CN105930006B - A kind of pressing force tablet and its pressure detection method - Google Patents
A kind of pressing force tablet and its pressure detection method Download PDFInfo
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- CN105930006B CN105930006B CN201610275954.2A CN201610275954A CN105930006B CN 105930006 B CN105930006 B CN 105930006B CN 201610275954 A CN201610275954 A CN 201610275954A CN 105930006 B CN105930006 B CN 105930006B
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- 238000003825 pressing Methods 0.000 title claims abstract description 81
- 238000001514 detection method Methods 0.000 title claims abstract description 42
- 239000004020 conductor Substances 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000008859 change Effects 0.000 claims description 24
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000523 sample Substances 0.000 abstract 3
- 239000010408 film Substances 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910001195 gallium oxide Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0028—Force sensors associated with force applying means
- G01L5/0038—Force sensors associated with force applying means applying a pushing force
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Human Computer Interaction (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The present invention relates to a kind of pressing force tablet and its pressure detection methods, multiple pressing force probe units that pressing force tablet includes substrate, is arranged on substrate same side, pressing force probe unit includes the first strain resistor and the second strain resistor, first strain resistor is made using the first conductive material layer, second strain resistor is formed using the second conductive material layer, and the temperature resistance coefficient of the first conductive material layer and the temperature resistance coefficient of the second conductive material layer are unequal.In each pressing force probe unit, according to the first strain resistor, the resistance value under fiducial temperature of the second strain resistor, local temperature changing value, temperature resistance coefficient, strain resistor coefficient, increased resistance value, it can be by the pressing force changing value for solving and being applied on substrate that establishes an equation, to realize the detection of pressing force on substrate.This pressing force tablet only need to make the first strain resistor, the second strain resistor in the one side of substrate, and structure is simpler, and cost of manufacture is lower.
Description
Technical Field
The present invention relates to a pressure detecting device, and more particularly, to a pressing force sensing plate and a pressure detecting method thereof.
Background
The pressing force sensing plate is characterized in that a plurality of strain resistors are arranged on the hard plate body, when the plate body is pressed to generate micro bending deformation, the pressing force can be detected according to the change of the resistance values of the strain resistors, and therefore the pressing force sensing plate can be manufactured according to the principle and can be integrated in a display device or a touch device, and therefore a certain pressing force detection function is achieved.
However, the resistance value of the strain resistor is affected by temperature change in addition to the pressing force, and particularly in the above-mentioned pressing force sensing plate, the resistance value of the strain resistor is often affected by local finger temperature, so that the detection accuracy is very low.
In order to solve such a problem, it is necessary to manufacture a double-sided strain resistor having opposite strain directions according to the structure of the pressing force sensing plate and to cancel the influence of temperature by a circuit such as a bridge.
Disclosure of Invention
The invention aims to provide a pressing force sensing plate and a pressure detection method thereof. The technical scheme is as follows:
a pressing force sensing plate characterized by: the pressing force detection unit comprises a first strain resistor and a second strain resistor, the first strain resistor is made of a first conductive material layer, the second strain resistor is made of a second conductive material layer, and the temperature resistance coefficient of the first conductive material layer is unequal to that of the second conductive material layer.
The temperature resistivity of the first conductive material layer is not equal to the temperature resistivity of the second conductive material layer, i.e., the temperature resistivity of the first conductive material layer is greater than or less than the temperature resistivity of the second conductive material layer.
Through with first strain resistance, second strain resistance sets up on same side of base plate in pairs, constitute a plurality of pressing force detection units, in every pressing force detection unit, according to the resistance value under the reference temperature of first strain resistance, second strain resistance, local temperature variation value, temperature resistance coefficient, strain resistance coefficient, resistance variation value, can solve the pressing force variation value of exerting on the base plate through the equation in line, thereby realized the detection of pressing force on the base plate, and as long as guarantee first strain resistance in every pressing force detection unit, second strain resistance is the same in position (center distance is less than 15mm), and temperature resistance coefficient between them is inequality, just can make the result of pressing force detection more accurate. Therefore, the pressing force induction plate only needs to manufacture the first strain resistor and the second strain resistor on one surface of the substrate, the structure is simpler, and the manufacturing cost is lower.
