CN106000779A - Glue dispensing mechanism of LED lamp die bonder - Google Patents

Glue dispensing mechanism of LED lamp die bonder Download PDF

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Publication number
CN106000779A
CN106000779A CN201610633273.9A CN201610633273A CN106000779A CN 106000779 A CN106000779 A CN 106000779A CN 201610633273 A CN201610633273 A CN 201610633273A CN 106000779 A CN106000779 A CN 106000779A
Authority
CN
China
Prior art keywords
glue
glue dispensing
dripping head
glue dripping
applying mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610633273.9A
Other languages
Chinese (zh)
Inventor
汪锐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201610633273.9A priority Critical patent/CN106000779A/en
Publication of CN106000779A publication Critical patent/CN106000779A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention discloses a glue dispensing mechanism of an LED lamp die bonder. The glue dispensing mechanism comprises a connecting seat, the upper surface of the connecting seat is fixed to the piston rod of a cylinder, the lower surface of the connecting seat is provided with a motor driven rotating shaft, the rotating shaft is provided with a rotating arm, one end of the rotating arm is provided with two hangers, a glue dispensing head fixing plate is horizontally arranged between the two hangers, the center of the glue dispensing head fixing plate is vertically provided with a glue dispensing device, the glue dispensing device comprises a cylindrical pedestal, two ends of the pedestal are respectively provided with a glue dispensing head A and a glue dispensing head B, a glue disc and a cleaning disc are arranged under the glue dispensing device, the bottom of the cleaning disc is provided with a hairbrush, and a cleaning agent is arranged in the cleaning disc. The glue dispensing mechanism can meet glue dispensing of different glue points, and also can remove solidified glue on the glue dispensing heads.

Description

A kind of glue applying mechanism of LED bonder
Technical field
The present invention relates to a kind of glue applying mechanism, particularly to the some glue of a kind of LED bonder Mechanism.
Background technology
Development along with LED technology so that LED is widely used in lighting field, and LED The manufacturing technology of lamp such as die bond technology development the most therewith.Point glue is important in die bond technology One ring.LED bonder often will identical carrier is solid different types of crystal, different crystal May corresponding different glue point, and Glue dripping head can solidify after a period of time that worked on glue, Affect precision for dispensing glue.To this end, it is proposed that the glue applying mechanism of a kind of LED bonder.
Summary of the invention
Present invention is primarily targeted at the glue applying mechanism that a kind of LED bonder is provided, can With the some glue of satisfied different glue points, the glue of solidification on Glue dripping head can be removed simultaneously, can be effective Solve the problem in background technology.
For achieving the above object, the technical scheme that the present invention takes is:
The glue applying mechanism of a kind of LED bonder, including connecting seat, table on described connection seat The piston rod of face and cylinder is fixed, and lower surface is provided with the rotary shaft of driven by motor, described rotary shaft Being provided with turning arm, described turning arm one end is provided with two hangers, water between said two hangers Putting down and be provided with Glue dripping head fixed plate, described Glue dripping head fixed plate center vertical is provided with point glue equipment, institute State point glue equipment and include that cylindrical base, described pedestal are respectively arranged at two ends with Glue dripping head A and put glue Head B, is provided with lacquer disk(-sc) and cleaning dish below described point glue equipment, described cleaning tray bottom is provided with hair Brush, inside fills abluent.
Further, described abluent is ethanol.
Further, described Glue dripping head fixed plate can rotate.
Further, described Glue dripping head A is cylindric, and described Glue dripping head B is flat column.
The present invention can move up and down under the driving of cylinder, adjusts the height of glue applying mechanism, Under the drive of motor, turning arm moves around rotation axis horizontal, and pedestal is respectively arranged at two ends with a glue Head A and Glue dripping head B, can meet the some glue of different glue point, be provided with lacquer disk(-sc) below point glue equipment With cleaning dish, described cleaning tray bottom is provided with hairbrush, and inside fills abluent, can remove a little The glue of solidification on glue head.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the present invention;
Fig. 2 is the close-up schematic view of structure at A in Fig. 1;
Fig. 3 is the structural representation of point glue equipment.
In figure: 1, hangers;2, Glue dripping head fixed plate;3, turning arm;4, point glue equipment; 5, rotary shaft;6, seat is connected;7, cylinder;8, lacquer disk(-sc);9, cleaning dish;10, hairbrush; 11, pedestal;12, piston rod;13, Glue dripping head A;14, Glue dripping head B.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be prone to bright with effect White understanding, below in conjunction with detailed description of the invention, is expanded on further the present invention.
As shown in Figures 1 to 3, the glue applying mechanism of a kind of LED bonder, including connecting seat, The piston rod of described connection seat upper surface and cylinder is fixed, and lower surface is provided with the rotation of driven by motor Axle, described rotary shaft is provided with turning arm, and described turning arm one end is provided with two hangers, described Between two hangers, level is provided with Glue dripping head fixed plate, and described Glue dripping head fixed plate center vertical sets Cylindrical base, described pedestal are respectively arranged at two ends with to have point glue equipment, described point glue equipment to include Glue dripping head A and Glue dripping head B, is provided with lacquer disk(-sc) and cleaning dish below described point glue equipment, described clearly Being provided with hairbrush bottom dishwashing, inside fills abluent.
Preferably, described abluent is ethanol, can be gone by the glue being solidificated on Glue dripping head Remove.
Preferably, described Glue dripping head fixed plate can rotate, in that context it may be convenient to changes Glue dripping head.
Preferably, described Glue dripping head A is cylindric, and described Glue dripping head B is flat column, can To select difform Glue dripping head as required.
By the way of explanation, only describe some one exemplary embodiment of the present invention above, undoubtedly, For those of ordinary skill in the art, in the case of without departing from the spirit and scope of the present invention, permissible By various different modes, described embodiment is modified.Therefore, above-mentioned accompanying drawing and be described in this It is illustrative in matter, should not be construed as the restriction to the claims in the present invention protection domain.

