CN106057689A - Integral glue-pouring process for heat-conducting and flame-retardant material - Google Patents
Integral glue-pouring process for heat-conducting and flame-retardant material Download PDFInfo
- Publication number
- CN106057689A CN106057689A CN201610390364.4A CN201610390364A CN106057689A CN 106057689 A CN106057689 A CN 106057689A CN 201610390364 A CN201610390364 A CN 201610390364A CN 106057689 A CN106057689 A CN 106057689A
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- Prior art keywords
- glue
- components
- parts
- mixed
- heat conductive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 59
- 239000000463 material Substances 0.000 title claims abstract description 35
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract 3
- 239000003063 flame retardant Substances 0.000 title abstract 3
- 239000003292 glue Substances 0.000 claims abstract description 204
- 238000003756 stirring Methods 0.000 claims abstract 2
- 239000000084 colloidal system Substances 0.000 claims description 30
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000002955 isolation Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 3
- 238000004078 waterproofing Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Treatment And Processing Of Natural Fur Or Leather (AREA)
- Floor Finish (AREA)
Abstract
The invention discloses an integral glue-pouring process for a heat-conducting and flame-retardant material. The process comprises the following steps of pouring glue A and glue B in a feed cylinder A and a feed cylinder B; stirring the glue A and the glue B separately; mixing the glue A with the glue B into AB glue; and performing pour sealing on components by using the mixed AB glue. According to the integral glue-pouring process for the heat-conducting and flame-retardant material, component parts that do not need to be subjected to glue pouring are subjected to isolation protection by using leatheroid, and a pour sealing path is set, so that the glue consumption in the pour sealing process is reduced, the cost is lowered, the component parts that do not need to be subjected to the glue pouring are not polluted, and the clearing expense is reduced.
Description
Technical field
The present invention relates to the technical field of components and parts encapsulating, particularly relate to the overall encapsulating work of a kind of heat conductive flame-retarding material
Skill.
Background technology
Encapsulating is that special convection cell is controlled, and by liquid dropping, coating, embedding in product surface or interiors of products,
Reaching sealing, damping, three effects such as anti-, generally use mostly is double-component glue, the glue being mainly used in Product Process
Bonding, perfusion, the coating of water, oil and other liquid, seal, fill.
Summary of the invention
It is an object of the present invention to: the overall process for filling colloid of a kind of heat conductive flame-retarding material is provided, this heat conductive flame-retarding material
The overall process for filling colloid of material can allow A glue and B glue circulate respectively, it is ensured that the composition of gluing is consistent every time, thus ensures to produce
Quality.
Further object is that: the overall process for filling colloid of a kind of heat conductive flame-retarding material, this heat conductive flame-retarding are provided
The overall process for filling colloid of material can allow A glue and B glue distinguish vacuum defoamation, it is ensured that A glue and the heat conductivity of B glue, water proofing property.
Further object is that: the overall process for filling colloid of a kind of heat conductive flame-retarding material, this heat conductive flame-retarding are provided
The overall process for filling colloid of material carries out insulation blocking to the position that need not embedding, reduces encapsulating amount, simultaneously to this position without dirt
Dye.
Further object is that: the overall process for filling colloid of a kind of heat conductive flame-retarding material, this heat conductive flame-retarding are provided
The overall process for filling colloid of material uses robotic arm manipulation, has concurrently set embedding path, saves the time, it is ensured that quality.
Further object is that: the overall process for filling colloid of a kind of heat conductive flame-retarding material, this heat conductive flame-retarding are provided
The overall process for filling colloid of material carries out vacuum defoamation to the components and parts after embedding, it is ensured that components and parts transmitting medium heat conductivity
Can be high, reach the effect of heat conductive flame-retarding.
For reaching this purpose, the present invention by the following technical solutions:
The overall process for filling colloid of a kind of heat conductive flame-retarding material, comprises the following steps:
A glue and B glue are poured in A barrel and B barrel respectively；
A glue and B glue are stirred respectively；
A glue and B glue are mixed into AB glue；
Use mixed AB glue that components and parts are carried out embedding.
Wherein, described A glue and B glue are stirred respectively, the most also include: use return duct by A glue in A barrel from lower past
On circulate, use return duct B glue is circulated in B barrel from the bottom up flowing.
Wherein, A glue is circulated flowing in A barrel by described use return duct from the bottom up, uses return duct by B glue
In B barrel, it is circulated flowing from the bottom up, the most also includes: A glue and B glue are carried out vacuum defoamation process.
Wherein, described A glue and B glue are mixed into AB glue, specifically: use dosing pump that A glue and B glue are precisely beaten
Glue, is then mixed into AB glue.
Preferably, the described AB glue that is then mixed into is for being dynamically mixed into AB glue.
