CN106019620A - Device for inhibiting laser speckles and laser projection device - Google Patents
Device for inhibiting laser speckles and laser projection device Download PDFInfo
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- CN106019620A CN106019620A CN201610511627.2A CN201610511627A CN106019620A CN 106019620 A CN106019620 A CN 106019620A CN 201610511627 A CN201610511627 A CN 201610511627A CN 106019620 A CN106019620 A CN 106019620A
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- laser
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- semiconductor laser
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/48—Laser speckle optics
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
- G03B21/204—LED or laser light sources using secondary light emission, e.g. luminescence or fluorescence
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Projection Apparatus (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a device for inhibiting laser speckles and a laser projection device. The device for inhibiting laser speckles comprises at least two sets of module assemblies; each module assembly comprises a semiconductor laser and a refrigeration device, wherein temperature outputted by the output end of the refrigeration device acts on the semiconductor laser; and temperature outputted by the refrigeration devices in each module assembly is different, correspondingly, temperature difference exits between the semiconductor lasers in each module assembly. According to the device for inhibiting laser speckles provided by the invention, a plurality of sets of module assemblies are adopted, the temperature of the semiconductor lasers in each module assembly is different, so that the wavelengths of laser of the same color outputted by the semiconductor lasers in each module assembly are different and have a certain difference, and therefore, the diversity of laser wavelength can be realized; and the device is simple, is easy to implement, has no other side effects, and can inhibit a laser speckle effect from the perspective of simplicity and easiness in implementation.
Description
Technical field
The present invention relates to the technical field of laser projection, be specifically related to a kind of device suppressing laser speckle.This
Invention relates to a kind of laser projection device simultaneously.
Background technology
Laser display is with red, green, blue (RGB) tricolor laser Display Technique as light source, is different from tradition
The high-pressure mercury-vapor lamp of continuous spectrum and xenon lamp systems on scialyscope, this laser display terminates can the most again
Abundant gorgeous color in existing natural world.The LASER Light Source of three primary colours line source leads to light and selects optical maser wavelength tool
Standby color gamut space is big, color abundant species, color saturation high, particularly in terms of colour gamut, and energy
Enough show 72% of Color Range seen from human eye, and traditional light-source system is only 30%.
It addition, the principle of luminosity of LASER Light Source has broken the pattern of conventional light source electro-optic conversion, the life-span the highest can
Up to more than 20000 hours, being more than 5-10 times of conventional high-tension finsen lamp, maintenance cost uses with overall
Low cost, meanwhile, power consumption aspect is also about the 1/3 of conventional light source, and LASER Light Source is in process of production
The heavy metal material that environment is had threat will not be used, belong to energy-conserving and environment-protective light source.High-power semiconductor laser
The development of device more makes it be provided with obvious advantage, market application potential in high brightness, large-sized display
Huge.
But, there is the feature of high coherence in laser, and this feature can cause display picture exists serious
Speckle issue, the existence of laser speckle makes the gray scale of image that violent change occur, reduces dividing of image
Resolution, conceals the detailed information of image, reduces observer and extracts the ability of details from coherent image,
This hinders the development of practicality of laser display technology significantly, and speckle issue becomes the bottle of laser display development
Neck.
Prior art dissipates speckle technology mainly have introducing polarization diversity, vibration screen, introduce set specially
The screen of meter increases the bandwidth of wavelength, increases random phase sheet and shakes the methods such as phase plate.In prior art
Use LASER Excited Fluorescence powder to add the live width of laser spectrum, but sacrifice the advantage that laser colour gamut is big simultaneously,
And the scheme of LASER Excited Fluorescence powder to there is fluorescent material overheated, the problem that high brightness can not realize.Separately
Outward, prior art also uses the mode of vibration screen, but which is for hard screen, soft screen and big
Size screens etc. have difficulties, the most inapplicable for the display without projection screen.The employing vibration also having is random
The mode of phase plate suppresses speckle, but which can not be inherently eliminated speckle, and random phase sheet,
Diffusion sheets etc. can reduce the efficiency of light energy utilization.
