CN105968694A - High-elasticity expanded perlite and phenolic resin composite insulation board and preparation method thereof - Google Patents
High-elasticity expanded perlite and phenolic resin composite insulation board and preparation method thereof Download PDFInfo
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- CN105968694A CN105968694A CN201610213772.2A CN201610213772A CN105968694A CN 105968694 A CN105968694 A CN 105968694A CN 201610213772 A CN201610213772 A CN 201610213772A CN 105968694 A CN105968694 A CN 105968694A
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- expanded perlite
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
The invention discloses a high-elasticity expanded perlite and phenolic resin composite insulation board, which is prepared from the following raw materials (by weight): 1.2-1.5 parts of hydrogenated butadiene-acrylonitrile rubber, 5-5.5 parts of polyaryl polymethylene isocyanate, 0.4-0.5 part of ceric sulfate, 55-57 parts of expanded perlite, 40-42 parts of phenolic resin, 4-4.1 parts of a curing agent HMTA, 2-2.3 parts of steel fiber, 10-11 parts of tetraethyl orthosilicate, a proper amount of 85wt% ammonia water, a proper amount of anhydrous ethanol, 160-180 parts of deionized water, a proper amount of n-hexane, 4-4.5 parts of nano-polytetrafluoroethylene, 0.1-0.2 part of dicumyl peroxide and 3-3.5 parts of 2,2,2-trifluoroethyl acrylate. By using hydrogenated butadiene-acrylonitrile rubber, polyaryl polymethylene isocyanate and ceric sulfate, bonding force of expanded perlite and phenolic resin is boosted, elastic resilience, heat resistance and toughness of the insulation board are improved, and heat insulating ability is raised.
Description
Technical field
The present invention relates to heat-insulation wall plate technical field, particularly relate to a kind of high resiliency expanded perlite phenolic resin composite insulation boards and preparation method thereof.
Background technology
Compound insulating material (CompositeInsulationMaterials) is to be combined homogeneous new material by two or more insulation material, be often referred to the compound of organic insulation material and inorganic heat insulation material, compound after the performance of more original machine or inorganic material more excellent.Make full use of the perlite Advantage of Mineral Resources that Xinyang is abundant herein, with expanded perlite (ExpendedPerlite, and phenolic resin (Phenol-formaldchydeResin EP), PF) it is primary raw material, add the auxiliary agents such as appropriate firming agent, toughener and hydrophober, the most hot-forming, it is prepared as expanded perlite/phenolic resin compound insulating material.Paper main research includes: the proportioning of (1) primary raw material and the optimization of compression ratio；(2) under conditions of phenolic resin consumption and compression ratio are certain, use the factor impacts on compound insulating material performance such as the hot-forming temperature of monofactorial Research on experimental methods, dwell time and hardener dose, thus primarily determine that the parameter index of each influence factor；(3) on experiment of single factor Research foundation, use orthogonal experiment, optimization Test condition, selection optimal parameter combines, and inquired into the reciprocal action between the factors such as hot-forming temperature, dwell time and hardener dose, use directly perceived analysis and variance analysis, experiment condition is investigated.Result proves, hot-forming temperature and hardener dose are the notable factors affecting compound insulating material performance；(4) to the physical property of material [apparent density, heat conductivity, water absorption rate), mechanical property (rupture strength, comprcssive strength, elastic modelling quantity, shock resistance) and microstructure test and characterize；(5) on the Research foundation of orthogonal test, adding suitable toughener and hydrophober, toughness and water absorption rate to compound insulating material are optimized.Test result indicate that, preferably preparation condition is: compression ratio, 2.0;Phenolic resin consumption, 40%;Hot-forming temperature, 240 DEG C；Dwell time, 1.5h；Firming agent (HMTA) consumption, 4%；Toughener (fiber) volume, 2%；Hydrophober (BS1042) volume, 0.6%.Under the conditions of more excellent, the apparent density of compound insulating material is 332.4kg/m3, heat conductivity is 0.047W/ (m K), and rupture strength is 1.436MPa, and comprcssive strength is 1.652MPa, and elastic modelling quantity is 2.496MPa, and impact strength is 147.26kJ/m2, water absorption rate is 2.03%.Compound insulating material prepared by this problem overcomes the deficiency that inorganic heat insulation material heat conductivity is bigger than normal, compensate for the shortcomings such as organic insulation material fire protection flame retarding and loss of properties on aging, has actual application value.
But expanded perlite water absorption rate is high, poor water resistance causes thermal insulation mortar volume contraction deformation in stirring big, and product later stage heat-insulating property reduces low with bond matrix intensity, affect later stage wallboard heat-insulating property.
