CN105990735A - Charging conenctor combination member - Google Patents
Charging conenctor combination member Download PDFInfo
- Publication number
- CN105990735A CN105990735A CN201610148643.XA CN201610148643A CN105990735A CN 105990735 A CN105990735 A CN 105990735A CN 201610148643 A CN201610148643 A CN 201610148643A CN 105990735 A CN105990735 A CN 105990735A
- Authority
- CN
- China
- Prior art keywords
- molding part
- charge connector
- inner molded
- contact area
- molectron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/521—Sealing between contact members and housing, e.g. sealing insert
Abstract
The invention discloses a charging connector combination member having a function of preventing water. The charging connector combination member comprises a molding part, a contact part which comprises a contact area which is arranged on the modling part and is configured to electrically connected to a corresponding main body, a welding area which is arranged under the molding part and is configured to be installed on a printed circuit board (PCB) and to be electriclaly connected to the printed circuit board, and an insulation cap portion which is configured to couple to the modling part.
Description
Cross-Reference to Related Applications
This application claims the benefit of priority of Korean Patent Application No. 10-2015-0035806 submitted on March 16th, 2015 in Korean Intellectual Property Office, its disclosure is incorporated herein.
Technical field
One exemplary embodiment relates to the charge connector molectron with simple structure and water-proof function.
Background technology
Generally, terminal comprises voice call function, video call function, information input/output (I/O) function and data storage function.Due to the variation of function recently, various contents can be accessed by terminal.Therefore, terminal also can comprise and realizes the storage of personal information or storage medium capability that credit payment processes and shooting photo or video, playing music or video file, object for appreciation game and receive other sophisticated functions of broadcast.Comprehensively provide this kind of function to realize multimedia device.
When providing many additional functions in the terminal, adapter can be used for the connection with peripheral unit and data I/O.Adapter can comprise the I/O port with peripheral device interface or allow users to transmit USB (universal serial bus) (USB) port of the data (if desired) of terminal.Peripheral unit can comprise such as earphone, remotely control and television set (TV).
Meanwhile, terminal comprises the charge connector molectron for charging.Existing charge connector molectron needs waterproof construction.
Summary of the invention
One exemplary embodiment provides can the charge connector molectron of waterproof efficiency of intensified charging connector assembly.
The technical assignment aimed at herein is not limited to aforementioned, and others not mentioned technical assignment also should by those skilled in the art from explained below it should be clearly understood that.
According on the one hand, there is a kind of charge connector molectron, it comprises: molding part (mold portion)；Contact portion, it comprises and is arranged on molding part and is configured to be electrically connected to correspondent entity (counterpart
Entity) contact area；Weld zone, it is arranged under molding part and is configured to attach to printed circuit board (PCB) (PCB) and is connected electrically；And Insulating cover segments, it is configured to the top surface of Overmolded part, exposes contact portion and therefore prevent dampness from flowing in contact portion.
Contact portion can comprise the multiple inner molded things (mold) provided with pin (pin) shape, and molding part can comprise multiple inner molded thing receiving portion, and therefore inner molded thing by the plurality of inner molded thing receiving portion and is accepted respectively.The coating of metal material can be plated on the whole surface of inner molded thing, and the top surface of inner molded thing can form the basal surface of contact area and inner molded thing and can form weld zone.And, the coating of metal material may be formed at least some of of the contact area of inner molded thing and weld zone at least some of on, and coating can be formed to connect contact area and weld zone.When inner molded thing is coupled to molding part, inner molded thing can protrude from the top surface of molding part to have preset height.The targeting part (guide portion) being configured to be fixed to inner molded thing molding part may be formed on the basal surface of inner molded thing.Inner molded thing can use the material identical with the material of molding part to be formed.
Multiple protuberances (protrusion) may be formed on the top surface of molding part, and contact area can by the coating of metal material is formed at protuberance at least some of on formed, and weld zone can by the coating of metal material is formed at the basal surface of molding part at least some of on formed.Contact area and weld zone can be formed by the coating of metal material being formed on the top surface of molding part and at least some of of basal surface.And, coating can be formed to connect contact area and weld zone.
Coating can use at least one of gold (Au), nickel (Ni) and copper (Cu) to be formed.
