CN105938754A - Electronic component and method for manufacturing electronic component - Google Patents
Electronic component and method for manufacturing electronic component Download PDFInfo
- Publication number
- CN105938754A CN105938754A CN201610124915.2A CN201610124915A CN105938754A CN 105938754 A CN105938754 A CN 105938754A CN 201610124915 A CN201610124915 A CN 201610124915A CN 105938754 A CN105938754 A CN 105938754A
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- CN
- China
- Prior art keywords
- main body
- film
- electronic unit
- inorganic particle
- magnetic powder
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 239000002184 metal Substances 0.000 claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 62
- 239000006247 magnetic powder Substances 0.000 claims abstract description 52
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- 150000001768 cations Chemical class 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
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- 229910052802 copper Inorganic materials 0.000 claims description 8
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- 238000010422 painting Methods 0.000 claims description 4
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- 239000004305 biphenyl Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Polymers C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- MKSSOGULQZHLEC-UHFFFAOYSA-N ethane-1,2-diol;2-methylprop-2-enoic acid;prop-2-enoic acid Chemical class OCCO.OC(=O)C=C.CC(=C)C(O)=O MKSSOGULQZHLEC-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 239000000411 inducer Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- ZIWDVJPPVMGJGR-UHFFFAOYSA-N n-ethyl-2-methylprop-2-enamide Chemical compound CCNC(=O)C(C)=C ZIWDVJPPVMGJGR-UHFFFAOYSA-N 0.000 description 1
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 235000019394 potassium persulphate Nutrition 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- AYEFIAVHMUFQPZ-UHFFFAOYSA-N propane-1,2-diol;prop-2-enoic acid Chemical compound CC(O)CO.OC(=O)C=C AYEFIAVHMUFQPZ-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- REYHXKZHIMGNSE-UHFFFAOYSA-M silver monofluoride Chemical compound [F-].[Ag+] REYHXKZHIMGNSE-UHFFFAOYSA-M 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- JHJUUEHSAZXEEO-UHFFFAOYSA-M sodium;4-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=C(S([O-])(=O)=O)C=C1 JHJUUEHSAZXEEO-UHFFFAOYSA-M 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Soft Magnetic Materials (AREA)
Abstract
The invention is aimed at providing an electronic component and method for manufacturing the electronic component, wherein the electronic component enables an external electrode to be firmly connected to a main body. The electronic component disclosed in the invention is characterized by comprising a main body, a coating film, a conductor, inorganic particles and an external electrode, wherein the main body is made of a mixture of metal magnetic powder and insulating resin, the coating film covers a surface of the main body, the conductor is arranged in the main body, the iorganic particles are adhered to the surface of the coating film, and the external electrode is electrically connected with the conductor; the external electrode covers a part, on to which the inorganic particles are adhered, of the surface of the coating film; the coating film comprise the resin and positive ions of metal.
Description
Technical field
The present invention relates to the manufacture method of electronic unit and electronic unit, particularly relate to possess and incite somebody to action
The mixture of metal magnetic powder and insulative resin is as the electronic unit of the main body of material and electricity
The manufacture method of subassembly.
Background technology
As the invention relevant to conventional electronic unit, it is known to the coil that patent documentation 1 is recorded
Parts.In this electronic unit, with the component within the resin covering containing metal magnetic powder.
And, in this electronic unit, for the purpose of the antirust grade of metal magnetic powder, carry out based on phosphoric acid
The chemical conversion treatment of salt.By chemical conversion treatment, it is formed with insulation tunicle on the surface of insulator.It addition,
Insulation tunicle is provided with terminal electrode.
, in the coil component described in patent documentation 1, there is terminal electrode and be difficult to from absolutely
Edge body peels off such problem.
Patent documentation 1: Japanese Unexamined Patent Publication 2013-225718 publication
Summary of the invention
Outer electrode can be made to be close contact in securely in consideration of it, it is an object of the invention to provide one
The electronic unit of main body and the manufacture method of electronic unit.
The electronic unit involved by one mode of the present invention, it is characterised in that possess: with metal
The mixture of magnetic powder and insulative resin is as the main body of material；Cover the surface of described main body
Film；It is arranged at the conductor of the inside of described main body；It is attached to surface inorganic of described film
Granule；And electrically connect and at the described inorganic particle of the surface of described film covering with described conductor
The outer electrode of the part of attachment, wherein, described film contains the cation of resin and metal.
The manufacture method of the electronic unit involved by one mode of the present invention, it is characterised in that tool
Standby: preparation possesses the main body formed by metal magnetic powder and insulative resin and is positioned at described main body
The operation of base substrate of conductor of inside；Prepare containing make the metal of composition described metal magnetic powder from
The work of the mixed liquor of ionizing composition, anionic surfactant and the resinous principle of sonization
Sequence；Described mixed liquor is coated described main body, and the operation being dried；And then, make
Dispersion liquid containing inorganic particle is attached to described main body, and the operation being dried.
Invention effect
In accordance with the invention it is possible to make outer electrode be close contact in main body securely.
Accompanying drawing explanation
Fig. 1 is the stereoscopic figure of electronic unit 1.
Fig. 2 is the perspective view of electronic unit 1.
Fig. 3 is sectional structure chart and the enlarged drawing of the line A-A of Fig. 1.
Fig. 4 is the explanatory diagram of the first experiment.
Fig. 5 is the stereoscopic figure of the electronic unit 1b involved by the second variation.
Fig. 6 is the exploded perspective view of electronic unit 1b.
Fig. 7 is sectional structure chart and the enlarged drawing of electronic unit 1b.
Description of reference numerals
1,1a, 1b-electronic unit；9-film；10-main body；11～14-insulator layers；15-without
Machine granule；16-insulator substrate；18-magnetic circuit；20,25-outer electrode；30-coil.
Detailed description of the invention
Hereinafter, referring to the drawings the electronic unit involved by one embodiment of the present invention is said
Bright.
(composition of electronic unit)
Hereinafter, referring to the drawings while the composition of electronic unit is illustrated.Fig. 1 is conduct
The stereoscopic figure of the electronic unit 1 of an embodiment of the invention.Fig. 2 is electronic unit 1
Perspective view.In fig. 2, outer electrode 20,25 is omitted.Fig. 3 is Fig. 1
The sectional structure chart of line A-A and enlarged drawing.Hereinafter, outer electrode 20,25 is arranged
Direction be defined as left and right directions, the direction that the central shaft of coil 30 extends is defined as upper and lower
To.It addition, the direction orthogonal with above-below direction and left and right directions is defined as fore-and-aft direction.This
Outward, fore-and-aft direction, left and right directions and above-below direction are mutually orthogonal.
As shown in Figure 1 to Figure 3, electronic unit 1 possess film 9, main body 10, inorganic particle 15,
Outer electrode 20,25 and coil 30.
Main body 10 using the mixture of metal magnetic powder and insulative resin as material.Insulating properties tree
Fat is the resin with electrical insulating property.Such as, insulative resin is epoxy resin, organic siliconresin.
Main body 10 is rectangular shape as shown in Figure 1, 2.Wherein, the shape of main body 10 is not limited to
This.In the present embodiment, main body 10 is made by the mixture of metal magnetic powder and epoxy resin.
