be solved in the present invention is to provide a kind of technique, can effectively reduce product fraction defective, improves and produces
The assemble method of the Microspeaker of moral character energy.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is, a kind of Microspeaker, including shell, sound
Film, voice coil loudspeaker voice coil, washer, Magnet and pcb board, described shell includes upper cover and lower casing, and lower casing includes that sound regulating hole, upper cover include pronunciation
Hole, pcb board is arranged in the bottom surface of lower casing, washer and magnet arrangements above lower casing base plate, and washer, Magnet and lower casing constitute magnetic
Return；Forming the accommodation space of annular between washer and the periphery of Magnet and lower case side wall, voice coil loudspeaker voice coil is to stretching in accommodation space；Magnetic returns
Returning mesopore including magnetic, magnetic returns mesopore and passes washer, Magnet, the middle part of lower casing, and the lead-in wire of voice coil loudspeaker voice coil is drawn from the top of voice coil loudspeaker voice coil inner ring,
Mesopore is returned with pcb board even from top to down through magnetic.
Above-described Microspeaker, sound regulating hole is arranged in the lower section of described accommodation space.
Above-described Microspeaker, the top of lower casing includes a circle bead, and the marginal adhesion of sound film is at the end face of bead
On.
Above-described Microspeaker, the end face of voice coil loudspeaker voice coil is bonded on sound film.
Above-described Microspeaker, upper cover is fastened on the periphery of bead.
Above-described Microspeaker, pcb board includes sound regulating hole, and the sound regulating hole of pcb board connects with the sound regulating hole of lower casing.
The assemble method of a kind of above-mentioned Microspeaker, comprises the following steps:
1, sound film is hot-forming in sound film molding mold；
2, voice coil loudspeaker voice coil snaps on voice coil loudspeaker voice coil sound film adhesive mould, and the lead-in wire of voice coil loudspeaker voice coil penetrates mould mesopore, glue on voice coil loudspeaker voice coil end face；
Voice coil loudspeaker voice coil sound film adhesive mould combines with sound film molding mold, makes voice coil loudspeaker voice coil end face bonding with sound film；
3, washer, Magnet and lower casing being assembled into magnetic to return, magnetic returns and snaps in sound film and magnetic and return in assembling die endoporus；Lower roof
Topcoating one encloses glue；Sound film magnetic returns assembling die and combines with sound film molding mold, makes lower casing end face bonding with sound film；Sound film magnetic returns
When assembling die combines with sound film molding mold, the lead-in wire of voice coil loudspeaker voice coil is penetrated magnetic and returns mesopore.
Above-described assemble method, the top of lower casing includes a circle bead, in step 3, a circle glue of lower casing end face
Water is coated in the end face of bead.
Microspeaker voice coil loudspeaker voice coil of the present invention lead-in wire from the top of voice coil loudspeaker voice coil inner ring draw, from top to down through magnetic return mesopore with
Pcb board connects, and operation is few, it is simple to assemble；Lead-in wire is hardly damaged, and product fine rate is high.
[accompanying drawing explanation]
The present invention is further detailed explanation with detailed description of the invention below in conjunction with the accompanying drawings.
Fig. 1 is the exploded view of embodiment of the present invention Microspeaker.
Fig. 2 is the profile of embodiment of the present invention Microspeaker.
Fig. 3 is that embodiment of the present invention voice coil loudspeaker voice coil is installed in mould and the schematic diagram of gluing.
Fig. 4 is the schematic diagram that embodiment of the present invention sound film is bonding with voice coil loudspeaker voice coil.
Fig. 5 is that embodiment of the present invention magnetic returns the schematic diagram being installed in mould also gluing.
Fig. 6 is the schematic diagram that embodiment of the present invention sound film is bonding with lower casing.
Fig. 7 is the profile of prior art Microspeaker.
[detailed description of the invention]
The structure of embodiment of the present invention Microspeaker as depicted in figs. 1 and 2, including shell, sound film 2, voice coil loudspeaker voice coil 3, washer 4,
Magnet 5, adjustable sound paper 8 and pcb board 7.
Shell includes upper cover 1 and lower casing 6, lower casing 6 has sound regulating hole 603, the middle part of upper cover 1 have sound hole 101.
The top of lower casing 6 includes a circle bead 601, and upper cover 1 is fastened on the periphery of bead 601.The marginal adhesion of sound film 2 exists
On the end face of bead 601, the end face of voice coil loudspeaker voice coil 3 is bonded in the bottom surface of sound film 2.