As a preferred aspect of the present invention, the device further includes a resistance detection module, and the resistance detection module is configured to monitor resistance change values of the first strain resistance and the second strain resistance, respectively.
As a further preferable aspect of the present invention, the display device further includes a calculation module, and the calculation module can calculate the pressing force applied to a certain position of the substrate according to the resistance change values of the first strain resistor and the second strain resistor at the position.
As a further preferable embodiment of the present invention, the calculation module solves the pressing force by using the following equation:
wherein,is the temperature change value of a certain position,for the value of the change in the pressing force applied to the position on the substrate,andthe variation values of the first strain resistor and the second strain resistor are respectively, R10 and R20 are resistance values of the first strain resistor and the second strain resistor at a standard temperature (e.g. 20 ℃), K1 and K2 are temperature resistance coefficients of the first conductive material layer and the second conductive material layer, and f1 and f2 are strain resistance coefficients of the first conductive material layer and the second conductive material layer, respectively.
The above R10, R20, K1, K2, f1 and f2 can be obtained by a method of pre-measurement or correction, and can be solved by the equation system. To make it possible toMore accurately, it is only necessary to ensure that the first strain resistor and the second strain resistor in each pressing force detection unit are identical in position (the center distance is less than 15mm) and that K1 and K2 are different (generally, f1 and f2 are relatively close, and K1 and K2 are different, which ensures that the equation has a solution).
As a preferred embodiment of the present invention, the substrate is a transparent substrate, and the first conductive material layer and the second conductive material layer are transparent oxide conductive film layers. The transparent oxide conductive film layer contains a large number of intrinsic carriers and extrinsic carriers, the intrinsic carriers and the extrinsic carriers can have different concentration ratios by setting different conditions (such as process conditions and material ratios for manufacturing the transparent oxide conductive film layer), different temperature resistivity coefficients (K1 and K2 are different) can be realized by interaction of the intrinsic carriers and the extrinsic carriers, and in addition, the pressing force sensing plate can be made transparent so as to meet the requirement of assembling the pressing force sensing plate into a touch display device.
As a further preferable aspect of the present invention, the first conductive material layer is a transparent conductive oxide film layer formed by a sputtering method under a high temperature condition, and the second conductive material layer is a transparent conductive oxide film layer formed by a sputtering method under a low temperature condition. By adopting different processes of high temperature and low temperature, the difference of the temperature resistance coefficients of the first conductive material layer and the second conductive material layer is larger, so that the detection result of the pressing force is more accurate.
In a further preferred embodiment of the present invention, the first conductive material layer and the second conductive material layer are transparent conductive oxides having different compositions. The first conductive material layer and the second conductive material layer may be oxides of In, Sb, Zn, Al, and Cd and a composite multi-element oxide thin film material thereof, for example, the first conductive material layer and the second conductive material layer may be two of Indium Tin Oxide (ITO), zinc aluminum oxide (AZO), Indium Gallium Oxide (IGO), and zinc gallium indium oxide (IGZO), respectively. The first conductive material layer and the second conductive material layer are made of transparent conductive oxides with different components, so that the difference of temperature resistance coefficients of the first conductive material layer and the second conductive material layer is larger, and the detection result of the pressing force is more accurate.
As a further preferable aspect of the present invention, the first strain resistor and the second strain resistor are respectively formed by patterning a first conductive material layer and a second conductive material layer, and the first conductive material layer and the second conductive material layer are on different layers. The first conductive material layer and the second conductive material layer are located on different layers, so that the difference of the temperature resistance coefficients of the first conductive material and the second conductive material is larger, and the detection result of the pressing force is more accurate.
