CN105960134B - A kind of controller housing - Google Patents
A kind of controller housing Download PDFInfo
- Publication number
- CN105960134B CN105960134B CN201610547877.1A CN201610547877A CN105960134B CN 105960134 B CN105960134 B CN 105960134B CN 201610547877 A CN201610547877 A CN 201610547877A CN 105960134 B CN105960134 B CN 105960134B
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- Prior art keywords
- oxide
- metal
- semiconductor
- skid sheet
- enclosure body
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of controller housings, it include: enclosure body, connector opening, the fixed device of U-tube slot, metal-oxide-semiconductor expansion, electrolytic capacitor slot and wiring board fitting groove, connector opening and wiring board fitting groove are provided in the enclosure body, U-tube slot and electrolytic capacitor slot are provided in the wiring board fitting groove, the metal-oxide-semiconductor expands fixed device and is connected with the U-tube slot.By the above-mentioned means, controller housing of the present invention, so that high-end metal-oxide-semiconductor input pin is connected to power supply and low side metal-oxide-semiconductor input pin is connected to sample resistance Distance Shortened half, route distributed inductance reduces, and works for high-frequency circuit and reduces detrimental effect.
Description
Technical field
The present invention relates to machinery equipment field, more particularly to a kind of controller housing.
Background technique
With the development of economy, city becomes larger, and road traffic improves, and electric bicycle and automobile have replaced bicycle, controls
Device processed is one of the core component of electric bicycle and automobile, and metal-oxide-semiconductor is controller essential elements.
It can hear that many electric vehicles are very loud on road, caused by this is the current imbalance of three phases, metal-oxide-semiconductor is voltage control
Type processed, Opposed Current control type, under same signal, the length and thickness of input line and output line also will affect electric current, compare
Current-control type is much larger.
Brushless controller has an A phase, B phase, and C is connected to motor, three groups of identical driving circuits, and every phase has high-end 1 (or N
A parallel connection) and low side 1 (or N number of parallel connection) metal-oxide-semiconductor, power is bigger, and high-end and low side parallel connection metal-oxide-semiconductor is more, high-end input
Foot is connected to power supply, and low side foot is connected to sample resistance and arrives ground wire, three phase three high-end metal-oxide-semiconductor input pins to power supply distance again
Difference, three phases, three low side metal-oxide-semiconductor output pins are different to sample resistance distance, this two lines road is high-frequency heavy-current, is made
3 high-end metal-oxide-semiconductor input pins obtain that voltage is inconsistent and 3 low side metal-oxide-semiconductor output pins on voltage it is inconsistent, the bigger MOS of MOS
Guan Yue is more, and the current error of three phases is bigger, and electric efficiency is lower, and current ameliorative way has: to high current line on 1 wiring board
Item is welded with tin, adds electrolytic capacitor every a distance between 2 liang of lines.
But every hot weather, brushless controller failure rapid increase, metal-oxide-semiconductor and power filter electrolytic capacitor are easy
It burns out, metal-oxide-semiconductor need to be fixed to radiate on the shell, and metal-oxide-semiconductor is according to controller housing shaped formation, on the market absolutely greatly on wiring board
It is mostly that long square opening stretches aluminum hull, metal-oxide-semiconductor is indirectly fixed by long aluminium sheet (frequently referred to gap bridge aluminium sheet), does gap bridge aluminium sheet with aluminium
When, there are many detrimental effects, comprising: because of aluminium toughness, need often to go up kerosene on screw tap, tapping is easy on gap bridge aluminium sheet
There is rotten tooth, gap bridge aluminium sheet is easily deformed and generates burr in processing, stacking, transport；Again because gap bridge aluminium plate thickness (about 5MM) is limited
Throwing depth of threat degree, screw can not twist too tight, and gap bridge aluminium sheet and aluminum hull influence metal-oxide-semiconductor are thermally conductive；In addition, in secondary or being dismounted for multiple times
When anti-revisionist, gap bridge aluminium sheet silk tooth is easily damaged；Connection line between metal-oxide-semiconductor is elongated；On wiring board in addition to metal-oxide-semiconductor, other devices
It is to be transmitted on aluminum hull to radiate indirectly by air in shell that part, which generates heat, and wherein power filter electrolytic capacitor generates heat and compares
Greatly, it is easy to fry at full capacity when electric vehicle hot weather is long.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of controller housing, high, compact-sized with unfailing performance,
The advantages that vdiverse in function, at the same the application of mechanical equipment and it is universal on have extensive market prospects.
