CN106010356B - The adhesive linkage of self-adhesion conductive glue slice - Google Patents
The adhesive linkage of self-adhesion conductive glue slice Download PDFInfo
- Publication number
- CN106010356B CN106010356B CN201610591065.7A CN201610591065A CN106010356B CN 106010356 B CN106010356 B CN 106010356B CN 201610591065 A CN201610591065 A CN 201610591065A CN 106010356 B CN106010356 B CN 106010356B
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- Prior art keywords
- adhesive linkage
- glycerine
- self
- adhesion
- diablement fort
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- 239000000853 adhesive Substances 0.000 title claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 24
- 239000003292 glue Substances 0.000 title claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 16
- 239000002994 raw material Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000003756 stirring Methods 0.000 claims abstract description 14
- 240000008042 Zea mays Species 0.000 claims abstract description 7
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 claims abstract description 7
- 235000002017 Zea mays subsp mays Nutrition 0.000 claims abstract description 7
- 235000005822 corn Nutrition 0.000 claims abstract description 7
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims abstract description 5
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 235000021355 Stearic acid Nutrition 0.000 claims abstract description 5
- 239000010426 asphalt Substances 0.000 claims abstract description 5
- 239000001768 carboxy methyl cellulose Substances 0.000 claims abstract description 5
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims abstract description 5
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 5
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims abstract description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 239000008117 stearic acid Substances 0.000 claims abstract description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 36
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- 235000011187 glycerol Nutrition 0.000 claims description 18
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 17
- 235000019441 ethanol Nutrition 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 10
- 229910001593 boehmite Inorganic materials 0.000 claims description 10
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 10
- 239000000194 fatty acid Substances 0.000 claims description 10
- 229930195729 fatty acid Natural products 0.000 claims description 10
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 10
- 230000001225 therapeutic effect Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000002775 capsule Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229920002545 silicone oil Polymers 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- 108010010803 Gelatin Proteins 0.000 claims description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 6
- 239000007853 buffer solution Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 6
- 229920000159 gelatin Polymers 0.000 claims description 6
- 239000008273 gelatin Substances 0.000 claims description 6
- 235000019322 gelatine Nutrition 0.000 claims description 6
- 235000011852 gelatine desserts Nutrition 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229920001778 nylon Polymers 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 229940048842 sodium xylenesulfonate Drugs 0.000 claims description 6
- QUCDWLYKDRVKMI-UHFFFAOYSA-M sodium;3,4-dimethylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1C QUCDWLYKDRVKMI-UHFFFAOYSA-M 0.000 claims description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 239000011780 sodium chloride Substances 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 4
- 238000010792 warming Methods 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- JJTUDXZGHPGLLC-UHFFFAOYSA-N lactide Chemical compound CC1OC(=O)C(C)OC1=O JJTUDXZGHPGLLC-UHFFFAOYSA-N 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 235000011054 acetic acid Nutrition 0.000 claims 1
- 238000005660 chlorination reaction Methods 0.000 claims 1
- 235000013312 flour Nutrition 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000395 magnesium oxide Substances 0.000 abstract description 4
- 230000000844 anti-bacterial effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 4
- 230000002496 gastric effect Effects 0.000 description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- 239000004568 cement Substances 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 2
- 210000001035 gastrointestinal tract Anatomy 0.000 description 2
- 230000035784 germination Effects 0.000 description 2
- 230000033764 rhythmic process Effects 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 208000018522 Gastrointestinal disease Diseases 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 208000010643 digestive system disease Diseases 0.000 description 1
- 208000018685 gastrointestinal system disease Diseases 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 210000002460 smooth muscle Anatomy 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J101/00—Adhesives based on cellulose, modified cellulose, or cellulose derivatives
- C09J101/08—Cellulose derivatives
- C09J101/26—Cellulose ethers
- C09J101/28—Alkyl ethers
- C09J101/286—Alkyl ethers substituted with acid radicals
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/36014—External stimulators, e.g. with patch electrodes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L89/00—Compositions of proteins; Compositions of derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/205—Adhesives in the form of films or foils characterised by their carriers characterised by the backing impregnating composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/32—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond
- D06M11/36—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond with oxides, hydroxides or mixed oxides; with salts derived from anions with an amphoteric element-oxygen bond
- D06M11/45—Oxides or hydroxides of elements of Groups 3 or 13 of the Periodic Table; Aluminates
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
- D06M23/06—Processes in which the treating agent is dispersed in a gas, e.g. aerosols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2401/00—Presence of cellulose
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2101/00—Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated
- D06M2101/02—Natural fibres, other than mineral fibres
- D06M2101/04—Vegetal fibres
- D06M2101/06—Vegetal fibres cellulosic
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Textile Engineering (AREA)
- Biomedical Technology (AREA)
- Dispersion Chemistry (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Inorganic Chemistry (AREA)
- Radiology & Medical Imaging (AREA)
- Biophysics (AREA)
- Heart & Thoracic Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
The present invention provides a kind of adhesive linkage of self-adhesion conductive glue slice, is made of the raw material of following mass ratio：Nitrile rubber 2, white carbon 1.2, stearic acid 2.2, carboxymethyl cellulose 4, corn plumule powder 2, live emulsified asphalt 3, magnesia 0.6, epoxy resin 0.8, above-mentioned raw materials are in closed container, 125-155 DEG C of temperature continuously stirs 15min or more to get the material of adhesive linkage.The adhesive linkage of the present invention has higher adhesiveness, and conductive layer firmly can be adhered on flexible slide glass, had the function of antibacterial.