Preferably, the described AB glue that is then mixed into is that static mixing becomes AB glue.
Wherein, described use mixed AB glue carries out embedding to components and parts, the most also includes: use leatheroid at components and parts
On need not embedding the edge at position be combined into protective bulkhead.
Wherein, described use mixed AB glue carries out embedding to components and parts, specifically: set embedding road on components and parts
Footpath, mechanical arm carries out embedding along embedding path with mixed AB glue.
Wherein, described use mixed AB glue carries out embedding to components and parts, the most also includes: components and parts are carried out vacuum
Deaeration processes.
Wherein, described components and parts are carried out vacuum defoamation process, the most also include: components and parts are carried out glue.
The invention have the benefit that the overall process for filling colloid of a kind of heat conductive flame-retarding material, comprise the following steps: A glue
Pour into respectively in A barrel and B barrel with B glue；A glue and B glue are stirred respectively；A glue and B glue are mixed into AB glue；Use mixed
AB glue after conjunction carries out embedding to components and parts.The overall process for filling colloid of this heat conductive flame-retarding material employs leatheroid to need not encapsulating
Components and parts position carry out insulation blocking, concurrently set embedding path, make potting process glue consumption reduce, reduce cost, right
The components and parts position that need not encapsulating is pollution-free, reduces cleaning up cost.
Accompanying drawing explanation
Below according to drawings and Examples, the present invention is described in further detail.
Fig. 1 is the FB(flow block) of the overall process for filling colloid of the heat conductive flame-retarding material described in embodiment one；
Fig. 2 is the FB(flow block) of the overall process for filling colloid of the heat conductive flame-retarding material described in embodiment two.
Detailed description of the invention
Further illustrate technical scheme below in conjunction with the accompanying drawings and by detailed description of the invention.
Embodiment one:
In the present embodiment, the overall process for filling colloid of a kind of heat conductive flame-retarding material, comprise the following steps:
A glue and B glue are poured in A barrel and B barrel respectively；
A glue and B glue are stirred respectively；
A glue and B glue are mixed into AB glue；
Use mixed AB glue that components and parts are carried out embedding.
In the present embodiment, described A glue and B glue are stirred respectively, the most also include:
Use return duct that A glue is circulated in A barrel flowing from the bottom up, use return duct by B glue in B barrel
It is circulated flowing from the bottom up.Carry out in B barrel up and down with B glue by A glue is circulated in A barrel up and down
Circulate, be uniformly distributed in order to prevent sedimentation before making A glue and the mixing of B glue.
In the present embodiment, A glue is circulated flowing in A barrel by described use return duct from the bottom up, uses back
B glue is circulated flowing in B barrel by flow tube from the bottom up, the most also includes:
A glue and B glue are carried out vacuum defoamation process.Vacuum pump is utilized to be reduced with the air pressure in B barrel by A barrel
To-0.08MPa, it is ensured that A glue and the heat conductivity of B glue and water proofing property are constant, decrease and there is bubble in the middle of A glue and B glue simultaneously
Produced series of problems.
In the present embodiment, described A glue and B glue are mixed into AB glue, specifically:
Use dosing pump that A glue and B glue are carried out accurate gluing, be then mixed into AB glue.Dosing pump is used to calculate mixed
The A glue closed and the ratio of B glue, it is possible to blend suitable AB glue accurately.
In the present embodiment, the described AB glue that is then mixed into is for being the most dynamically mixed into AB glue.Use dynamically mixing
Become AB glue, greatly ensure that proportional difference can uniformly mix with B glue compared with big or that toughness is strong A glue.
In the present embodiment, described use mixed AB glue carries out embedding to components and parts, the most also includes:
The edge at the position that employing leatheroid need not embedding on components and parts is combined into protective bulkhead.Leatheroid is used to need not
Protective bulkhead is established at the edge at the position of embedding, and the glue amount used when greatly reducing encapsulating, without the need for the position of embedding
Pollution will not be produced, reduce cleaning up cost.
In the present embodiment, described use mixed AB glue carries out embedding to components and parts, specifically:
Setting embedding path on components and parts, mechanical arm carries out embedding along embedding path with mixed AB glue.Use
Mechanical arm technique, intelligent processing method, embedding path is set, saves the time, it is ensured that quality.
In the present embodiment, described use mixed AB glue carries out embedding to components and parts, the most also includes:
Components and parts are carried out vacuum defoamation process.The components and parts that embedding is complete are carried out vacuum defoamation process, it is ensured that unit
The transmitting medium heat conductivility of device conduction of heat operationally is high.
In the present embodiment, described components and parts are carried out vacuum defoamation process, the most also include:
Components and parts are carried out glue.
As it is shown in figure 1, the overall process for filling colloid of this heat conductive flame-retarding material, specifically comprise the following steps that
S11, A glue and B glue are poured in A barrel and B barrel respectively.