It addition, for the density improving the metal magnetic powder in main body 10, there are 2 kinds of metal magnetic powder
Particle diameter.Wherein, main body possesses at least one metal magnetic powder.Specifically, metal magnetic
Powder is the magnetic powder (maximum particle diameter 100 formed by the Fe-Si-Cr alloy of mean diameter 80 μm
μm) and the mixed powder of magnetic powder that formed by the carbonyl iron of mean diameter 3 μm.Additionally,
Metal magnetic powder can also comprise Fe powder, the alloyed powder containing Fe, the noncrystalline powder containing Fe.
Fe alloy refers to such as, Fe-Si alloy, Fe-Si-Cr alloy, Fe-Si-Al alloy.
It addition, to the insulating properties that these powder are implemented to be formed by metal-oxide by chemical conversion treatment in advance
Cladding is as dielectric film.The tunicle of the insulating properties being formed at metal magnetic powder may not be metal oxygen
Compound.Dielectric film is for instance, it is possible to formed by silicones, glass.And, it is contemplated that electronic unit
The inductance value of 1 and DC superposition characteristic, metal magnetic powder can also main body 10 contain relatively
More than 90wt%.It addition, the resin contained by main body 10 can also be the insulating properties such as glass ceramics
Inorganic material, polyimide resin.
Coil 30 is provided in an example of the conductor of the inside of main body 10, passes through coiled wires
Constitute.More specifically, copper cash has the section shape of rectangular shape, this rectangular shape
There is the long limit extended at above-below direction.It addition, the surface of copper cash is wrapped by.Coil 30 forms 2
Segment structure.In the epimere of coil 30, when overlooking from upside, wire with from outer circumferential side towards interior
The mode of all sides rotates the most in the counterclockwise direction.It addition, in the hypomere of coil 30,
When overlooking from upside, wire by from inner circumferential side towards in the way of outer circumferential side helically along side counterclockwise
To rotation.Thus, the central shaft of coil 30 extends at above-below direction.
It addition, the inner circumferential side of the hypomere of the end of the inner circumferential side of the epimere of coil 30 and coil 30
End connects.Further, the end of the outer circumferential side of the epimere of coil 30 is exposed from the left side of main body 10
To outside.The end of the outer circumferential side of the hypomere of coil 30 is exposed to outside from the right side of main body 10.
Additionally, the material of coil 30 has electric conductivity, also listed in addition to Cu Au, Ag,
Pd、Ni。
The surface of film 9 main body covered 10.Film 9 can not also main body covered 10 surface
All, main body covered 10 at least some of.In the present embodiment, film 9 covers
The most whole of the surface of main body 10.Wherein, in order to do not hinder coil 30 and outer electrode 20,
The connection of 25, preferably film 9 do not cover the two ends of coil 30 and expose to outside portion from main body 10
Point.It addition, film 9 is containing resin and the cation of metal.Metal contained by film 9
The cation of cation e.g. Fe, Ni, Co, Al, Cr.Film 9 can also be containing multiple
The cation of the metallic element of kind.Resin can also be acrylic resin.Acrylic resin
Cross-linked structure can be formed.In addition, it is contemplated that make when electronic unit 1 is arranged on circuit substrate
By the situation of solder, the higher meeting of heat decomposition temperature of the resin contained by film 9 is more preferable.Such as,
The temperature of Mass lost of about 5% is produced as thermal decomposition resin contained by film 9 will be made
In the case of temperature, this heat decomposition temperature is more than 240 DEG C.Herein, heat decomposition temperature can lead to
Cross following analytical equipment and analysis condition is measured.
Analytical equipment: TG-DTA 2000SA (ネ ッ チ ジ ャ パ Application company system)
Analysis condition
Temperature curve: RT → 300 DEG C (10 DEG C/min)
Measure environment: decompression (uses rotary pump: 0.1Pa)
Shuttle (unit) material: Al
Measuring samples weight: 100mg
It addition, as confirming to constitute the ion (sun of the element of the metal magnetic powder contained by film 9
Ion) a kind of analytical technology, list x-ray photoelectron spectrum analysis (XPS).XPS
Measuring condition as described below.
■ measurement apparatus: ア Le バ ッ Network Off ァ イ company PHI 5000 VersaProbe
■ x-ray source: Al-K alpha ray
■ measured zone: 100 μm φ
The acceleration energy of ■ X-ray: 93.9eV
■ measures the time of 1 step: 100ms
■ Fe2p accumulative total: 500
■ energy compensating: C1s=284.6eV
If with XPS analysis film 9, then in Fe2p3 spectrum, it is possible to confirm represent Fe sun from
Peak value near the 710eV of the existence of son.On the other hand, Fe metal (metallic state is being represented
Fe) existence 707eV near peak value unconfirmed.Thereby, it is possible to prove to constitute film 9
The existence of the ion (cation) of the element of contained metal magnetic powder.
Additionally, the resinous principle contained by film 9 can also is that ring in addition to acrylic resin
Epoxy resins, polyimide resin, organic siliconresin, polyamide-imide resin, polyether-ether-ketone tree
Fat, fluororesin, silicon Acrylote ketone resin etc..In addition, the resinous principle contained by film 9
Such as also list out polymethyl methacrylate resin, acrylonitrile-styrene-propylene copolymer, benzene
The allyl resin Emulsions such as ethylene-propylene copolymer.As concrete ProductName, list by Japan
Nipol SX1706A, SX1503A, LX814, LX855EX that ZENO company produces,
Neocryl A-639, A-655, the A-6015 etc. produced by this chemical conversion of nanmu company of Japan.
It addition, as the monomer used in the resinous principle contained by film 9 the most especially limit
Fixed, list: (methyl) acrylic acid, acrylic acid methyl ester., ethyl acrylate, n-butyl acrylate,
Isobutyl 2-propenoate, tert-butyl acrylate, lauryl ester, stearyl acrylate base ester, propylene
Acid 2-Octyl Nitrite, acrylic acid tetrahydro furfuryl ester, acrylic acid diethylamino ethyl ester, acrylic acid 2-
Hydroxyl ethyl ester, acrylic acid 2-hydroxypropyl acrylate, methacrylic acid, methyl methacrylate, methacrylic acid
Propyl ester, n-BMA, isobutyl methacrylate, Tert-butyl Methacrylate, methyl
1-Octyl acrylate, lauryl ester, 2-Ethylhexyl Methacrylate, methacrylic acid
Stearyl, diethyl aminoethyl methacrylate, HEMA, methyl-prop
Olefin(e) acid 2-hydroxypropyl acrylate, ethylene glycol list (methyl) acrylate, polyethyleneglycol (methyl) propylene
Acid esters etc. (methyl) acrylic acid acrylic acid ethylene glycol esters, methyl vinyl ether, ethyl vinyl
Vinyl ester, N methacrylamide, the N-second such as alkyl vinyl ethers, vinyl acetate such as ether
The N-alkyl such as base acrylamide, N-methyl methacrylamide, N-ethyl methacrylamide take
Nitrile, styrene, ethylene, the fourths two such as generation (methyl) acrylic amide, acrylonitrile, methacrylonitrile
Alkene, vinyl chloride, vinylidene chloride, vinyl acetate, p-methylstyrene, α-methyl styrene
Deng styrene monomer.These other monomer may be used alone, two or more kinds can also be used.
(methyl) acrylic acid means acrylic or methacrylic acid.
