CN105964462A - Refrigeration type rotational flow atomizing chamber - Google Patents

Refrigeration type rotational flow atomizing chamber Download PDF

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Publication number
CN105964462A
CN105964462A CN201610546168.1A CN201610546168A CN105964462A CN 105964462 A CN105964462 A CN 105964462A CN 201610546168 A CN201610546168 A CN 201610546168A CN 105964462 A CN105964462 A CN 105964462A
Authority
CN
China
Prior art keywords
flow atomizing
swirling flow
atomizing chamber
heat conduction
atomizing room
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610546168.1A
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Chinese (zh)
Inventor
应刚
吴海荣
邓东卫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Skyray Instrument Co Ltd
Original Assignee
Jiangsu Skyray Instrument Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Skyray Instrument Co Ltd filed Critical Jiangsu Skyray Instrument Co Ltd
Priority to CN201610546168.1A priority Critical patent/CN105964462A/en
Publication of CN105964462A publication Critical patent/CN105964462A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B16/00Spray booths

Abstract

The invention discloses a refrigeration type rotational flow atomizing chamber. The atomizing chamber comprises a rotational flow atomizing chamber body, a heat conduction silicon gel layer and an external metal heat conduction layer; the heat conduction silicon gel layer is evenly attached to the outer wall of the rotational flow atomizing chamber body, and the external metal heat conduction layer is connected with the rotational flow atomizing chamber body through heat conduction silicon gel; and the heat conduction silicon gel layer is formed and is combined and assembled with the external metal heat conduction layer, and the defects that in the original technology, due to the complex external structure of the rotational flow atomizing chamber body, the machining difficulty of an original assembling part is high, the cost is large, tight contact is hardly to achieve, consequently, thermal conductivity of the atomizing chamber body is reduced, and functions and stability of a whole refrigeration system are affected are overcome.

