CN105957664A - Chip resistor, circuit board and terminal equipment - Google Patents
Chip resistor, circuit board and terminal equipment Download PDFInfo
- Publication number
- CN105957664A CN105957664A CN201610251077.5A CN201610251077A CN105957664A CN 105957664 A CN105957664 A CN 105957664A CN 201610251077 A CN201610251077 A CN 201610251077A CN 105957664 A CN105957664 A CN 105957664A
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- CN
- China
- Prior art keywords
- chip
- resistive element
- electrode
- circuit board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention provides a chip resistor, a circuit board and terminal equipment. The chip resistor comprises N laminated resistor assemblies, wherein the resistor assemblies are composed of substrates, resistor bodies and electrodes, N is a positive integer equal to or greater than 2, the electrodes are symmetrically arranged at two ends of the substrates, and the resistor bodies are arranged on one of the planes of the substrates and connected with the electrodes in a non-vertical way. Thus, cross wiring of circuits can be realized; designing of the layout of the circuit board is made possible; difficulty in the layout of the circuit board is reduced; time for the layout of the circuit board is decreased; and efficiency of the layout of the circuit board is improved.
Description
Technical field
The application relates to electronic technology field, particularly relates to a kind of Chip-R, circuit board and terminal unit.
Background technology
At present, during PCB (Printed Circuit Board the is called for short PCB) fabric swatch of electronic product, often
The situation of crossing elimination wiring occurs, now in order to avoid crossing elimination, it is necessary to multilayer circuit board is set, or will intersect
Circuit rewiring with avoid intersect, this not only adds fabric swatch cost, the cycle also making fabric swatch is longer, inefficiency.
Summary of the invention
One of technical problem that the application is intended to solve in correlation technique the most to a certain extent.
To this end, the application proposes a kind of Chip-R, it is achieved the cross wire between circuit, the fabric swatch for circuit board designs offer
Condition, reduces fabric swatch difficulty, saves the fabric swatch time, improve cloth plate efficiency..
For reaching above-mentioned purpose, the embodiment of the present application proposes a kind of Chip-R, including: the resistor assembly that N number of stacking is arranged；
Wherein, described resistor assembly is made up of substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；Described electrode
Being symmetricly set on the two ends of described substrate, described resistive element is arranged in a plane of described substrate, and non-with described electrode
Vertical connection.
The Chip-R that the embodiment of the present application provides, the resistor assembly arranged including N number of stacking, wherein, resistor assembly is by base
Plate, it is arranged on the electrode at substrate two ends, and is arranged on substrate and the resistive element composition that be connected non-perpendicular with electrode.Thus may be used
Realizing the cross wire between circuit, the fabric swatch design for circuit board provides condition, reduces fabric swatch difficulty, saves fabric swatch
Time, improve cloth plate efficiency.
In an embodiment of the invention, the angle that the resistive element in the resistor assembly that described N number of stacking is arranged forms with electrode
Being worth identical, described angle refers to the acute angle of resistive element and electrode composition.
In an embodiment of the invention, the angle that the resistive element in the resistor assembly that described N number of stacking is arranged forms with electrode
Value difference, described angle refers to the acute angle of resistive element and electrode composition.
In an embodiment of the invention, the resistance of the resistive element in the resistor assembly that N number of stacking is arranged is different.
In an embodiment of the invention, the resistance of the resistive element in the resistor assembly that N number of stacking is arranged is identical.
In an embodiment of the invention, it is arranged between the adjacent electrode of Chip-R homonymy and is spaced default distance.
In an embodiment of the invention, described resistive element is by being sintered to fix on the substrate.
For reaching above-mentioned purpose, the embodiment of the present application proposes a kind of circuit board, including Chip-R as above.
The circuit board that the embodiment of the present application provides, uses the Chip-R of the resistor assembly including that N number of stacking arranges, Qi Zhong electricity
Resistance assembly is by substrate, the electrode that is arranged on substrate two ends, and is arranged on substrate and the resistive element group that be connected non-perpendicular with electrode
Become.Thus circuit board is when wiring, can carry out the cross wire between circuit, and the fabric swatch design for circuit board provides condition,
Reduce fabric swatch difficulty, save the fabric swatch time, improve cloth plate efficiency.
