CN106057503A - Chip high-voltage ceramic dielectric capacitor capacitance measurement device - Google Patents
Chip high-voltage ceramic dielectric capacitor capacitance measurement device Download PDFInfo
- Publication number
- CN106057503A CN106057503A CN201610556018.9A CN201610556018A CN106057503A CN 106057503 A CN106057503 A CN 106057503A CN 201610556018 A CN201610556018 A CN 201610556018A CN 106057503 A CN106057503 A CN 106057503A
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- Prior art keywords
- electrode
- chip high
- voltage ceramic
- outs
- ceramic capacitor
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims abstract description 16
- 239000003990 capacitor Substances 0.000 title abstract description 14
- 238000005259 measurement Methods 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000001514 detection method Methods 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims abstract description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 230000003028 elevating effect Effects 0.000 claims abstract description 8
- 239000003985 ceramic capacitor Substances 0.000 claims description 35
- 238000005452 bending Methods 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 229910052573 porcelain Inorganic materials 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
The application discloses a chip high-voltage ceramic dielectric capacitor capacitance measurement device comprising a capacitance detector, a detection fixture, a pressing plate and base. A chip high-voltage ceramic dielectric capacitor comprises a silver-coated ceramic chip, a plastic shell and a metal lead-out wire. The bottom part of the plastic shell is provided with two positioning grooves. The detection fixture is fixedly arranged on the base and connected with the capacitance detector through a data line. The detection fixture is provided with two conductive columns and two elastic positioning pins. The two conductive columns can be fit with two transverse fitting parts arranged on the chip high-voltage ceramic dielectric capacitor and conducted. The two elastic positioning pins are matched with the two positioning grooves. The pressing plate is arranged exactly above the detection fixture and the height can be changed through elevating. With application of the structure, the degree of automation is high, labor intensity is low, the detection efficiency is high and measurement is accurate and reliable.
Description
Technical field
The application relates to verifying attachment when a kind of capacitor produces, particularly a kind of chip high voltage ceramic capacitor electric capacity
Measurement apparatus.
Background technology
Capacitor is a kind of energy-storage travelling wave tube, and its function is the electric energy in temporary-storage circuit, and it is in the form of a charge
Store energy.In circuit, capacitor be usually used in tuning, filter, couple, bypass, energy conversion and time delay.
The structure of capacitor be by two panels very close to electrode conductor constituted, when in circuit voltage raise time, electricity
Extremely going up and can accumulate more electric charge, therefore, the highest or electrode conductor the area of voltage is the biggest, and the quantity of electric charge that can store just is got over
Many, capacitance is the biggest；Additionally, the dielectric property of the distance between two plate electrodes and the dielectric material (insulator) in the middle of it is also
Can affect capacitance, electrode leans on the nearest, the relation attracted each other due to positive and negative charge, and electrode will be accumulated more electricity
Lotus, so electric capacity is the biggest；As for dielectric material for the impact of electric capacity, if dielectric constant is the biggest, then can accumulate more on electrode
Electric charge, so electric capacity is the biggest.
Ceramic capacitor (wire-type ceramic capacitor) is using pottery as dielectric material, and it is in pottery
Matrix two sides plating is led, and forms electrode, then burn-ons metal lead wire (metal wire) using as can be with circuit at electrode surface
The output/input terminal that plate is electrically connected with.Ceramic capacitor ground feature be that volume is little, heat-resist, be lost little, insulation resistance is high and
Dielectric constant is big, is therefore applicable to high pressure and high-frequency circuit.
Development in science and technology in recent years is maked rapid progress, and each electronic product is more prevalent, so needing to apply substantial amounts of capacitor,
The power supply unit of such as liquid crystal display must use high-precision ceramic capacitor, and it is operated in 100 volts to 5000 volts
Alternating voltage between spy, capacitance in several micromicrofarads (pF) between tens of micromicrofarads, and its error is necessarily equal to or
Less than ± 1%.
The high-voltage ceramic capacitor produced at present, has disk high-voltage ceramic capacitor, chip multilayer ceramic capacitor etc..
