CN105916292A - Bendable aluminum-based copper-clad plate and purpose and preparation method thereof - Google Patents
Bendable aluminum-based copper-clad plate and purpose and preparation method thereof Download PDFInfo
- Publication number
- CN105916292A CN105916292A CN201610430748.4A CN201610430748A CN105916292A CN 105916292 A CN105916292 A CN 105916292A CN 201610430748 A CN201610430748 A CN 201610430748A CN 105916292 A CN105916292 A CN 105916292A
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- China
- Prior art keywords
- aluminum
- foil plate
- preparation
- plate
- aluminum foil
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a bendable aluminum-based copper-clad plate and a purpose and a preparation method thereof. The bendable aluminum-based copper-clad plate is characterized in that an aluminum foil plate and a copper foil plate are bonded together through a TPI thermoplastic polyimide film layer. The preparation method successively comprises five steps of: surface processing of the aluminum foil plate, cleaning, drying, superposing and pressing molding. The bendable aluminum-based copper-clad plate has the advantages that the structure is reasonable, and the finished product is bendable. The preparation method is reasonable and controllable, the quality of the finished product is good, and the finished product can be used to prepare LED lamp circuit boards with various geometrical shapes and curved surfaces.
Description
Technical field
The present invention relates to a kind of can the aluminum-based copper-clad plate and application thereof of bending and preparation method, belong to technical field of motors,
It is specifically related to electronic circuit plate technique.
Background technology
Instantly electronic circuit board, is all the aluminum-based copper-clad plate prepared by aluminium foil and Copper Foil, is prepared by etching.
Described this wiring board, it is common that do not allow bending, this is because bending can make aluminum base and Copper Foil (circuit)
Peel off, even very likely result in the disconnection of copper foil circuit, and have a strong impact on it and normally work.
But, some wiring board duty is not tiled arrangements, especially LED illumination lamp, often will be according to making
With on-the-spot and decorative effect, and it is arranged to various geometry and curved surface arcuation, so, is the most easily given its wiring board
Damage.
Summary of the invention
It is desirable to provide one disclosure satisfy that specific operation, and do not easily cause aluminium foil and be difficult to Copper Foil stripping and circuit
Disconnect can the aluminum-based copper-clad plate and application thereof of bending and preparation method, to overcome the deficiency of prior art.
One of present invention technical scheme realizing its purpose is, a kind of can the aluminum-based copper-clad plate of bending, it includes aluminum foil plate
And copper foil plate, between aluminum foil plate and copper foil plate, there is TPI thermoplastic polyimide film layer；And described aluminum foil plate and copper foil plate lead to
Cross TPI thermoplastic polyimide film layer heat bonding integral.
In view of TPI TPI, there is the stability of physical property under the strongest adhesion strength and room temperature, and use
Wiring board prepared by the present invention, can arbitrarily bend due to the existence of TPI thermoplastic polyimide film layer, is not easy to produce Copper Foil
Circuit peels off with aluminum base, it is achieved thereby that the purpose of the present invention.
The two of technical solution of the present invention, are to prepare various geometry, the LED illumination lamp of various radian curved surface by the present invention
Wiring board, or other figuration electronic product wiring board.
The three of technical scheme, be described can the preparation method of aluminum-based copper-clad plate of bending, it is with aluminum foil plate, copper
Paper tinsel plate and TPI thermoplastic polyimide film, for going out issuance of materials, be equipped for main process equipment with vacuum hot pressing formation, with can bending
Aluminum-based copper-clad plate is target product, it is characterised in that its preparation process includes successively:
(1) aluminum foil plate surface cleaning processes；Described purified treatment includes alkali cleaning, pickling and 3 operations of rust cleaning；And described 3 works
Sequence is implemented the most respectively；
(2) cleaning treatment；Described cleaning treatment is the aluminum foil plate processed through step 1 surface cleaning to be implemented washing process；
(3) drying and processing；Described drying and processing, is to be dried by the aluminum foil plate processed through step 2 washing；
(4) overlapping；Described overlapping is by the aluminum foil plate dried through step 3 and TPI thermoplastic polyimide film and copper foil plate, logical
Cross overlapping equipment and be overlapped into 3 layers of composite insulating foil successively；
(5) pressing and forming；Described pressing and forming is the 3 layers of composite insulating foil that will overlap through step 4, is hot pressed into by vacuum hotpressing equipment
Target product.