Insulating cover segments can be formed the top surface with Overmolded part and side, and multiple hole may be formed on Insulating cover segments to expose contact area.Flange may be formed on the side of Insulating cover segments, and flange may be in response to be coupling in and compressed between Insulating cover segments and correspondent entity, and can close and the interval of correspondent entity thus prevent wet gas current from entering in molding part.And, Insulating cover segments can be set to relative to correspondent entity to couple direction vertical, and multiple flange can be provided parallel on Insulating cover segments.Insulating cover segments can use the elastomeric material comprising rubber to be formed.
According to another aspect, it is provided that a kind of charge connector molectron, it comprises: molding part；Multiple inner molded things, it is configured through molding part, and each inner molded thing comprises the top surface protrusion being configured to from inner molded thing and and is electrically connected to the contact area of correspondent entity on molding part on the top surface of inner molded thing and is configured to be electrically connected to the weld zone of PCB on the basal surface of inner molded thing；And Insulating cover segments, it is configured to cover the top surface of contact portion and side, exposure contact area and prevents dampness from flowing in contact portion.
The coating of metal material may be formed on the whole surface of inner molded thing.The coating of metal material may be formed at least some of of the contact area of inner molded thing and weld zone at least some of on, and coating can be formed to connect contact area and weld zone.
According to another aspect, a kind of charge connector molectron is provided, it comprises: molding part, it comprises the contact area being formed on molding part and is formed at the weld zone under inner molded thing, contact area is configured to be electrically connected to correspondent entity and protrude from the top surface of molding part with integral form, and weld zone is configured to attach to PCB and is connected electrically；And Insulating cover segments, it is configured to cover the top surface of contact portion and side and expose contact area.
The coating of metal material may be formed at least some of of the weld zone that is included in molding part and contact area at least some of on, and coating can be formed to connect contact area and weld zone.
Effect
According to one exemplary embodiment, it is possible to the waterproof efficiency of intensified charging connector assembly.
And, according to one exemplary embodiment, it is possible to use molding part reinforced assembly ability and yield and waterproof ability.
Accompanying drawing explanation
From combining description below the example embodiment that following accompanying drawing is carried out, these and/or other aspects, features and advantages of the disclosure will become clear from and be easier to understanding:
Fig. 1 is the perspective view of the charge connector molectron according to an embodiment；
Fig. 2 is the bottom perspective view of the charge connector molectron of Fig. 1；
Fig. 3 is the side cross-sectional view of the charge connector molectron of Fig. 1；
The assembling process of the charge connector molectron of Fig. 4 pictorial image 1；
Fig. 5 is the perspective view of the charge connector molectron according to another embodiment；
Fig. 6 is the bottom perspective view of the charge connector molectron of Fig. 5；
Fig. 7 is the side cross-sectional view of the charge connector molectron of Fig. 5；And
The assembling process of the charge connector molectron of Fig. 8 pictorial image 5.
Detailed description of the invention
Hereinafter, some example embodiment will be described in detail by referring to the drawings.About distributing to the reference number of assembly in accompanying drawing, it should be noted that identical assembly will be specified by identical reference number, in any possible place, even if they illustrate in different drawings.And, in the description of example embodiment, it is thus well known that being described in detail in of dependency structure or function thinks that this description will will be omitted when causing the ambiguous interpretation of the disclosure.
It addition, such as first, second, A, B, the term of (a) and (b) etc. can be used for describing assembly in this article.These terminological each be not intended to limit the corresponding essence of assembly, order or sequence, but be only used for correspondence assembly and other assemblies one or more differentiation.It should be noted that, if describe in the description an assembly " connect ", " coupling " or " in conjunction with " to another assembly, then the 3rd assembly can " connect ", " coupling " or " in conjunction with " between the first and second assemblies, although the first assembly can be directly connected to, couple or be attached to the second assembly.
Unless otherwise defined, the technology that comprises used herein has the identical implication being commonly understood by with the technical staff in the field belonged to by example embodiment with all terms of scientific terminology.Will be further understood that, term, such as those defined in common dictionary, should be interpreted that and have the implication consistent with its implication in the context of association area and will not explain with the meaning of idealization or excessive form (overly formal), unless the most so limited herein.
Hereinafter, will describe referring to figs. 1 to Fig. 8 according to the charge connector molectron 10 of one exemplary embodiment.