Disk high-voltage ceramic capacitor is traditional structure, ceramic two thin long leads of being burn-on on silver strip, surface bag last layer epoxy
Resin, the circuit board of installation has two apertures to capacitor plug-in mounting.This installation form manufacturability is poor, it is impossible to tolerates high machinery and shakes
Move or impact, and due to lead-in inductance, use upper frequency limit to be restricted.For adapting to miniaturization, the development trend of slimming,
Electronic component structure form is changed into, by tradition plug-in, the trend that SMT mounted type becomes irresistible.Chip multilayer porcelain dielectric
Container can meet the needs that SMT attachment produces, and as being superimposed as lamellar by ceramic membrane, the chip of two ends coating external electrode structure is many
Layer ceramic capacitor, it can be made into high pressure larger capacity capacitor, and the capacitor making relatively low capacity exists certain difficulty, and it
Process equipment and technology want complicated a lot, cause industrialization cost high, selling price is the highest.Under this background, the present invention
The most just arise at the historic moment.
Summary of the invention
The application to solve the technical problem that being for above-mentioned the deficiencies in the prior art, and provides a kind of automaticity
Height, labor intensity is little, and detection efficiency is high, measures chip high voltage ceramic capacitor capacitance measuring device accurately and reliably.
For solving above-mentioned technical problem, the application the technical scheme is that
A kind of chip high voltage ceramic capacitor capacitance measuring device, including capacitance detecting instrument, detection tool, pressing plate and base；
Chip high voltage ceramic capacitor includes by silver ceramics, moulds shell and metal lead-outs.
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics；First electrode and second
A metal lead-outs respectively it is welded with on electrode.
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal is drawn
Line all includes transverse weld portion, vertical bending part and transverse fit portion；Transverse weld portion is used for and the first electrode or the second electrode
Weld；Transverse fit portion is for being electrically connected with device to be mounted；Vertical bending part be used for connecting transverse weld portion and
Transverse fit portion.
Mould shell to be coated on by silver ceramics and the periphery of part metals lead-out wire, mould and shell is provided with two wire lead slots, each
Wire lead slot is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for putting
Put the vertical slot of the vertical bending part of metal lead-outs and for placing the opening translot in metal lead-outs transverse fit portion；Mould the end of shell
Portion is provided with two locating slots.
Detection tool is fixedly installed on base, and is connected with capacitance detecting instrument by data wire.
Being provided with two conductive poles and two elastic positioning pins on detection tool, two conductive poles can be situated between with chip high pressure porcelain
Two transverse fit portions on capacitor are affixed merging and conduct；Two elastic positioning pins and two locating slots match.
Pressing plate is positioned at the surface of detection tool, and height can lift.
Described shell of moulding is cube.
Described shell of moulding is epoxy resin.
Described pressing plate is fixedly installed on the side of base by elevating lever.
The displacement transducer that can detect lifter rod lifting displacement it is provided with on described elevating lever.
After the application uses said structure, above-mentioned chip high voltage ceramic capacitor can make single plate shape, and neat appearance can
It is rest directly upon on wiring board, it is not necessary to plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.
Meanwhile, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor is simple, industrialization cost and sale price
Lattice are cheap.Manual or automatic being placed on by above-mentioned chip high voltage ceramic capacitor is detected on tool, makes locating slot and alignment pin phase
Coordinating, pressing plate declines automatically, can complete the measured capacitance value of chip high voltage ceramic capacitor, thus automaticity is high, labor
Fatigue resistance is little, and detection efficiency is high, measures accurately and reliably.
Accompanying drawing explanation
Fig. 1 is the structural representation of the application a kind of chip high voltage ceramic capacitor capacitance measuring device；
Fig. 2 shows the structural representation of chip high voltage ceramic capacitor.
Detailed description of the invention
With concrete better embodiment, the application is described in further detail below in conjunction with the accompanying drawings.
As depicted in figs. 1 and 2, wherein have by porcelain silver strip the 1, first electrode the 11, second electrode 12, mould shell 2, wire lead slot 21,
Electrode translot 211, vertical slot 212, opening translot 213, metal lead-outs 3, transverse weld portion 31, vertical bending part 32, laterally paste
Conjunction portion 33, chip high voltage ceramic capacitor 4, locating slot 41, capacitance detecting instrument 5, detection tool 6, conductive pole 61, elastic positioning pin
62, the technical characteristics such as pressing plate 7, base 8 and elevating lever 81.