S12, A glue and B glue are stirred respectively.
A glue is circulated flowing in A barrel by S13, use return duct from the bottom up, uses return duct to be expected at B by B glue
Flowing it is circulated from the bottom up in Tong.
S14, A glue and B glue are carried out vacuum defoamation process.
S15, employing dosing pump carry out accurate gluing to A glue and B glue, are the most dynamically mixed into AB glue.
The edge at the position that S16, employing leatheroid need not embedding on components and parts is combined into protective bulkhead.
S17, on components and parts set embedding path, mechanical arm carries out embedding along embedding path with mixed AB glue.
S18, components and parts are carried out vacuum defoamation process.
S19, components and parts are carried out glue.
Embodiment two:
In the present embodiment, the overall process for filling colloid of a kind of heat conductive flame-retarding material, comprise the following steps:
A glue and B glue are poured in A barrel and B barrel respectively；
A glue and B glue are stirred respectively；
A glue and B glue are mixed into AB glue；
Use mixed AB glue that components and parts are carried out embedding.
In the present embodiment, described A glue and B glue are stirred respectively, the most also include:
Use return duct that A glue is circulated in A barrel flowing from the bottom up, use return duct by B glue in B barrel
It is circulated flowing from the bottom up.Carry out in B barrel up and down with B glue by A glue is circulated in A barrel up and down
Circulate, be uniformly distributed in order to prevent sedimentation before making A glue and the mixing of B glue.
In the present embodiment, A glue is circulated flowing in A barrel by described use return duct from the bottom up, uses back
B glue is circulated flowing in B barrel by flow tube from the bottom up, the most also includes:
A glue and B glue are carried out vacuum defoamation process.A glue and B glue are carried out vacuum defoamation process.Vacuum pump is utilized to be expected by A
Cylinder is reduced to-0.08MPa with the air pressure in B barrel, it is ensured that A glue and the heat conductivity of B glue and water proofing property are constant, subtract simultaneously
Lack and there is series of problems produced by bubble in the middle of A glue and B glue.
In the present embodiment, described A glue and B glue are mixed into AB glue, specifically:
Use dosing pump that A glue and B glue are carried out accurate gluing, be then mixed into AB glue.Dosing pump is used to calculate mixed
The A glue closed and the ratio of B glue, it is possible to blend suitable AB glue accurately..
In the present embodiment, the described AB glue that is then mixed into becomes AB glue for then static mixing.Use static mixing
Can reach use cost low, maintenance process is simple.
In the present embodiment, described use mixed AB glue carries out embedding to components and parts, the most also includes:
The edge at the position that employing leatheroid need not embedding on components and parts is combined into protective bulkhead.Leatheroid is used to need not
Protective bulkhead is established at the edge at the position of embedding, and the glue amount used when greatly reducing encapsulating, without the need for the position of embedding
Pollution will not be produced, reduce cleaning up cost.
In the present embodiment, described use mixed AB glue carries out embedding to components and parts, specifically:
Setting embedding path on components and parts, mechanical arm carries out embedding along embedding path with mixed AB glue.Use
Mechanical arm technique, intelligent processing method, embedding path is set, saves the time, it is ensured that quality.
In the present embodiment, described use mixed AB glue carries out embedding to components and parts, the most also includes:
Components and parts are carried out vacuum defoamation process.The components and parts that embedding is complete are carried out vacuum defoamation process, it is ensured that unit
The transmitting medium heat conductivility of device conduction of heat operationally is high.
In the present embodiment, described components and parts are carried out vacuum defoamation process, the most also include:
Components and parts are carried out glue.
As in figure 2 it is shown, the overall process for filling colloid of this heat conductive flame-retarding material, specifically comprise the following steps that
S21, A glue and B glue are poured in A barrel and B barrel respectively.
S22, A glue and B glue are stirred respectively.
A glue is circulated flowing in A barrel by S23, use return duct from the bottom up, uses return duct to be expected at B by B glue
Flowing it is circulated from the bottom up in Tong.
S24, A glue and B glue are carried out vacuum defoamation process.
S25, employing dosing pump carry out accurate gluing to A glue and B glue, and then static mixing becomes AB glue.
The edge at the position that S26, employing leatheroid need not embedding on components and parts is combined into protective bulkhead.
S27, on components and parts set embedding path, mechanical arm carries out embedding along embedding path with mixed AB glue.
S28, components and parts are carried out vacuum defoamation process.
S29, components and parts are carried out glue.
It is to be understood that, above-mentioned detailed description of the invention is only presently preferred embodiments of the present invention and institute's application technology is former
Reason, in technical scope disclosed in this invention, change that any those familiar with the art is readily apparent that or
Replace, all should contain within the scope of the present invention.