It addition, as it is shown on figure 3, film 9 is also into because of the metal magnetic powder contained by main body 10
The recess C come off from this main body 10 and produce, and substantially take recess C.As its result,
Thickness d 1 at the film 9 of recess C forms the painting than other the part on the surface of main body 10
The thickness d 2 of film 9 is thick.
It is provided with inorganic particle 15, this nothing to make outer electrode 20,25 and film 9 touch
Machine granule 15 is attached at least some of of the surface of film 9.The material of inorganic particle 15 can
Metallic monomer or alloy, metal-oxide, metal is used to stop up a kind of compound etc. or multiple.
For example, it may be Argent grain, silica dioxide granule, zirconium granule, acidifying alumina particles, silicon nitride
Grain.It addition, inorganic particle can be by multiple metallic monomer or alloy, metal-oxide, gold
Belong to the multiple structure stopping up the formation such as compound.In the present embodiment, inorganic particle 15 is attached to
The silicon dioxide of the most whole of the surface of film 9.Wherein, in order to do not hinder coil 30 with
The connection of outer electrode 20,25, preferably inorganic particle 15 be not attached to the two ends of coil 30 from
Main body 10 is exposed to outside part.Inorganic particle can be such as spherical.Preferably inorganic particle
Mean diameter at more than 1nm below 200nm.By using mean diameter to be in this scope
Inorganic particle such that it is able to improve the adhesion of outer electrode 20,25 and film 9.Such as,
Volume average particle size is median diameter d50.
Inorganic particle 15 is attached to the surface of film 9 and is not meant to be mixed by inorganic particle 15
Make inorganic particle 15 deposit at the surface of film 9 and inner homogeneous together in the material of film 9
State, as shown in the enlarged drawing of Fig. 3, it is meant that inorganic particle 15 is dispersed in film 9
State on surface.Wherein, a part of inorganic particle 15 is present in film 9.In the case of Gai,
The amount of the inorganic particle 15 contained by film 9 of per unit volume is along with leaning on the surface from film 9
The surface of nearly main body 10 and reduce.And, inorganic particle 15 can not also contact with main body 10.
That is, inorganic particle 15 can also be less than the region of the near surface in main body 10 of up to film 9.
Additionally, as shown in the enlarged drawing of the upside of Fig. 3, in the present embodiment, inorganic particle 15 is also
It is attached to the surface as film 9 and is formed without the part of outer electrode 20,25.But,
Inorganic particle 15 is attached to the surface as film 9 and at least between outer electrode 20 and film 9
Part and outer electrode 25 and film 9 between part.
It addition, be not the surface utilizing the film of inorganic particle 15 to hide film 9, inorganic particle
15 sparsely exist into the surface being able to observe that film 9 from the gap of countless inorganic particles 15
Degree.In film 9 in the part of inorganic particle 15 attachment, preferably inorganic particle 15 covers and is coated with
More than the 20% of film 9.It addition, inorganic particle 15 can also cover the whole of film 9.
Outer electrode 20 electrically connects with coil 30, and, outer electrode 20 covers at film 9
Part at least some of of surface inorganic granule 15 attachment.In the present embodiment, outside
Whole of the right side of electrode 20 main body covered 10, and also above, the end of main body covered 10
Face, a part above and below.Thus, outside outer electrode 20 is with the hypomere of coil 30
The end of all sides connects.
Outer electrode 25 electrically connects with coil 30, and, outer electrode 25 covers at film 9
Part at least some of of surface inorganic granule 15 attachment.In the present embodiment, outside
Whole of the left side of electrode 25 main body covered 10, and also above, the end of main body covered 10
Face, a part above and below.Thus, outside outer electrode 25 is with the epimere of coil 30
The end of all sides connects.
It addition, inorganic particle 15 is present in the border of outer electrode 20,25 and film 9.And,
Outer electrode 20,25 enters the gap of multiple inorganic particles 15, touches with the surface of film 9.
The most such outer electrode 20,25 can be made up of the composite of metal with resin.
Wherein, outer electrode 20,25 can also utilize the existing outer electrode such as plating, sputtering to be formed
Method is made.
By by the signal from one of outer electrode 20 or outer electrode 25 input via coil
30 are output from another of outer electrode 20 or outer electrode 25, the above electricity constituted
Subassembly 1 is as inducer function.
(manufacture method of electronic unit)
Then, an example of the manufacture method of electronic unit 1 is illustrated.
First, install coil in making 30 main body 10.For instance, it is possible to by embedding moulding
Make.Specifically, prepare coil 30 and be placed on mould.Then, using as main body 10
Raw-material metal magnetic powder is injected in mould with the mixture of epoxy resin.Then, epoxy is made
Resin solidifies.And, by interior install coil 30 main body 10 from mould take out.
Then, the coating of this main body 10 is comprised there is the function of a part of ionizing making main body 10
Ionizing composition and film 9 contained by the mixed solution of resinous principle, form film 9
(film formation process).That is, ionizing composition, resinous principle, solvent mixing are prepared mixing
Solution.Resinous principle is the compound being become above-mentioned resin by reaction.Resinous principle can be
Reactive resin or non-reacted resin.Reactive resin refers to the tree with reactive group
Fat.Reactive group such as refers to, hydroxyl, amino, sulfonic group or its salt, epoxy radicals, phosphate or
Its salt, carboxyl.Reactive resin can be made up of a kind of monomer, it is also possible to by various of monomer structure
Become.Reactive resin can also be such as the allyl resin with hydroxyl.Non-reacted resin
It it is the resin without above-mentioned reactive group.Non-reacted resin is such as by ethylene, propylene, (first
Base) acrylic acid methyl ester., (methyl) ethyl acrylate, the monomer such as styrene is formed.Additionally, resin
Composition can also not exclusively be dissolved in mixed solution, and mixed solution can also be the state of Emulsion.
Ionizing composition specifically refers to make the composition of the metal ionization contained by metal magnetic powder.
Ionizing composition e.g. sulphuric acid, Fluohydric acid., ferric flouride, nitric acid, hydrochloric acid, phosphoric acid, carboxylic acid.
Solvent can be such as water, it is also possible to be the alcohol such as methanol, ethanol.
It addition, in the manufacture method of the electronic unit 1 involved by one embodiment of the present invention,
It is the powder of Fe or Fe alloy at metal magnetic powder, and is positioned at inside and the end of main body 10
In the case of the conductor exposed from main body is Cu or Ag, owing to Fe ionization tendency is more than
Cu or Ag, so, compared with conductor, film can be easier to selection and be attached to contained by main body
Metal magnetic powder.That is, by using the gold containing the metallic element being easier to ionizing than conductor
Belong to magnetic powder, thus produce the cation of metal magnetic pruinescence optionally ionizing.Utilize and produce
Cation, the balance collapse of electric charge and resinous principle become to be difficult to maintain the state of Emulsion to pile up
In main body thus form coating.Now, the cation of the segment conductor owing to exposing at conductor is difficult
To produce, it is possible to suppression covers the conductor exposed, while forming coating (film).
Mixed solution except containing resinous principle and ionizing composition possibly together with surfactant.If table
Face activating agent is difficult to inactivate, then resinous principle is difficult to maintain the state of Emulsion and be difficult to form film,
If but surfactant some easily inactivate, then mixed solution becomes excessively unstable and is difficult to locate
Reason.