As in figure 2 it is shown, chip high voltage ceramic capacitor includes by silver ceramics, moulds shell and metal lead-outs.
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics；First electrode and second
A metal lead-outs respectively it is welded with on electrode.
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal is drawn
Line all includes transverse weld portion, vertical bending part and transverse fit portion；Transverse weld portion is used for and the first electrode or the second electrode
Weld；Transverse fit portion is for being electrically connected with device to be mounted；Vertical bending part be used for connecting transverse weld portion and
Transverse fit portion.
Mould shell to be coated on by silver ceramics and the periphery of part metals lead-out wire, mould and shell is provided with two wire lead slots, each
Wire lead slot is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for putting
Put the vertical slot of the vertical bending part of metal lead-outs and for placing the opening translot in metal lead-outs transverse fit portion；Mould the end of shell
Portion is provided with two locating slots.
As it is shown in figure 1, a kind of chip high voltage ceramic capacitor capacitance measuring device, including capacitance detecting instrument, detection tool,
Pressing plate and base.
Detection tool is fixedly installed on base, and is connected with capacitance detecting instrument by data wire.
Being provided with two conductive poles and two elastic positioning pins on detection tool, two conductive poles can be situated between with chip high pressure porcelain
Two transverse fit portions on capacitor are affixed merging and conduct；Two elastic positioning pins and two locating slots match.
Pressing plate is positioned at the surface of detection tool, and height can lift.
Above-mentioned mould shell be preferably shaped to cube, the material moulding shell is preferably epoxy resin.
Further, above-mentioned pressing plate is preferably fixedly installed on the side of base by elevating lever.
Further, above-mentioned elevating lever is preferably provided with the displacement transducer that can detect lifter rod lifting displacement.
After the application uses said structure, above-mentioned chip high voltage ceramic capacitor can make single plate shape, and neat appearance can
It is rest directly upon on wiring board, it is not necessary to plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.
Meanwhile, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor is simple, industrialization cost and sale price
Lattice are cheap.
During measured capacitance value, manual or automatic being placed on by above-mentioned chip high voltage ceramic capacitor is detected on tool, and it is fixed to make
Position groove matches with alignment pin, and pressing plate declines automatically, and elastic positioning pin compresses, and pressing plate continues to decline, and makes chip high pressure porcelain
Transverse fit portion on dielectric container is fully on conductive pole, and the capacitance that can complete chip high voltage ceramic capacitor is surveyed
Amount, thus automaticity is high, labor intensity is little, and detection efficiency is high, measures accurately and reliably.
The preferred implementation of the application described in detail above, but, the application is not limited in above-mentioned embodiment
Detail, in the technology concept of the application, the technical scheme of the application can be carried out multiple equivalents, this
A little equivalents belong to the protection domain of the application.
Claims (5)
1. a chip high voltage ceramic capacitor capacitance measuring device, it is characterised in that: include capacitance detecting instrument, detection tool,
Pressing plate and base；
Chip high voltage ceramic capacitor includes by silver ceramics, moulds shell and metal lead-outs；
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics；First electrode and the second electrode
On be respectively welded with a metal lead-outs；
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal lead-outs is equal
Including transverse weld portion, vertical bending part and transverse fit portion；Transverse weld portion is for carrying out with the first electrode or the second electrode
Welding；Transverse fit portion is for being electrically connected with device to be mounted；Vertical bending part is used for connecting transverse weld portion with horizontal
Sticking part；
Mould shell to be coated on by silver ceramics and the periphery of part metals lead-out wire, mould and shell is provided with two wire lead slots, each lead-in wire
Groove is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for placing gold
Belong to the vertical slot of the vertical bending part of lead-out wire and for placing the opening translot in metal lead-outs transverse fit portion；The bottom moulding shell sets
It is equipped with two locating slots；
Detection tool is fixedly installed on base, and is connected with capacitance detecting instrument by data wire；
Being provided with two conductive poles and two elastic positioning pins on detection tool, two conductive poles can be with chip high tension porcelain capacitance
Two transverse fit portions on device are affixed merging and conduct；Two elastic positioning pins and two locating slots match；
Pressing plate is positioned at the surface of detection tool, and height can lift.