In a further preferred embodiment of the present invention, the first strain resistor and the second strain resistor are provided in an overlapping manner. First strain resistance, second strain resistance overlap the setting for first strain resistance, second strain resistance receive the influence of pressing force and temperature variation more synchronous, consequently can improve the accuracy degree of the testing result of pressing force.
A pressing force detection method, characterized by comprising the steps of:
(1) the pressing force detection units are arranged on the same side face of the substrate and comprise first strain resistors and second strain resistors, the first strain resistors are made of a first conductive material layer, the second strain resistors are made of a second conductive material, the temperature resistance coefficient of the first conductive material is not equal to that of the second conductive material, and low-resistance connecting lines are arranged on the first strain resistors, the second strain resistors and the outside of the first strain resistors and the second strain resistors so as to enable an external circuit to detect the resistance value;
(2) detecting the change values of the first strain resistor and the second strain resistor;
(3) the magnitude of the pressing force is solved by the following equation group:
Wherein,is the temperature change value of a certain position,for the variation value of the pressing force applied to the position on the substrate,Andthe variation values of the first strain resistor and the second strain resistor are respectively, R10 and R20 are resistance values of the first strain resistor and the second strain resistor at a standard temperature (e.g. 20 ℃), K1 and K2 are temperature resistance coefficients of the first conductive material and the second conductive material, and f1 and f2 are strain resistance coefficients of the first conductive material and the second conductive material, respectively.
Compared with the prior art, the invention has the following advantages:
through with first strain resistance, second strain resistance sets up on same side of base plate in pairs, constitute a plurality of pressing force detection units, in every pressing force detection unit, according to the resistance value under the reference temperature of first strain resistance, second strain resistance, local temperature variation value, temperature resistance coefficient, strain resistance coefficient, resistance variation value, can solve the pressing force variation value of exerting on the base plate through the equation in line, thereby realized the detection of pressing force on the base plate, and as long as guarantee first strain resistance in every pressing force detection unit, second strain resistance is the same in position (center distance is less than 15mm), and temperature resistance coefficient between them is inequality, just can make the result of pressing force detection more accurate. Therefore, the pressing force induction plate only needs to manufacture the first strain resistor and the second strain resistor on one surface of the substrate, the structure is simpler, and the manufacturing cost is lower.
Drawings
FIG. 1 is a schematic structural diagram of a first embodiment of the present invention;
fig. 2 is a schematic diagram of a first strain resistor and a second strain resistor arranged side by side in a pressing force detection unit according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a second embodiment of the present invention;
fig. 4 is a schematic diagram illustrating an overlapping arrangement of the first strain resistor and the second strain resistor in the pressing force detection unit according to the second embodiment of the present invention.
Detailed Description
The following further describes the preferred embodiments of the present invention with reference to the accompanying drawings.
The pressing force sensing plate comprises a transparent substrate 1 and a plurality of pressing force detection units 2 arranged on the same side surface of the transparent substrate 1, wherein the pressing force detection units 2 comprise a first strain resistor 201 and a second strain resistor 202, the first strain resistor 201 and the second strain resistor 202 are arranged side by side, the first strain resistor 201 is made of a first conductive material layer 2010, the second strain resistor 202 is made of a second conductive material layer 2020, the first conductive material layer 2010 is a transparent conductive oxide film layer made by a sputtering method under a high temperature condition, the second conductive material layer 2020 is a transparent conductive oxide film layer made by a sputtering method under a low temperature condition, the first conductive material layer 2010 and the second conductive material layer 2020 are transparent conductive oxides with different components, for example, the first conductive material layer 2010 and the second conductive material layer 2020 can be Indium Tin Oxide (ITO) or Indium Tin Oxide (ITO) respectively, Two of zinc aluminum oxide (AZO), Indium Gallium Oxide (IGO), and zinc gallium indium oxide (IGZO), the temperature resistivity of the first conductive material layer 2010 is not equal to the temperature resistivity of the second conductive material layer 2020.
