CN106047284A - Special antistatic heat-conducting binding material for LED (light-emitting diode) lamps and preparation method thereof - Google Patents
Special antistatic heat-conducting binding material for LED (light-emitting diode) lamps and preparation method thereof Download PDFInfo
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- CN106047284A CN106047284A CN201610513840.7A CN201610513840A CN106047284A CN 106047284 A CN106047284 A CN 106047284A CN 201610513840 A CN201610513840 A CN 201610513840A CN 106047284 A CN106047284 A CN 106047284A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J191/00—Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
- C09J191/06—Waxes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a special antistatic heat-conducting binding material for LED (light-emitting diode) lamps and a preparation method thereof. The special antistatic heat-conducting binding material for LED (light-emitting diode) lamps comprises the following main raw materials in parts by weight: 5-15 parts of phenol formaldehyde epoxy vinyl ester resin, 5-15 parts of polyethylene terephthalate, 5-15 parts of rosin resin, 5-15 parts of acrylic resin, 5-15 parts of antistatic heat-conducting aid, 5-10 parts of nano silicon dioxide powder, 1-3 parts of silane coupling agent, 1-3 parts of tert-butylhydroquinone and 1-3 parts of hindered amine light stabilizer. The antistatic heat-conducting aid comprises the following main raw materials in parts by weight: 25-30 parts of calcium carbonate powder, 10-20 parts of liquid paraffin, 10-20 parts of sulfite and 5-10 parts of magnesium hydroxide. The special antistatic heat-conducting binding material for LED lamps has the advantages of excellent comprehensive properties, favorable processability, high heat conductivity, high antistatic capacity, low cost and the like.
Description
Technical field
The present invention relates to a kind of technical field of polymer materials, specifically a kind of LED special antistatic conducting adhesive material
Material and preparation method thereof.
Background technology
LED is general lighting field as the lighting source of forth generation, the developing direction in its future, uses solid light source LED
Replace the conventional illumination sources such as electric filament lamp, fluorescent lamp and become the developing goal in coming 10 years.The antistatic of great power LED dissipates
Heat problem is one of difficult problem of hindering it to develop rapidly at present.Owing to the bad meeting of chip cooling causes the accumulation of heat, and organic
Macromolecule viscous material is easy to gather electric charge and produces electrostatic, and these problems all have a strong impact on the light efficiency of LED, life-span and reliable
Property.The most how to utilize new material to improve the thermal diffusivity of LED and sheet resistance becomes important research topic.
Summary of the invention
It is an object of the invention to provide LED special antistatic conducting adhesive material and preparation method thereof, on solving
State the problem proposed in background technology.
For achieving the above object, the present invention provides following technical scheme:
A kind of LED special antistatic conducting adhesive material, includes according to the primary raw material of weight portion: epoxy novolac vinyl esters
Resin 5-15 part, polyethylene terephthalate 5-15 part, rosin resin 5-15 part, acrylic resin 5-15 part, antistatic
Heat conduction auxiliary agent 5-15 part, nano grade silica particles 5-10 part, silane coupling agent 1-3 part, tert-butylhydroquinone 1-3 part,
Hindered amine light stabilizer 1-3 part；Described antistatic heat conduction auxiliary agent, includes according to the primary raw material of weight portion: calcium carbonate powder
25-30 part, liquid paraffin 10-20 part, sulfite 10-20 part, magnesium hydroxide 5-10 part.
As the further scheme of the present invention: described LED special antistatic conducting adhesive material, according to weight portion
Primary raw material includes: phenol formaldehyde epoxy vinyl ester resin 10 parts, polyethylene terephthalate 10 parts, rosin resin 10 parts,
Acrylic resin 10 parts, antistatic heat conduction auxiliary agent 10 parts, nano grade silica particles 8 parts, silane coupling agent 2 parts, tertiary butyl
Hydroquinone 2 parts, hindered amine light stabilizer 2 parts；Described antistatic heat conduction auxiliary agent, includes according to the primary raw material of weight portion:
Calcium carbonate powder 28 parts, liquid paraffin 15 parts, sulfite 15 parts, 5 parts of magnesium hydroxide.
As the further scheme of the present invention: the particle diameter of described nano grade silica particles is 30-60nm.