Claims (10)
1. the overall process for filling colloid of a heat conductive flame-retarding material, it is characterised in that comprise the following steps:
A glue and B glue are poured in A barrel and B barrel respectively；
A glue and B glue are stirred respectively；
A glue and B glue are mixed into AB glue；
Use mixed AB glue that components and parts are carried out embedding.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 1, it is characterised in that described by A glue with B glue
Stir respectively, the most also include:
Use return duct that A glue is circulated in A barrel flowing from the bottom up, use return duct by B glue in B barrel under
Up it is circulated flowing.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 2, it is characterised in that described use return duct
A glue is circulated in A barrel from the bottom up flowing, uses return duct that B glue is circulated in B barrel stream from the bottom up
Dynamic, the most also include:
A glue and B glue are carried out vacuum defoamation process.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 1, it is characterised in that described by A glue with B glue
It is mixed into AB glue, specifically:
Use dosing pump that A glue and B glue are carried out accurate gluing, be then mixed into AB glue.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 4, it is characterised in that described be then mixed into
For AB glue for being dynamically mixed into AB glue.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 4, it is characterised in that described be then mixed into
It is that static mixing becomes AB glue for AB glue.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 1, it is characterised in that after described use mixing
AB glue components and parts are carried out embedding, the most also include:
The edge at the position that employing leatheroid need not embedding on components and parts is combined into protective bulkhead.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 1, it is characterised in that after described use mixing
AB glue components and parts are carried out embedding, specifically:
Setting embedding path on components and parts, mechanical arm carries out embedding along embedding path with mixed AB glue.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 1, it is characterised in that after described use mixing
AB glue components and parts are carried out embedding, the most also include:
Components and parts are carried out vacuum defoamation process.
The overall process for filling colloid of heat conductive flame-retarding material the most according to claim 9, it is characterised in that described to components and parts
Carry out vacuum defoamation process, the most also include:
Components and parts are carried out glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390364.4A CN106057689B (en) | 2016-06-01 | 2016-06-01 | The whole process for filling colloid of heat conductive flame-retarding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390364.4A CN106057689B (en) | 2016-06-01 | 2016-06-01 | The whole process for filling colloid of heat conductive flame-retarding material |
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| Publication Number | Publication Date |
|---|---|
| CN106057689A true CN106057689A (en) | 2016-10-26 |
| CN106057689B CN106057689B (en) | 2019-06-07 |
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| CN201610390364.4A Active CN106057689B (en) | 2016-06-01 | 2016-06-01 | The whole process for filling colloid of heat conductive flame-retarding material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109181624A (en) * | 2018-08-24 | 2019-01-11 | 深圳市荣者光电科技发展有限公司 | The preparation method of gleam image intensifier encapsulation adhesives |
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| CN102641698A (en) * | 2012-04-16 | 2012-08-22 | 西安永电电气有限责任公司 | Silica gel preparation method |
| CN103044924A (en) * | 2012-12-17 | 2013-04-17 | 肇庆皓明有机硅材料有限公司 | Addition type liquid pouring sealant for semiconductor assembling piece and preparation method thereof |
| CN203916649U (en) * | 2014-04-25 | 2014-11-05 | 安徽安大华泰新材料有限公司 | A kind of thermosensitive type polyurethane pouring sealant preparation facilities |
| CN105101720A (en) * | 2015-07-17 | 2015-11-25 | 北京航天万源科技公司 | Modular potting process for electronic product |
-
2016
- 2016-06-01 CN CN201610390364.4A patent/CN106057689B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201921650U (en) * | 2011-01-05 | 2011-08-10 | 袁遵钢 | Dispenser apparatus |
| CN102641698A (en) * | 2012-04-16 | 2012-08-22 | 西安永电电气有限责任公司 | Silica gel preparation method |
| CN103044924A (en) * | 2012-12-17 | 2013-04-17 | 肇庆皓明有机硅材料有限公司 | Addition type liquid pouring sealant for semiconductor assembling piece and preparation method thereof |
| CN203916649U (en) * | 2014-04-25 | 2014-11-05 | 安徽安大华泰新材料有限公司 | A kind of thermosensitive type polyurethane pouring sealant preparation facilities |
| CN105101720A (en) * | 2015-07-17 | 2015-11-25 | 北京航天万源科技公司 | Modular potting process for electronic product |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109181624A (en) * | 2018-08-24 | 2019-01-11 | 深圳市荣者光电科技发展有限公司 | The preparation method of gleam image intensifier encapsulation adhesives |
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| Publication number | Publication date |
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| CN106057689B (en) | 2019-06-07 |
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Address after: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Patentee after: Zhaoshun Technology (Guangdong) Co., Ltd Address before: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Patentee before: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. |
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