For reaching above-mentioned purpose, the embodiment of the present application proposes a kind of terminal unit, including circuit board as above.
For reaching above-mentioned purpose, the embodiment of the present application proposes another kind of terminal unit, including following one or more assemblies: circuit
Plate, housing, processor, memorizer, power circuit, multimedia groupware, audio-frequency assembly, input/output (I/O) connects
Mouthful, sensor cluster, and communications component；Wherein, described circuit board is placed in the interior volume that described housing surrounds, institute
State processor and described memorizer is arranged on described circuit board；Described power circuit, for for each of described mobile terminal
Circuit or device are powered；Described memorizer is used for storing executable program code；Described processor is by reading described memorizer
The executable program code of middle storage runs the program corresponding with described executable program code；
At least including a Chip-R on described circuit board, wherein, Chip-R includes: the resistor group that N number of stacking is arranged
Part；Wherein, described resistor assembly includes substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；Described electricity
Pole is symmetricly set on the two ends of described substrate, and described resistive element is arranged in a plane of described substrate, and with described electrode
Non-perpendicular connection.
The terminal unit that the embodiment of the present application provides, the resistor assembly that the Chip-R that circuit board includes is arranged by N number of stacking
Composition, wherein resistor assembly is by substrate, the electrode that is arranged on substrate two ends, and is arranged on substrate and company non-perpendicular with electrode
The resistive element composition connect.Thus circuit board is when wiring, can realize the cross wire between circuit, and the fabric swatch for circuit board designs
Provide condition, reduce fabric swatch difficulty, save the fabric swatch time, improve cloth plate efficiency, and then reduce terminal unit
Design difficulty and cost.
Accompanying drawing explanation
The present invention above-mentioned and/or that add aspect and advantage will be apparent from from the following description of the accompanying drawings of embodiments
With easy to understand, wherein:
Fig. 1 is the structural representation of the Chip-R of one embodiment of the application；
Fig. 2 is the structural representation of the resistor assembly in the Chip-R of one embodiment of the application；
Fig. 3 is the Chip-R structural representation of another embodiment of the application；
Fig. 4 is two conspectuses crossed one another in pcb board；
Fig. 5 is the board structure of circuit schematic diagram of one embodiment of the application；
Fig. 6 is the structural representation of the terminal unit of one embodiment of the application；
The structural representation of the terminal unit of Fig. 7 another embodiment of the application.
Description of reference numerals:
Chip-R-100；Resistor assembly-110；Substrate-111；
Resistive element-112；Electrode-113；Resistor assembly-110a；
Resistor assembly-110b；Resistive element 112a；Resistive element-112b；
Electrode-113a；Electrode-113b；Circuit board 5；
Terminal unit 6；Housing 70；Processor 71；
Memorizer 72；Power circuit 73；Multimedia groupware 74；
Audio-frequency assembly 75；The interface 76 of input/output (I/O)；
Sensor cluster 77；Communications component 78.
Detailed description of the invention
Embodiments herein is described below in detail, and the example of described embodiment is shown in the drawings, the most identical
Or similar label represents same or similar element or has the element of same or like function.Retouch below with reference to accompanying drawing
The embodiment stated is exemplary, it is intended to be used for explaining the application, and it is not intended that restriction to the application.
Below with reference to the accompanying drawings the structure of the Chip-R of the embodiment of the present application, circuit board and terminal unit is described.
Fig. 1 is the structural representation of the Chip-R of one embodiment of the application, and Fig. 2 is the paster of one embodiment of the application
The structural representation of the resistor assembly in resistance.
As depicted in figs. 1 and 2, Chip-R 100, including: the resistor assembly 110 that N number of stacking is arranged.
Wherein, as illustrated in fig. 1 and 2, described resistor assembly 110 is made up of substrate 111, resistive element 112 and electrode 113,
N is the positive integer equal to or more than 2；Described electrode 113 is symmetricly set on the two ends of described substrate 111, described resistive element
112 are arranged in a plane of described substrate 111, and non-perpendicular with described electrode 113 are connected.
Wherein, resistive element 112 can be by being sintered to fix on substrate 111.