As the further scheme of the present invention: in described antistatic heat conduction auxiliary agent, calcium carbonate powder and magnesium hydroxide particle diameter are
100-200μm。
The preparation method of a kind of LED special antistatic conducting adhesive material, concretely comprises the following steps:
(1) first, calcium carbonate powder and 60 DEG C of magnesium hydroxide are vacuum dried 24h, subsequently by the Paris white after vacuum drying
End and magnesium hydroxide are dispersed in liquid paraffin and sulfite and stir, and are allowed to dispersion and obtain mixture；By mixture
Join in phenol formaldehyde epoxy vinyl ester resin, fully carry out sucking filtration after mixing, put into 60 DEG C of vacuum drying ovens and be dried 24h,
To mixture I；
(2) then, by mixture I and polyethylene terephthalate, rosin resin, acrylic resin, nano silicon
Powder, silane coupling agent, tert-butylhydroquinone, hindered amine light stabilizer are mixed together uniformly, and carry out ultrasound wave-micro-
Ripple Combined Treatment, the temperature of ultrasonic-microwave Combined Treatment is 60 DEG C-90 DEG C, and the time is 30min-90min, obtains LED special
Semi-finished product with antistatic conducting adhesive material；
(3) last, by the semi-finished product of above-mentioned LED special antistatic conducting adhesive material, from the feeding of double screw extruder
Mouthful, screw speed is set as 200-600r/min, and through melt extruding, water-cooled pelletizing obtains pellet；Then, at 125-130 DEG C
Lower forced air drying 4-5h, uses injection machine injection mo(u)lding, obtains LED special antistatic conducting adhesive material.
As the further scheme of the present invention: in step (2), the temperature of ultrasonic-microwave Combined Treatment is 75 DEG C, the time
For 60min.
As the further scheme of the present invention: in step (3), screw speed is set as 400r/min.
Compared with prior art, the invention has the beneficial effects as follows:
LED special antistatic conducting adhesive material prepared by the present invention has higher thermal conductivity and sheet resistance value, aobvious
Show good heat conductivility and antistatic property, simultaneously prepared by the adhesion strength of material the strongest, actual application can be met
Application demand with great-power electronic encapsulation field.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the technical scheme of this patent is described in more detail.
Embodiment 1
A kind of LED special antistatic conducting adhesive material, includes according to the primary raw material of weight portion: epoxy novolac vinyl esters
Resin 5-15 part, polyethylene terephthalate 5-15 part, rosin resin 5-15 part, acrylic resin 5-15 part, antistatic
Heat conduction auxiliary agent 5-15 part, nano grade silica particles 5-10 part, silane coupling agent 1-3 part, tert-butylhydroquinone 1-3 part,
Hindered amine light stabilizer 1-3 part；Described antistatic heat conduction auxiliary agent, includes according to the primary raw material of weight portion: calcium carbonate powder
25-30 part, liquid paraffin 10-20 part, sulfite 10-20 part, magnesium hydroxide 5-10 part.
The preparation method of a kind of LED special antistatic conducting adhesive material, concretely comprises the following steps:
(1) first, calcium carbonate powder and 60 DEG C of magnesium hydroxide are vacuum dried 24h, subsequently by the Paris white after vacuum drying
End and magnesium hydroxide are dispersed in liquid paraffin and sulfite and stir, and are allowed to dispersion and obtain mixture；By mixture
Join in phenol formaldehyde epoxy vinyl ester resin, fully carry out sucking filtration after mixing, put into 60 DEG C of vacuum drying ovens and be dried 24h,
To mixture I；
(2) then, by mixture I and polyethylene terephthalate, rosin resin, acrylic resin, nano silicon
Powder, silane coupling agent, tert-butylhydroquinone, hindered amine light stabilizer are mixed together uniformly, and carry out ultrasound wave-micro-
Ripple Combined Treatment, the temperature of ultrasonic-microwave Combined Treatment is 60 DEG C, and the time is 30min, obtains the special antistatic of LED and leads
The semi-finished product of hot adhesion material；
(3) last, by the semi-finished product of above-mentioned LED special antistatic conducting adhesive material, from the feeding of double screw extruder
Mouthful, screw speed is set as 200r/min, and through melt extruding, water-cooled pelletizing obtains pellet；Then, drum at 125-130 DEG C
Air-dry dry 4-5h, use injection machine injection mo(u)lding, obtain LED special antistatic conducting adhesive material.
