CN106024747A - Multi-pin wiring needle for chip pins - Google Patents

Multi-pin wiring needle for chip pins Download PDF

Info

Publication number
CN106024747A
CN106024747A CN201610569336.9A CN201610569336A CN106024747A CN 106024747 A CN106024747 A CN 106024747A CN 201610569336 A CN201610569336 A CN 201610569336A CN 106024747 A CN106024747 A CN 106024747A
Authority
CN
China
Prior art keywords
pin
needle
wiring
pedestal
guide rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610569336.9A
Other languages
Chinese (zh)
Inventor
吕耀安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing informed investment home intellectual property rights Operation Co., Ltd.
Original Assignee
WUXI HI-NANO TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI HI-NANO TECHNOLOGY Co Ltd filed Critical WUXI HI-NANO TECHNOLOGY Co Ltd
Priority to CN201610569336.9A priority Critical patent/CN106024747A/en
Publication of CN106024747A publication Critical patent/CN106024747A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses a multi-pin wiring needle for chip pins. The multi-pin wiring needle comprises a pin pedestal wiring needle, and a plurality of pin needle assemblies laterally arranged on the pin pedestal, wherein adjacent pin needle assemblies are arranged at equal intervals, and the distance equals to the minimal distance between the chip pins. Each pin needle assembly comprises a slide needle guide rail wiring needle, which is of a lateral U shape and comprises an upper lateral groove, a longitudinal groove and a lower lateral groove. The pin needle assembly further comprises a pin needle pedestal wiring needle and a pin needle wiring needle, the pin needle pedestal wiring needle is stuck in the slide needle guide rail wiring needle and slides along the slide needle guide rail wiring needle, and the end of the pin needle wiring needle is fixed on the pin needle pedestal wiring needle. The multi-pin wiring needle can conduct wiring work for multiple chip pins, thereby substantially improving work efficiency.

Description

Many stitch chip pin routing pin
Technical field
The present invention relates to semiconductor assembly and test field, be specifically related to a kind of many stitch chip pin routing pin.
Background technology
Semiconductor chip after encapsulation, has external pin, is used for connecting power supply etc..External pin is logical Excessive line pin, is fixed on stamped metal on semiconductor chip.In the prior art, this kind gets pin ready Mostly be single stitch to make, then work efficiency is low, if using the routing pin of many stitch, the most again due to The chip of different model, the spacing of its external pin is different, needs the routing pin of different model to mate, and increases Add production cost.
Summary of the invention
For the deficiencies in the prior art, the invention discloses a kind of many stitch chip pin routing pin.
Technical scheme is as follows:
A kind of many stitch chip pin routing pin, including pin base routing pin;In described pin base laterally It is placed with multiple pin needle assembly;The spacing distance of adjacent pin needle assembly is equal, and this distance and chip The minimum separation distances of pin is equal;Described pin needle assembly includes sliding pin guide rail routing pin;Described sliding pin is led Rail routing pin is horizontal concave shape, horizontal including the upper end transverse concave groove interconnected, longitudinal fluting and lower end To groove;Described pin needle assembly also includes pin pin pedestal routing pin and pin stylus printer line pin;Described pin Pin pedestal routing pin is stuck among sliding pin guide rail routing pin and can slide along described sliding pin guide rail routing pin;Described The termination of pin stylus printer line pin is fixed on described pin pin pedestal routing pin.
The method have the benefit that:
The invention provides a kind of work that can multiple chip pins be carried out routing simultaneously, so using this Bright it is greatly improved work efficiency.And the arbitrary pin pin in the present invention can slide onto and disengage it from duty, Or slide and make it into duty, use with the chip of applicable different pin-pitch.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the present invention.
Detailed description of the invention
Fig. 1 is the schematic diagram of the present invention.As it is shown in figure 1, the present invention includes pin base 1.Pin base On be laterally placed with multiple pin needle assembly.The spacing distance of adjacent pin needle assembly is equal, and this distance Equal with the minimum separation distances of chip pin.Pin needle assembly includes sliding pin guide rail 2.Sliding pin guide rail 2 is Horizontal concave shape, including the upper end transverse concave groove interconnected, longitudinal fluting and lower end transverse concave groove.Draw Foot needle assembly also includes pin pin pedestal 3 and pin pin 4.Pin pin pedestal 3 is stuck among sliding pin guide rail 2 And can slide along sliding pin guide rail 2.The termination of pin pin 4 is fixed on pin pin pedestal 3.
Each pin pin in the present invention can slide onto as required so that it is departs from duty, it is also possible to Slide as required so that it is enter duty.When needs slide onto, can be along sliding pin guide rail 2, by pin Pin pedestal 3 the most laterally, afterwards longitudinally, more laterally, slips at the upper end transverse concave groove of sliding pin guide rail 2 and blocks. Then this root pin pin is due to pin contraction in length, it is impossible to carries out routing work again, adds this root the most virtually Distance between the pin pin of pin both sides, the chip bigger to adapt to pin-pitch.
And due in the present invention, the minimum separation distances phase of the adjacent distance between pin pin and chip pin Deng, as long as so appropriately adjusting the state of multiple pin pins, then to be adapted to arbitrariness in principle good for the present invention Chip, in use without being equipped with set of device for every kind of chip, save the cost of processed materials purchased, also I.e. save production cost.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.Permissible Understanding, those skilled in the art the most directly derive or associate The oher improvements and changes arrived, within being all considered as being included in protection scope of the present invention.