Specifically, as illustrated in fig. 1 and 2, in the present embodiment, the resistive element 112 in resistor assembly 110 and electrode 113
Non-perpendicular connection, so when the stacking of N number of resistor assembly 110 arranges one Chip-R 100 of composition, by a paster
Resistance 100 achieves that and is reliably connected by the circuit crossed one another in circuit board, thus the fabric swatch process for designer provides
Facility, decreases the fabric swatch time.
Further, the N number of resistor assembly 110 in Chip-R 100 can be the same or different, i.e. Chip-R 100
In the resistor assembly 110 that arranges of N number of stacking in resistive element 112 and electrode 113 composition angle can identical also may be used
With difference；And, the resistance of the resistive element 112 in the resistor assembly 100 that N number of stacking is arranged can be the same or different.
For example, if N=2, the resistive element in two resistive elements in Chip-R is 45 ° with the angle of electrode composition, then
The structure of Chip-R can be as shown in Figure 3.
Fig. 3 is the Chip-R structural representation of another embodiment of the application.Fig. 4 be in pcb board two cross one another
Conspectus.
As it is shown on figure 3, Chip-R 100 is made up of 2 resistor assembly 110a and 110b, wherein the first resistor assembly 110a
In, resistive element 112a and electrode 113a angle at 45 °, in the second resistor assembly 110b, resistive element 112b and electrode 113b
Angle at 45 °, then this Chip-R can realize the transmission of signal as shown in Figure 4.The signal of A point will be transferred to D
Point, is transferred to C point by the signal that B point inputs.
Time specifically used, can select between corresponding resistive element and the angle of electrode composition and circuit according to angle between AC and BD
The Chip-R of angle coupling, and according to the needs of line transmission, select the Chip-R that the resistive element of different resistance is constituted.
Further, when homonymy has at least two electrode 113 in Chip-R 100, it is arranged on described Chip-R 110
It is spaced default distance between the adjacent electrode 113 of homonymy.
Concrete, Chip-R as shown in Figure 3, electrode 113a and 113b respectively from different resistive elements and connection,
For realizing the isolation between the signal of telecommunication, need between electrode 113a and 113b to arrange default distance.
Wherein, the distance preset needs the sectional area size according to substrate, each electrode to need size of current and the circuit of transmission
Between the class of insulation determine.
The Chip-R that the embodiment of the present application provides, the resistor assembly arranged including N number of stacking, wherein, described resistor assembly
Being made up of substrate, resistive element and electrode, N is the positive integer equal to or more than 2；Described electrode is symmetricly set on described substrate
Two ends, described resistive element is arranged in a plane of described substrate, and non-perpendicular with described electrode is connected.Thus can be real
Cross wire between existing circuit, the fabric swatch design for circuit board provides condition, reduces fabric swatch difficulty, when saving fabric swatch
Between, improve cloth plate efficiency.
Fig. 5 is the board structure of circuit schematic diagram of one embodiment of the application.As it is shown in figure 5, this circuit board 5 includes N bar
The transmission line of cross wire, and as above Chip-R 100 described in any embodiment, wherein, N is equal to or more than 2
Positive integer.
Wherein, the concrete structure of Chip-R 100 and the mode that is connected with N bar circuit, can refer to above-described embodiment
Describing in detail, here is omitted.
The circuit board that the embodiment of the present application provides, uses the Chip-R of the resistor assembly including that N number of stacking arranges, wherein,
Resistor assembly is made up of substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；Described electrode is symmetricly set on
The two ends of described substrate, described resistive element is arranged in a plane of described substrate, and non-perpendicular with described electrode is connected.
Hereby it is achieved that circuit board is when wiring, can carry out the cross wire between circuit, the fabric swatch design for circuit board provides bar
Part, reduces fabric swatch difficulty, saves the fabric swatch time, improves cloth plate efficiency.
Fig. 6 is the structural representation of the terminal unit of one embodiment of the application.As shown in Figure 6, this terminal unit 6 includes
Circuit board 5 as above.
It should be noted that the above-mentioned detailed description to circuit board 5, the terminal unit being also applied in the present embodiment, herein
Repeat no more.