Summary of the invention
The present invention provides a kind of device suppressing laser speckle, to solve the above-mentioned problems in the prior art.
The present invention additionally provides a kind of laser projection device.
The present invention provides a kind of device suppressing laser speckle, including: at least two group modular assemblies, described mould
Block assembly includes semiconductor laser and refrigerating plant, the temperature action of the outfan output of described refrigerating plant
In described semiconductor laser；
Often the temperature of the output of the described refrigerating plant in group modular assembly is different, accordingly, and often group module group
Between semiconductor laser in part, there is the temperature difference.
Preferably, described modular assembly also includes temperature control modules, and described temperature control modules connects described
Refrigerating plant, to control the temperature of described refrigerating plant output；
Between semiconductor laser in described often group modular assembly, there is the temperature difference, be to pass through temperature control modules
Control often to organize, between the semiconductor laser in modular assembly, there is the temperature difference.
Preferably, often the temperature range between the semiconductor laser in group modular assembly is more than or equal to 3 DEG C,
And less than or equal to 10 DEG C.
Preferably, often the temperature difference between the semiconductor laser in group modular assembly is identical, is 5 DEG C.
Preferably, often the temperature range of the semiconductor laser in group modular assembly is greater than equal to 0 DEG C, and little
In equal to 60 DEG C.
Preferably, also including total attemperating unit, described total moisture content controls in device connection often group modular assembly
Temperature control modules, to control the temperature set by each temperature control modules.
Preferably, described total attemperating unit connect often group modular assembly in temperature control modules, be described always
Attemperating unit is connected by the control mode that circuit connects often organizes the temperature control modules in modular assembly.
Preferably, described semiconductor laser includes RGB semiconductor laser white light module.
Preferably, described refrigerating plant uses air-cooled or water-cooling pattern refrigeration.
Preferably, described semiconductor laser is arranged on described refrigerating plant；Accordingly, described refrigeration dress
The temperature action of the outfan output put, in described semiconductor laser, is that described refrigerating plant is by contact institute
State semiconductor laser so that the temperature action of its output is in described semiconductor laser.
Preferably, described modular assembly uses the mode of subregion to be configured, the module arranged in same district
The temperature of the semiconductor laser in assembly is identical, the semiconductor laser in modular assembly in different subregions
Between there is the temperature difference.
Preferably, described modular assembly uses array format distribution to arrange.
The present invention additionally also provides for a kind of laser projection device, including the device of above-mentioned suppression laser speckle.
Compared with prior art, the invention have the advantages that
The present invention provides a kind of device suppressing laser speckle, and this device includes: at least two group modular assemblies,
Described modular assembly includes semiconductor laser and refrigerating plant, the temperature of the outfan output of described refrigerating plant
Degree acts on described semiconductor laser；Often the temperature of the output of the described refrigerating plant in group modular assembly is not
With, accordingly, often between the semiconductor laser in group modular assembly, there is the temperature difference.
The device of this suppression laser speckle that the present invention provides organizes modular assembly by arranging more, and often organizes mould
The temperature of the semiconductor laser in block assembly has difference, so that often organize the quasiconductor in modular assembly
The wavelength of the laser of the same color of laser instrument output is different, certain diversity occurs, and therefore, this device can
Realize the multiformity of optical maser wavelength, and, this device is simple, there is not other side effect, conforms to the principle of simplicity
Single easy angle effectively inhibits laser speckle effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of the suppression laser speckle device that the application first embodiment provides.
Fig. 2 is that the application first embodiment provides at different temperatures, red light semiconductor laser output
The schematic diagram of wavelength case.
Detailed description of the invention
The application first embodiment provides a kind of device suppressing laser speckle, and this device is to make multiple half
The wavelength of the laser of the same color of conductor laser output is different, forms diversity and the multiformity of wavelength, from
And the live width of semiconductor laser is increased, the speckle effect of corresponding laser also can substantially reduce.
Below by way of specific embodiment, this device is introduced and illustrates.