Description
Technical field
The present invention relates to field of medical device more particularly to a kind of adhesive linkages of self-adhesion conductive glue slice.
Background technology
The a certain specific region of gastrointestinal tract can drive gastrointestinal smooth muscle to shrink, the control basic bioelectricity rhythm and pace of moving things of gastrointestinal tract,
Medically this specific region is referred to as gastrointestinal pacemaker point (Pacemaker).
WeiDongLi Capsule therapeutic equipment operation principle, which is the electrical activity based on gastrointestinal pacemaker point, to be driven by impressed current stimulation, promoted
Disorderly gastrointestinal electrical activity is set to generate following effect, to restore normal rhythm, to reach treatment various functions gastrointestinal disease
Purpose.
Therapeutic electrode is typically to act on human body by self-adhesion conductive glue slice, and therapeutic electrode is connect by realization with human body, from
Viscous conductive glue slice has the function of conductive and adherency.The existing self-adhesion conductive glue slice for WeiDongLi Capsule therapeutic equipment is being adhered to
Before on skin, it usually needs use alcohol and degreaser, carry out degreasing to skin surface and disinfect, then again lead self-adhesion
Electric film is adhered on the skin after degreasing, disinfection, cumbersome using process, if skin surface does not have degreasing or cleaning dry
Only, then the conductive effect and adhesiving effect of self-adhesion conductive glue slice can be influenced.
Invention content
The purpose of the present invention is to provide the self-adhesions of a kind of adhesive linkage of self-adhesion conductive glue slice and WeiDongLi Capsule therapeutic equipment to lead
Electric film, to solve the above technical problems.
The technical problems to be solved by the invention are realized using following technical scheme：
A kind of adhesive linkage of self-adhesion conductive glue slice, which is characterized in that be made of the raw material of following mass ratio：
Nitrile rubber 2, white carbon 1.2, stearic acid 2.2, carboxymethyl cellulose 4, corn plumule powder 2, emulsified asphalt 3 of living,
Magnesia 0.6, epoxy resin 0.8,
Above-mentioned raw materials are in closed container, 125-155 DEG C of temperature, continuously stir 15min or more to get the object of adhesive linkage
Material.
The corn plumule powder is ground using the niblet of germination, and the length of corn germination is 3.5mm.
Adhesive linkage has higher adhesiveness, and conductive layer firmly can be adhered on flexible slide glass, has antibacterial work
With.