The LED special antistatic conducting adhesive material that above-mentioned technique prepares, records its adhesion strength, antistatic energy
Power and heat conductivility parameter are as follows: adhesion strength 12MPa；Sheet resistance 4.2 × 107Ω, thermal conductivity 3.82W/m.K.
Embodiment 2
A kind of LED special antistatic conducting adhesive material, includes according to the primary raw material of weight portion: epoxy novolac vinyl esters
Resin 10 parts, polyethylene terephthalate 10 parts, rosin resin 10 parts, acrylic resin 10 parts, antistatic heat conduction auxiliary agent
10 parts, nano grade silica particles 8 parts, silane coupling agent 2 parts, tert-butylhydroquinone 2 parts, hindered amine light stabilizer 2
Part；Described antistatic heat conduction auxiliary agent, includes according to the primary raw material of weight portion: calcium carbonate powder 28 parts, liquid paraffin 15 parts, Asia
Sulfuric ester 15 parts, 5 parts of magnesium hydroxide.
The preparation method of a kind of LED special antistatic conducting adhesive material, concretely comprises the following steps:
(1) first, calcium carbonate powder and 60 DEG C of magnesium hydroxide are vacuum dried 24h, subsequently by the Paris white after vacuum drying
End and magnesium hydroxide are dispersed in liquid paraffin and sulfite and stir, and are allowed to dispersion and obtain mixture；By mixture
Join in phenol formaldehyde epoxy vinyl ester resin, fully carry out sucking filtration after mixing, put into 60 DEG C of vacuum drying ovens and be dried 24h,
To mixture I；
(2) then, by mixture I and polyethylene terephthalate, rosin resin, acrylic resin, nano silicon
Powder, silane coupling agent, tert-butylhydroquinone, hindered amine light stabilizer are mixed together uniformly, and carry out ultrasound wave-micro-
Ripple Combined Treatment, the temperature of ultrasonic-microwave Combined Treatment is 75 DEG C, and the time is 60min, obtains the special antistatic of LED and leads
The semi-finished product of hot adhesion material；
(3) last, by the semi-finished product of above-mentioned LED special antistatic conducting adhesive material, from the feeding of double screw extruder
Mouthful, screw speed is set as 400r/min, and through melt extruding, water-cooled pelletizing obtains pellet；Then, drum at 125-130 DEG C
Air-dry dry 4-5h, use injection machine injection mo(u)lding, obtain LED special antistatic conducting adhesive material.
The LED special antistatic conducting adhesive material that above-mentioned technique prepares, records its adhesion strength, antistatic energy
Power and heat conductivility parameter are as follows: adhesion strength 15MPa；Sheet resistance 5.4 × 107Ω, thermal conductivity 4.57W/m.K.
Embodiment 3
A kind of LED special antistatic conducting adhesive material, includes according to the primary raw material of weight portion: epoxy novolac vinyl esters
Resin 15 parts, polyethylene terephthalate 15 parts, rosin resin 15 parts, acrylic resin 15 parts, antistatic heat conduction auxiliary agent 5
Part, nano grade silica particles 10 parts, silane coupling agent 3 parts, tert-butylhydroquinone 3 parts, hindered amine light stabilizer 3
Part；Described antistatic heat conduction auxiliary agent, includes according to the primary raw material of weight portion: calcium carbonate powder 30 parts, liquid paraffin 20 parts, Asia
Sulfuric ester 20 parts, 10 parts of magnesium hydroxide.
The preparation method of a kind of LED special antistatic conducting adhesive material, concretely comprises the following steps:
(1) first, calcium carbonate powder and 60 DEG C of magnesium hydroxide are vacuum dried 24h, subsequently by the Paris white after vacuum drying
End and magnesium hydroxide are dispersed in liquid paraffin and sulfite and stir, and are allowed to dispersion and obtain mixture；By mixture
Join in phenol formaldehyde epoxy vinyl ester resin, fully carry out sucking filtration after mixing, put into 60 DEG C of vacuum drying ovens and be dried 24h,
To mixture I；
(2) then, by mixture I and polyethylene terephthalate, rosin resin, acrylic resin, nano silicon
Powder, silane coupling agent, tert-butylhydroquinone, hindered amine light stabilizer are mixed together uniformly, and carry out ultrasound wave-micro-
Ripple Combined Treatment, the temperature of ultrasonic-microwave Combined Treatment is 90 DEG C, and the time is 90min, obtains the special antistatic of LED and leads
The semi-finished product of hot adhesion material；
(3) last, by the semi-finished product of above-mentioned LED special antistatic conducting adhesive material, from the feeding of double screw extruder
Mouthful, screw speed is set as 400r/min, and through melt extruding, water-cooled pelletizing obtains pellet；Then, drum at 125-130 DEG C
Air-dry dry 4-5h, use injection machine injection mo(u)lding, obtain LED special antistatic conducting adhesive material.