Hereinafter, when describing reference number, identical reference numbers refers to similar component, and relative repetition of explanation here will be omitted.When determining that the detailed description relevant with known association area makes one exemplary embodiment present fuzzy, this description will be omitted.In addition, describe based on the diagram direction of charge connector molectron 10 or state that charge connector molectron 10 is arranged on printed circuit board (PCB) (PCB) 1 at following term " up/down ", " left/right " and " front/rear ", but, one exemplary embodiment is not restricted to this.The corresponding essence of assembly, order or sequence etc. are not limited by this term.Term used herein " terminal " not only can comprise mobile communication terminal but also comprise the wearable device of the not device of such as personal computer (PC) etc., the mancarried device of such as photographing unit, music player etc. and such as table etc. equipped with communication function.
Hereinafter, will describe referring to figs. 1 to Fig. 4 according to the charge connector molectron 10 of an one exemplary embodiment.Fig. 1 is the perspective view of the charge connector molectron 10 according to an embodiment, Fig. 2 is the bottom perspective view of the charge connector molectron 10 of Fig. 1, Fig. 3 is the side cross-sectional view of the charge connector molectron 10 of Fig. 1, and the assembling process of the charge connector molectron 10 of Fig. 4 pictorial image 1.
Referring to figs. 1 to Fig. 4, charge connector molectron 10 can comprise be configured to form the profile of charge connector molectron 10 molding part 12, be configured to be electrically connected to the contact portion 11 of correspondent entity (not shown), be configured to be electrically coupled to the weld zone 112 of PCB 1 and be configured to the Insulating cover segments 13 of Overmolded part 12.
Here, " correspondent entity " is provided to be configured to couple to the device of charge connector molectron 10.Charge connector molectron 10 according to an embodiment is provided to terminal, and correspondent entity can be attached to the cable of external power source etc..But, it be only example and therefore correspondent entity can be physical connection and be electrically connected to the various devices of charge connector molectron 10.
Molding part 12 forms the profile of charge connector molectron 10 and uses injection molding to be formed.
Contact portion 11 can comprise and is configured through molding part 12 and has multiple inner molded things 110 of predetermined pin or cylindrical shape.Such as, contact portion 11 can comprise five inner molded things 110.But, it is only that the quantity of example and therefore inner molded thing 110 can differently be revised.
The contact area 111 being configured to be electrically connected to correspondent entity is formed on the top surface of inner molded thing 110, and is configured to attach to PCB 1 and the weld zone 112 that is connected electrically is formed on the basal surface of inner molded thing 110.Inner molded thing 110 is formed by injection molding by non-conducting material.The coating of predetermined metal material is formed on the surface of inner molded thing 110, is consequently formed contact area 111 and weld zone 112.Here, inner molded thing 110 can use the material identical or different with the material of molding part 12 to be formed.
Here, coating can comprise and may be electrically connected to terminal and the conductive metallic material of PCB 1.Such as, during coating can use gold (Au), nickel (Ni) and copper (Cu) one or its at least one alloy are formed.Alternatively, coating can generally include Ni material and comprise Au or Cu material selectively.But, it is only example and the most any conductive material can be used for coating.
Coating may be formed at and maybe can be made only in the part as contact area 111 and weld zone 112 on the whole surface of inner molded thing 110.When coating is made only in the part district of inner molded thing 110, form coating to connect contact area 111 and weld zone 112.
And, when such as and being therefore coupled to molding part 12 in the receiving portion 121 receiving inner molded thing 110 in the hole that inner molded thing 110 is inserted into molding part 12, contact area 111 protrudes on molding part 12 from inner molded thing 110 with predetermined altitude.Inner molded thing 110 can be coupled to molding part 12 so that the weld zone 112 being formed on the basal surface of inner molded thing 110 disposes with the height identical with the basal surface of molding part 12 or downwardly projecting under molding part 12 from inner molded thing 110 further.
Protruding (projection) 112a can be downwardly projecting from weld zone 112 with predetermined altitude.Referring to figs. 2 and 3, protruding 112a can be plugged into PCB 1 and is therefore coupled to PCB 1, therefore strengthens the bonding force between PCB 1 and charge connector molectron 10 and coupling reliability.