As surfactant, although use anionic surfactant, non-ionic surface to live
Property material, but particularly preferably anionic surfactant.Preferably Anionic surfactants
Agent have sulfonic in the case of, the degree of the inactivation of surfactant properly and easily forms film
9, and, miscible fluid is easily processed.As anionic surfactant, such as, enumerate fuel-displaced
The alkylsurfuric acids such as the acid fatty acid oil such as sodium, Oleum Ricini potassium, sodium lauryl sulfate, ammonium lauryl sulfate
The alkylbenzenesulfonates such as ester salt, dodecylbenzene sodium sulfonate, alkylnaphthalene sulfonate, alkyl sulfonate,
Dialkyl sulfosuccinates, alkyl phosphate salt, LOMAR PWA EINECS 246-676-2-formalin condensation product, poly-
Oxygen ethylene, alkyl phenyl ether sulfuric acid, polyoxyethylene alkyl sulfate salt etc..Live in above-mentioned surface
Property agent can be used alone or can also combine two or more use.
And, the mixed solution of preparation is attached to main body 10, forms coating.Coating is by adding
Heat and become the layer of film 9.That is, hot coating is added to form film 9.Specifically, at resin
In the case of composition is reactive resin, by heating, solvent volatilization and resinous principle solidification,
Coating becomes film 9.In the case of the resin that resinous principle is non-reacted, coating is by adding
Heat is dried, thus becomes film 9.In the case of Gai, resinous principle can also be resin itself.
Make the method that mixed solution is attached to main body 10, can be dipping, it is also possible to be coating, it is possible to
To be spraying.It addition, for the contiguity power improving coating and inorganic particle, preferably by based on quiet
The interaction of electricity, the combination formation etc. of chemical reaction.Such as, main body 10 is immersed in mixing
In solution, this mixed solution contains that ionizing promoting, composition and surfactant add to is commercially available
Composition in latex, wherein, commercially available latex is ionizing composition and resinous principle is scattered in water system
The latex of solvent.An example of the particular make-up of mixed solution is represented at table 1.In Table 1,
Resinous principle is propylene-ester analog copolymer (NipolLATEX SX-1706A (Japan ZEON
Company's system)), anionic surfactant is that chemical conversion Industries, Inc of Sanyo manufactures
Eleminol JS-2, ionizing composition is 5% sulphuric acid.By impregnating, contained by main body 10
A part (such as, being in the metal magnetic powder of the near surface of main body 10) for metal magnetic powder
It is ionized.
[table 1]
| Material name | Component (ml/l) |
| NipoLATEX SX-1706A | 100 |
| Eleminol JS-2 | 35 |
| 5% sulphuric acid | 50 |
| 30% hydrogen peroxide | 2 |
| Pure water | 813 |
Specifically, due to ionizing, contained in the metal magnetic powder contained by main body 10
Fe becomes cation.And, cation and the propylene-ester analog copolymer in mixed solution
Resin contained by (NipolLATEX SX-1706A (ZEON company of Japan system)) becomes
Divide reaction.In other words, if cation exists, the dispersion stabilization of the resinous principle in mixed solution
Reduce and with cation coagulation.As its result, in mixed solution scattered resinous principle (
In the example of table 1, propylene-ester analog copolymer (Japan ZEON company NipolLATEX
SX-1706A)) it is neutralized, and in the surface coagulation of the main body 10 constituting electronic unit 1.By
This, main body 10 is covered by the coating.Wherein, the two ends of the coil 30 exposed from main body 10 are difficult to
It is covered by the coating.This is because, owing to the constitution element (such as Cu, Ag) of coil 30 is relative
It is inert element in Fe and is difficult to be ionized, so as a result, it is difficult to make resinous principle coagulate
Collection.Therefore, the inorganic particle 15 being attached to coating (film 9) is also difficult to be attached to from main body
The two ends of the coil 30 that 10 expose.Thus, outer electrode 20,25 can be directly contacted with coil
The two ends of 30, and utilize the concavo-convex raising outer electrode 20,25 formed by inorganic particle 15
Adhesion with main body 10, so as to the unidirectional current resistive of suppression electronic unit is big.
Then, through cleaning based on pure water and dehydration, coating is applied inorganic particle 15 (granule
Working procedure of coating).In the present embodiment, main body 10 be impregnated in two as inorganic particle 15
In the colloid solution of silicon oxide.Thus, inorganic particle 15 is attached to the surface of coating.
Then, pass through cleaning based on pure water and be dried, coating is implemented heat treated.Pass through
This heat treated, the resinous principle contained by coating cross-links each other via Fe or resinous principle,
Thus film 9 is formed.
Inorganic particle 15 is made to apply after forming coating.Specifically, be define coating after
Main body 10 be dried, then, make main body 10 impregnated in the dispersion liquid containing inorganic particle.Pass through
Utilize dipping, make inorganic particle 15 be attached to film 9, then make curing of coatings such that it is able to make
Inorganic particle 15 is attached to the surface of film 9.Even if it addition, entering one at inorganic particle 15
In the case of among film 9, it is also possible to along with from the surface of film 9 close to the table of main body 10
The mode that face and inorganic particle 15 reduce configures.Therefore, it is possible on the surface of film 9 with inorganic
Granule 15 is effectively formed concavo-convex, and can make the contiguity of the relative film 9 of outer electrode 20,25
Property is effectively improved.Dispersion liquid use as disperse medium the organic solvents such as water, alcohols, ketone or
Their mixed solvent of person.Dispersion liquid is for the purpose of improving dispersibility, it is also possible to add surface activity
Deng dispersion stabilizer.It addition, the inorganic particle contained by dispersion liquid can also be a kind of to multiple.
Shape as inorganic particle, it is also possible to be ball, ellipse, threadiness, Margarita shape etc..
Herein, coating strength and chemical-resistant with film 9 rise to purpose, it is also possible to upper
Interpolation ethamine, propylamine, 2-aminopropane., butylamine, dimethylamine, diethylamine in the mixed solution stated, two
Propylamine, dibutyl amine, triethylamine, tripropyl amine (TPA), allyl amine, diallylamine, triallylamine,
Dimethylethanolamine, diethyl ethylene diamine, ethanolamine, the amine compounds such as diethanolamine, triethanolamine
Amino resins, phenolic resin, the rings such as thing, melmac, paracyanogen diamine resin, carbamide resin
The firming agent such as epoxy resins, isocyanate compound, and add process such as carrying out heat treatment.
Then, the surface of film 9 is formed being attached with at least some of of inorganic particle 15
The outer electrode 20,25 (electrode forming process) covered.In the present embodiment, formed master
Whole of the right side of body 10 and above, bottom surface, a part for front and back cover
Outer electrode 20, and formed whole of the left side to main body 10 and above, bottom surface,
A part for front and back carries out the outer electrode 25 covered.Specifically, utilize proofing etc.,
Conductive material will be immersed (such as, containing Ag paste, Cu near the right side of main body 10 and its
The colloid solution of paste, Pd, Sn etc.) in.Further, by near the left side of main body 10 and its
Immerse in Ag paste.Then, making, the Ag paste being attached to main body 10 is dried, by burning
Knot, thus form the basal electrode of outer electrode 20,25.Further, on the surface of basal electrode
Implement plating (such as, plating Ni and plating Sn, plating Cu and plating Ni and plating Sn).By above
Operation, completes electronic unit 1.