Description

A kind of refrigeration mode swirling flow atomizing room
Technical field
The present invention relates to field, swirling flow atomizing room, particularly relate to a kind of refrigeration mode swirling flow atomizing room.
Background technology
The rotational flow atomizer of current domestic use generally uses simple glass or quartz glass to make, profile is all complex-curved, these curve forms not only increase manufacturing process difficulty and the cost of assembly parts, it is difficult to be in close contact the most simultaneously thus reduces the heat conductivity of aerochamber, affect the function of whole refrigeration system and stablize, the most in use can not well carry out refrigeration control, therefore, import mode is generally used to solve, the most not only increase production cycle and cost, also weaken enterprise the core of product is controlled, it is thus desirable to find a kind of new mode to solve problems.
Summary of the invention
In view of this, need to overcome at least one in drawbacks described above of the prior art, the invention provides a kind of refrigeration mode swirling flow atomizing room, including.
Swirling flow atomizing room, thermal conductive silicon glue-line, external metallization heat-conducting layer;
Described thermal conductive silicon glue-line is uniformly attached to described swirling flow atomizing chamber outer wall, and described external metallization heat-conducting layer is connected with described swirling flow atomizing room by described heat conductive silica gel.
According in this patent background technology to described in prior art, the rotational flow atomizer of domestic use generally uses simple glass or quartz glass to make, profile is complex-curved, the most not only increase manufacturing process difficulty and the cost of assembly parts, it is difficult to be in close contact the most simultaneously thus reduces the heat conductivity of aerochamber, affect the function of whole refrigeration system and stablize;And refrigeration mode swirling flow atomizing room disclosed by the invention, provide a kind of integral structure, use a kind of intermedium by described rotational flow atomizer and shell directly in conjunction with method, manufacturing process difficulty and cost is made to be simplified and reduce, contact the conduction of heat being more closely greatly improved aerochamber simultaneously, and then be greatly promoted refrigerating function and the stability of whole refrigeration system.
It addition, according to a kind of refrigeration mode swirling flow atomizing room disclosed by the invention also there is following additional technical feature:
Further, described swirling flow atomizing room is simple glass or quartz glass structure.
Further, described heat conductive silica gel is liquid thermal conductivity silica gel.
Further, described external metallization heat-conducting layer is heat conduction good body metal structure.
Further, described heat conduction good body metal structure is aluminum hull structure.
Further, described thermal conductive silicon glue-line is the described thermal conductive silicon glue-line cured layer that to be heat conductive silica gel formed after being uniformly in harmonious proportion and standing.
Alternatively, heat conductive silica gel is through being uniformly in harmonious proportion and placingIt is more than 20 HourAfter room temperature be 20 degree-30 degree between formed cured layer.
Further, described thermal conductive silicon glue-line is the structure that liquid heat conductive silica gel solidify to form.
Described herein refer to be in the closed state or in the short time heat conductive silica gel of liquid for liquid.
Further, described heat conductive silica gel layer thickness is more than or equal to 0.05mm.
Aspect and advantage that the present invention adds will part be given in the following description, and part will become apparent from the description below, or is recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage will be apparent from easy to understand from the following description of the accompanying drawings of embodiments, wherein:
Fig. 1 is the front view of the swirling flow atomizing room of the present invention;
Fig. 2 is the three-dimensional view of the swirling flow atomizing room of the present invention;
In figure, in figure, 100 refrigeration mode swirling flow atomizing room imports, the cross section of 200 refrigeration mode swirling flow atomizing rooms, 300 tops, refrigeration mode swirling flow atomizing room, 400 bottoms, refrigeration mode swirling flow atomizing room.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
In describing the invention, it will be appreciated that, term " on ", D score, " end ", " top ", "front", "rear", " interior ", " outward ", " horizontal ", the orientation of the instruction such as " erecting " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " couples ", " connection ", " being connected ", should be interpreted broadly " connection ", " cooperation ", connects for example, it may be fixing, it is integrally connected, it is also possible to be to removably connect;It can be the connection of two element internals;Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary;" coordinating " can be face and the coordinating of face, it is also possible to is point and the coordinating of face or line and face, also includes the cooperation of hole axle, for the ordinary skill in the art, and can be with concrete condition understanding above-mentioned term concrete meaning in the present invention.
The inventive concept of the present invention is as follows, a kind of integral structure is provided, use a kind of intermedium by described rotational flow atomizer and shell directly in conjunction with method, manufacturing process difficulty and cost is made to be simplified and reduce, contact the conduction of heat being more closely greatly improved aerochamber simultaneously, and then be greatly promoted refrigerating function and the stability of whole refrigeration system..
According to embodiments of the invention, including swirling flow atomizing room, thermal conductive silicon glue-line, external metallization heat-conducting layer;Described thermal conductive silicon glue-line is uniformly attached to described swirling flow atomizing chamber outer wall, and described external metallization heat-conducting layer is connected with described swirling flow atomizing room by described heat conductive silica gel.
It addition, according to a kind of refrigeration mode swirling flow atomizing room disclosed by the invention also there is following additional technical feature:
According to some embodiments of the present invention, described swirling flow atomizing room is simple glass or quartz glass structure.
Further, described heat conductive silica gel is liquid thermal conductivity silica gel.
According to some embodiments of the present invention, described external metallization heat-conducting layer is heat conduction good body metal structure.
Alternatively, described heat conduction good body metal structure is aluminum hull structure.
According to some embodiments of the present invention, described thermal conductive silicon glue-line is that heat conductive silica gel is through being uniformly in harmonious proportion and placingIt is more than 20 HourAfter room temperature be 20 degree-30 degree between formed cured layer.
According to some embodiments of the present invention, described thermal conductive silicon glue-line is the structure that liquid heat conductive silica gel solidify to form.
According to some embodiments of the present invention, described heat conductive silica gel layer thickness is more than or equal to 0.05mm.
Any mention that " embodiment ", " embodiment ", " illustrative examples " etc. mean to combine concrete component, structure or feature that this embodiment describes and be contained at least one embodiment of the present invention.In this specification, this schematic representation everywhere is not necessarily referring to identical embodiment.And, when combining any embodiment and describing concrete component, structure or feature, advocated, realize such component, structure or feature in conjunction with other embodiment and all fall within the scope of those skilled in the art.
Although the detailed description of the invention of the present invention is described in detail by the multiple illustrative examples with reference to the present invention, it must be understood that, those skilled in the art can be designed that multiple other improvement and embodiment, these improve and embodiment will fall within spirit and scope.Specifically, within the scope of aforementioned disclosure, accompanying drawing and claim, rational modification and improvement can be made in terms of the layout of parts and/or sub-combination layout, without departing from the spirit of the present invention.Except the modification in terms of parts and/or layout and improvement, its scope is defined by the appended claims and the equivalents thereof.

