CN105977188A - Ink mark baking and cleaning device of diode - Google Patents
Ink mark baking and cleaning device of diode Download PDFInfo
- Publication number
- CN105977188A CN105977188A CN201610444127.1A CN201610444127A CN105977188A CN 105977188 A CN105977188 A CN 105977188A CN 201610444127 A CN201610444127 A CN 201610444127A CN 105977188 A CN105977188 A CN 105977188A
- Authority
- CN
- China
- Prior art keywords
- baking
- diode
- conveyer belt
- conveyor belt
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The invention relates to an ink mark baking and cleaning device of a diode. The ink mark baking and cleaning device comprises a baking area, a feeding area and a conveyor belt, wherein the feeding area and the baking area are sequentially arranged above the conveyor belt along the conveying direction of the conveyor belt; a heating pipe is arranged in the baking area; the conveyor belt is provided with a material tank; a discharge table is arranged in the material tank; the conveyor belt comprises a driving wheel for driving the conveyor belt to move and a driven wheel; the driving wheel is located at the front side of the conveying direction of the conveyor belt; a cleaning pipe which is consistent with the driving wheel in track is also arranged at the front side of the driving wheel; and a second heating pipe is also arranged below the conveyor belt. The ink mark baking and cleaning device of the diode has the advantages that the operation is simple; the labor intensity of a worker is reduced; the production efficiency is improved; and ink on the diode can be thoroughly dried.
Description
Technical field
The present invention relates to a kind of roasting plant, particularly relate to a kind of diode ink indicia baking and clean device.
Background technology
At present, diode is critical elements indispensable in electron trade, and each diode is all marked with oil
Ink, ink is in order to distinguish the both positive and negative polarity of diode.Ink on diode needs to dry could send into packaging process,
The diode arrangement being marked with ink is generally carried out drying and processing in baking oven by current diode production enterprise,
Then baking oven can only dry the ink of diode top half, and cannot dry the oil of diode and baking oven contact position
Ink, therefore, uses existing baking oven to be difficult to be marked at diode curing ink completely and dries, additionally, workman needs
Consume substantial amounts of labour deposited in baking oven by diode or take out.
Accordingly, it would be desirable to seek a kind of new technical scheme to solve the problems referred to above
Summary of the invention
It is an object of the invention to: provide a kind of diode ink indicia baking to clean device.
For achieving the above object, the technical solution used in the present invention is:
Device is cleaned in a kind of diode ink indicia baking, including baking zone, feeding area and conveyer belt, transmits
It is sequentially provided with feeding area and baking zone along conveyer belt direction of transfer above band, is provided with in baking zone and adds heat pipe, pass
Sending band to be provided with material trough, be provided with material platform in material trough, conveyer belt includes the active driving feed belt motion
Wheel and follower, drivewheel is positioned at the front side of conveyer belt direction of transfer, is additionally provided with and actively wheel track on front side of drivewheel
The cleaning pipe that mark is consistent, is additionally provided with second and adds heat pipe below conveyer belt.
Baking zone top connects a pressure fan, pressure fan and add and be provided with pre-add heat pipe between heat pipe.
The jack placing diode it is evenly distributed with on material platform.
In technique scheme, with prior art, to compare having the technical effect that of being reached simple to operate, alleviates
Labor strength, improves production efficiency, it is possible to thoroughly dried by the ink on diode.
Accompanying drawing explanation
Accompanying drawing 1 is the embodiment of the present invention one structural representation.
Accompanying drawing 2 is the structural representation of a kind of material platform of the embodiment of the present invention.
In the figures above: 1-baking zone, 2-feeding area, 3-conveyer belt, 4-adds heat pipe, 5-material trough, 6-
Material platform, 7-feed belt, 8-drivewheel, 9-follower, 10-cleans pipe, and 11-second adds heat pipe, 12-
Pressure fan, 13-pre-add heat pipe, 14-jack.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
Embodiment one:
As depicted in figs. 1 and 2, a kind of diode ink indicia baking of the present invention cleans device, including baking zone
1, feeding area 2 and conveyer belt 3, is sequentially provided with feeding area 2 He along conveyer belt 3 direction of transfer above conveyer belt 3
Baking zone 1, is provided with in baking zone 1 and adds heat pipe 4, and conveyer belt 3 is provided with material trough 5, is provided with blowing in material trough 5
Platform 6, conveyer belt 3 includes drivewheel 8 and the follower 9 driving feed belt 7 motion, and drivewheel 8 is positioned at conveyer belt
The front side of 3 direction of transfers, is additionally provided with the cleaning pipe 10 consistent with drivewheel 8 track, conveyer belt 3 on front side of drivewheel 8
Lower section is additionally provided with second and adds heat pipe 11, and baking zone 1 top connects pressure fan 12, pressure fan 12 with add heat pipe 4 it
Between be provided with pre-add heat pipe 13, material platform 6 is evenly distributed with place diode jack 14.