The LED special antistatic conducting adhesive material that above-mentioned technique prepares, records its adhesion strength, antistatic energy
Power and heat conductivility parameter are as follows: adhesion strength 14MPa；Sheet resistance 5.1 × 107Ω, thermal conductivity 4.11W/m.K.
Comparative example 1
A kind of special binding material of LED, includes according to the primary raw material of weight portion: phenol formaldehyde epoxy vinyl ester resin 10 parts,
Polyethylene terephthalate 10 parts, rosin resin 10 parts, acrylic resin 10 parts, nano grade silica particles 8 parts, silane
Class coupling agent 2 parts, tert-butylhydroquinone 2 parts, hindered amine light stabilizer 2 parts.
The preparation method of the special binding material of a kind of LED, concretely comprises the following steps:
(1) first, by phenol formaldehyde epoxy vinyl ester resin and polyethylene terephthalate, rosin resin, acrylic resin,
Nano grade silica particles, silane coupling agent, tert-butylhydroquinone, hindered amine light stabilizer are mixed together uniformly, and
Carrying out ultrasonic-microwave Combined Treatment, the temperature of ultrasonic-microwave Combined Treatment is 75 DEG C, and the time is 60min, obtains LED
The semi-finished product of special binding material；
(2) last, by the semi-finished product of the above-mentioned special binding material of LED, from the spout of double screw extruder, screw speed
Being set as 400r/min, through melt extruding, water-cooled pelletizing obtains pellet；Then, forced air drying 4-5h at 125-130 DEG C,
Use injection machine injection mo(u)lding, obtain the special binding material of LED.
The special binding material of LED that above-mentioned technique prepares, records its adhesion strength, anti-static ability and heat conductivity
Energy parameter is as follows: adhesion strength 6MPa；Sheet resistance 1.8 × 107Ω, thermal conductivity 2.74W/m.K.
Comparative example 2
A kind of special binding material of LED, includes according to the primary raw material of weight portion: phenol formaldehyde epoxy vinyl ester resin 10 parts,
Silane coupling agent 2 parts, hindered amine light stabilizer 2 parts.
The preparation method of the special binding material of a kind of LED, concretely comprises the following steps:
(1) first, phenol formaldehyde epoxy vinyl ester resin and silane coupling agent, hindered amine light stabilizer are mixed together all
Even, and carry out mechanical agitation process 60min, obtain the semi-finished product of the special binding material of LED；
(2) last, by the semi-finished product of the above-mentioned special binding material of LED, from the spout of double screw extruder, screw speed
Being set as 400r/min, through melt extruding, water-cooled pelletizing obtains pellet；Then, forced air drying 4-5h at 125-130 DEG C,
Use injection machine injection mo(u)lding, obtain the special binding material of LED.
The special binding material of LED that above-mentioned technique prepares, records its adhesion strength, anti-static ability and heat conductivity
Energy parameter is as follows: adhesion strength 2MPa；Sheet resistance 5.3 × 106Ω, thermal conductivity 1.22W/m.K.
Comparative example 3
A kind of special binding material of LED, includes according to the primary raw material of weight portion: phenol formaldehyde epoxy vinyl ester resin 10 parts,
Polyethylene terephthalate 10 parts, rosin resin 10 parts, acrylic resin 10 parts, antistatic heat conduction auxiliary agent 10 parts, nanometer
SiO 2 powder 8 parts, silane coupling agent 2 parts, tert-butylhydroquinone 2 parts, hindered amine light stabilizer 2 parts；Described anti-
Electrostatic heat conduction auxiliary agent, includes according to the primary raw material of weight portion: calcium carbonate powder 28 parts, liquid paraffin 15 parts, sulfite 15
Part, 5 parts of magnesium hydroxide.