Fig. 1 is the structural representation of the suppression laser speckle device that the application first embodiment provides.Refer to
Fig. 1, the device of this suppression laser speckle includes at least two group modular assemblies, and described modular assembly includes quasiconductor
Laser instrument and refrigerating plant.
Accordingly, this device can include the some groups of module groups being made up of semiconductor laser and refrigerating plant
Part, each modular assembly can be regarded as a subregion, and this device is made up of several subregions above-mentioned.Often
In one subregion, include semiconductor laser and refrigerating plant, and the outfan output of this refrigerating plant
Temperature action in described semiconductor laser.
Owing to described semiconductor laser can dispel the heat under the effect of described refrigerating plant, temperature also may be used
To be regulated to a preset temperature according to refrigerating plant, often group modular assembly is respectively provided with independent refrigerating plant,
Therefore, the temperature often organizing the semiconductor laser in modular assembly can be according to the temperature of refrigerating plant output
Different and there is diversity, it is, often the semiconductor laser in group modular assembly has the temperature difference,
Temperature residing for semiconductor laser is different, and the wavelength of the laser of its output also has a undulatory property, therefore,
By adjusting the temperature of semiconductor laser, and then change the wavelength of the laser of its output.
Even if it should be noted that often organize, there is between the semiconductor laser in modular assembly the temperature difference, but should
The temperature difference does not interferes with the color of laser, such as, for exporting the semiconductor laser of HONGGUANG, when multiple
During the temperature difference of this semiconductor laser, it can also export HONGGUANG, the wavelength of the HONGGUANG only exported
Difference, in the case, the wavelength of input is belonging to the wave-length coverage of HONGGUANG to multiple semiconductor lasers, because of
This, its input remain as HONGGUANG, for the principle of exportable green glow and the semiconductor laser of blue light in red
The principle of light laser is similar, illustrates the most one by one at this.
In a word, by changing the temperature of semiconductor laser, thus it is possible to vary the wavelength of the laser of its output, enter
And, the wavelength of the exportable laser of semiconductor laser of different temperatures is different, it is achieved optical maser wavelength various
Property, reduce the coherence of light beam.The speckle effect of laser display is owing to the high coherence of laser beam causes
, therefore, use this device by reduce laser beam coherence, thus when reducing laser display dissipate
Speckle contrast.
It addition, the implementation simple possible of this device, as long as the temperature controlled between multiple semiconductor laser
Degree and the temperature difference, it is achieved simple, operability is extremely strong, and provided for laser display technology by this device
Great convenience.
Above-mentioned is to the introduction of this device and explanation by principle knowledge, below by way of the more specifically side of realization
The present embodiment is illustrated and introduces by formula.
From the point of view of preferred implementation, described refrigerating plant can be given described with the temperature of auto-control output
Semiconductor laser, but the regulation and control of this temperature may be less accurate, in order to ensure the accuracy of this device, can
To increase temperature control equipment in each modular assembly, in order to control the temperature of refrigerating plant output, the most just
Can control the temperature of described semiconductor laser, these regulation and control typically can use circuit realiration, therefore, this temperature
Degree control methods have advantage accurately.
Concrete, described modular assembly also includes temperature control modules, and described temperature control modules connects described
Refrigerating plant, to control the temperature of described refrigerating plant output.
Between semiconductor laser in described often group modular assembly, there is the temperature difference, be to pass through temperature control modules
Control often to organize, between the semiconductor laser in modular assembly, there is the temperature difference.
Below by way of semiconductor laser, refrigerating plant and temperature control equipment in binding modules assembly, this is pressed down
The device of laser speckle processed is described in detail.
First, described semiconductor laser is illustrated.
Described semiconductor laser is for Output of laser, and this laser instrument can be mono-colour laser, it is possible to
It is the white light laser being made up of red, green, blue, in the application of actual laser display, is more
Using RGB laser instrument, therefore, described semiconductor laser includes RGB semiconductor laser white light mould
Block.