A kind of self-adhesion conductive glue slice of WeiDongLi Capsule therapeutic equipment, which is characterized in that including flexible slide glass and be attached to flexible load
The self-adhesion conducting resinl on piece surface,
Flexible slide glass is using diablement fort as carrier, and coating plastic material forms on diablement fort, the diablement fort cotton content
35%, containing fiber crops amount 65%, diablement fort coating plastic material before is first impregnated 2 hours in buffer solution, buffer solution be acetic acid, ethyl alcohol,
The mass fraction of the mixed solution of glycerine, water, each composition of mixed solution is：It is acetic acid 2.5%, ethyl alcohol 15.5%, glycerine 7%, remaining
Amount is water；Diablement fort after immersion takes out, and is dried with 70-75 DEG C of nitrogen stream, carries boehmite powder in nitrogen stream, often stands
Contain boehmite powder 0.2g, after nitrogen stream dries diablement fort, one layer of boehmite powder of diablement fort surface adhesion in the nitrogen of square rice；
Then the plastic material of melting is coated in the surface of diablement fort, up to flexible slide glass after being cooled to；
The self-adhesion conducting resinl includes adhesive linkage, conductive layer, clean layer, and the one side of the conductive layer is secured by adhesive linkage
Be adhered on flexible slide glass, the another side of the conductive layer coats clean layer, and the thickness of clean layer is 0.25mm；
The adhesive linkage is made of the raw material of following mass ratio：
Nitrile rubber 2, white carbon 1.2, stearic acid 2.2, carboxymethyl cellulose 4, corn plumule powder 2, emulsified asphalt 3 of living,
Magnesia 0.6, epoxy resin 0.8,
Above-mentioned raw materials are in closed container, 125-155 DEG C of temperature, continuously stir 15min or more to get the object of adhesive linkage
Material；
The conductive layer is made of the raw material of following mass ratio：
Glycerine 6, gelatin 13, polyester 2.3, carries silver-bearing copper silicone oil 3.5, polytetrafluoroethylene (PTFE) 4, rosin 2.8, gathers nylon fiber 5.5
Second lactide 1.2,
By rosin heating to molten condition, glycerine and gelatin is then added, is thoroughly mixed uniformly, nylon is then added
Fiber, polyester, polytetrafluoroethylene (PTFE) and poly (glycolide-lactide), in closed container, temperature is maintained at 175 DEG C, persistently stirs 5min, finally
It is added and carries silver-bearing copper silicone oil, continue to stir 15min, inject the sheet for being made that thickness is 2-3.5mm in mold；
The clean layer is formed by the raw material mixture of following mass ratio：
Glycerine 5, fatty acid diethanolamine 1.6, alcohol 3, Sucus Luffae 6, sodium xylene sulfonate 0.6, fatty acid amide 2.3,
Sodium chloride 1.3, water 8,
Water is heated to 85 DEG C, wherein by glycerine dissolving, fatty acid diethanolamine, sodium xylene sulfonate, fat is then added
Fat acid amide, continuously stirs 5min or more, and 10min is refrigerated at a temperature of being placed in -12 DEG C；- 2 DEG C are warming up to, 5min is kept the temperature；It rises again
Temperature to 20 DEG C, keep the temperature 10min, be then mixed evenly with alcohol, sodium chloride and Sucus Luffae to get.
The silver ion for carrying silver-bearing copper silicone oil derives from silver nitrate, and copper ion source is in copper nitrate, the quality point of silver nitrate
Number is 3.5%, and the mass fraction of copper nitrate is 2.5%.
The beneficial effects of the invention are as follows：
The self-adhesion conductive glue slice of the present invention is suitable for WeiDongLi Capsule therapeutic equipment, has excellent electric conductivity and adhesiveness, note attached
Before skin surface, degreasing need not be carried out to skin and is disinfected, the clean layer of self-adhesion conductive glue slice can be to skin
The grease on surface is emulsified and is absorbed, and obstruction of the oil film to electric current of skin surface is eliminated, and clean layer also acts as clearly skin
The effect of clean disinfection.
Flexible slide glass has preferable pliability, and plastic material is coated on diablement fort, and diablement fort can be made to have higher bullet
Property, convenient for being bonded with adhesive linkage, diablement fort surface attached boehmite powder, can reduce during plastic cement coats on diablement fort
Plastic cement immerses the amount of diablement fort fibrous inside, and the presence of boehmite powder can make the plastic cement rapid curing contacted with diablement fort, realizes
To the package of diablement fort.
Adhesive linkage has higher adhesiveness, and conductive layer firmly can be adhered on flexible slide glass, has antibacterial work
With.
Conductive layer is connected with therapeutic electrode, and conductive layer has preferable electric conductivity and adhesiveness, and elasticity preferably, restore by shape
Power is strong.
It is strong to clean layer adhesion, there is good electric conductivity, the oil membrane for absorbing skin surface can be emulsified, there is cleaning
Skin and effect to skin degerming.
Specific implementation mode
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below
Specific embodiment is closed, the present invention is further explained, but following embodiments are only the preferred embodiment of the present invention, and not all.
Based on the implementation example in the implementation mode, those skilled in the art's obtained other realities without making creative work
Example is applied, protection scope of the present invention is belonged to.