The terminal unit that the present embodiment provides, the resistor assembly that the Chip-R that circuit board includes is arranged by N number of stacking forms,
Wherein resistor assembly is by substrate, the electrode that is arranged on substrate two ends, and is arranged on substrate and the electricity that be connected non-perpendicular with electrode
Resistance body forms.Thus circuit board is when wiring, can realize the cross wire between circuit, and the fabric swatch design for circuit board provides
Condition, reduces fabric swatch difficulty, saves the fabric swatch time, improves cloth plate efficiency, and then reduces the design of terminal unit
Difficulty and cost.
The structural representation of the terminal unit of Fig. 7 another embodiment of the application.
As it is shown in fig. 7, this terminal unit, including following one or more assemblies: circuit board 5, housing 70, processor 71,
Memorizer 72, power circuit 73, multimedia groupware 74, audio-frequency assembly 75, the interface 76 of input/output (I/O),
Sensor cluster 77, and communications component 78；Wherein, in described circuit board 5 is placed in the space that described housing 70 surrounds
Portion, described processor 71 and described memorizer 72 are arranged on described circuit board 5；Described power circuit 73, is used for as institute
Each circuit or the device of stating mobile terminal are powered；Described memorizer 72 is used for storing executable program code；Described processor
71 run corresponding with described executable program code by reading the executable program code of storage in described memorizer 72
Program；
Wherein, described circuit board 5 at least including a Chip-R, wherein, Chip-R includes: N number of stacking is arranged
Resistor assembly；Wherein, described resistor assembly includes substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；
Described electrode is symmetricly set on the two ends of described substrate, and described resistive element is arranged in a plane of described substrate, and with institute
State the non-perpendicular connection of electrode.
It is understood that any component on circuit board 5 can use above-mentioned Chip-R to constitute, the tool of Chip-R
Body structure can refer to the detailed description of above-described embodiment, and here is omitted.
The terminal unit that the embodiment of the present application provides, the resistor assembly that the Chip-R that circuit board includes is arranged by N number of stacking
Composition, wherein resistor assembly is by substrate, the electrode that is arranged on substrate two ends, and is arranged on substrate and company non-perpendicular with electrode
The resistive element composition connect.Thus circuit board is when wiring, can realize the cross wire between circuit, and the fabric swatch for circuit board designs
Provide condition, reduce fabric swatch difficulty, save the fabric swatch time, improve cloth plate efficiency, and then reduce terminal unit
Design difficulty and cost.
In describing the invention, term " angle ", " distance " etc. instruction orientation or position relationship for based on accompanying drawing institute
The orientation shown or position relationship, be for only for ease of and describe the present invention and simplify description rather than instruction or the position of hint indication
Put or element must have specific orientation, with specific orientation, specific azimuth configuration, therefore it is not intended that to this
The restriction of invention.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " tool
Body example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material
Material or feature are contained at least one embodiment or the example of the application.
In this manual, the schematic representation of above-mentioned term is necessarily directed to identical embodiment or example.And,
Describe specific features, structure, material or feature can with in one or more embodiments in office or example in an appropriate manner
In conjunction with.Additionally, in the case of the most conflicting, those skilled in the art can different real by described in this specification
The feature executing example or example and different embodiment or example is combined and combines.
Claims (10)
1. a Chip-R, it is characterised in that including: the resistor assembly that N number of stacking is arranged；Wherein, described resistor group
Part is made up of substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；
Described electrode is symmetricly set on the two ends of described substrate, and described resistive element is arranged in a plane of described substrate, and
Non-perpendicular with described electrode it is connected.
Chip-R the most according to claim 1, it is characterised in that in the resistor assembly that described N number of stacking is arranged
Resistive element is identical with the angle value that electrode forms, and described angle refers to the acute angle of resistive element and electrode composition.
Chip-R the most according to claim 1, it is characterised in that in the resistor assembly that described N number of stacking is arranged
Resistive element is different from the angle value that electrode forms, and described angle refers to the acute angle of resistive element and electrode composition.
4. according to the arbitrary described Chip-R of claim 1-3, it is characterised in that the resistor group that described N number of stacking is arranged
The resistance of the resistive element in part is different.
5. according to the arbitrary described Chip-R of claim 1-3, it is characterised in that the resistor group that described N number of stacking is arranged
The resistance of the resistive element in part is identical.