But whether use which kind of semiconductor laser to be all applicable to this device, because this device is for any ripple
Long laser is respectively provided with corresponding effect, so, the kind of the semiconductor laser in this device is by appointing
What limits.
Secondly, described temperature control equipment is the output temperature for controlling described refrigerating plant, it is also possible to
It is interpreted as that this temperature control equipment can control the temperature of semiconductor laser.In disparate modules assembly half
The temperature of conductor laser is different, and therefore, the semiconductor laser in disparate modules assembly is had
Temperature has temperature contrast.
For the problem of the temperature difference between the semiconductor laser in disparate modules assembly, owing to the temperature difference more greatly may be used
Can affect the verity effect of laser display, the temperature difference is less to reducing the effect of speckle effect of laser and failing to understand
Aobvious, so, the scope for the temperature difference is arranged according to practical situations, generally, and different moulds
The temperature range between semiconductor laser in block assembly is greater than equal to 3 DEG C, and less than or equal to 10 DEG C.
Situation for this temperature difference illustrates, and the temperature difference between disparate modules assembly can be set as identical,
Difference, such as, the semiconductor laser in first modular assembly and second modular assembly can also be set as
The temperature difference of device is 5 DEG C, the temperature between semiconductor laser in second modular assembly and the 3rd modular assembly
Difference is 8 DEG C, and the temperature difference between semiconductor laser in the 3rd modular assembly and the 4th modular assembly is
10 DEG C, so the temperature difference between the semiconductor laser in four modular assemblies can have diversity, but should
It is the most obvious that diversity is typically arranged.
It addition, for the uniformity making laser linewidth that semiconductor laser exports, can be by disparate modules group
The temperature difference between part is set to identical temperature, it is preferred that this temperature difference could be arranged to 5 DEG C.
Such as, using multiple RGB semiconductor laser, the temperature control of first semiconductor laser is
20 DEG C, it is 25 DEG C that the temperature of the second semiconductor laser controls, and the temperature control of the 3rd semiconductor laser is
30 DEG C, after accurate temperature controlling, it addition, temperature control can according to practical situations select air-cooled or
Water-cooled, each color wavelength of the most multiple subregions occurs in that differentiation.
Fig. 2 is that the application first embodiment provides at different temperatures, red light semiconductor laser output
The schematic diagram of wavelength case.Refer under the red light semiconductor laser different temperatures that Fig. 2, Fig. 2 are tests
Wavelength, through detection understand, 20 DEG C, 25 DEG C, 30 DEG C time wavelength be respectively 637.8nm, 638.8nm and
639.8nm, if the modular assembly of three subregions works simultaneously, the live width of semiconductor laser is from original
2nm expands to 4nm, and, use the semiconductor laser light as laser display of aforesaid way setting
If source, its speckle effect can substantially reduce.
In addition, it is necessary to explanation, the situation of blue light and green light semiconductor and red light semiconductor laser
The situation of device is similar, and this is no longer going to repeat them.
From examples detailed above it can also be seen that control the different temperatures of different semiconductor laser, can be obvious
Affect the wavelength of the laser of different semiconductor laser output so that it is poor that the optical maser wavelength of each color occurs
Alienation, and then increase the live width of semiconductor laser so that laser speckle effect substantially reduces.
The temperature general control of the multiple RGB laser modules in common laser projection at same temperature,
So, the wavelength of the laser of each color of this semiconductor laser output is all identical, even if there being individuality
Difference, but the impact on wavelength is less, is negligible, and the application is specially by difference quasiconductor
The temperature of laser instrument controls within the scope of different temperature, and the change fluctuation of its wavelength can affect quasiconductor and swash
The live width of light device, and then reduce speckle effect.
Except arranging the temperature difference of the semiconductor laser in above-mentioned disparate modules assembly, simultaneously need to note arranging
The temperature range of the semiconductor laser in each modular assembly, generally, described semiconductor laser
The scope of application be 0 DEG C-60 DEG C, but in view of the problem in practical and life-span of semiconductor laser, preferably
The scope of application of semiconductor laser be set to 15 DEG C-35 DEG C.