Here, targeting part 113 may be formed on the centre of inner molded thing 110 or basal surface so that inner molded thing 110 is fixed to molding part 12.Such as, the multiple targeting parts 113 protruded towards radially outer direction may be formed on the basal surface of inner molded thing 110, and the gathering sill 122 that targeting part 113 can be fixedly inserted into may be formed on molding part 12.Additionally, the coupling unit 114 being configured to be fixed to molding part 12 can be formed by this way so that a part for the periphery of inner molded thing 110 is outwardly in the centre of the longitudinal direction of inner molded thing 110.But, the shape of inner molded thing 110 is not limited to accompanying drawing, and can provide inner molded thing 110 with variously-shaped.And, targeting part 113 and coupling unit 114 can omit from inner molded thing 110.
Insulating cover segments 13 can use insulant to be formed, and in order to the elastomeric material that use such as rubber waterproof when being coupled to correspondent entity is formed.Form Insulating cover segments 13 with the top surface of Overmolded part 12 and side.Multiple holes 131 are formed in the top surface of Insulating cover segments 13 outwards to expose contact area 111.Here, owing to providing Insulating cover segments 13, so sealing directly can be applied around contact area 111.Flow in contact portion 11 therefore, it is possible to be effectively prevented dampness.
And, at least one flange 132 is formed on the side of Insulating cover segments 13 to strengthen waterproof ability.Flange 132 is compressed in response to coupling with correspondent entity or box (case) 2 and is resiliently deformed with closing and correspondent entity or the interval of box 2.Such as, multiple flanges 132 can be formed as parallel on the side of Insulating cover segments 13, and flange 132 be formed as relative to correspondent entity to couple direction vertical.But, it is only that the shape of example and Insulating cover segments 13 and flange 132 can differently be revised.
Hereinafter, the assembling process of the charge connector molectron 10 according to an embodiment will be described.With reference to Fig. 4, prepare molding part 12 and multiple inner molded thing 110.Coating uses predetermined metal material to be formed on the surface of each inner molded thing 110.Cated inner molded thing 110 is inserted in molding part 12 and is therefore coupled to molding part 12.The part from molding part 12 protrusion of each inner molded thing 110 is used as contact area 111, and the basal surface of molding part 12 is used as weld zone 112.By from above Insulating cover segments 13 being coupled to the molding part 12 that couples with inner molded thing 110, completing the assembling of charge connector molectron 10.
According to embodiment, owing to charge connector molectron 10 uses injection molding by molding part 12 and being coupled by the inner molded thing 110 being multiple pin being manufactured, likely simplify structure and the shape of charge connector molectron 10, promote it to manufacture and assembling, and strengthen its waterproof ability.
With reference to Fig. 5 to Fig. 8, in charge connector molectron 20, contact portion 21 can be integrally formed with molding part 22.Hereinafter, will describe with reference to Fig. 5 to Fig. 8 according to the charge connector molectron 20 of another one exemplary embodiment.Identical reference numbers will refer to above similar component described in that one exemplary embodiment, and here will omit the explanation repeated.Fig. 5 is the perspective view of the charge connector molectron 20 according to another one exemplary embodiment, Fig. 6 is the bottom perspective view of the charge connector molectron 20 of Fig. 5, Fig. 7 is the side cross-sectional view of the charge connector molectron 20 of Fig. 5, and the assembling process of the charge connector molectron 20 of Fig. 8 pictorial image 5.
With reference to Fig. 5 to Fig. 8, in charge connector molectron 20, eliminate the inner molded thing 110 of Fig. 1 to Fig. 4, and be integrally formed contact portion 21 and molding part 22.Charge connector molectron 20 comprises the molding part 22 being configured to form the profile of charge connector molectron 20 and is configured to the Insulating cover segments 23 of Overmolded part 22.The contact area 211 being configured to be electrically connected to correspondent entity (not shown) is formed on the top surface of molding part 22, and the weld zone 212 being configured to be electrically connected to PCB 1 is formed on the basal surface of molding part 22.Hereinafter, contact area 211 and weld zone 212 are referred to as contact portion 21.
Molding part 22 forms the profile of charge connector molectron 20.Form multiple protuberance 210 to protrude from the top surface of molding part 22 with predetermined altitude.Contact area 211 by the coating of metal material is formed at protuberance 210 at least some of on formed.Form coating to connect contact area 211 and weld zone 212.Such as, contact area 211 can have beam shapes to be connected to the weld zone 212 being formed on the basal surface of molding part 22.But, it is only example and coating may be formed on the whole surface of protuberance 210.