(effect)
According to the electronic unit 1 involved by present embodiment, it is possible to make outer electrode 20,25 firm
Be close contact in main body 10.More specifically, inorganic particle 15 is attached to the surface of film 9.Cause
This, utilize inorganic particle 15 to be formed on the surface of film 9 concavo-convex.And, outer electrode 20,
25 are attached with the part of inorganic particle 15 in the covering of the surface of film 9.Thus, outer electrode 20,
25 enter into by inorganic particle 15 formed concavo-convex.As its result, at outer electrode 20,25
And between film 9 and inorganic particle 15, produce anchor effect.Therefore, outer electrode 20,25
It is close contact in film 9 securely.
It addition, in electronic unit 1, the film 9 of main body covered 10 is containing resin and metallic magnetic
The cation of property element contained by powder.Owing to such film 9 ratio is by phosphatic chemical conversion treatment
The painting thickness formed, so wear resistance, insulating properties, moisture-proof, chemical resistance etc. are the most excellent.
It addition, for the metal magnetic powder contained by main body 10, be carried out insulating properties in advance
Cladding.Wherein, in the manufacture process of electronic unit 1, the cladding that there is this insulating properties is peeled off
Misgivings.Herein, in electronic unit 1, the film 9 of main body covered 10 is containing resin and gold
The cation belonged to, this cation is produced by the metal ionization contained by metal magnetic powder.Cause
This, even if in the case of the cladding stripping to the insulating properties that metal magnetic powder is implemented, by afterwards
Operation, cation is also from this metal magnetic powder dissolution, and they contribute to the formation of film 9, and
And metal magnetic powder can be covered.As its result, in electronic unit 1, insulating properties, antirust
Property is more excellent.
, if main body 10 is using the mixture of metal magnetic powder and resin as material, then in system
During making, a part for metal magnetic powder comes off from the surface of main body 10, and at the table of main body 10
Face forms recess C.If forming recess C, the area that main body 10 is exposed towards air increases.As
Its result, main body 10 becomes prone to absorb the moisture in air.Further, due to the product of recess C
Raw, the distance of the coil 30 and the surface of main body 10 that are positioned at main body 10 diminishes.More than according to
Reason, due to the generation of recess C, coil 30 becomes prone to be corroded.Herein, such as patent
Electronic unit described in document 1 is such, in the feelings utilizing phosphate chemical conversion treatment to form film
Under condition, owing to the thickness being formed is relatively thin, so it is difficult for filling this recess C.But,
In electronic unit 1, do not use film based on phosphate chemical conversion treatment, and use containing from main body
The cation of the metal of 10 ionizings and the film 9 of resin.Owing to film 9 ratio is based on phosphate
The painting thickness of chemical conversion treatment, it is possible to landfill is because of the formed recess that comes off of metal magnetic powder
C.Therefore, in electronic unit 1, it is possible to the corrosion of suppression coil 30.That is, electronic unit 1
Moisture-proof is excellent.
It addition, in the manufacturing process of electronic unit 1, use mixed solution, this mixed solution contains
Have and ionizing is promoted, and composition and surfactant add the composition in commercially available latex, wherein city to
The latex sold is ionizing composition and resinous principle is scattered in the latex of solvent of water system.Thus, energy
Enough improve the film property of film 9.The manufacturing process of electronic unit 1 relative to use respectively only from
The solution of son chemical conversion point and the manufacturing process of the only solution of resinous principle are simple.
Further, in the manufacturing process of electronic unit 1, sulphuric acid, hydrogen peroxide, hydrogen fluorine are being used
In the case of acid, ferric flouride, carboxylic acid etc. are as ionizing composition, when forming film 9, although
Fe contained by main body 10 is ionized, but formed coil 30 Cu almost without by from
Sonization.Therefore, coil 30 becomes to be difficult to be covered by film 9.That is, in the system of electronic unit 1
Make in method, utilize deliquescent difference based on ionizing composition by main such that it is able to only exist
Need the partially selectively formation film 9 of coating.I.e., it is possible to formed coil 30 from main body
The film 9 that 10 parts exposed are uncovered.
Effect that the present application person proves effective to confirm electronic unit 1 and carried out the first experiment and
Second experiment.Fig. 4 is the explanatory diagram of the first experiment.
The present application person is in order to carry out the first experiment and the second experiment, each preparation the first sample respectively
To the 3rd sample each 100.First sample is electronic unit 1, uses silicon dioxide as inorganic
Granule 15.By make to be impregnated in by the main body of metal magnetic powder and resin formation table 1 form mixed
Close in solution, make main body dried, make main body impregnated in the dispersion liquid containing inorganic particle, so
Post-heating main body, thus obtain the first sample.Mixed solution contains propylene-ester analog copolymer (day
This ZEON company NipolLATEX SX-1706A) as resinous principle, and containing sulfur
Acid and hydrogen peroxide are as ionizing composition.Second sample is not attached to be coated with at inorganic particle 15
Film 9 is the most different from the first sample.That is, by making by metal magnetic powder and resin formation
Main body impregnated in the mixed solution of the composition of table 1, and makes main body be dried, thus obtains the second sample.
3rd sample is on this point of the chemical conversion treatment formation film by employing phosphating composition
Different from the second sample.That is, the first sample is embodiments of the invention, second and the 3rd sample be
The comparative example of the present invention.
The present application person first experiment in by the first sample to the 3rd sample solder in circuit
Substrate B1, as shown in Figure 4, vertically erects this circuit substrate B1, to the first sample to
The side of three samples applies power F on the downside of vertical direction.And, when the first sample is to the 3rd sample
When circuit substrate B1 comes off, measure power F that the side to the first sample to the 3rd sample applies.
Table 2 is the table of the experimental result representing the first experiment.
[table 2]
| Minima | Meansigma methods | |
| First sample | 38N | 40N |
| Second sample | 32N | 34N |
| 3rd sample | 25N | 28N |
Compare, more firmly according to table 2, the first sample and the second sample and the 3rd sample
It is fixedly arranged on circuit substrate B1.This is owing to following reason causes.Relative at the first sample
In, inorganic particle 15 is attached to film 9, and in the second sample and the 3rd sample, inorganic particle is not
It is attached to film.Thus, in the first sample, compared with the second sample and the 3rd sample, outward
Portion's electrode 20,25 more firmly touches relative to film 9.As its result, the first sample with
Second sample and the 3rd sample are compared, and outer electrode 20,25 becomes to be difficult to peel off from main body 10,
And be difficult to come off from circuit substrate B1.
During the present application person tests second, confirm the first sample under conditions of high temperature, high humility
Product are the most normally energized to the 3rd sample.For the condition of the second experiment, temperature is 85
± 2 DEG C, humidity in the case of 85 ± 2%, flow continuously through the electric current of 6A.And, open from experiment
After beginning 24 hours, it is thus identified that the "on" position of the first sample to the 3rd sample.To start from experiment
After 24 hours, the sample of energising is judged to certified products, and will be not powered on after experiment starts 24 hours
Sample be judged to defective work.Table 3 is the table representing the second experimental result.