Claims (1)

1. stitch chip pin routing pin more than a kind, it is characterised in that include pin base (1);Described Multiple pin needle assembly laterally it is placed with in pin base;The spacing distance of adjacent pin needle assembly is equal, And this distance is equal with the minimum separation distances of chip pin;Described pin needle assembly includes sliding pin guide rail (2); Described sliding pin guide rail (2) is horizontal concave shape, including the upper end transverse concave groove interconnected, longitudinally the most recessed Groove and lower end transverse concave groove;Described pin needle assembly also includes pin pin pedestal (3) and pin pin (4); Described pin pin pedestal (3) is stuck among sliding pin guide rail (2) and can slide along described sliding pin guide rail (2); The termination of described pin pin (4) is fixed on described pin pin pedestal (3).
CN201610569336.9A 2016-07-18 2016-07-18 Multi-pin wiring needle for chip pins Pending CN106024747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610569336.9A CN106024747A (en) 2016-07-18 2016-07-18 Multi-pin wiring needle for chip pins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610569336.9A CN106024747A (en) 2016-07-18 2016-07-18 Multi-pin wiring needle for chip pins

Publications (1)

Publication Number Publication Date
CN106024747A true CN106024747A (en) 2016-10-12

Family

ID=57115894

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610569336.9A Pending CN106024747A (en) 2016-07-18 2016-07-18 Multi-pin wiring needle for chip pins

Country Status (1)

Country Link
CN (1) CN106024747A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102480073A (en) * 2010-11-23 2012-05-30 微联解决方案株式会社 Bga socket with improved structure
CN202474009U (en) * 2012-02-28 2012-10-03 常州天合光能有限公司 Bus bar mounting clamp
CN104201136A (en) * 2014-09-02 2014-12-10 中江县凯讯电子有限公司 Pin reshaping device applicable to different IC elements
CN204760377U (en) * 2015-08-10 2015-11-11 泉州宏讯电子有限公司 Integrated circuit chip

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102480073A (en) * 2010-11-23 2012-05-30 微联解决方案株式会社 Bga socket with improved structure
CN202474009U (en) * 2012-02-28 2012-10-03 常州天合光能有限公司 Bus bar mounting clamp
CN104201136A (en) * 2014-09-02 2014-12-10 中江县凯讯电子有限公司 Pin reshaping device applicable to different IC elements
CN204760377U (en) * 2015-08-10 2015-11-11 泉州宏讯电子有限公司 Integrated circuit chip

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20180607

Address after: 102600 3 floor, 2 building, No. 4 Daxing District Garden Road, Beijing, 1 unit 317

Applicant after: Beijing informed investment home intellectual property rights Operation Co., Ltd.

Address before: 214000 Jiangsu Wuxi New District, Qingyuan Road 20, Taihu international science and Technology Park, sensor network university science and Technology Park, D building, first floor

Applicant before: Wuxi Hi-Nano Technology Co., Ltd.

TA01 Transfer of patent application right
AD01 Patent right deemed abandoned

Effective date of abandoning: 20190329

AD01 Patent right deemed abandoned