Claims (4)

1. a glue applying mechanism for LED bonder, including connecting seat, it is characterised in that: institute Stating and connect the piston rod of seat upper surface and cylinder and fix, lower surface is provided with the rotation of driven by motor Axle, described rotary shaft is provided with turning arm, and described turning arm one end is provided with two hangers, described Between two hangers, level is provided with Glue dripping head fixed plate, and described Glue dripping head fixed plate center vertical sets Cylindrical base, described pedestal are respectively arranged at two ends with to have point glue equipment, described point glue equipment to include Glue dripping head A and Glue dripping head B, is provided with lacquer disk(-sc) and cleaning dish below described point glue equipment, described clearly Being provided with hairbrush bottom dishwashing, inside fills abluent.
The glue applying mechanism of a kind of LED bonder the most according to claim 1, its feature It is: described abluent is ethanol.
The glue applying mechanism of a kind of LED bonder the most according to claim 1, its feature It is: described Glue dripping head fixed plate can rotate.
The glue applying mechanism of a kind of LED bonder the most according to claim 1, its feature Being: described Glue dripping head A is cylindric, described Glue dripping head B is flat column.
CN201610633273.9A 2016-08-04 2016-08-04 Glue dispensing mechanism of LED lamp die bonder Pending CN106000779A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610633273.9A CN106000779A (en) 2016-08-04 2016-08-04 Glue dispensing mechanism of LED lamp die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610633273.9A CN106000779A (en) 2016-08-04 2016-08-04 Glue dispensing mechanism of LED lamp die bonder

Publications (1)

Publication Number Publication Date
CN106000779A true CN106000779A (en) 2016-10-12

Family

ID=57133901

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610633273.9A Pending CN106000779A (en) 2016-08-04 2016-08-04 Glue dispensing mechanism of LED lamp die bonder

Country Status (1)

Country Link
CN (1) CN106000779A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108405264A (en) * 2018-05-11 2018-08-17 深圳市诺峰光电设备有限公司 A kind of full-automatic silicone dispenser

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201300111Y (en) * 2008-07-31 2009-09-02 洪世杰 Improved-type structure of automatic spraying equipment
KR100962663B1 (en) * 2010-03-23 2010-06-11 금강금속(주) Applicator of adhesive for appratus bonding led
CN201632367U (en) * 2009-12-22 2010-11-17 亿光电子(中国)有限公司 Dispensing arm of die bonder
US20110204102A1 (en) * 2008-10-31 2011-08-25 Heishin Ltd. Variable nozzle, variable nozzle device, and applying device including variable nozzle device
CN102509754A (en) * 2011-12-16 2012-06-20 深圳翠涛自动化设备股份有限公司 Dispensing arm structure for die bonder
CN203170524U (en) * 2013-04-27 2013-09-04 深圳市微恒自动化设备有限公司 Dispensing device of die bonder

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201300111Y (en) * 2008-07-31 2009-09-02 洪世杰 Improved-type structure of automatic spraying equipment
US20110204102A1 (en) * 2008-10-31 2011-08-25 Heishin Ltd. Variable nozzle, variable nozzle device, and applying device including variable nozzle device
CN201632367U (en) * 2009-12-22 2010-11-17 亿光电子(中国)有限公司 Dispensing arm of die bonder
KR100962663B1 (en) * 2010-03-23 2010-06-11 금강금속(주) Applicator of adhesive for appratus bonding led
CN102509754A (en) * 2011-12-16 2012-06-20 深圳翠涛自动化设备股份有限公司 Dispensing arm structure for die bonder
CN203170524U (en) * 2013-04-27 2013-09-04 深圳市微恒自动化设备有限公司 Dispensing device of die bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108405264A (en) * 2018-05-11 2018-08-17 深圳市诺峰光电设备有限公司 A kind of full-automatic silicone dispenser

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20161012

RJ01 Rejection of invention patent application after publication