6. according to the arbitrary described Chip-R of claim 1-3, it is characterised in that be arranged on the adjacent of Chip-R homonymy
Default distance it is spaced between electrode.
Chip-R the most according to claim 6, it is characterised in that described resistive element is by being sintered to fix at described base
On plate.
8. a circuit board, it is characterised in that include the Chip-R as described in claim 1-7 is arbitrary.
9. a terminal unit, it is characterised in that include circuit board as claimed in claim 8.
10. a terminal unit, it is characterised in that include following one or more assembly: circuit board, housing, processor,
Memorizer, power circuit, multimedia groupware, audio-frequency assembly, the interface of input/output (I/O), sensor cluster, with
And communications component；Wherein, described circuit board is placed in the interior volume that described housing surrounds, described processor and described storage
Device is arranged on described circuit board；Described power circuit, powers for each circuit or the device for described mobile terminal；Institute
State memorizer for storing executable program code；Described processor is by reading the executable program of storage in described memorizer
Code runs the program corresponding with described executable program code；
At least including a Chip-R on described circuit board, wherein, Chip-R includes: the resistor group that N number of stacking is arranged
Part；Wherein, described resistor assembly includes substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；Described electricity
Pole is symmetricly set on the two ends of described substrate, and described resistive element is arranged in a plane of described substrate, and with described electrode
Non-perpendicular connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610251077.5A CN105957664A (en) | 2016-04-20 | 2016-04-20 | Chip resistor, circuit board and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610251077.5A CN105957664A (en) | 2016-04-20 | 2016-04-20 | Chip resistor, circuit board and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105957664A true CN105957664A (en) | 2016-09-21 |
Family
ID=56917707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610251077.5A Pending CN105957664A (en) | 2016-04-20 | 2016-04-20 | Chip resistor, circuit board and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105957664A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08279402A (en) * | 1995-04-04 | 1996-10-22 | Fuji Electric Co Ltd | Zinc oxide arrester |
| JPH11204314A (en) * | 1998-01-09 | 1999-07-30 | Murata Mfg Co Ltd | Laminated electronic component array |
| JP2001196204A (en) * | 2000-01-11 | 2001-07-19 | Matsushita Electric Ind Co Ltd | Ceramic electronic component and manufacturing method thereof |
| CN1885713A (en) * | 2005-06-24 | 2006-12-27 | Tdk株式会社 | Surge absorption circuit |
| CN102324292A (en) * | 2011-08-26 | 2012-01-18 | 深圳市卓怡恒通电脑科技有限公司 | Exclusion and use the pcb board of this exclusion |
| CN202172527U (en) * | 2011-08-04 | 2012-03-21 | 山东新北洋信息技术股份有限公司 | Printed circuit board |
-
2016
- 2016-04-20 CN CN201610251077.5A patent/CN105957664A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08279402A (en) * | 1995-04-04 | 1996-10-22 | Fuji Electric Co Ltd | Zinc oxide arrester |
| JPH11204314A (en) * | 1998-01-09 | 1999-07-30 | Murata Mfg Co Ltd | Laminated electronic component array |
| JP2001196204A (en) * | 2000-01-11 | 2001-07-19 | Matsushita Electric Ind Co Ltd | Ceramic electronic component and manufacturing method thereof |
| CN1885713A (en) * | 2005-06-24 | 2006-12-27 | Tdk株式会社 | Surge absorption circuit |
| CN202172527U (en) * | 2011-08-04 | 2012-03-21 | 山东新北洋信息技术股份有限公司 | Printed circuit board |
| CN102324292A (en) * | 2011-08-26 | 2012-01-18 | 深圳市卓怡恒通电脑科技有限公司 | Exclusion and use the pcb board of this exclusion |
Non-Patent Citations (2)
| Title |
|---|
| 何宾: "《Altium Designer 15.0电路仿真 设计 验证与工艺实现权威指南》", 31 October 2015, 清华大学出版社 * |
| 陈凌霄，张晓磊: "《电子电路测量与设计实验》", 31 August 2015, 北京邮电大学出版社 * |
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| PB01 | Publication | ||
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Application publication date: 20160921 |