CN106000779A - Glue dispensing mechanism of LED lamp die bonder - Google Patents
Glue dispensing mechanism of LED lamp die bonder Download PDFInfo
- Publication number
- CN106000779A CN106000779A CN201610633273.9A CN201610633273A CN106000779A CN 106000779 A CN106000779 A CN 106000779A CN 201610633273 A CN201610633273 A CN 201610633273A CN 106000779 A CN106000779 A CN 106000779A
- Authority
- CN
- China
- Prior art keywords
- glue
- glue dispensing
- dripping head
- glue dripping
- applying mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 83
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004922 lacquer Substances 0.000 claims description 5
- 238000004851 dishwashing Methods 0.000 claims description 2
- 239000012459 cleaning agent Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a glue dispensing mechanism of an LED lamp die bonder. The glue dispensing mechanism comprises a connecting seat, the upper surface of the connecting seat is fixed to the piston rod of a cylinder, the lower surface of the connecting seat is provided with a motor driven rotating shaft, the rotating shaft is provided with a rotating arm, one end of the rotating arm is provided with two hangers, a glue dispensing head fixing plate is horizontally arranged between the two hangers, the center of the glue dispensing head fixing plate is vertically provided with a glue dispensing device, the glue dispensing device comprises a cylindrical pedestal, two ends of the pedestal are respectively provided with a glue dispensing head A and a glue dispensing head B, a glue disc and a cleaning disc are arranged under the glue dispensing device, the bottom of the cleaning disc is provided with a hairbrush, and a cleaning agent is arranged in the cleaning disc. The glue dispensing mechanism can meet glue dispensing of different glue points, and also can remove solidified glue on the glue dispensing heads.
Description
Technical field
The present invention relates to a kind of glue applying mechanism, particularly to the some glue of a kind of LED bonder
Mechanism.
Background technology
Development along with LED technology so that LED is widely used in lighting field, and LED
The manufacturing technology of lamp such as die bond technology development the most therewith.Point glue is important in die bond technology
One ring.LED bonder often will identical carrier is solid different types of crystal, different crystal
May corresponding different glue point, and Glue dripping head can solidify after a period of time that worked on glue,
Affect precision for dispensing glue.To this end, it is proposed that the glue applying mechanism of a kind of LED bonder.
Summary of the invention
Present invention is primarily targeted at the glue applying mechanism that a kind of LED bonder is provided, can
With the some glue of satisfied different glue points, the glue of solidification on Glue dripping head can be removed simultaneously, can be effective
Solve the problem in background technology.
For achieving the above object, the technical scheme that the present invention takes is:
The glue applying mechanism of a kind of LED bonder, including connecting seat, table on described connection seat
The piston rod of face and cylinder is fixed, and lower surface is provided with the rotary shaft of driven by motor, described rotary shaft
Being provided with turning arm, described turning arm one end is provided with two hangers, water between said two hangers
Putting down and be provided with Glue dripping head fixed plate, described Glue dripping head fixed plate center vertical is provided with point glue equipment, institute
State point glue equipment and include that cylindrical base, described pedestal are respectively arranged at two ends with Glue dripping head A and put glue
Head B, is provided with lacquer disk(-sc) and cleaning dish below described point glue equipment, described cleaning tray bottom is provided with hair
Brush, inside fills abluent.
Further, described abluent is ethanol.
Further, described Glue dripping head fixed plate can rotate.
Further, described Glue dripping head A is cylindric, and described Glue dripping head B is flat column.
The present invention can move up and down under the driving of cylinder, adjusts the height of glue applying mechanism,
Under the drive of motor, turning arm moves around rotation axis horizontal, and pedestal is respectively arranged at two ends with a glue
Head A and Glue dripping head B, can meet the some glue of different glue point, be provided with lacquer disk(-sc) below point glue equipment
With cleaning dish, described cleaning tray bottom is provided with hairbrush, and inside fills abluent, can remove a little
The glue of solidification on glue head.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the present invention;
Fig. 2 is the close-up schematic view of structure at A in Fig. 1;
Fig. 3 is the structural representation of point glue equipment.
In figure: 1, hangers;2, Glue dripping head fixed plate;3, turning arm;4, point glue equipment;
5, rotary shaft;6, seat is connected;7, cylinder;8, lacquer disk(-sc);9, cleaning dish;10, hairbrush;
11, pedestal;12, piston rod;13, Glue dripping head A;14, Glue dripping head B.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be prone to bright with effect
White understanding, below in conjunction with detailed description of the invention, is expanded on further the present invention.
As shown in Figures 1 to 3, the glue applying mechanism of a kind of LED bonder, including connecting seat,
The piston rod of described connection seat upper surface and cylinder is fixed, and lower surface is provided with the rotation of driven by motor
Axle, described rotary shaft is provided with turning arm, and described turning arm one end is provided with two hangers, described
Between two hangers, level is provided with Glue dripping head fixed plate, and described Glue dripping head fixed plate center vertical sets
Cylindrical base, described pedestal are respectively arranged at two ends with to have point glue equipment, described point glue equipment to include
Glue dripping head A and Glue dripping head B, is provided with lacquer disk(-sc) and cleaning dish below described point glue equipment, described clearly
Being provided with hairbrush bottom dishwashing, inside fills abluent.