Weld zone 212 by the coating of metal material is formed at the basal surface of molding part 22 at least some of on formed.Such as, weld zone 212 also can have beam shapes to be connected to contact area 211.Protruding 212a can be downwardly projecting from weld zone 212 with predetermined altitude.With reference to Fig. 6 and Fig. 7, protruding 212a can be plugged in PCB 1 and is therefore coupled to PCB 1, therefore strengthens the bonding force between PCB 1 and charge connector molectron 20 and coupling reliability.
In order to waterproof, Insulating cover segments 23 can use the elastomeric material of insulant and such as rubber to be formed.Form Insulating cover segments 23 with the top of Overmolded part 22 and side.Multiple holes 231 are formed on the top surface of Insulating cover segments 23 outwards to expose contact area 211.Here, Insulating cover segments 23 can directly seal around contact area 211, and it is possible to is effectively prevented dampness and is flow in contact portion 21 by contact area 211.And, at least one flange 232 is formed on the side of Insulating cover segments 23 to strengthen waterproof ability.
Hereinafter, the assembling process of the charge connector molectron 20 according to another one exemplary embodiment will be described.With reference to Fig. 8, prepare molding part 22.By use at least some of of metal material protuberance 210 that coating is formed on molding part 22 top surface and molding part 22 basal surface at least some of on form contact area 211 and weld zone 212.By Insulating cover segments 23 is coupled to molding part 22, complete the assembling of charge connector molectron 20.
According to one exemplary embodiment, use injection molding to be formed due to the molding part 22 of charge connector molectron 20 and be integrally formed molding part 22 and contact portion 21, likely simplify shape and the structure of charge connector molectron 20, promote it to manufacture and assembling, and strengthen its waterproof ability.
According to one exemplary embodiment, owing to contact portion 11,21 uses injection molding to manufacture, it is possible to strengthen waterproof ability, it is achieved simple structure and shape, and reinforced assembly ability and yield.Further, it is possible to separately fabricated and then assembling contact portion 11 and molding part 12, or likely it is integrally formed contact portion 21 and molding part 22.Therefore, it is possible to manufacture the charge connector molectron 10,20 that can strengthen waterproof ability and reinforced assembly ability and yield.It is additionally, since Insulating cover segments 13,23 can directly seal around contact area 111,211, flows in contact portion 11,21 it is therefore possible to be effectively prevented dampness.
Multiple one exemplary embodiment is had described above.However, it should be understood that can various modification can be adapted to these example embodiment.Such as, the result being suitable for can be realized, if if described technology combines by different way with the assembly in different order execution and/or described system, structure, device or circuit and/or substituted by its equivalent or other assemblies or supplemented.Therefore, other embodiments are in the range of following claims.
Claims (20)
1. a charge connector molectron, including:
Molding part；
Contact portion, including the contact area being arranged on described molding part and be configured to be electrically connected to correspondent entity；
Weld zone, is arranged under described molding part and is configured to attach to printed circuit board (PCB) (PCB) and be connected electrically；And
Insulating cover segments, is configured to cover the top surface of described molding part, expose described contact portion and prevent dampness from flowing in described contact portion.
2. charge connector molectron as claimed in claim 1, wherein said contact portion includes the multiple inner molded things provided with pin shape, and
Described molding part includes multiple inner molded thing receiving portion, and therefore described inner molded thing by the plurality of inner molded thing receiving portion and is accepted respectively.
3. charge connector molectron as claimed in claim 2, wherein the coating of metal material is plated on the whole surface of described inner molded thing, and the top surface of described inner molded thing forms the basal surface of described contact area and described inner molded thing and forms described weld zone.
4. charge connector molectron as claimed in claim 2, wherein the coating of metal material be formed at described inner molded thing described contact area at least some of and described weld zone at least some of on, and
Described coating is formed to connect described contact area and described weld zone.
5. charge connector molectron as claimed in claim 2, wherein when described inner molded thing is coupled to described molding part, described inner molded thing protrudes from the described top surface of described molding part to have preset height.
6. charge connector molectron as claimed in claim 2, is wherein configured to be formed on the basal surface of described inner molded thing the targeting part that described inner molded thing is fixed to described molding part.
7. charge connector molectron as claimed in claim 2, wherein said inner molded thing uses the material identical with the material of described molding part to be formed.