The pressing force sensing plate further comprises a resistance detection module and a calculation module (not shown in fig. 1); the resistance detection module is used for respectively monitoring resistance change values of the first strain resistor 201 and the second strain resistor 202; the calculation module can calculate the pressing force applied to a certain position of the transparent substrate 1 according to the resistance change values of the first strain resistor 201 and the second strain resistor 202 at the position; the calculation module solves the pressing force by adopting the following equation set:
wherein,is the temperature change value of a certain position,for the value of the change in the pressing force applied to the position on the transparent substrate,andthe variation values of the first strain resistor and the second strain resistor are respectively, R10 and R20 are resistance values of the first strain resistor 201 and the second strain resistor 202 at a standard temperature, K1 and K2 are temperature resistance coefficients of the first conductive material layer and the second conductive material layer, respectively, and f1 and f2 are strain resistance coefficients of the first conductive material layer and the second conductive material layer, respectively.
The embodiment further provides a method for detecting pressing force, which includes the following steps:
(1) the same side surface of the transparent substrate 1 is provided with a plurality of pressing force detection units 2, each pressing force detection unit 2 comprises a first strain resistor 201 and a second strain resistor 202, each first strain resistor 201 is made of a first conductive material layer 2010, each second strain resistor 202 is made of a second conductive material layer 2020, the temperature resistance coefficient of the first conductive material layer 2010 is not equal to that of the second conductive material layer 2020, and low-resistance connecting lines 3 are arranged between each first strain resistor 201 and each second strain resistor 202 and the outside so as to enable an external circuit to perform resistance value detection;
(2) detecting the change values of the first strain resistor 201 and the second strain resistor 202;
(3) the magnitude of the pressing force is solved by the following equation group:
Wherein,is the temperature change value of a certain position,for the value of the change in the pressing force applied to the position on the transparent substrate,andthe variation values of the first strain resistor 201 and the second strain resistor 202 are respectively shown, R10 and R20 are resistance values of the first strain resistor 201 and the second strain resistor 202 at a standard temperature, K1 and K2 are temperature resistance coefficients of the first conductive material layer 2010 and the second conductive material layer 2020 respectively, and f1 and f2 are strain resistance coefficients of the first conductive material layer 2010 and the second conductive material layer 2020 respectively.
R10, R20, K1, K2, f1 and f2 can be obtained by a method of measurement or correction in advanceThe change value of the pressing force can be obtained by solving the equation set. To make it possible toMore precisely, it is only necessary to ensure that the first strain resistor 201 and the second strain resistor 202 in each pressing force detection unit 2 are identical in position (the center distance is less than 15mm), and that K1 and K2 are not identical.
Example two
As shown in fig. 3 and 4, in the case that the other parts are the same as the first embodiment, the difference is that: the first strain resistor 201 and the second strain resistor 202 are respectively formed by patterning a first conductive material layer 2010 and a second conductive material layer 2020, the first conductive material layer 2010 and the second conductive material layer 2020 are located on different layers, the first conductive material layer 2010 and the second conductive material layer 2020 are separated by an insulating layer (not shown in fig. 3) and the first strain resistor 201 and the second strain resistor 202 are arranged in an overlapping manner.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and the equivalent or simple change of the structure, the characteristics and the principle described in the present patent idea is included in the protection scope of the present patent. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (7)
1. A pressing force sensing plate characterized by: the device comprises a substrate, a resistance detection module, a calculation module and a plurality of pressing force detection units arranged on the same side surface of the substrate; the pressing force detection unit comprises a first strain resistor and a second strain resistor, the first strain resistor is made of a first conductive material layer, the second strain resistor is made of a second conductive material layer, and the temperature resistance coefficient of the first conductive material layer is not equal to that of the second conductive material layer; the resistance detection module is used for respectively monitoring resistance change values of the first strain resistor and the second strain resistor; the calculation module can calculate the pressing force applied to a certain position of the substrate according to the resistance change values of the first strain resistor and the second strain resistor at the position; the calculation module solves the pressing force by adopting the following equation set:
wherein,is the temperature change value of a certain position,for the value of the change in the pressing force applied to the position on the substrate,andthe variation values of the first strain resistor and the second strain resistor are respectively, R10 and R20 are resistance values of the first strain resistor and the second strain resistor at a standard temperature, K1 and K2 are temperature resistance coefficients of the first conductive material layer and the second conductive material layer respectively, and f1 and f2 are strain resistance coefficients of the first conductive material layer and the second conductive material layer respectively.