Such as, introducing at above-mentioned example, it is 20 DEG C that the temperature of first semiconductor laser controls, the
It is 25 DEG C that the temperature of two semiconductor lasers controls, and it is 30 DEG C that the temperature of the 3rd semiconductor laser controls, also
Being exactly generally, the temperature of semiconductor laser is arranged on 15 DEG C-35 DEG C.
The above-mentioned more than half conductor laser of by the agency of and temperature control equipment, and can not obtain in modular assembly
Be refrigerating plant, this refrigerating plant is used for semiconductor laser radiating and cooling, described refrigerating plant
The temperature action of input output is in described semiconductor laser.Above-mentioned also mentioned, described refrigerating plant
Cryogenic temperature can be controlled by described temperature control equipment and arrange.
It should be noted that the relation of described refrigerating plant and described semiconductor laser can be contact,
Can also be contactless.
The heat of conventional mode usually contact passes to distribute, and will be arranged at by described semiconductor laser
On described refrigerating plant；Accordingly, the temperature action of the outfan output of described refrigerating plant is partly led in described
Body laser, is that described refrigerating plant is by contacting described semiconductor laser so that the temperature of its output is made
For described semiconductor laser.
Described refrigerating plant uses air-cooled or water-cooling pattern refrigeration.
Concrete, temperature control mode is mainly above two, and one is air-cooled, and air-cooled utilization is TEC
Refrigerator and external fan；Another kind is water-cooled, utilizes in heat sink below semiconductor laser and gets through water
The pipeline of flowing, the water temperature arranged by water cooling unit is freezed.
The refrigeration principle of described TEC refrigerator is as follows: semiconductor cooler (Thermo Electric Cooler) is
The Peltier effect utilizing semi-conducting material is made.So-called Peltier effect, refers to when DC current passes through
During the galvanic couple of two kinds of semi-conducting materials composition, absorb heat in its one end, the phenomenon of one end heat release.Heavily doped N-type
With the semi-conducting material that the Tellurobismuthite. of p-type is mainly used as TEC, Bismuth Telluride elements uses electrically coupled in series, and is
Parallel heating.TEC include some p-types and N-type to (group), they are connected together by electrode, and
It is clipped between two ceramic electrodes；When there being electric current to flow through from TEC, the heat that electric current produces can be from TEC
Opposite side is passed in side, produces " hot " side and " cold " side on TEC, here it is the heating of TEC and refrigeration
Principle.
No matter use which kind of mode to semiconductor laser cooling, as long as control semiconductor laser in advance
If temperature, and the temperature difference between different semiconductor lasers is in controlled range, belongs to the application
Protection domain.
Do not contact between semiconductor laser with refrigerating plant for contactless referring to, and pass through convection type
Or other modes make the temperature transfer extremely described semiconductor laser that refrigerating plant exports, for described quasiconductor
Laser instrument is lowered the temperature, and controls in corresponding temperature or temperature range.
Generally, the refrigeration of the above-mentioned contact being positioned on refrigerating plant by semiconductor laser is used
Mode, and contactless mode may be applied in some certain occasions.
Furthermore it is possible to modular assembly carries out subregion setting, described modular assembly uses the mode of subregion to carry out
Arranging, the temperature of the semiconductor laser in the modular assembly arranged in same district is identical, in different subregions
Modular assembly in semiconductor laser between there is the temperature difference.
Such as, many group red, green, blue semiconductor laser white light module and multiple temperature control equipment are set.
The plurality of white light module is arranged in the form of an array, chooses several white light module as the first subregion, its by
First temperature control equipment carries out temperature control heat radiation, chooses several white light module as the second subregion, and it is by
Two temperature control equipments carry out the first temperature control equipment under temperature control heat radiation, the first subregion and the second subregion and
Second temperature control equipment there is obvious temperature contrast, make the output wave of red, green, blue semiconductor laser
Long have notable difference, and the temperature of each subregion up to N subregion, can be made to control difference, Mei Gefen
The output wavelength of district's RGB semiconductor laser is different.