[table 3]
| Yields | |
| First sample | 98% |
| Second sample | 97% |
| 3rd sample | 68% |
According to table 3, in the first sample and the second sample, obtain better than the 3rd sample
Result.This is owing to following reason causes.Relative in the first sample and the second sample,
Film 9 comprises the cation of resin and metal, in the 3rd sample, by phosphate chemical conversion treatment
Form film.This is because, accordingly, the thickness of the film 9 of the first sample and the second sample becomes
Must be more than the thickness of film of the 3rd sample, the moisture-proof of the first sample and the second sample is higher than the
The moisture-proof of three samples.
(the first variation)
Hereinafter, the electronic unit 1a involved by the first variation is illustrated.Due to the ministry of electronics industry
The structure of part 1a is identical with electronic unit 1, so omitting the description.In electronic unit 1a,
Use zirconium granule as different from electronic unit 1 on this point of inorganic particle 15.First variation
It is embodiments of the invention.
It is real that the present application person has also carried out first to the electronic unit 1a involved by the first variation
Test.Specifically, prepare as 100, the 4th sample of electronic unit 1a, and carried out the
One experiment.When the 4th sample comes off from circuit substrate B1, put on the side of the 4th sample
The minima of power is 37N, and meansigma methods is 39N.Therefore, using zirconia particles as inorganic
In the electronic unit 1a of granule 15, with electronic unit 1 too, it is possible to make outer electrode 20,
25 are close contact in main body 10 securely.So, for inorganic particle 15, it is possible to use various material.
(the second variation)
Hereinafter, to the composition of the electronic unit involved by the second variation referring to the drawings while entering
Row explanation.Fig. 5 is the stereoscopic figure of the electronic unit 1b involved by the second variation.Fig. 6
It it is the exploded perspective view of electronic unit 1b.Fig. 7 is the sectional structure chart of electronic unit 1b and puts
Big figure.Following, the stacked direction of electronic unit 1b is defined as above-below direction, and by outside
The direction of electrode 20,25 arrangement is defined as left and right directions.It addition, will be with above-below direction and a left side
The orthogonal direction of right direction is defined as fore-and-aft direction.Additionally, fore-and-aft direction, left and right directions and on
Lower direction is mutually orthogonal.
Electronic unit 1b is different from electronic unit 1 main body 10 is duplexer on this point.With with
Centered by lower involved difference, electronic unit 1b is illustrated.
Electronic unit 1b possess as shown in Figures 5 to 7 film 9, main body 10, inorganic particle 15,
Outer electrode 20,25 and coil 30.
Main body 10 is illustrated in figure 6 rectangular-shaped, including insulator layer 11～14, insulator-base
Plate 16 and magnetic circuit 18.Insulator layer 11,12, insulator substrate 16 and insulator layer 13,
14 with from upside towards downside such order stacked.
Insulator layer 11,14 is oblong-shaped, and with metal magnetic powder and the mixing of insulative resin
Thing is as material.In the present embodiment, insulator layer 11,14 is by metal magnetic powder and epoxy
The mixture of resin is made.Metal magnetic powder and the gold of electronic unit 1 due to electronic unit 1b
Belong to magnetic powder identical, so omitting the description.Such as, the thickness of insulator layer 11,14 is about 60
μm, less than the maximum particle diameter of the metal magnetic powder contained by this insulator layer 11,14.
Insulator layer 12,13 is made up of epoxy resin etc..Overlook time insulator layer 12,13 in
Oblong-shaped.Additionally, the material of insulator layer 12,13 can also be the insulation such as benzocyclobutene
The property insulating properties inorganic material such as resin, glass ceramics.
Insulator substrate 16 is oblong-shaped, is that the printing making epoxy resin be infiltrated in glass cloth is joined
Line substrate.Additionally, the material of insulator substrate 16 can also be the insulating properties trees such as benzocyclobutene
The insulating properties inorganic material such as fat, glass ceramics.
The magnetic circuit 18 substantial middle in the inside of main body 10 in the column extended at above-below direction, and
Comprise metal magnetic powder and resin.Material and the material of insulator layer 11,14 due to magnetic circuit 18
Expect identical, so omitting the description.The most through insulator layer of magnetic circuit 18 12,13 and
Insulator substrate 16.The section shape of the above-below direction being perpendicular to magnetic circuit 18 is oblong shape.
Coil 30 is disposed on an example of the conductor in main body 10, and by Au, Ag, Cu,
The conductive materials such as Pd, Ni are made.It addition, coil 30 include coil portion 32,37, lead division
32a, 37a and via conductor 39.
Coil portion 32 is arranged on above insulator substrate 16 as shown in Figure 6, when overlooking from upside
Time, coil portion 32 be by from outer circumferential side towards the spiral being rotated in a clockwise direction in the way of inner circumferential side
The conductor layer of shape.Coil portion 37 is arranged on below insulator substrate 16 as shown in Figure 6, when
When overlooking from upside, coil portion 37 be by from inner circumferential side towards in the way of outer circumferential side along clockwise direction
The spiral helicine conductor layer rotated.Additionally, for ease of understanding, in figure 6, at insulator layer
13 above describe coil portion 37.
Lead division 32a is connected with the end of the outer circumferential side of coil portion 32, is drawn to insulator-base
The minor face on the above right side of plate 16.Thus, lead division 32a from the right side of main body 10 to outside
Expose.Lead division 37a is connected with the end of the outer circumferential side of coil portion 37, is drawn to insulator
The minor face in the left side below substrate 16.Thus, lead division 37a is outside from the left side of main body 10
Portion exposes.Additionally, for the preparation understood, in figure 6, note on insulator layer 13
Carry lead division 37a.
The most through insulator substrate of via conductor 39 16, by the inner circumferential of coil portion 32
The end of side is connected with the end of the inner circumferential side of coil portion 37.
The surface of film 9 the most main body covered 10 at least some of.This embodiment party
In formula, the most whole of the surface of film 9 main body covered 10.Wherein, film 9 does not covers
The part that lead division 32a, 37a expose to outside from main body 10, in order to do not hinder coil 30 with
The connection of outer electrode 20,25.Additionally, due to the detailed and electricity of the film 9 of electronic unit 1b
The film 9 of subassembly 1 the most identical, so omitting the description.
Inorganic particle 15 is attached at least one of the two of the surface of film 9 as shown in Figure 7
Silicon oxide.In the present embodiment, inorganic particle 15 is attached to surface the most whole of film 9
Individual face.Wherein, inorganic particle 15 is not attached to lead division 32a, 37a from main body 10 to outside
Exposed portion, in order to do not hinder the connection of coil 30 and outer electrode 20,25.Additionally, due to
The inorganic particle 15 of electronic unit 1b in detail and the inorganic particle 15 of electronic unit 1 detailed
Identical, so omitting the description.
Outer electrode 20 electrically connects with coil 30, and, inorganic particulate is covered on the surface of film 9
Parts at least some of of grain 15 attachment.In the present embodiment, outer electrode 20 covers main
Whole of the right side of body 10, and the most main body covered 10 above, bottom surface, above and below
A part.Thus, outer electrode 20 is connected with lead division 32a.
Outer electrode 25 electrically connects with coil 30, and, inorganic particulate is covered on the surface of film 9
Parts at least some of of grain 15 attachment.In the present embodiment, outer electrode 25 covers main
Whole of the left side of body 10, and the most main body covered 10 above, bottom surface, above and below
A part.Thus, outer electrode 25 is connected with lead division 37a.