8. charge connector molectron as claimed in claim 1, plurality of protuberance is formed on the top surface of described molding part, and described contact area by the coating of metal material is formed at described protuberance at least some of on formed, and
Described weld zone by the described coating of described metal material is formed at the basal surface of described molding part at least some of on formed.
9. charge connector molectron as claimed in claim 8, wherein said contact area and described weld zone are formed by the described coating of described metal material being formed on the described top surface of described molding part and at least some of of described basal surface.
10. charge connector molectron as claimed in claim 8, wherein said coating is formed to connect described contact area and described weld zone.
11. charge connector molectrons as claimed in claim 1, wherein said coating uses at least one in gold (Au), nickel (Ni) and copper (Cu) to be formed.
12. charge connector molectrons as claimed in claim 1, wherein said Insulating cover segments is formed to cover top surface and the side of described molding part, and multiple hole is formed on described Insulating cover segments to expose described contact area.
13. charge connector molectrons as claimed in claim 12, wherein flange is formed on the described side of described Insulating cover segments, and
Described flange is compressed between described Insulating cover segments and described correspondent entity in response to being coupling in, and close and the interval of described correspondent entity thus prevent dampness from flowing in described molding part.
14. charge connector molectrons as claimed in claim 13, wherein said Insulating cover segments be disposed relative to described correspondent entity to couple direction vertical, and multiple flange is provided parallel in described insulation covering part.
15. charge connector molectrons as claimed in claim 12, wherein said Insulating cover segments uses the elastomeric material comprising rubber to be formed.
16. 1 kinds of charge connector molectrons, including:
Molding part；
Multiple inner molded things, it is configured through described molding part, and each inner molded thing includes being configured to protrude from the top surface of described inner molded thing and be electrically connected to the contact area of correspondent entity on described molding part on the described top surface of described inner molded thing and be configured to be electrically connected to the weld zone of printed circuit board (PCB) (PCB) on the basal surface of described inner molded thing；And
Insulating cover segments, is configured to cover the top surface of contact portion and side and expose described contact area.
17. charge connector molectrons as claimed in claim 16, wherein the coating of metal material is formed on the whole surface of described inner molded thing.
18. charge connector molectrons as claimed in claim 16, wherein the coating of metal material be formed at described inner molded thing described contact area at least some of and described weld zone at least some of on, and described coating is formed to connect described contact area and described weld zone.
19. 1 kinds of charge connector molectrons, including:
Molding part, including the contact area being formed on described molding part and be formed at the weld zone under inner molded thing, described contact area is configured to be electrically connected to correspondent entity and protrude from the top surface of described molding part with integral form, and described weld zone is configured to attach to printed circuit board (PCB) (PCB) and is connected electrically；And
Insulating cover segments, is configured to cover the top surface of contact portion and side, the described contact area of exposure and prevents dampness from flowing in described contact portion.
20. charge connector molectrons as claimed in claim 19, wherein the coating of metal material be formed at the described contact area being included in described molding part at least some of and described weld zone at least some of on, and
Described coating is formed to connect described contact area and described weld zone.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0035806 | 2015-03-16 | ||
| KR1020150035806A KR20160111100A (en) | 2015-03-16 | 2015-03-16 | Signal pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105990735A true CN105990735A (en) | 2016-10-05 |
Family
ID=57043935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610148643.XA Pending CN105990735A (en) | 2015-03-16 | 2016-03-16 | Charging conenctor combination member |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20160111100A (en) |