By being inserted in the jack 14 of material platform 6 by the diode needing drying in feeding area 2, pass through conveyer belt
The transmission of 3 so that material trough 5 enters in baking zone 1 along feeding area 2, due to the air-supply effect of pressure fan 12,
Can be distributed to adding the uniform thermal power that heat pipe 4 produces in material trough 5, to the oil on the diode in material trough 5
Ink carries out heating, drying, and material trough 5 continues to transmit forward along conveyer belt 3 afterwards, through the cleaning of over cleaning pipe 10,
Impurity on diode is cleaned up, is sent to bottom along conveyer belt 3 afterwards, adds heat pipe 11 by second
Heating, again diode is carried out heating, drying, diode carries out blanking from feeding area 2 afterwards, complete dry
The dry cycle cleaned；And the setting of pre-add heat pipe 13, the entrance suddenly of cold wind can be avoided, reduce baking
Baking temperature in roasting district 1 and making toasts the most thorough.
In technique scheme, with prior art, to compare having the technical effect that of being reached simple to operate, alleviates
Labor strength, improves production efficiency, it is possible to thoroughly dried by the ink on diode.
Above-described embodiment only for technology design and the feature of the present invention are described, its object is to allow and is familiar with technique
Personage will appreciate that present disclosure and implement according to this, can not limit the scope of the invention with this.
All according to spirit of the invention made equivalence change or modify, all should contain protection scope of the present invention it
In.
Claims (3)
1. device is cleaned in diode ink indicia baking, it is characterised in that: include baking zone,
Feeding area and conveyer belt, be sequentially provided with along conveyer belt direction of transfer above described conveyer belt
Material district and baking zone, be provided with in described baking zone and add heat pipe, and described conveyer belt is provided with material trough,
Being provided with material platform in described material trough, described conveyer belt includes the active driving feed belt motion
Wheel and follower, described drivewheel is positioned at the front side of conveyer belt direction of transfer, before described drivewheel
Side is additionally provided with the cleaning pipe consistent with drivewheel track, is additionally provided with second and adds below described conveyer belt
Heat pipe.
Device, its feature are cleaned in a kind of diode ink indicia baking the most according to claim 1
Being: described baking zone top connects a pressure fan, described pressure fan and adding is provided with between heat pipe
Pre-add heat pipe.
Device, its feature are cleaned in a kind of diode ink indicia baking the most according to claim 1
It is: on described material platform, be evenly distributed with the jack placing diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610444127.1A CN105977188A (en) | 2016-06-20 | 2016-06-20 | Ink mark baking and cleaning device of diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610444127.1A CN105977188A (en) | 2016-06-20 | 2016-06-20 | Ink mark baking and cleaning device of diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105977188A true CN105977188A (en) | 2016-09-28 |
Family
ID=57022500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610444127.1A Pending CN105977188A (en) | 2016-06-20 | 2016-06-20 | Ink mark baking and cleaning device of diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105977188A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106345646A (en) * | 2016-09-29 | 2017-01-25 | 成都鼎翔通信技术有限公司 | PCB paint spraying device |
| CN107170667A (en) * | 2017-05-25 | 2017-09-15 | 昆山国显光电有限公司 | Substrate wet processing process and substrate wet processing process unit |
| CN115132625A (en) * | 2022-07-14 | 2022-09-30 | 先之科半导体科技(东莞)有限公司 | Plastic packaging device for diode production |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060005860A1 (en) * | 2002-09-30 | 2006-01-12 | Lam Research Corp. | Apparatus and method for processing a substrate |
| CN203093305U (en) * | 2013-01-14 | 2013-07-31 | 东莞市耀盛机械有限公司 | Infrared drying oven device |
| CN103801536A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Wafer cleaning device |
| CN203917087U (en) * | 2014-06-18 | 2014-11-05 | 四川蓝彩电子科技有限公司 | Glass-encapsulated diode ink indicia apparatus for baking |
-
2016
- 2016-06-20 CN CN201610444127.1A patent/CN105977188A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060005860A1 (en) * | 2002-09-30 | 2006-01-12 | Lam Research Corp. | Apparatus and method for processing a substrate |
| CN103801536A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Wafer cleaning device |
| CN203093305U (en) * | 2013-01-14 | 2013-07-31 | 东莞市耀盛机械有限公司 | Infrared drying oven device |
| CN203917087U (en) * | 2014-06-18 | 2014-11-05 | 四川蓝彩电子科技有限公司 | Glass-encapsulated diode ink indicia apparatus for baking |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106345646A (en) * | 2016-09-29 | 2017-01-25 | 成都鼎翔通信技术有限公司 | PCB paint spraying device |
| CN106345646B (en) * | 2016-09-29 | 2018-12-21 | 成都展讯通信技术有限公司 | Pcb board spray-painting plant |
| CN107170667A (en) * | 2017-05-25 | 2017-09-15 | 昆山国显光电有限公司 | Substrate wet processing process and substrate wet processing process unit |
| CN115132625A (en) * | 2022-07-14 | 2022-09-30 | 先之科半导体科技(东莞)有限公司 | Plastic packaging device for diode production |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160928 |