The preparation method of the special binding material of a kind of LED, concretely comprises the following steps:
(1) first, calcium carbonate powder and 60 DEG C of magnesium hydroxide are vacuum dried 24h, subsequently by the Paris white after vacuum drying
End and magnesium hydroxide are dispersed in liquid paraffin and sulfite and stir, and are allowed to dispersion and obtain mixture；By mixture
Join in phenol formaldehyde epoxy vinyl ester resin, fully carry out sucking filtration after mixing, put into 60 DEG C of vacuum drying ovens and be dried 24h,
To mixture I；
(2) then, by mixture I and polyethylene terephthalate, rosin resin, acrylic resin, nano silicon
Powder, silane coupling agent, tert-butylhydroquinone, hindered amine light stabilizer are mixed together uniformly, and carry out mechanical agitation
Process 60min, obtain the semi-finished product of the special binding material of LED；
(3) last, by the semi-finished product of the above-mentioned special binding material of LED, from the spout of double screw extruder, screw speed
Being set as 400r/min, through melt extruding, water-cooled pelletizing obtains pellet；Then, forced air drying 4-5h at 125-130 DEG C,
Use injection machine injection mo(u)lding, obtain the special binding material of LED.
The special binding material of LED that above-mentioned technique prepares, records its adhesion strength, anti-static ability and heat conductivity
Energy parameter is as follows: adhesion strength 9MPa；Sheet resistance 3.1 × 107Ω, thermal conductivity 3.19W/m.K.
Above the better embodiment of this patent is explained in detail, but this patent is not limited to above-mentioned embodiment party
Formula, in the ken that one skilled in the relevant art is possessed, it is also possible on the premise of without departing from this patent objective
Make a variety of changes.
Claims (7)
1. a LED special antistatic conducting adhesive material, it is characterised in that include according to the primary raw material of weight portion: phenol
Aldehyde epoxy vinyl ester resin 5-15 part, polyethylene terephthalate 5-15 part, rosin resin 5-15 part, acrylic resin
5-15 part, antistatic heat conduction auxiliary agent 5-15 part, nano grade silica particles 5-10 part, silane coupling agent 1-3 part, tertiary butyl pair
Benzodiazepines 1-3 part, hindered amine light stabilizer 1-3 part；Described antistatic heat conduction auxiliary agent, according to the primary raw material bag of weight portion
Include: calcium carbonate powder 25-30 part, liquid paraffin 10-20 part, sulfite 10-20 part, magnesium hydroxide 5-10 part.
LED the most according to claim 1 special antistatic conducting adhesive material, it is characterised in that according to weight portion
Primary raw material includes: phenol formaldehyde epoxy vinyl ester resin 10 parts, polyethylene terephthalate 10 parts, rosin resin 10 parts,
Acrylic resin 10 parts, antistatic heat conduction auxiliary agent 10 parts, nano grade silica particles 8 parts, silane coupling agent 2 parts, tertiary butyl
Hydroquinone 2 parts, hindered amine light stabilizer 2 parts；Described antistatic heat conduction auxiliary agent, includes according to the primary raw material of weight portion:
Calcium carbonate powder 28 parts, liquid paraffin 15 parts, sulfite 15 parts, 5 parts of magnesium hydroxide.
LED the most according to claim 1 and 2 special antistatic conducting adhesive material, it is characterised in that described nanometer two
The particle diameter of silicon oxide powder is 30-60nm.
LED the most according to claim 3 special antistatic conducting adhesive material, it is characterised in that described antistatic is led
In hot auxiliary agent, calcium carbonate powder and magnesium hydroxide particle diameter are 100-200 μm.