In order to solve the above technical problems, one technical scheme adopted by the invention is that:
A kind of controller housing is provided comprising: enclosure body, connector opening, the fixed dress of U-tube slot, metal-oxide-semiconductor expansion
It sets, electrolytic capacitor slot and wiring board fitting groove,
It is provided with connector opening and wiring board fitting groove in the enclosure body, is provided in the wiring board fitting groove
U-tube slot and electrolytic capacitor slot, the metal-oxide-semiconductor expand fixed device and are connected with the U-tube slot.
In a preferred embodiment of the present invention, it includes press strip and metal-oxide-semiconductor Anti-skid sheet that the metal-oxide-semiconductor, which expands fixed device,
The press strip and the metal-oxide-semiconductor Anti-skid sheet are set in the U-tube slot, the metal-oxide-semiconductor Anti-skid sheet be set to the press strip and
Between the enclosure body.
In a preferred embodiment of the present invention, the metal-oxide-semiconductor Anti-skid sheet is integral type arcuate structure, and the metal-oxide-semiconductor is anti-
Mounting hole is provided on slide plate and the press strip.
In a preferred embodiment of the present invention, the two sides of the bottom of the metal-oxide-semiconductor Anti-skid sheet are respectively arranged with an elastic slice,
The bottom of the elastic slice and the metal-oxide-semiconductor Anti-skid sheet is provided with chamfering, is provided with gap between 2 elastic slices.
In a preferred embodiment of the present invention, it includes arc fixinig plate and adjusting bracket that the metal-oxide-semiconductor, which expands fixed device,
The two sides of the arcuate structure bottom are respectively arranged with an adjusting bracket, are provided with gap between 2 adjusting brackets.
In a preferred embodiment of the present invention, the metal-oxide-semiconductor Anti-skid sheet includes two panels Anti-skid sheet monomer, is prevented described in two panels
The lower end of slide plate monomer is provided with chamfering, and the press strip is provided between Anti-skid sheet monomer described in two panels.
In a preferred embodiment of the present invention, it includes expanding block that the metal-oxide-semiconductor, which expands fixed device, and the expanding block is set
It is placed in the U-tube slot, the expanding block is trapezium structure or concave structure.
In a preferred embodiment of the present invention, the metal-oxide-semiconductor expands fixed device and the enclosure body passes through bolt
Connection.
It in a preferred embodiment of the present invention, further include mounting hole, the bottom surface of the U-tube slot is provided with the installation
Hole.
In a preferred embodiment of the present invention, the inner wall of the electrolytic capacitor slot is the arc knot being bonded with electrolytic capacitor
Structure.
It is connected the beneficial effects of the present invention are: high-end metal-oxide-semiconductor input pin is made to be connected to power supply with low side metal-oxide-semiconductor input pin
To sample resistance Distance Shortened half, controller efficiency is improved, lower noise, thermally conductive more preferable, reduces cost.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, in which:
Fig. 1 is the schematic perspective view of controller housing of the invention；
Fig. 2 is the attachment structure schematic diagram that the metal-oxide-semiconductor in the specific embodiment of the invention one expands fixed device；
Fig. 3 is the structural schematic diagram that the metal-oxide-semiconductor in the specific embodiment of the invention two expands fixed device；
Fig. 4 is the attachment structure schematic diagram that metal-oxide-semiconductor described in the specific embodiment of the invention three expands fixed device；
Fig. 5 is the attachment structure schematic diagram that metal-oxide-semiconductor described in the specific embodiment of the invention four expands fixed device；
Fig. 6 is that the metal-oxide-semiconductor in the specific embodiment of the invention five in the middle part of TO220 encapsulation metal-oxide-semiconductor expands fixed device
Attachment structure schematic diagram；
Fig. 7 is that the metal-oxide-semiconductor in the specific embodiment of the invention five in TO220 encapsulation metal-oxide-semiconductor bottom expands fixed device
Attachment structure schematic diagram；
Fig. 8 is that the metal-oxide-semiconductor in the specific embodiment of the invention five in the middle part of TO-247 encapsulation metal-oxide-semiconductor expands fixed device
Attachment structure schematic diagram；
Fig. 9 is the structural schematic diagram that the inverted metal-oxide-semiconductor expands fixed device in the specific embodiment of the invention six；
Figure 10 is the structure schematic diagram of controller housing of the invention.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Fig. 1-10 is please referred to, the embodiment of the present invention includes:
A kind of controller housing can be used for the fixation of the metal-oxide-semiconductors such as TO-247 encapsulation or TO-220 encapsulation comprising: shell
Body ontology 1, connector opening 2, the U-tube slot 3 for placing metal-oxide-semiconductor 10, metal-oxide-semiconductor expand fixed device 9, for placing route
The wiring board fitting groove 4 of plate 11, cooling fin 6, electrolytic capacitor slot 7, is set in wiring board fitting groove wiring board fixation hole 5
Thermally conductive sheet 8.