Meanwhile, according under reality application or particular case, it is also possible to exist and each subregion only has a mould
The situation of block assembly.
Control for the temperature difference between multiple different semiconductor lasers, except the temperature that above-mentioned employing is independent
Outside control module is controlled, it is also possible to use total attemperating unit that the above-mentioned temperature difference is carried out by modules assembly
Control.
Concrete, the device of described suppression laser speckle also includes total attemperating unit, and described total moisture content controls dress
Put to connect and often organize the temperature control modules in modular assembly, to control the temperature set by each temperature control modules
Degree.
It should be noted that described total attemperating unit can be connected by the control mode that circuit connects often organizes mould
Temperature control modules in block assembly.I.e. control the temperature in all modular assemblies by circuit, and different
The temperature difference between modular assembly.
When modular assembly is provided with subregion, the modular assembly in same district can be by a temperature control equipment control
Temperature processed, and described total attemperating unit can control the temperature of temperature control equipment of each subregion, and not
With the temperature difference between the temperature control equipment of subregion.
It addition, on the basis of above-mentioned first embodiment, utilize the device of above-mentioned suppression laser speckle, permissible
Producing laser projection device, the application the second embodiment provides a kind of laser projection device, and this device includes
The device of above-mentioned suppression laser speckle, owing to above-mentioned device to this suppression laser speckle has done detailed
Introducing and explanation, this embodiment refers to the explanation to the device of this suppression laser speckle of the above-mentioned first embodiment,
This is no longer going to repeat them.
Although the present invention is open as above with preferred embodiment, but it is not for limiting the present invention, Ren Heben
Skilled person without departing from the spirit and scope of the present invention, can make possible variation and amendment,
Therefore protection scope of the present invention should be defined in the range of standard with the claims in the present invention.
Claims (13)
1. the device suppressing laser speckle, it is characterised in that including: at least two group modular assemblies, institute
State modular assembly and include semiconductor laser and refrigerating plant, the temperature of the outfan output of described refrigerating plant
Act on described semiconductor laser；
Often the temperature of the output of the described refrigerating plant in group modular assembly is different, accordingly, and often group module group
Between semiconductor laser in part, there is the temperature difference.
The device of suppression laser speckle the most according to claim 1, it is characterised in that described module group
Part also includes temperature control modules, and described temperature control modules connects described refrigerating plant, to control described system
The temperature of device for cooling output；
Between semiconductor laser in described often group modular assembly, there is the temperature difference, be to pass through temperature control modules
Control often to organize, between the semiconductor laser in modular assembly, there is the temperature difference.
The device of suppression laser speckle the most according to claim 1, it is characterised in that often group module group
The temperature range between semiconductor laser in part is more than or equal to 3 DEG C, and less than or equal to 10 DEG C.
The device of suppression laser speckle the most according to claim 3, it is characterised in that often group module group
The temperature difference between semiconductor laser in part is identical, is 5 DEG C.
The device of suppression laser speckle the most according to claim 1, it is characterised in that often group module group
The temperature range of the semiconductor laser in part is greater than equal to 0 DEG C, and less than or equal to 60 DEG C.
The device of suppression laser speckle the most according to claim 2, it is characterised in that also include stagnation temperature
Control device, described total moisture content controls the temperature control modules in device connection often group modular assembly, every to control
Temperature set by individual temperature control modules.
The device of suppression laser speckle the most according to claim 6, it is characterised in that described total temperature control
Device connects often organizes the temperature control modules in modular assembly, and described total attemperating unit is connected by circuit
Control mode connects often organizes the temperature control modules in modular assembly.
The device of suppression laser speckle the most according to claim 1, it is characterised in that described quasiconductor
Laser instrument includes RGB semiconductor laser white light module.
The device of suppression laser speckle the most according to claim 1, it is characterised in that described refrigeration fills
Put and use air-cooled or water-cooling pattern refrigeration.