A kind of self-adhesion conductive glue slice of WeiDongLi Capsule therapeutic equipment, including flexible slide glass and the self-adhesion for being attached to flexible slide surface
Conducting resinl,
The flexibility slide glass is using diablement fort as carrier, and coating plastic material forms on diablement fort, and the diablement fort contains
Cotton amount 35%, amount containing fiber crops 65%, diablement fort first impregnates 2 hours in buffer solution before coating plastic material, and buffer solution is acetic acid, second
The mass fraction of the mixed solution of alcohol, glycerine, water, each composition of mixed solution is：Acetic acid 2.5%, ethyl alcohol 15.5%, glycerine 7%,
Surplus is water；Diablement fort after immersion takes out, and is dried with 70-75 DEG C of nitrogen stream, carries boehmite powder in nitrogen stream, often
Contain boehmite powder 0.2g, after nitrogen stream dries diablement fort, one layer of boehmite of diablement fort surface adhesion in the nitrogen of cubic meter
Powder；Then the plastic material of melting is coated in the surface of diablement fort, up to flexible slide glass after being cooled to；
The self-adhesion conducting resinl includes adhesive linkage, conductive layer, clean layer, and the one side of the conductive layer is secured by adhesive linkage
Be adhered on flexible slide glass, the another side of the conductive layer coats clean layer, and the thickness of clean layer is 0.25mm；
The adhesive linkage is made of the raw material of following mass ratio：
Nitrile rubber 2, white carbon 1.2, stearic acid 2.2, carboxymethyl cellulose 4, corn plumule powder 2, emulsified asphalt 3 of living,
Magnesia 0.6, epoxy resin 0.8,
Above-mentioned raw materials are in closed container, 125-155 DEG C of temperature, continuously stir 15min or more to get the object of adhesive linkage
Material；
The conductive layer is made of the raw material of following mass ratio：
Glycerine 6, gelatin 13, polyester 2.3, carries silver-bearing copper silicone oil 3.5, polytetrafluoroethylene (PTFE) 4, rosin 2.8, gathers nylon fiber 5.5
Second lactide 1.2,
By rosin heating to molten condition, glycerine and gelatin is then added, is thoroughly mixed uniformly, nylon is then added
Fiber, polyester, polytetrafluoroethylene (PTFE) and poly (glycolide-lactide), in closed container, temperature is maintained at 175 DEG C, persistently stirs 5min, finally
It is added and carries silver-bearing copper silicone oil, continue to stir 15min, inject the sheet for being made that thickness is 2-3.5mm in mold；
The clean layer is formed by the raw material mixture of following mass ratio：
Glycerine 5, fatty acid diethanolamine 1.6, alcohol 3, Sucus Luffae 6, sodium xylene sulfonate 0.6, fatty acid amide 2.3,
Sodium chloride 1.3, water 8,
Water is heated to 85 DEG C, wherein by glycerine dissolving, fatty acid diethanolamine, sodium xylene sulfonate, fat is then added
Fat acid amide, continuously stirs 5min or more, and 10min is refrigerated at a temperature of being placed in -12 DEG C；- 2 DEG C are warming up to, 5min is kept the temperature；It rises again
Temperature to 20 DEG C, keep the temperature 10min, be then mixed evenly with alcohol, sodium chloride and Sucus Luffae to get.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
For personnel it should be appreciated that the present invention is not limited to the above embodiments, described in the above embodiment and specification is only the present invention
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also has various
Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute
Attached claims and its equivalent thereof.