The wiring board fixation hole is set in the connector opening, and the cooling fin is set to the bottom surface and two
Side, the cover board are connected with the enclosure body, and the bottom surface of the U-tube slot is provided with the mounting hole, due to shell
The bottom surface of the bottom surface of ontology and the U-tube slot be it is same, so the bottom surface of the U-tube slot is provided with described mounting hole etc.
The bottom surface of enclosure body is provided with mounting hole 93.
The inner wall of the electrolytic capacitor slot is the arcuate structure being bonded with electrolytic capacitor, and the press strip is isosceles trapezoid knot
Structure.
It is provided with connector opening and wiring board fitting groove in the enclosure body, is provided in the wiring board fitting groove
Thermally conductive sheet, U-tube slot and electrolytic capacitor slot, the metal-oxide-semiconductor expand fixed device and are set in the U-tube slot, the metal-oxide-semiconductor
Fixed device is expanded to be bolted with the enclosure body.
The working principle of controller housing are as follows: high-end metal-oxide-semiconductor and low side metal-oxide-semiconductor are divided into two rows of and are compactly mounted directly
In the circuit board, when big power controller metal-oxide-semiconductor number is more, can be opened in enclosure body 2 or multiple U-tube slots into
Row is fixed, and aluminum hull opening in high-end metal-oxide-semiconductor side reaches battery, the connecting terminal of motor is directly inserted on wiring board.
Both sides metal-oxide-semiconductor Anti-skid sheet is promoted to squeeze to two sides using press strip gradient, metal-oxide-semiconductor Anti-skid sheet, metal-oxide-semiconductor, U-tube slot
Between generate frictional force, reach fixed effect.
Specific embodiment one
It includes press strip 91 and metal-oxide-semiconductor Anti-skid sheet 92 that the metal-oxide-semiconductor, which expands fixed device 9, and the press strip and the metal-oxide-semiconductor are anti-
Slide plate is set in the U-tube slot, and the metal-oxide-semiconductor Anti-skid sheet is set between the press strip and the enclosure body.
The metal-oxide-semiconductor Anti-skid sheet is integral type arcuate structure, and is provided with peace on the metal-oxide-semiconductor Anti-skid sheet and the press strip
Fill hole 93.
When installation, first press strip and metal-oxide-semiconductor Anti-skid sheet fixed Combination are got up with 1 pre-installation screw without a head,
Then insulating film is pressed between two rows of metal-oxide-semiconductors with the metal-oxide-semiconductor anti-skid device after combination, so that metal-oxide-semiconductor expands fixed device card
Between two rows of metal-oxide-semiconductors, pre-installation screw passes through corresponding mounting hole on U-tube slot, then wiring board and metal-oxide-semiconductor is expanded solid
Determine device to be mounted in enclosure body, the connector on wiring board is open across connector, sets right press strip and metal-oxide-semiconductor Anti-skid sheet makes it
On mounting hole be aligned with the mounting hole in enclosure body, then the mounting hole on both sides is connected with normal screws, then
Back-out pre-installation screw, replace pre-installation screw that enclosure body and metal-oxide-semiconductor are expanded fixed device with normal screws and be fixed up,
I.e. so that wiring board is fixedly connected with enclosure body, then by cover plate lid in enclosure body.