| CN (1) | CN105990735A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106785597A (en) * | 2017-03-02 | 2017-05-31 | 苏州摩比力特电子科技有限公司 | Multi-contact data interface and apply its mobile terminal |
| CN108183346A (en) * | 2017-12-25 | 2018-06-19 | 广东小天才科技有限公司 | PIN needle connector and wrist-watch |
| CN108963493A (en) * | 2018-06-28 | 2018-12-07 | 维沃移动通信有限公司 | A kind of connector and terminal device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519991A (en) * | 2002-12-27 | 2004-08-11 | ������-�ֿ˹����ɷ�����˾ | Composite material for mfg. electrical contacts and process for its prepn. |
| CN101188337A (en) * | 2006-11-24 | 2008-05-28 | 富士通株式会社 | Terminal and mobile terminal apparatus |
| CN101257161A (en) * | 2007-02-05 | 2008-09-03 | 泰科电子公司 | Connector with metalized coated polymer contact |
| CN201478582U (en) * | 2009-03-26 | 2010-05-19 | 中兴通讯股份有限公司 | Mobile phone and waterproof assembly of connector |
| CN102017316A (en) * | 2008-04-24 | 2011-04-13 | 大陆汽车有限责任公司 | Plug-type connection for making contact with an electrical printed circuit board which is arranged in a housing |
| US20130244737A1 (en) * | 2010-12-09 | 2013-09-19 | Nippon Mektron, Ltd. | Lid member with waterproof function, and method of manufacturing thereof |
| CN204130797U (en) * | 2014-09-05 | 2015-01-28 | 东莞中探探针有限公司 | A kind of ultra-thin water-proof connector |
-
2015
- 2015-03-16 KR KR1020150035806A patent/KR20160111100A/en unknown
-
2016
- 2016-03-16 CN CN201610148643.XA patent/CN105990735A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519991A (en) * | 2002-12-27 | 2004-08-11 | ������-�ֿ˹����ɷ�����˾ | Composite material for mfg. electrical contacts and process for its prepn. |
| CN101188337A (en) * | 2006-11-24 | 2008-05-28 | 富士通株式会社 | Terminal and mobile terminal apparatus |
| CN101257161A (en) * | 2007-02-05 | 2008-09-03 | 泰科电子公司 | Connector with metalized coated polymer contact |
| CN102017316A (en) * | 2008-04-24 | 2011-04-13 | 大陆汽车有限责任公司 | Plug-type connection for making contact with an electrical printed circuit board which is arranged in a housing |
| CN201478582U (en) * | 2009-03-26 | 2010-05-19 | 中兴通讯股份有限公司 | Mobile phone and waterproof assembly of connector |
| US20130244737A1 (en) * | 2010-12-09 | 2013-09-19 | Nippon Mektron, Ltd. | Lid member with waterproof function, and method of manufacturing thereof |
| CN204130797U (en) * | 2014-09-05 | 2015-01-28 | 东莞中探探针有限公司 | A kind of ultra-thin water-proof connector |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106785597A (en) * | 2017-03-02 | 2017-05-31 | 苏州摩比力特电子科技有限公司 | Multi-contact data interface and apply its mobile terminal |
| CN108183346A (en) * | 2017-12-25 | 2018-06-19 | 广东小天才科技有限公司 | PIN needle connector and wrist-watch |
| CN108183346B (en) * | 2017-12-25 | 2019-11-26 | 广东小天才科技有限公司 | PIN needle connector and wrist-watch |
| CN108963493A (en) * | 2018-06-28 | 2018-12-07 | 维沃移动通信有限公司 | A kind of connector and terminal device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160111100A (en) | 2016-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7390197B2 (en) | Electronic device with integral connectors | |
| US9444177B2 (en) | Waterproof electrical receptacle connector | |
| US20160104957A1 (en) | Connector Assembly | |
| US9614333B2 (en) | Electrical receptacle connector | |
| US9660373B2 (en) | Waterproof electrical receptacle connector | |
| US9647393B2 (en) | Electrical receptacle connector | |
| US9793662B2 (en) | Electrical plug connector | |
| US9444204B2 (en) | Serial bus connector | |
| US9515436B2 (en) | USB type-C electrical plug connector | |
| US20160181722A1 (en) | Waterproof electrical receptacle connector | |
| US11251572B2 (en) | Electrical connector with grounding features on the board-side wall of the housing | |
| US20140113497A1 (en) | Waterproof connector | |
| KR20160042752A (en) | Connector assembly | |
| US20170324187A1 (en) | Electrical connector having excellent waterproof property | |
| US10439314B2 (en) | Electrical plug connector | |
| CN210835357U (en) | Optical module | |
| US9647358B2 (en) | Electrical plug connector | |
| US11146027B2 (en) | Electrical receptacle connector | |
| CN105990735A (en) | Charging conenctor combination member | |
| US9553412B2 (en) | Electronic connector | |
| US20160134011A1 (en) | Antenna module and antenna assembly including the same | |
| CN114696135A (en) | Electrical connector | |
| CN104518346A (en) | Connector module | |
| KR20130096142A (en) | A mobile high-definition link converter | |
| KR101773502B1 (en) | Receptacle connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161005 |
|
| WD01 | Invention patent application deemed withdrawn after publication |