Preferably, described abluent is ethanol, can be gone by the glue being solidificated on Glue dripping head
Remove.
Preferably, described Glue dripping head fixed plate can rotate, in that context it may be convenient to changes Glue dripping head.
Preferably, described Glue dripping head A is cylindric, and described Glue dripping head B is flat column, can
To select difform Glue dripping head as required.
By the way of explanation, only describe some one exemplary embodiment of the present invention above, undoubtedly,
For those of ordinary skill in the art, in the case of without departing from the spirit and scope of the present invention, permissible
By various different modes, described embodiment is modified.Therefore, above-mentioned accompanying drawing and be described in this
It is illustrative in matter, should not be construed as the restriction to the claims in the present invention protection domain.
Claims (4)
1. a glue applying mechanism for LED bonder, including connecting seat, it is characterised in that: institute
Stating and connect the piston rod of seat upper surface and cylinder and fix, lower surface is provided with the rotation of driven by motor
Axle, described rotary shaft is provided with turning arm, and described turning arm one end is provided with two hangers, described
Between two hangers, level is provided with Glue dripping head fixed plate, and described Glue dripping head fixed plate center vertical sets
Cylindrical base, described pedestal are respectively arranged at two ends with to have point glue equipment, described point glue equipment to include
Glue dripping head A and Glue dripping head B, is provided with lacquer disk(-sc) and cleaning dish below described point glue equipment, described clearly
Being provided with hairbrush bottom dishwashing, inside fills abluent.
The glue applying mechanism of a kind of LED bonder the most according to claim 1, its feature
It is: described abluent is ethanol.
The glue applying mechanism of a kind of LED bonder the most according to claim 1, its feature
It is: described Glue dripping head fixed plate can rotate.
The glue applying mechanism of a kind of LED bonder the most according to claim 1, its feature
Being: described Glue dripping head A is cylindric, described Glue dripping head B is flat column.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610633273.9A CN106000779A (en) | 2016-08-04 | 2016-08-04 | Glue dispensing mechanism of LED lamp die bonder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610633273.9A CN106000779A (en) | 2016-08-04 | 2016-08-04 | Glue dispensing mechanism of LED lamp die bonder |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106000779A true CN106000779A (en) | 2016-10-12 |
Family
ID=57133901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610633273.9A Pending CN106000779A (en) | 2016-08-04 | 2016-08-04 | Glue dispensing mechanism of LED lamp die bonder |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106000779A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108405264A (en) * | 2018-05-11 | 2018-08-17 | 深圳市诺峰光电设备有限公司 | A kind of full-automatic silicone dispenser |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201300111Y (en) * | 2008-07-31 | 2009-09-02 | 洪世杰 | Improved-type structure of automatic spraying equipment |
KR100962663B1 (en) * | 2010-03-23 | 2010-06-11 | 금강금속(주) | Applicator of adhesive for appratus bonding led |
CN201632367U (en) * | 2009-12-22 | 2010-11-17 | 亿光电子(中国)有限公司 | Dispensing arm of die bonder |
US20110204102A1 (en) * | 2008-10-31 | 2011-08-25 | Heishin Ltd. | Variable nozzle, variable nozzle device, and applying device including variable nozzle device |
CN102509754A (en) * | 2011-12-16 | 2012-06-20 | 深圳翠涛自动化设备股份有限公司 | Dispensing arm structure for die bonder |
CN203170524U (en) * | 2013-04-27 | 2013-09-04 | 深圳市微恒自动化设备有限公司 | Dispensing device of die bonder |
-
2016
- 2016-08-04 CN CN201610633273.9A patent/CN106000779A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201300111Y (en) * | 2008-07-31 | 2009-09-02 | 洪世杰 | Improved-type structure of automatic spraying equipment |
US20110204102A1 (en) * | 2008-10-31 | 2011-08-25 | Heishin Ltd. | Variable nozzle, variable nozzle device, and applying device including variable nozzle device |
CN201632367U (en) * | 2009-12-22 | 2010-11-17 | 亿光电子(中国)有限公司 | Dispensing arm of die bonder |
KR100962663B1 (en) * | 2010-03-23 | 2010-06-11 | 금강금속(주) | Applicator of adhesive for appratus bonding led |
CN102509754A (en) * | 2011-12-16 | 2012-06-20 | 深圳翠涛自动化设备股份有限公司 | Dispensing arm structure for die bonder |
CN203170524U (en) * | 2013-04-27 | 2013-09-04 | 深圳市微恒自动化设备有限公司 | Dispensing device of die bonder |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108405264A (en) * | 2018-05-11 | 2018-08-17 | 深圳市诺峰光电设备有限公司 | A kind of full-automatic silicone dispenser |
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Legal Events
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---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |
|
RJ01 | Rejection of invention patent application after publication |