Specific embodiment two
It includes press strip 91 and metal-oxide-semiconductor Anti-skid sheet 92 that the metal-oxide-semiconductor, which expands fixed device 9, and the press strip and the metal-oxide-semiconductor are anti-
Slide plate is set in the U-tube slot, and the metal-oxide-semiconductor Anti-skid sheet is set between the press strip and the enclosure body.
The metal-oxide-semiconductor Anti-skid sheet is integral type arcuate structure, and the two sides of the bottom of the metal-oxide-semiconductor Anti-skid sheet are respectively arranged with
One elastic slice 94, the metal-oxide-semiconductor Anti-skid sheet are an integral structure with the elastic slice, the bottom of the elastic slice and the metal-oxide-semiconductor Anti-skid sheet
Portion is provided with chamfering, and gap is provided between 2 elastic slices, is provided with installation on the metal-oxide-semiconductor Anti-skid sheet and the press strip
Hole 93.
When installation, first press strip and metal-oxide-semiconductor Anti-skid sheet fixed Combination are got up with 1 pre-installation screw without a head,
Then insulating film is pressed between two rows of metal-oxide-semiconductors with the metal-oxide-semiconductor anti-skid device after combination, so that metal-oxide-semiconductor Anti-skid sheet is stuck in two rows
Between metal-oxide-semiconductor, and the press strip is set in the gap between the elastic slice, and pre-installation screw passes through corresponding on U-tube slot
Then wiring board and metal-oxide-semiconductor are expanded fixed device and are mounted in enclosure body by mounting hole, the connector on wiring board is passed through and patched
Part opening, sets right press strip and metal-oxide-semiconductor Anti-skid sheet is aligned mounting hole thereon with the mounting hole in enclosure body, then with common
Screw connects the mounting hole on both sides, then back-outs pre-installation screw, replaces pre-installation screw by shell with normal screws
Ontology and metal-oxide-semiconductor expand fixed device and are fixed up, i.e., so that wiring board is fixedly connected with enclosure body, then by cover board
It covers in enclosure body.
Specific embodiment three
It includes arc fixinig plate 95 and adjusting bracket 96 that the metal-oxide-semiconductor, which expands fixed device, and the two of the arcuate structure bottom
Side is respectively arranged with an adjusting bracket, and the arc fixinig plate is an integral structure with the adjusting bracket, 2 adjusting brackets
Between be provided with gap.
When installation, pre-installation screw is connected with the metal-oxide-semiconductor anti-skid device first, can will pre-install spiral shell
Silk offsets with adjusting bracket, then expands fixed device with metal-oxide-semiconductor and insulating film is pressed between two rows of metal-oxide-semiconductors, so that metal-oxide-semiconductor is anti-skidding
Piece is stuck between two rows of metal-oxide-semiconductors, then adjusts pre-installation screw and pre-installation screw is made to oppress adjusting bracket downwards, to strut
Metal-oxide-semiconductor, then wiring board and metal-oxide-semiconductor are expanded fixed device and are mounted in enclosure body, the connector on wiring board passes through connector
Opening, sets right press strip and metal-oxide-semiconductor Anti-skid sheet is aligned mounting hole thereon with the mounting hole in enclosure body, then with common spiral shell
Silk connects the mounting hole on both sides, then back-outs pre-installation screw, replaces pre-installation screw by shell sheet with normal screws
Body and metal-oxide-semiconductor expand fixed device and are fixed up, i.e., so that wiring board is fixedly connected with enclosure body, then by cover plate lid
In enclosure body.
Specific embodiment four
It includes press strip 91 and metal-oxide-semiconductor Anti-skid sheet 92 that the metal-oxide-semiconductor, which expands fixed device, and the press strip and the metal-oxide-semiconductor are anti-
Slide plate is set in the U-tube slot, and the metal-oxide-semiconductor Anti-skid sheet is set between the press strip and the enclosure body, described
Mounting hole is provided on press strip.
The metal-oxide-semiconductor Anti-skid sheet includes two panels Anti-skid sheet monomer 97, and the lower end of Anti-skid sheet monomer described in two panels is provided with down
Angle is provided with the press strip between Anti-skid sheet monomer described in two panels.