Additionally, due to the manufacture method of the main body 10 of electronic unit 1b is universal, so omitting
Explanation.Further, since the formation of the film 9 of electronic unit 1b and the coating of inorganic particle 15
Formation and the coating of inorganic particle 15 with the film 9 of electronic unit 1 are identical, so omitting
Explanation.
In the electronic unit 1b constituted like that above, it is also possible to play identical with electronic unit 1
Action effect.
(other embodiments)
Electronic unit involved in the present invention is not limited to electronic unit 1,1a, 1b, it is possible to
Change in the range of its purport.
In addition it is also possible at random combine electronic unit 1, the composition of 1a, 1b.
Although additionally, the most whole of the surface of film 9 main body covered 10, but can also
The part on the surface of main body covered 10.Although it addition, inorganic particle 15 is attached to film 9
The most whole of surface, but the part on the surface of film 9 can also be attached to, such as,
Can also be only attached to be formed with the part of outer electrode 20,25 on the surface of film 9.
It addition, in electronic unit 1,1a, 1b, the surface of film 9 main body covered 10 big
Causing whole, inorganic particle 15 is applied to the most whole of the surface of film 9.Therefore,
Inorganic particle 15 exists throughout the most whole ground of film 9 with the interface of outer electrode 20,25.
But, inorganic particle 15 can also be not present in the film 9 interface with outer electrode 20,25
The most whole, it is also possible to exist only in one of the film 9 interface with outer electrode 20,25
Point.
It addition, in the manufacture method of electronic unit 1, in order to film 9 is applied inorganic particle 15,
Main body 10 be impregnated in the colloid solution of the silicon dioxide of inorganic particle 15.But, right
Film 9 applies the method for inorganic particle 15 and is not limited to this, for example, it is also possible to by main body 10
Impregnated in the aqueous solution of inorganic particle 15, it is also possible to by aqueous solution or the glue of inorganic particle 15
Liquid solution is sprayed or coats main body 10.Alternatively, it is also possible to make the powder of inorganic particle 15 attached
In main body 10.
Additionally, in electronic unit 1,1a, 1b, enumerate the coil 30 example as conductor
Son.But, conductor may not be the wire being wound as coil 30.The entirety of conductor
Can also be not present in the inside of main body 10, a part for conductor is arranged on the inside of main body 10
?.Therefore, a part for conductor can also be exposed from main body 10, and a part for conductor also may be used
To be positioned on the surface of main body 10.
Additionally, the cation of the metal contained by film 9 is not the gold contained by metallic magnetic gonosome powder
The cation belonged to, it is also possible to be the cation of the metal contained by resin of film 9, it is also possible to be
The cation of other metal.
Metal magnetic powder can be such as Fe powder, carbonyl iron dust, alloy (example containing ferrum and Si
As, Fe-Si-Cr alloy, Fe-Si alloy, Fe-Si-Al alloy) powder.It addition,
Resin contained by film 9 can also be epoxy resin, polyimide based resin, silicone tree
Fat, polyamide-imide resin, polyether-ether-ketone resin, fluororesin, silicon Acrylote ketone resin etc..
In addition, as the resin contained by film 9, it is also possible to list from acrylic acid methyl ester., third
Olefin(e) acid ethyl ester, n-butyl acrylate, acrylic acid 2-hydroxy methacrylate, acrylic acid 2-hydroxy propyl ester, third
Olefin(e) acid 2-Octyl Nitrite, methyl methacrylate, ethyl methacrylate, the positive fourth of methacrylic acid
Ester, 2-hydroxyethyl methacrylate, methacrylic acid 2-hydroxy propyl ester, glycidyl
Ester, glycidyl methacrylate, acrylamide, Methacrylamide, acrylonitrile, benzene second
Alkene, ethylene, butadiene, vinyl chloride, vinylidene chloride, vinylacetate, acrylic acid, methyl
Acrylic acid etc. select a kind of monomer or by a kind of fluoropolymer resin etc. formed above.Additionally,
Containing for obtaining the Ammonium persulfate. of this resin, potassium peroxydisulfate, tert-butyl group hydrogen mistake in above-mentioned resin
The such polymerization initiator of oxide does not affect the characteristic of film 9.
It addition, the material of the thickness as regulation film 9, it is possible to use live in anion system surface
Property agent, nonionic system surfactant replace surfactant Eleminol JS-2 (Sanyo be melted into
Industries, Inc's system).Specifically, as anion system surfactant, list:
The horizontal hydrochlorate of alkylbenzene, alkyl di-sulfate, alkyl diphenyl base ether disulfonate, polyxyethylated
Phenyl ether sulfuric ester, polyoxyethylene aryl ether sulfuric ester, carboxylate system surfactant, phosphate
It is surfactant, naphthalenesulfonic acid formalin condensation substance, polycarboxylate-type surfactant etc..As
Nonionic surfactant, enumerates: polyoxyethylene alkyl ether sulphuric acid (alkyl；Octyl group, decyl,
Lauryl, stearyl, oleyl etc.), polyoxyethylene alkyl phenyl ether (alkyl；Octyl group, nonyl
Base etc.), polyox-yethylene-polyoxypropylene block copolymer etc..It addition, enumerate have sulfonic group and
Its salt, carboxyl and its salt and the water miscible resin of phosphate and its salt etc..
In addition to the foregoing materials, it is also possible to by the tannin making corrosion resistance improve, film 9 is composed
The Argentous fluoride that the such plasticizer of Dibutyl phthalate giving flexibility, the film property making film 9 improve
Deng metal ion and the scratch on the surface preventing film 9 and improve the lubricant of resistance to water and add
It is added in the mixed solution for forming film 9, such as, by fluororesin base lubricant, polyolefin
It is that wax, melamine cyanurate, molybdenum bisuphide add in mixed solution.
Further, it is colored as purpose with the raising of the corrosion resistance of film 9 and electronic unit, it is possible to
With by carbon black, the pigment such as phthalocyanine blue adds in the mixed solution for forming film 9.
And, by the high molecular polymer by having phosphorous acidic group, such as, at main chain or
Person's side chain has phosphate, phosphorous acidic group, phosphonate group, the organic high molecular compound of phosphinic acid base
It is added on the mixed solution for forming film 9 such that it is able to make resistance to saprophagous character, chemical resistance carry
High.
It addition, from improving the intensity of film 9, heat conductivity, electrical conductivity angularly, also
Can be by glass fibre, calcium carbonate, nylon, graphite, aluminium oxide, aluminium nitride, boron nitride
It is added on mixed solution Deng filler etc..
Industrial applicability
As previously discussed, the present invention is useful to the manufacture method of electronic unit and electronic unit
, especially outstanding on this point of outer electrode can be made to be close contact in main body securely.
Claims (8)
1. an electronic unit, it is characterised in that possess:
Main body, described main body is using the mixture of metal magnetic powder and insulative resin as material；
Film, described film covers the surface of described main body；
Conductor, described conductor is arranged on the inside of described main body；
Inorganic particle, described inorganic particle is attached to the surface of described film；And
Outer electrode, described outer electrode electrically connects with described conductor, and at the table of described film
Face covers the part of described inorganic particle attachment,
Described film comprises the cation of resin and metal.