Chip high voltage ceramic capacitor capacitance measuring device the most according to claim 1, it is characterised in that moulding shell described in: is
Cube.
Chip high voltage ceramic capacitor capacitance measuring device the most according to claim 1, it is characterised in that moulding shell described in: is
Epoxy resin.
Chip high voltage ceramic capacitor capacitance measuring device the most according to claim 1, it is characterised in that: described pressing plate leads to
Cross elevating lever and be fixedly installed on the side of base.
Chip high voltage ceramic capacitor capacitance measuring device the most according to claim 4, it is characterised in that: described elevating lever
On be provided with the displacement transducer that can detect lifter rod lifting displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556018.9A CN106057503B (en) | 2016-07-15 | 2016-07-15 | A kind of chip high voltage ceramic capacitor capacitance measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556018.9A CN106057503B (en) | 2016-07-15 | 2016-07-15 | A kind of chip high voltage ceramic capacitor capacitance measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106057503A true CN106057503A (en) | 2016-10-26 |
| CN106057503B CN106057503B (en) | 2018-04-20 |
Family
ID=57186834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556018.9A Active CN106057503B (en) | 2016-07-15 | 2016-07-15 | A kind of chip high voltage ceramic capacitor capacitance measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106057503B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018233348A1 (en) * | 2017-06-20 | 2018-12-27 | 京东方科技集团股份有限公司 | Measuring device and measuring system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299290A (en) * | 1992-04-24 | 1993-11-12 | Matsushita Electric Ind Co Ltd | Porcelain capacitor |
| CN2541937Y (en) * | 2002-04-29 | 2003-03-26 | 广东南方宏明电子科技股份有限公司 | Chip high voltage ceramic capacitor |
| CN201242579Y (en) * | 2007-12-28 | 2009-05-20 | 暄泰电子(苏州)有限公司 | Automatic tester for capacitance |
| CN201242944Y (en) * | 2008-07-16 | 2009-05-20 | 福建国光电子科技股份有限公司 | Heating pressurization solidified machine |
| CN102435861A (en) * | 2011-10-31 | 2012-05-02 | 上海思源电力电容器有限公司 | Capacitor component detection system and method |
| CN205845725U (en) * | 2016-07-15 | 2016-12-28 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic capacitor capacitance measuring device |
-
2016
- 2016-07-15 CN CN201610556018.9A patent/CN106057503B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299290A (en) * | 1992-04-24 | 1993-11-12 | Matsushita Electric Ind Co Ltd | Porcelain capacitor |
| CN2541937Y (en) * | 2002-04-29 | 2003-03-26 | 广东南方宏明电子科技股份有限公司 | Chip high voltage ceramic capacitor |
| CN201242579Y (en) * | 2007-12-28 | 2009-05-20 | 暄泰电子(苏州)有限公司 | Automatic tester for capacitance |
| CN201242944Y (en) * | 2008-07-16 | 2009-05-20 | 福建国光电子科技股份有限公司 | Heating pressurization solidified machine |
| CN102435861A (en) * | 2011-10-31 | 2012-05-02 | 上海思源电力电容器有限公司 | Capacitor component detection system and method |
| CN205845725U (en) * | 2016-07-15 | 2016-12-28 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic capacitor capacitance measuring device |
Non-Patent Citations (1)
| Title |
|---|
| THOMAS L.FLOYD: "《交直流电路基础 系统方法》", 31 January 2014, 机械工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018233348A1 (en) * | 2017-06-20 | 2018-12-27 | 京东方科技集团股份有限公司 | Measuring device and measuring system |
| US10983376B2 (en) | 2017-06-20 | 2021-04-20 | Boe Technology Group Co., Ltd. | Measuring device and a measuring system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106057503B (en) | 2018-04-20 |
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