Claims (7)

1. a refrigeration mode swirling flow atomizing room, it is characterised in that
Swirling flow atomizing room, thermal conductive silicon glue-line, external metallization heat-conducting layer;
Described thermal conductive silicon glue-line is uniformly attached to described swirling flow atomizing chamber outer wall, and described external metallization heat-conducting layer is connected with described swirling flow atomizing room by described heat conductive silica gel.
A kind of refrigeration mode swirling flow atomizing room the most according to claim 1, it is characterised in that described swirling flow atomizing room is simple glass or quartz glass structure.
A kind of refrigeration mode swirling flow atomizing room the most according to claim 1, it is characterised in that described heat conductive silica gel is liquid thermal conductivity silica gel.
A kind of refrigeration mode swirling flow atomizing room the most according to claim 1, it is characterised in that described external metallization heat-conducting layer is heat conduction good body metal structure.
5. according to a kind of refrigeration mode swirling flow atomizing room described in claim 4, it is characterised in that described heat conduction good body metal structure is aluminum hull structure.
A kind of refrigeration mode swirling flow atomizing room the most according to claim 1, it is characterised in that described thermal conductive silicon glue-line is the cured layer that heat conductive silica gel is formed after being uniformly in harmonious proportion and standing.
A kind of refrigeration mode swirling flow atomizing room the most according to claim 1, it is characterised in that the structure that described thermal conductive silicon glue-line is solidify to form by liquid heat conductive silica gel.
CN201610546168.1A 2016-07-13 2016-07-13 Refrigeration type rotational flow atomizing chamber Pending CN105964462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610546168.1A CN105964462A (en) 2016-07-13 2016-07-13 Refrigeration type rotational flow atomizing chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610546168.1A CN105964462A (en) 2016-07-13 2016-07-13 Refrigeration type rotational flow atomizing chamber

Publications (1)

Publication Number Publication Date
CN105964462A true CN105964462A (en) 2016-09-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610546168.1A Pending CN105964462A (en) 2016-07-13 2016-07-13 Refrigeration type rotational flow atomizing chamber

Country Status (1)

Country Link
CN (1) CN105964462A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133491A (en) * 2001-10-30 2003-05-09 Inoac Corp Method for manufacturing heat conductive sheet
CN201026477Y (en) * 2007-01-10 2008-02-27 宋贺生 Rotational flow atomizer for injecting water
CN104321550A (en) * 2012-03-27 2015-01-28 Ntn株式会社 Composite plain bearing, cradle guide, and sliding nut
CN105318375A (en) * 2014-07-28 2016-02-10 佛山市顺德区美的电热电器制造有限公司 Induction cooker, panel assembly used for induction cooker and processing method
CN105375669A (en) * 2015-12-07 2016-03-02 天津博威动力设备有限公司 Generator housing material facilitating heat dissipation
CN205797605U (en) * 2016-07-13 2016-12-14 江苏天瑞仪器股份有限公司 A kind of refrigeration mode swirling flow atomizing room

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133491A (en) * 2001-10-30 2003-05-09 Inoac Corp Method for manufacturing heat conductive sheet
CN201026477Y (en) * 2007-01-10 2008-02-27 宋贺生 Rotational flow atomizer for injecting water
CN104321550A (en) * 2012-03-27 2015-01-28 Ntn株式会社 Composite plain bearing, cradle guide, and sliding nut
CN105318375A (en) * 2014-07-28 2016-02-10 佛山市顺德区美的电热电器制造有限公司 Induction cooker, panel assembly used for induction cooker and processing method
CN105375669A (en) * 2015-12-07 2016-03-02 天津博威动力设备有限公司 Generator housing material facilitating heat dissipation
CN205797605U (en) * 2016-07-13 2016-12-14 江苏天瑞仪器股份有限公司 A kind of refrigeration mode swirling flow atomizing room

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Application publication date: 20160928