Electronic unit the most according to claim 1, it is characterised in that
Described inorganic particle is also contained in described film,
In the amount of the described inorganic particle contained by film described in per unit volume along with from this painting
The surface of film is close to the surface of described main body and reduces.
Electronic unit the most according to claim 1 and 2, it is characterised in that
In order to make described outer electrode touch with described film, described inorganic particle is set.
Electronic unit the most as claimed in any of claims 1 to 3, it is characterised in that
The cation of described metal is the cation of the metal contained by described metal magnetic powder.
Electronic unit the most as claimed in any of claims 1 to 4, it is characterised in that
Described metal magnetic powder is the powder of Fe or Fe alloy,
Described conductor is Cu or Ag.
6. the manufacture method of an electronic unit, it is characterised in that possess:
Preparing the operation of base substrate, described base substrate possesses and is formed by metal magnetic powder and insulative resin
Main body and be positioned at the conductor of inside of described main body；
Preparing the operation of mixed liquor, described mixed liquor contains the metal making composition described metal magnetic powder
Ionizing composition, anionic surfactant and the resinous principle of ionizing；
Described mixed liquor is coated described main body, and the operation being dried；And
Then, the dispersion liquid containing inorganic particle is made to be attached to described main body, and the work being dried
Sequence.
The manufacture method of electronic unit the most according to claim 6, it is characterised in that
Described metal magnetic powder is the powder of Fe or Fe alloy,
Described conductor is Cu or Ag.
8. according to the manufacture method of the electronic unit described in claim 6 or 7, it is characterised in that
Described anionic surfactant has sulfonic group.
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| JP2015042180 | 2015-03-04 | ||
| JP2015-042180 | 2015-03-04 | ||
| JP2015-239973 | 2015-12-09 | ||
| JP2015239973A JP6508023B2 (en) | 2015-03-04 | 2015-12-09 | Electronic component and method of manufacturing electronic component |
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| CN105938754B CN105938754B (en) | 2018-06-26 |
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| JP (1) | JP6508023B2 (en) |
| KR (1) | KR101845601B1 (en) |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108074729A (en) * | 2016-11-15 | 2018-05-25 | 三星电机株式会社 | Film-type inductor and the method for manufacturing film-type inductor |
| CN108231336A (en) * | 2016-12-14 | 2018-06-29 | 三星电机株式会社 | Inductor |
| CN108399998A (en) * | 2017-01-31 | 2018-08-14 | 株式会社村田制作所 | The manufacturing method of coil component and the coil component |
| CN109903974A (en) * | 2017-12-08 | 2019-06-18 | 株式会社村田制作所 | Electronic component |
| CN112582132A (en) * | 2019-09-30 | 2021-03-30 | 株式会社村田制作所 | Coil component and method for producing magnetic powder mixed resin material used for the same |
| CN113496812A (en) * | 2020-04-07 | 2021-10-12 | 株式会社村田制作所 | Inductor |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019041032A (en) * | 2017-08-28 | 2019-03-14 | Tdk株式会社 | Electronic component and manufacturing method thereof |
| KR102549138B1 (en) * | 2018-02-09 | 2023-06-30 | 삼성전기주식회사 | Chip electronic component |
| JP7169128B2 (en) | 2018-08-31 | 2022-11-10 | 太陽誘電株式会社 | Coil parts and electronic equipment |
| US11854731B2 (en) | 2018-08-31 | 2023-12-26 | Taiyo Yuden Co., Ltd. | Coil component and electronic device |
| JP7156209B2 (en) * | 2019-08-09 | 2022-10-19 | 株式会社村田製作所 | Inductor components and substrates with built-in inductor components |
| KR102409325B1 (en) * | 2020-05-08 | 2022-06-15 | 삼성전기주식회사 | Coil component |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049377A (en) * | 2009-10-23 | 2011-05-11 | 日本油漆株式会社 | Method for coating ferrous substrate with powder coating film |
| CN102314995A (en) * | 2010-06-23 | 2012-01-11 | Tdk株式会社 | Electronic component |
| CN103180919A (en) * | 2010-10-21 | 2013-06-26 | Tdk株式会社 | Coil component and method for producing same |
| US20140009254A1 (en) * | 2012-07-04 | 2014-01-09 | Tdk Corporation | Coil component |
| WO2014119564A1 (en) * | 2013-01-29 | 2014-08-07 | 株式会社村田製作所 | Ceramic electronic component and manufacturing method therefor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003145034A (en) * | 2001-06-18 | 2003-05-20 | Nippon Parkerizing Co Ltd | Self-deposition type surface treatment coating method of surface of electronic part and micro-equipment part and electronic part and micro-equipment part having self-deposition type surface treatment coating film |
| JP5614479B2 (en) * | 2013-08-09 | 2014-10-29 | Tdk株式会社 | Coil parts manufacturing method |
-
2015
- 2015-12-09 JP JP2015239973A patent/JP6508023B2/en active Active
-
2016
- 2016-03-03 KR KR1020160025883A patent/KR101845601B1/en active IP Right Grant
- 2016-03-04 CN CN201610124915.2A patent/CN105938754B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049377A (en) * | 2009-10-23 | 2011-05-11 | 日本油漆株式会社 | Method for coating ferrous substrate with powder coating film |
| CN102314995A (en) * | 2010-06-23 | 2012-01-11 | Tdk株式会社 | Electronic component |
| CN103180919A (en) * | 2010-10-21 | 2013-06-26 | Tdk株式会社 | Coil component and method for producing same |
| US20140009254A1 (en) * | 2012-07-04 | 2014-01-09 | Tdk Corporation | Coil component |
| WO2014119564A1 (en) * | 2013-01-29 | 2014-08-07 | 株式会社村田製作所 | Ceramic electronic component and manufacturing method therefor |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108074729A (en) * | 2016-11-15 | 2018-05-25 | 三星电机株式会社 | Film-type inductor and the method for manufacturing film-type inductor |
| CN108231336A (en) * | 2016-12-14 | 2018-06-29 | 三星电机株式会社 | Inductor |
| CN108399998A (en) * | 2017-01-31 | 2018-08-14 | 株式会社村田制作所 | The manufacturing method of coil component and the coil component |
| CN109903974A (en) * | 2017-12-08 | 2019-06-18 | 株式会社村田制作所 | Electronic component |
| US11948725B2 (en) | 2017-12-08 | 2024-04-02 | Murata Manufacturing Co., Ltd. | Electronic component |
| CN112582132A (en) * | 2019-09-30 | 2021-03-30 | 株式会社村田制作所 | Coil component and method for producing magnetic powder mixed resin material used for the same |
| CN112582132B (en) * | 2019-09-30 | 2023-06-02 | 株式会社村田制作所 | Coil component and method for producing magnetic powder mixed resin material used for the same |
| CN113496812A (en) * | 2020-04-07 | 2021-10-12 | 株式会社村田制作所 | Inductor |
| CN113496812B (en) * | 2020-04-07 | 2024-02-02 | 株式会社村田制作所 | Inductor(s) |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016167576A (en) | 2016-09-15 |
| KR20160108210A (en) | 2016-09-19 |
| KR101845601B1 (en) | 2018-04-04 |
| JP6508023B2 (en) | 2019-05-08 |
| CN105938754B (en) | 2018-06-26 |
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