Pcb board 7 is arranged on the bottom surface of lower casing 6.Washer 4 and Magnet 5 are arranged in the top of lower casing 6 base plate, washer 4, magnetic
Ferrum 5 and lower casing 6 constitute magnetic and return.
Forming the accommodation space 602 of annular between washer 4 and the periphery of Magnet 5 and lower casing 6 sidewall, voice coil loudspeaker voice coil 3 is to extending into
In accommodation space 602.
Magnetic has returned a magnetic and has returned mesopore 10, and magnetic returns mesopore 10 and passes washer 4, Magnet 5, the middle part of lower casing 6, drawing of voice coil loudspeaker voice coil 3
Line 301 is drawn from the top of voice coil loudspeaker voice coil 3 inner ring, returns mesopore 10 with pcb board 7 even through magnetic from top to down.
Sound regulating hole 603 on lower casing 6 base plate is arranged in the lower section of accommodation space 602, and pcb board 7 also includes sound regulating hole 701,
The sound regulating hole 701 of pcb board 7 connects with the sound regulating hole 603 of lower casing 6, and adjustable sound paper 8 is attached to outside sound regulating hole 701.
The assemble method of above example Microspeaker of the present invention as shown in Figures 3 to 6, comprises the following steps:
1, sound film 2 is hot-forming in sound film molding mold 11；
2, voice coil loudspeaker voice coil 3 snaps on voice coil loudspeaker voice coil sound film adhesive mould 12, and the lead-in wire 301 of voice coil loudspeaker voice coil 3 is penetrated mould mesopore 1201, voice coil loudspeaker voice coil
Glue 15 on 3 end faces；Voice coil loudspeaker voice coil sound film adhesive mould 12 combines with sound film molding mold 11, makes voice coil loudspeaker voice coil 3 end face bonding with sound film 2；
3, washer 4, Magnet 5 and lower casing 6 being assembled into magnetic to return, the lower casing 6 that magnetic returns snaps in sound film and returns assembling die 13 with magnetic
Endoporus in；The end face of lower casing 6 bead 601 is coated with a circle glue 16；Sound film magnetic returns assembling die 13 and sound film molding mold 11 groups
Closing, the end face making lower casing 6 bead 601 is bonding with sound film 2；Sound film magnetic returns assembling die 13 when combining with sound film molding mold 11,
The lead-in wire 301 of voice coil loudspeaker voice coil 3 is penetrated magnetic and returns mesopore 10；
4, pcb board 7 is fixed on the bottom surface of lower casing 6, and the lead-in wire 301 of voice coil loudspeaker voice coil 3 welds with pcb board 7；Upper casing 1 is fastened to
In the bead of lower casing 6.
The sound regulating hole of above example Microspeaker of the present invention is arranged in side, and the lead-in wire of voice coil loudspeaker voice coil is from the top of voice coil loudspeaker voice coil inner ring
Drawing, return mesopore through magnetic from top to down and be connected with pcb board, operation is few, it is simple to assemble；Lead-in wire is hardly damaged, product fine
Rate is high.
The assemble method of above example Microspeaker of the present invention realizes die module, changes flow line stations dispersion
Work pattern, in succession returns with voice coil loudspeaker voice coil, magnetic with other mould after sound film molding and realizes bonding, and bonding process middle pitch film is without departing from sound film
Mould, sound film will not deform or damage；Voice coil leads returns mesopore outlet from magnetic, this avoid lead-in wire and beats from sound film outlet
The operation of lead-in wire fixing glue；On voice coil loudspeaker voice coil, glue is bonding with sound film by hot pressing, and glue on diaphragm so can be avoided to scratch sound film.
In sum, the invention has the beneficial effects as follows, structural manufacturing process is simple, easy to assembly, life-span length, can effectively reduce product
Product fraction defective, significantly improves properties of product.