The device of suppression laser speckle the most according to claim 1, it is characterised in that described partly lead
Body laser is arranged on described refrigerating plant；Accordingly, the temperature of the outfan output of described refrigerating plant
Act on described semiconductor laser, be that described refrigerating plant is by contacting described semiconductor laser so that
The temperature action of its output is in described semiconductor laser.
The device of 11. suppression laser speckles according to claim 1, it is characterised in that described module group
Part uses the mode of subregion to be configured, the semiconductor laser in the modular assembly arranged in same district
Temperature is identical, has the temperature difference between the semiconductor laser in modular assembly in different subregions.
The device of 12. suppression laser speckles according to claim 1, it is characterised in that described module
Assembly uses array format distribution to arrange.
13. 1 kinds of laser projection devices, it is characterised in that include pressing down described in any one of claim 1-12
The device of laser speckle processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610511627.2A CN106019620A (en) | 2016-07-01 | 2016-07-01 | Device for inhibiting laser speckles and laser projection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610511627.2A CN106019620A (en) | 2016-07-01 | 2016-07-01 | Device for inhibiting laser speckles and laser projection device |
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| CN106019620A true CN106019620A (en) | 2016-10-12 |
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| CN201610511627.2A Pending CN106019620A (en) | 2016-07-01 | 2016-07-01 | Device for inhibiting laser speckles and laser projection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN106568396A (en) * | 2016-10-26 | 2017-04-19 | 深圳奥比中光科技有限公司 | Laser projector and depth camera thereof |
| CN107272308A (en) * | 2017-08-21 | 2017-10-20 | 青岛海信电器股份有限公司 | Laser projection device |
| WO2018120687A1 (en) * | 2016-12-30 | 2018-07-05 | 深圳市光峰光电技术有限公司 | Laser light source and display device |
| WO2018121059A1 (en) * | 2016-12-30 | 2018-07-05 | 深圳市光峰光电技术有限公司 | Laser light source and projection device |
| CN108267916A (en) * | 2016-12-30 | 2018-07-10 | 深圳市光峰光电技术有限公司 | Laser light source and display equipment |
| CN109038207A (en) * | 2018-07-27 | 2018-12-18 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of controllable temperature VCSEL device and preparation method thereof |
| CN110609393A (en) * | 2019-09-23 | 2019-12-24 | 山西傲维光视光电科技有限公司 | Laser light source system for balancing service life of laser and eliminating speckles for cinema |
| WO2020144794A1 (en) * | 2019-01-10 | 2020-07-16 | 三菱電機株式会社 | Semiconductor laser device |
| CN114374145A (en) * | 2022-01-12 | 2022-04-19 | 南京大学 | REC semiconductor laser array wavelength control system |
| JP2022089985A (en) * | 2019-01-10 | 2022-06-16 | 三菱電機株式会社 | Semiconductor laser device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020196414A1 (en) * | 2000-07-10 | 2002-12-26 | Manni Jeffrey Glenn | Systems and methods for speckle reduction through bandwidth enhancement |
| JP2004144794A (en) * | 2002-10-21 | 2004-05-20 | Sony Corp | Illuminator and picture display device |
| CN200953056Y (en) * | 2006-09-13 | 2007-09-26 | 中国科学院光电研究院 | Laser homogeneous coupling device |
| JP2009283778A (en) * | 2008-05-23 | 2009-12-03 | Sony Corp | Semiconductor laser module and projection type display device |
| JP2011165786A (en) * | 2010-02-08 | 2011-08-25 | Seiko Epson Corp | Light source device, image display apparatus, and monitor |