It is thus desirable to composite is further improved, meet the needs of heat-insulation wall plate development, need to improve the performances such as the resistance to water of warming plate, heat insulating ability, thermostability, anti-flammability, durability, toughness, resilience, crushing resistance, sound-proofing, bend resistance, aging resistance, radioprotective, protection against the tide.
Summary of the invention
The object of the invention is contemplated to make up the defect of prior art, it is provided that a kind of high resiliency expanded perlite phenolic resin composite insulation boards and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of high resiliency expanded perlite phenolic resin composite insulation boards, is prepared by the raw materials in: hydrogenated nitrile-butadiene rubber 1.2-1.5, polyphenyl polymethylene isocyanates 5-5.5, ceric sulfate 0.4-0.5, expanded perlite 55-57, phenolic resin 40-42, firming agent HMTA4-4.1, steel fibre 2-2.3, tetraethyl orthosilicate 10-11,85wt% ammonia are appropriate, dehydrated alcohol appropriate, deionized water 160-180, normal hexane are appropriate, nanometer polytetrafluoroethylcomposite 4-4.5, dicumyl peroxide 0.1-0.2, acrylic acid trifluoro ethyl ester 3-3.5.
The preparation method of described high resiliency thermal expansion perlite phenolic resin composite insulation boards, comprises the following steps:
(1) expanded perlite is mixed with dehydrated alcohol, the deionized water of 55-60 weight portion, add polyphenyl polymethylene isocyanates, it is heated with stirring to 44-47 DEG C in a water bath, adding 85wt% ammonia regulation pH is 8-9, tetraethyl orthosilicate is dripped after continuing stirring 10-12min, constant temperature 44-47 DEG C stirring reaction 4-4.3h after dropping, reaction is cooled to room temperature after stopping and obtaining mixed material；
(2) mixed material (1st) step obtained adds the ethanol of 2-2.5 times of volume and stirs, and is aged 48h, is filtrated to get filtrate, again filtrate is immersed in the normal hexane of 2-2.5 times of volume, filter, by filtrate freeze-day with constant temperature at 45-46 DEG C, obtain modified expanded perlite；
(3) nanometer polytetrafluoroethylcomposite, acrylic acid trifluoro ethyl ester, hydrogenated nitrile-butadiene rubber, ceric sulfate are mixed with the dehydrated alcohol of 20-25 weight portion, it is heated to 60-70 DEG C, add dicumyl peroxide, stirring reaction 30-40 minute, obtaining glue, the stirring of modified expanded perlite limit seethed, the most described glue is sprayed on limit, continuing stirring after sprayed to seethe until being dried, obtaining powder；
(4) powder that (3rd) step obtains is mixed homogeneously with other residual componentss, extruded in vacuum environment, it is again heated to 240-245 DEG C, compression ratio is 1.8-2.0, suppresses 1.5-1.6h, to obtain final product.
The invention have the advantage that the present invention uses tetraethyl orthosilicate to be modified expanded perlite, expanded perlite pore interior is made to have nano level hole, improve heat insulation effect, and the coarse thin film with activity hydroxy is defined on the surface of expanded perlite, improve expanded perlite and the compatibility of phenolic resin and adhesion, improve the intensity of warming plate；By using nanometer polytetrafluoroethylcomposite, acrylic acid trifluoro ethyl ester to be coated with perlite surface, preventing perlite water suction from causing nanoaperture to be destroyed, heat-insulating property declines, and extends service life；By using hydrogenated nitrile-butadiene rubber, polyphenyl polymethylene isocyanates, ceric sulfate, improve the adhesion of expanded perlite and phenolic resin, improve the resilience of warming plate, thermostability and toughness, improve heat insulating ability simultaneously.
Detailed description of the invention
A kind of high resiliency expanded perlite phenolic resin composite insulation boards, is made up of the raw material of following weight portion (kilogram): hydrogenated nitrile-butadiene rubber 1.2, polyphenyl polymethylene isocyanates 5, ceric sulfate 0.4, expanded perlite 55, phenolic resin 40, firming agent HMTA4, steel fibre 2, tetraethyl orthosilicate 10,85wt% ammonia are appropriate, dehydrated alcohol appropriate, deionized water 160, normal hexane are appropriate, nanometer polytetrafluoroethylcomposite 4, dicumyl peroxide 0.1, acrylic acid trifluoro ethyl ester 3.