Claims (8)
1. a Microspeaker, including shell, sound film, voice coil loudspeaker voice coil, washer, Magnet and pcb board, described shell include upper cover and under
Shell, lower casing includes that sound regulating hole, upper cover include that sound hole, pcb board are arranged in the bottom surface of lower casing, washer and magnet arrangements at the bottom of lower casing
The top of plate, washer, Magnet and lower casing constitute magnetic and return, it is characterised in that shape between washer and the periphery of Magnet and lower case side wall
The accommodation space circularized, voice coil loudspeaker voice coil is to stretching in accommodation space；Magnetic returns and includes that magnetic returns mesopore, magnetic return mesopore through washer, Magnet,
The middle part of lower casing, the lead-in wire of voice coil loudspeaker voice coil is drawn from the top of voice coil loudspeaker voice coil inner ring, returns mesopore through magnetic from top to down and is connected with pcb board.
Microspeaker the most according to claim 1, it is characterised in that sound regulating hole is arranged in the lower section of described accommodation space.
Microspeaker the most according to claim 1, it is characterised in that the top of lower casing includes a circle bead, the limit of sound film
Edge is bonded on the end face of bead.
Microspeaker the most according to claim 3, it is characterised in that the end face of voice coil loudspeaker voice coil is bonded on sound film.
Microspeaker the most according to claim 3, it is characterised in that upper cover is fastened on the periphery of bead.
Microspeaker the most according to claim 2, it is characterised in that pcb board includes sound regulating hole, the sound regulating hole of pcb board with
The sound regulating hole connection of lower casing.
7. the assemble method of the Microspeaker described in a claim 1, it is characterised in that comprise the following steps:
701, sound film is hot-forming in sound film molding mold；
702, voice coil loudspeaker voice coil snaps on voice coil loudspeaker voice coil sound film adhesive mould, and the lead-in wire of voice coil loudspeaker voice coil penetrates mould mesopore, glue on voice coil loudspeaker voice coil end face；Sound
Circle sound film adhesive mould combines with sound film molding mold, makes voice coil loudspeaker voice coil end face bonding with sound film；
703, washer, Magnet and lower casing being assembled into magnetic to return, magnetic returns and snaps in sound film and magnetic and return in assembling die endoporus；Lower casing end face
It is coated with a circle glue；Sound film magnetic returns assembling die and combines with sound film molding mold, makes lower casing end face bonding with sound film；Sound film magnetic returns group
When mould combines with sound film molding mold, the lead-in wire of voice coil loudspeaker voice coil is penetrated magnetic and returns mesopore.
Assemble method the most according to claim 3, it is characterised in that the top of lower casing includes a circle bead, in step 703
In, a circle glue of lower casing end face is coated in the end face of bead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610644009.5A CN106060735A (en) | 2016-08-05 | 2016-08-05 | Miniature loudspeaker and miniature loudspeaker assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610644009.5A CN106060735A (en) | 2016-08-05 | 2016-08-05 | Miniature loudspeaker and miniature loudspeaker assembly method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106060735A true CN106060735A (en) | 2016-10-26 |
Family
ID=57480192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610644009.5A Pending CN106060735A (en) | 2016-08-05 | 2016-08-05 | Miniature loudspeaker and miniature loudspeaker assembly method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106060735A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658311A (en) * | 2017-01-20 | 2017-05-10 | 深圳市吉瑞德隆电子科技有限公司 | Loudspeaker and electronic device |
| CN108093352A (en) * | 2018-01-26 | 2018-05-29 | 东莞市余泰电子有限公司 | A kind of loudspeaker built in lead |
| CN111065031A (en) * | 2019-11-13 | 2020-04-24 | 深圳稳泰电声有限公司 | Loudspeaker single body structure and assembling method |
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| CN201590894U (en) * | 2010-01-04 | 2010-09-22 | 东莞市石排乐音电子厂 | Miniature loudspeaker |
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| CN106658311A (en) * | 2017-01-20 | 2017-05-10 | 深圳市吉瑞德隆电子科技有限公司 | Loudspeaker and electronic device |
| CN108093352A (en) * | 2018-01-26 | 2018-05-29 | 东莞市余泰电子有限公司 | A kind of loudspeaker built in lead |
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| CN111065031A (en) * | 2019-11-13 | 2020-04-24 | 深圳稳泰电声有限公司 | Loudspeaker single body structure and assembling method |
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Effective date of registration: 20180815 Address after: 518000 121 pinghuan industrial town, Malan street, Pingshan District, Shenzhen, Guangdong Applicant after: Shenzhen Xi AI Creative Technology Limited Address before: 518000 120-121 (1-3) level of pinghuan industrial town, Pingshan street, Pingshan New District, Shenzhen, Guangdong. Applicant before: SHENZHEN CCA ELECTRONIC FACTORY |
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