Claims (1)
1. a kind of self-adhesion conductive glue slice of WeiDongLi Capsule therapeutic equipment, including flexible slide glass are led with the self-adhesion for being attached to flexible slide surface
Electric glue, it is characterised in that the flexibility slide glass is using diablement fort as carrier, and coating plastic material forms on diablement fort, the cotton
Burlap cotton content 35%, amount containing fiber crops 65%, diablement fort first impregnates 2 hours in buffer solution before coating plastic material, and buffer solution is
The mass fraction of the mixed solution of acetic acid, ethyl alcohol, glycerine, water, each composition of mixed solution is：Acetic acid 2.5%, ethyl alcohol 15.5%,
Glycerine 7%, surplus are water；Diablement fort after immersion takes out, and is dried with 70-75 DEG C of nitrogen stream, and Bo Mu is carried in nitrogen stream
Mountain flour contains boehmite powder 0.2g, after nitrogen stream dries diablement fort, one layer of diablement fort surface adhesion in every cubic metre of nitrogen
Boehmite powder；Then the plastic material of melting is coated in the surface of diablement fort, up to flexible slide glass after being cooled to；
The self-adhesion conducting resinl includes adhesive linkage, conductive layer, clean layer, and the one side of the conductive layer is firmly glued by adhesive linkage
It is attached on flexible slide glass, the another side of the conductive layer coats clean layer, and the thickness of clean layer is 0.25mm；
The adhesive linkage is made of the raw material of following mass ratio：
Nitrile rubber 2, white carbon 1.2, stearic acid 2.2, carboxymethyl cellulose 4, corn plumule powder 2, emulsified asphalt 3 of living, oxidation
Magnesium 0.6, epoxy resin 0.8,
Above-mentioned raw materials are in closed container, 125-155 DEG C of temperature, continuously stir 15min or more to get the material of adhesive linkage；
The conductive layer is made of the raw material of following mass ratio：
Glycerine 6, gelatin 13, polyester 2.3, carries silver-bearing copper silicone oil 3.5, polytetrafluoroethylene (PTFE) 4, rosin 2.8, poly- second third at nylon fiber 5.5
Lactide 1.2,
By rosin heating to molten condition, glycerine and gelatin is then added, is thoroughly mixed uniformly, it is fine that nylon is then added
Dimension, polyester, polytetrafluoroethylene (PTFE) and poly (glycolide-lactide), in closed container, temperature is maintained at 175 DEG C, persistently stirs 5min, finally plus
Enter to carry silver-bearing copper silicone oil, continue to stir 15min, injects the sheet for being made that thickness is 2-3.5mm in mold；
The clean layer is formed by the raw material mixture of following mass ratio：
Glycerine 5, fatty acid diethanolamine 1.6, alcohol 3, Sucus Luffae 6, sodium xylene sulfonate 0.6, fatty acid amide 2.3, chlorination
Sodium 1.3, water 8, water are heated to 85 DEG C, by glycerine dissolving wherein, then be added fatty acid diethanolamine, sodium xylene sulfonate,
Fatty acid amide continuously stirs 5min or more, and 10min is refrigerated at a temperature of being placed in -12 DEG C；- 2 DEG C are warming up to, 5min is kept the temperature；Again
Be warming up to 20 DEG C, keep the temperature 10min, be then mixed evenly with alcohol, sodium chloride and Sucus Luffae to get.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610591065.7A CN106010356B (en) | 2016-07-25 | 2016-07-25 | The adhesive linkage of self-adhesion conductive glue slice |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610591065.7A CN106010356B (en) | 2016-07-25 | 2016-07-25 | The adhesive linkage of self-adhesion conductive glue slice |
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| CN106010356A CN106010356A (en) | 2016-10-12 |
| CN106010356B true CN106010356B (en) | 2018-10-23 |
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Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4706680A (en) * | 1986-06-30 | 1987-11-17 | Nepera Inc. | Conductive adhesive medical electrode assemblies |
| CN102973422A (en) * | 2011-09-04 | 2013-03-20 | 重庆市彭水县彭双科技有限公司 | Production method of hand sanitizer |
| EP2897798A4 (en) * | 2012-09-24 | 2016-03-09 | Celanese Acetate Llc | Fibrous substrates adhered with substituted cellulose ester adhesives and methods relating thereto |
| CN104371614B (en) * | 2014-11-07 | 2016-08-24 | 苏州维泰生物技术有限公司 | A kind of medical use hydrocolloid pressure sensitive adhesive and preparation method thereof |
| CN104479598B (en) * | 2014-11-27 | 2016-10-19 | 苏州市贝克生物科技有限公司 | Water proofing property medical adhesive and preparation method thereof |
| CN104479583A (en) * | 2014-11-27 | 2015-04-01 | 苏州市贝克生物科技有限公司 | Medical adhesive and preparation method thereof |
| CN104893601B (en) * | 2015-05-19 | 2017-05-17 | 中国航空工业集团公司北京航空材料研究院 | Conductive adhesive film with two conductive structures and preparation method of conductive adhesive film |
| CN105696110A (en) * | 2016-02-26 | 2016-06-22 | 哈尔滨工业大学深圳研究生院 | Conductive nanofiber and preparation method and application thereof |
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