5. a preparation method for the LED special antistatic conducting adhesive material as described in claim 1-4 is arbitrary, its feature
It is, concretely comprises the following steps:
(1) first, calcium carbonate powder and 60 DEG C of magnesium hydroxide are vacuum dried 24h, subsequently by the Paris white after vacuum drying
End and magnesium hydroxide are dispersed in liquid paraffin and sulfite and stir, and are allowed to dispersion and obtain mixture；By mixture
Join in phenol formaldehyde epoxy vinyl ester resin, fully carry out sucking filtration after mixing, put into 60 DEG C of vacuum drying ovens and be dried 24h,
To mixture I；
(2) then, by mixture I and polyethylene terephthalate, rosin resin, acrylic resin, nano silicon
Powder, silane coupling agent, tert-butylhydroquinone, hindered amine light stabilizer are mixed together uniformly, and carry out ultrasound wave-micro-
Ripple Combined Treatment, the temperature of ultrasonic-microwave Combined Treatment is 60 DEG C-90 DEG C, and the time is 30min-90min, obtains LED special
Semi-finished product with antistatic conducting adhesive material；
(3) last, by the semi-finished product of above-mentioned LED special antistatic conducting adhesive material, from the feeding of double screw extruder
Mouthful, screw speed is set as 200-600r/min, and through melt extruding, water-cooled pelletizing obtains pellet；Then, at 125-130 DEG C
Lower forced air drying 4-5h, uses injection machine injection mo(u)lding, obtains LED special antistatic conducting adhesive material.
LED the most according to claim 5 special antistatic conducting adhesive material, it is characterised in that ultrasonic in step (2)
The temperature of ripple-microwave combined process is 75 DEG C, and the time is 60min.
LED the most according to claim 5 special antistatic conducting adhesive material, it is characterised in that screw rod in step (3)
Speed setting is 400r/min.
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| CN201610513840.7A CN106047284A (en) | 2016-07-04 | 2016-07-04 | Special antistatic heat-conducting binding material for LED (light-emitting diode) lamps and preparation method thereof |
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| CN201610513840.7A CN106047284A (en) | 2016-07-04 | 2016-07-04 | Special antistatic heat-conducting binding material for LED (light-emitting diode) lamps and preparation method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107573643A (en) * | 2017-08-17 | 2018-01-12 | 芜湖晶鑫光电照明有限公司 | A kind of special encapsulating material of LED |
| CN107699153A (en) * | 2017-11-06 | 2018-02-16 | 张永宏 | A kind of static-free glue band |
| CN109724053A (en) * | 2018-11-29 | 2019-05-07 | 重庆秉为科技有限公司 | It is a kind of for producing the heat sink material of LED light shell |
| DE102021202102A1 (en) | 2021-03-04 | 2022-09-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Use of a stabilizer composition for stabilizing organic materials, stabilizer composition, masterbatch, composition, molding composition of the moldings, method for the oxidative, thermal actinic stabilization of a thermoplastic and use of a composition |
| CN116001468A (en) * | 2022-12-03 | 2023-04-25 | 佛山市金镭科技有限公司 | Production process of wear-resistant laser electrochemical aluminum |
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| CN105295185A (en) * | 2015-08-31 | 2016-02-03 | 无锡市嘉邦电力管道厂 | Heat-conducting and anti-static halogen-free inflaming retarding type composite material as well as preparation method and application thereof |
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| CN105086382A (en) * | 2015-08-04 | 2015-11-25 | 金宝丽科技（苏州）有限公司 | Heat-conductive anti-static APET composite material and preparing method thereof |
| CN105295185A (en) * | 2015-08-31 | 2016-02-03 | 无锡市嘉邦电力管道厂 | Heat-conducting and anti-static halogen-free inflaming retarding type composite material as well as preparation method and application thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107573643A (en) * | 2017-08-17 | 2018-01-12 | 芜湖晶鑫光电照明有限公司 | A kind of special encapsulating material of LED |
| CN107699153A (en) * | 2017-11-06 | 2018-02-16 | 张永宏 | A kind of static-free glue band |
| CN109724053A (en) * | 2018-11-29 | 2019-05-07 | 重庆秉为科技有限公司 | It is a kind of for producing the heat sink material of LED light shell |
| DE102021202102A1 (en) | 2021-03-04 | 2022-09-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Use of a stabilizer composition for stabilizing organic materials, stabilizer composition, masterbatch, composition, molding composition of the moldings, method for the oxidative, thermal actinic stabilization of a thermoplastic and use of a composition |
| WO2022184687A1 (en) | 2021-03-04 | 2022-09-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Use of a stabilizer composition for stabilizing organic materials, stabilizer composition, master batch, composition, molding compound for moldings, process for oxidative, thermal and actinic stabilization of a thermoplastic, and use of a composition |
| CN116001468A (en) * | 2022-12-03 | 2023-04-25 | 佛山市金镭科技有限公司 | Production process of wear-resistant laser electrochemical aluminum |
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