2. The pressing force sensing plate according to claim 1, characterized in that: the substrate is a transparent substrate, and the first conductive material layer and the second conductive material layer are transparent oxide conductive film layers.
3. The pressing force sensing plate according to claim 2, characterized in that: the first conductive material layer is a transparent conductive oxide film layer manufactured by a sputtering method under a high-temperature condition, and the second conductive material layer is a transparent conductive oxide film layer manufactured by a sputtering method under a low-temperature condition.
4. The pressing force sensing plate according to claim 2, characterized in that: the first conductive material layer and the second conductive material layer are transparent conductive oxides with different components.
5. The pressing force sensing plate according to claim 2, characterized in that: the first strain resistor and the second strain resistor are formed by patterning a first conductive material layer and a second conductive material layer respectively, and the first conductive material layer and the second conductive material layer are located on different layers.
6. The pressing force sensing plate according to claim 5, wherein: the first strain resistor and the second strain resistor are arranged in an overlapping mode.
7. A pressing force detection method, characterized by comprising the steps of:
(1) the pressing force detection units are arranged on the same side face of the substrate and comprise first strain resistors and second strain resistors, the first strain resistors are made of a first conductive material layer, the second strain resistors are made of a second conductive material layer, the temperature resistance coefficient of the first conductive material layer is not equal to that of the second conductive material layer, and low-resistance connecting lines are arranged on the first strain resistors, the second strain resistors and the outside of the first strain resistors and the second strain resistors so that an external circuit can detect the resistance value;
(2) detecting the change values of the first strain resistor and the second strain resistor;
(3) the magnitude of the pressing force is solved by the following equation group:
Wherein,is the temperature change value of a certain position,for the value of the change in the pressing force applied to the position on the substrate,andthe resistance values of the first strain resistor and the second strain resistor are respectively the variation values of the first strain resistor and the second strain resistor, R10 and R20 are the resistance values of the first strain resistor and the second strain resistor at the standard temperature, K1 and K2 are the temperature resistance coefficients of the first conductive material and the second conductive material respectively, and f1 and f2 are the strain resistance coefficients of the first conductive material and the second conductive material respectively.
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CN107561761B (en) * | 2017-09-20 | 2020-09-01 | 厦门天马微电子有限公司 | Display panel, driving method thereof and display device |
CN111238361B (en) * | 2020-03-13 | 2024-09-17 | 北京石墨烯技术研究院有限公司 | Graphene temperature strain sensor |
CN113178628B (en) * | 2021-04-19 | 2023-03-10 | 河南利威新能源科技有限公司 | Lithium ion battery module and health state monitoring method thereof |
Citations (2)
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US4311980A (en) * | 1978-10-12 | 1982-01-19 | Fabrica Italiana Magneti Marelli, S.P.A. | Device for pressure measurement using a resistor strain gauge |
CN1435751A (en) * | 2002-01-31 | 2003-08-13 | 阿尔卑斯电气株式会社 | Induction plate and method for mfg. same |
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JP5198608B2 (en) * | 2010-03-18 | 2013-05-15 | 韓国標準科学研究院 | Flexible force or pressure sensor array using semiconductor strain gauge, method for manufacturing the flexible force or pressure sensor array, and force or pressure measuring method using the flexible force or pressure sensor array |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US4311980A (en) * | 1978-10-12 | 1982-01-19 | Fabrica Italiana Magneti Marelli, S.P.A. | Device for pressure measurement using a resistor strain gauge |
CN1435751A (en) * | 2002-01-31 | 2003-08-13 | 阿尔卑斯电气株式会社 | Induction plate and method for mfg. same |
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