When installation, first press strip and metal-oxide-semiconductor Anti-skid sheet fixed Combination are got up, i.e., 2 Anti-skid sheet monomers are set respectively
The two sides of press strip are placed in, so that being equipped with gap between Anti-skid sheet monomer described in two panels, is then expanded and is fixed with the metal-oxide-semiconductor after combination
Insulating film is pressed between two rows of metal-oxide-semiconductors by device, so that metal-oxide-semiconductor expands fixed device card between metal-oxide-semiconductor, then wiring board
It expands fixed device with metal-oxide-semiconductor to be mounted in enclosure body, the connector on wiring board is open across connector, by the lower end of screw
Mounting hole in enclosure body, the mounting hole on the gap and press strip between Anti-skid sheet monomer are sequentially passed through, screw passes through
When gap, it is fixed so that Anti-skid sheet monomer extends to two sides and oppresses two rows of metal-oxide-semiconductors, it can by enclosure body and route
Plate is fixed up, then by cover plate lid in enclosure body.
Specific embodiment five
It includes expanding block 98 that the metal-oxide-semiconductor, which expands fixed device, and the expanding block is set in the U-tube slot, described
Expanding block is trapezium structure, is provided with mounting hole on the expanding block.
When expanding block is installed, the position of expanding block can be adjusted according to the structure of metal-oxide-semiconductor, such as when being used in
When TO220 encapsulates metal-oxide-semiconductor, expanding block can choose the bottom and middle part for being stuck in two rows of metal-oxide-semiconductors according to itself size, for example, when with
When TO247 encapsulates metal-oxide-semiconductor, expanding block is stuck in the middle part of two rows of metal-oxide-semiconductors after being inverted.
When installation, directly expanding block is pressed between two rows of metal-oxide-semiconductors, that is, utilizes the inverted trapezoidal structure pressure of expanding block
Compel metal-oxide-semiconductor, wiring board and metal-oxide-semiconductor are then expanded fixed device and are mounted in enclosure body, the connector on wiring board is passed through and connect
Insert aperture, the expanding block that sets right are aligned mounting hole thereon with the mounting hole in enclosure body, then with normal screws by shell
Body ontology and metal-oxide-semiconductor expand fixed device and are fixed up, i.e., then will lid so that wiring board is fixedly connected with enclosure body
Plate covers in enclosure body.
Specific embodiment six
It includes expanding block that the metal-oxide-semiconductor, which expands fixed device, and the expanding block is set in the U-tube slot, described swollen
Mounting hole is provided in expansion block, and the expanding block is concave structure.
When installation, insulating film is pressed between two rows of metal-oxide-semiconductors after expanding block is inverted, so that metal-oxide-semiconductor expansion is solid
Determine device card between metal-oxide-semiconductor, i.e., the groove on expanding block downward, at this moment by enclosure body lid assist side and expanding block,
Connector on wiring board is open across connector, and the expanding block that sets right makes the mounting hole pair on mounting hole and enclosure body thereon
Together, then the mounting hole on wiring board and expanding block is connected with setscrew, the bottom end of setscrew is passing through installation
The side wall of groove is oppressed in hole when entering groove, so that expanding block expands outwardly compressing metal-oxide-semiconductor, such wiring board and shell sheet
Body is just capable of fixing and is connected to, finally by cover plate lid in enclosure body.
Specific embodiment seven
It includes elastic device that the metal-oxide-semiconductor, which expands fixed device, the elastic device be set to metal-oxide-semiconductor end or in
Portion.
When installation, directly insulating film is pressed between two rows of metal-oxide-semiconductors using elastic device, so that elastic device card
Between metal-oxide-semiconductor, at this moment by enclosure body lid assist side and expanding block, the connector on wiring board is open across connector,
The expanding block that sets right is aligned mounting hole thereon with the mounting hole in enclosure body, then with setscrew by wiring board and expansion
Mounting hole on block connects, and the side wall of groove is oppressed in the bottom end of setscrew when passing through mounting hole and entering groove,
So that expanding block expands outwardly compressing metal-oxide-semiconductor, such wiring board is just capable of fixing with enclosure body to be connected to, finally by cover plate lid
In enclosure body.