| US20130010265A1 (en) * | 2011-07-07 | 2013-01-10 | ReadID Inc. | Despeckling devices and methods |
| CN103904554A (en) * | 2012-12-26 | 2014-07-02 | 索尼公司 | Cooling device and semiconductor laser device |
| CN205880392U (en) * | 2016-07-01 | 2017-01-11 | 中国科学院光电研究院 | Device and laser projection device that restrain laser speckle |
-
2016
- 2016-07-01 CN CN201610511627.2A patent/CN106019620A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020196414A1 (en) * | 2000-07-10 | 2002-12-26 | Manni Jeffrey Glenn | Systems and methods for speckle reduction through bandwidth enhancement |
| JP2004144794A (en) * | 2002-10-21 | 2004-05-20 | Sony Corp | Illuminator and picture display device |
| CN200953056Y (en) * | 2006-09-13 | 2007-09-26 | 中国科学院光电研究院 | Laser homogeneous coupling device |
| JP2009283778A (en) * | 2008-05-23 | 2009-12-03 | Sony Corp | Semiconductor laser module and projection type display device |
| JP2011165786A (en) * | 2010-02-08 | 2011-08-25 | Seiko Epson Corp | Light source device, image display apparatus, and monitor |
| US20130010265A1 (en) * | 2011-07-07 | 2013-01-10 | ReadID Inc. | Despeckling devices and methods |
| CN103904554A (en) * | 2012-12-26 | 2014-07-02 | 索尼公司 | Cooling device and semiconductor laser device |
| CN205880392U (en) * | 2016-07-01 | 2017-01-11 | 中国科学院光电研究院 | Device and laser projection device that restrain laser speckle |
Non-Patent Citations (1)
| Title |
|---|
| GUANG ZHENG ET.AL: "Laser Digital Cinema Projector", 《JOURNAL OF DISPLAY TECHNOLOGY》 * |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106568396A (en) * | 2016-10-26 | 2017-04-19 | 深圳奥比中光科技有限公司 | Laser projector and depth camera thereof |
| CN106501959A (en) * | 2016-10-26 | 2017-03-15 | 深圳奥比中光科技有限公司 | A kind of face battle array laser-projector and its depth camera |
| WO2018120687A1 (en) * | 2016-12-30 | 2018-07-05 | 深圳市光峰光电技术有限公司 | Laser light source and display device |
| WO2018121059A1 (en) * | 2016-12-30 | 2018-07-05 | 深圳市光峰光电技术有限公司 | Laser light source and projection device |
| CN108267916A (en) * | 2016-12-30 | 2018-07-10 | 深圳市光峰光电技术有限公司 | Laser light source and display equipment |
| CN108267915A (en) * | 2016-12-30 | 2018-07-10 | 深圳市光峰光电技术有限公司 | Laser light source and display equipment |
| CN108267917A (en) * | 2016-12-30 | 2018-07-10 | 深圳市光峰光电技术有限公司 | laser light source and projection device |
| CN107272308B (en) * | 2017-08-21 | 2020-05-19 | 海信视像科技股份有限公司 | Laser projection device |
| CN107272308A (en) * | 2017-08-21 | 2017-10-20 | 青岛海信电器股份有限公司 | Laser projection device |
| CN109038207A (en) * | 2018-07-27 | 2018-12-18 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of controllable temperature VCSEL device and preparation method thereof |
| WO2020144794A1 (en) * | 2019-01-10 | 2020-07-16 | 三菱電機株式会社 | Semiconductor laser device |
| JPWO2020144794A1 (en) * | 2019-01-10 | 2021-09-09 | 三菱電機株式会社 | Semiconductor laser device |
| JP2022089985A (en) * | 2019-01-10 | 2022-06-16 | 三菱電機株式会社 | Semiconductor laser device |
| JP7145977B2 (en) | 2019-01-10 | 2022-10-03 | 三菱電機株式会社 | Semiconductor laser device |
| JP7297121B2 (en) | 2019-01-10 | 2023-06-23 | 三菱電機株式会社 | Semiconductor laser device |
| CN110609393A (en) * | 2019-09-23 | 2019-12-24 | 山西傲维光视光电科技有限公司 | Laser light source system for balancing service life of laser and eliminating speckles for cinema |
| CN114374145A (en) * | 2022-01-12 | 2022-04-19 | 南京大学 | REC semiconductor laser array wavelength control system |
| CN114374145B (en) * | 2022-01-12 | 2023-09-29 | 南京大学 | REC semiconductor laser array wavelength control system |
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