The preparation method of described high resiliency thermal expansion perlite phenolic resin composite insulation boards, comprises the following steps:
(1) by expanded perlite and the dehydrated alcohol of 55 weight portions, deionized water mixing, add polyphenyl polymethylene isocyanates, it is heated with stirring to 44 DEG C in a water bath, adding 85wt% ammonia regulation pH is 8, tetraethyl orthosilicate is dripped after continuing stirring 10min, constant temperature 44 DEG C stirring reaction 4h after dropping, reaction is cooled to room temperature after stopping and obtaining mixed material；
(2) mixed material (1st) step obtained adds the ethanol of 2 times of volumes and stirs, and is aged 48h, is filtrated to get filtrate, then is immersed in by filtrate in the normal hexane of 2 times of volumes, filters, by filtrate freeze-day with constant temperature at 45 DEG C, obtains modified expanded perlite；
(3) dehydrated alcohol of nanometer polytetrafluoroethylcomposite, acrylic acid trifluoro ethyl ester, hydrogenated nitrile-butadiene rubber, ceric sulfate and 20 weight portions is mixed, it is heated to 60 DEG C, add dicumyl peroxide, stirring reaction 30 minutes, obtaining glue, the stirring of modified expanded perlite limit seethed, the most described glue is sprayed on limit, continuing stirring after sprayed to seethe until being dried, obtaining powder；
(4) powder that (3rd) step obtains is mixed homogeneously with other residual componentss, extruded in vacuum environment, it is again heated to 240 DEG C, compression ratio is 1.8, suppresses 1.5h, to obtain final product.
The apparent density of the warming plate of this embodiment is 322kg/m3, heat conductivity is 0.030W/ (m K), and rupture strength is 1.68MPa, and comprcssive strength is 1.865MPa, and elastic modelling quantity is 2.98MPa, and impact strength is 186kJ/m2, water absorption rate is 1.1%.
Claims (2)
1. a high resiliency expanded perlite phenolic resin composite insulation boards, it is characterised in that: it is prepared by the raw materials in: hydrogenated nitrile-butadiene rubber 1.2-1.5, polyphenyl polymethylene isocyanates 5-5.5, ceric sulfate 0.4-0.5, expanded perlite 55-57, phenolic resin 40-42, firming agent HMTA4-4.1, steel fibre 2-2.3, tetraethyl orthosilicate 10-11,85wt% ammonia are appropriate, dehydrated alcohol appropriate, deionized water 160-180, normal hexane are appropriate, nanometer polytetrafluoroethylcomposite 4-4.5, dicumyl peroxide 0.1-0.2, acrylic acid trifluoro ethyl ester 3-3.5.
The preparation method of high resiliency thermal expansion perlite phenolic resin composite insulation boards the most according to claim 1, it is characterised in that comprise the following steps:
(1) expanded perlite is mixed with dehydrated alcohol, the deionized water of 55-60 weight portion, add polyphenyl polymethylene isocyanates, it is heated with stirring to 44-47 DEG C in a water bath, adding 85wt% ammonia regulation pH is 8-9, tetraethyl orthosilicate is dripped after continuing stirring 10-12min, constant temperature 44-47 DEG C stirring reaction 4-4.3h after dropping, reaction is cooled to room temperature after stopping and obtaining mixed material；
(2) mixed material (1st) step obtained adds the ethanol of 2-2.5 times of volume and stirs, and is aged 48h, is filtrated to get filtrate, again filtrate is immersed in the normal hexane of 2-2.5 times of volume, filter, by filtrate freeze-day with constant temperature at 45-46 DEG C, obtain modified expanded perlite；
(3) nanometer polytetrafluoroethylcomposite, acrylic acid trifluoro ethyl ester, hydrogenated nitrile-butadiene rubber, ceric sulfate are mixed with the dehydrated alcohol of 20-25 weight portion, it is heated to 60-70 DEG C, add dicumyl peroxide, stirring reaction 30-40 minute, obtaining glue, the stirring of modified expanded perlite limit seethed, the most described glue is sprayed on limit, continuing stirring after sprayed to seethe until being dried, obtaining powder；
(4) powder that (3rd) step obtains is mixed homogeneously with other residual componentss, extruded in vacuum environment, it is again heated to 240-245 DEG C, compression ratio is 1.8-2.0, suppresses 1.5-1.6h, to obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610213772.2A CN105968694A (en) | 2016-04-08 | 2016-04-08 | High-elasticity expanded perlite and phenolic resin composite insulation board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610213772.2A CN105968694A (en) | 2016-04-08 | 2016-04-08 | High-elasticity expanded perlite and phenolic resin composite insulation board and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN105968694A true CN105968694A (en) | 2016-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610213772.2A Withdrawn CN105968694A (en) | 2016-04-08 | 2016-04-08 | High-elasticity expanded perlite and phenolic resin composite insulation board and preparation method thereof |
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| CN (1) | CN105968694A (en) |
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2016
- 2016-04-08 CN CN201610213772.2A patent/CN105968694A/en not_active Withdrawn
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Application publication date: 20160928 |