The beneficial effect of controller housing of the present invention is: so that high-end metal-oxide-semiconductor input pin is connected to power supply and low side metal-oxide-semiconductor
Input pin is connected to sample resistance Distance Shortened, and controller efficiency improves, lower noise, thermally conductive more preferable, reduces cost.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (6)
1. a kind of controller housing characterized by comprising enclosure body, connector opening, the expansion of U-tube slot, metal-oxide-semiconductor are solid
Determine device, electrolytic capacitor slot and wiring board fitting groove,
It is provided with connector opening and wiring board fitting groove in the enclosure body, is provided with U-shaped in the wiring board fitting groove
Tube seat and electrolytic capacitor slot, the metal-oxide-semiconductor expand fixed device and are connected with the U-tube slot, the fixed dress of metal-oxide-semiconductor expansion
It sets and is bolted with the enclosure body,
It includes press strip and metal-oxide-semiconductor Anti-skid sheet that the metal-oxide-semiconductor, which expands fixed device, and the press strip and the metal-oxide-semiconductor Anti-skid sheet are arranged
In in the U-tube slot, the metal-oxide-semiconductor Anti-skid sheet is set between the press strip and the enclosure body, the U-tube slot
Be provided with mounting hole on bottom surface, the metal-oxide-semiconductor Anti-skid sheet and the press strip, bolt by the press strip by metal-oxide-semiconductor Anti-skid sheet to
Two sides squeeze, and the frictional force generated between metal-oxide-semiconductor Anti-skid sheet, metal-oxide-semiconductor, U-tube slot makes metal-oxide-semiconductor expand fixed device to two rows
Metal-oxide-semiconductor is fixed.
2. controller housing according to claim 1, which is characterized in that the metal-oxide-semiconductor Anti-skid sheet is integral type arc knot
Structure.
3. controller housing according to claim 1, which is characterized in that the metal-oxide-semiconductor Anti-skid sheet includes two panels Anti-skid sheet
The lower end of monomer, Anti-skid sheet monomer described in two panels is provided with chamfering, and the pressure is provided between Anti-skid sheet monomer described in two panels
Item.
4. controller housing according to claim 1 or 2 or 3, which is characterized in that the bottom of the metal-oxide-semiconductor Anti-skid sheet
Two sides are respectively arranged with an elastic slice, and the bottom of the elastic slice and the metal-oxide-semiconductor Anti-skid sheet is provided with chamfering, 2 elastic slices it
Between be provided with gap.
5. controller housing according to claim 1, which is characterized in that the metal-oxide-semiconductor Anti-skid sheet uses expanding block, described
Expanding block is set in the U-tube slot, and the expanding block is trapezium structure or concave structure.
6. controller housing according to claim 1, which is characterized in that the inner wall of the electrolytic capacitor slot is and electrolysis is electric
Hold the arcuate structure of fitting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610547877.1A CN105960134B (en) | 2016-07-13 | 2016-07-13 | A kind of controller housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610547877.1A CN105960134B (en) | 2016-07-13 | 2016-07-13 | A kind of controller housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105960134A CN105960134A (en) | 2016-09-21 |
| CN105960134B true CN105960134B (en) | 2019-04-19 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610547877.1A Active CN105960134B (en) | 2016-07-13 | 2016-07-13 | A kind of controller housing |
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| CN (1) | CN105960134B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555190B (en) * | 2021-07-20 | 2022-07-15 | 珠海格力电器股份有限公司 | Inductor and electrical apparatus box assisting in heat dissipation of electronic component |
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| CN202574061U (en) * | 2012-05-11 | 2012-12-05 | 山东安博电驱动技术有限公司 | Control device and electric vehicle |
| CN202587704U (en) * | 2012-05-11 | 2012-12-05 | 山东安博电驱动技术有限公司 | Controller and electric vehicle |
| CN103747649A (en) * | 2013-12-17 | 2014-04-23 | 南京海勇电子科技有限公司 | Controller for electric vehicles |
| CN204069589U (en) * | 2014-07-30 | 2014-12-31 | 广东高标电子科技有限公司 | Controller for electric vehicle and electric motor car |
| CN205812587U (en) * | 2016-07-13 | 2016-12-14 | 芮金书 | A kind of controller housing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105960134A (en) | 2016-09-21 |
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