In the three of described technical scheme, the present invention also advocates:
The thickness of described TPI polyimide film layer is in the range of 0.02 ~ 0.03mm.
And the alkali cleaning described in its step 1, it is to use 25wt%NaOH aqueous solution alkali cleaning；Described pickling, is to use concentration
It is 380 ~ 420g/L HNO3Aqueous solution pickling；Described rust cleaning, is to use 100kg water for industrial use to add 30 ~ 50kgJF-201 type aluminum
The aqueous solution rust cleaning of rust remover.However, it is not limited to this, especially process raw materials used and technological parameter, be to regard
Practical situation carries out changing.
And the cleaning described in its step 2, be to use city disclosure water to clean, after again with deionized water cleaning, and all adopt
Clean by spray mode.But it is not limited to this, it is also possible to directly clean with deionized water
And the drying and processing described in its step 3, it is to use tunnel cave drying and processing, dries temperature and control 130 ~ 150 DEG C of scopes
In, the time controls in the range of 2 ~ 5min.But it is not limited to this, becomes inverse correlation with drying time owing to drying temperature, dry temperature
Spent low can proper extension drying time, till workpiece is dried completely.
And the hot-forming temperature described in its step 5 is in the range of 300 ~ 350 DEG C；Pressure is 4.0 ~ 4.5MPa scope
In, the time is in the range of 50 ~ 70min, and implements hot-forming under vacuum conditions, and its vacuum is more than-40mm mercury column.But
Being not limited thereto, this is currently preferred process strategies, the technology requirement of target product to be regarded in being embodied as implementing
Depending on.
Requiring to consider for aluminum foil plate quality difference, the present invention also advocates, when described aluminum foil plate system hard aluminum foil plate
Under the conditions of, between step 1 and step 2, also anodized step；Described anodized is sulphuric acid anodizing
Process.And for soft aluminum foil plate, the present invention does not advocate it is implemented anodized.
Preparation method of the present invention, advocates to use the continuous preparation method of production line, in order to be effectively improved production efficiency.
After above-mentioned 3 technical schemes are implemented in full, the target product that the present invention is had is rational in infrastructure, can be any
Bending, is not likely to produce aluminium foil and peels off with Copper Foil (circuit), and the method that its preparation method is had is the most controlled, target product quality
Excellent and be particularly well-suited to the features such as LED illumination lamp wiring board, it is self-evident, it is achieved thereby that the purpose of the present invention, full
The technology requirement of the LED illumination lamp special operation condition condition of the most various geometries of foot and various radian curved surface.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram.
Detailed description of the invention
Below in conjunction with accompanying drawing, by the description of detailed description of the invention, the invention will be further described.
One of detailed description of the invention, as shown in Figure 1.
A kind of can the aluminum-based copper-clad plate of bending, it includes aluminum foil plate 1 and copper foil plate 2, and described in it, at aluminum foil plate 1 and copper
TPI thermoplastic polyimide film layer 3 is had between paper tinsel plate 2；And described aluminum foil plate 1 and copper foil plate 2 sub-by TPI thermoplasticity polyamides
Amine thin layer 3 heat bonding is integral.
The thickness of described TPI thermoplastic polyimide film layer 3 is in the range of 0.02 ~ 0.03mm.
The two of detailed description of the invention, please join reading accompanying drawing 1.
A kind of prepare described above can the method for aluminum-based copper-clad plate of bending, with aluminum foil plate, copper foil plate and TPI thermoplastic poly
Imide membrane, for going out issuance of materials, is equipped for main process equipment with vacuum hot pressing formation, with can the aluminum-based copper-clad plate of bending as target
Product, and its preparation process includes successively:
(1) aluminum foil plate surface cleaning processes；Described purified treatment includes alkali cleaning, pickling and 3 operations of rust cleaning；And described 3 works
Sequence is implemented the most respectively；
(2) cleaning treatment；Described cleaning treatment is the aluminum foil plate processed through step 1 surface cleaning to be implemented washing process；
(3) drying and processing；Described drying and processing, is to be dried by the aluminum foil plate processed through step 2 washing；
(4) overlapping；Described overlapping is by the aluminum foil plate dried through step 3 and TPI thermoplastic polyimide film and copper foil plate, logical
Cross overlapping equipment and be overlapped into 3 layers of composite insulating foil successively；
(5) pressing and forming；Described pressing and forming is the 3 layers of composite insulating foil that will overlap through step 4, is hot pressed into by vacuum hotpressing equipment
Type target product.
And the thickness of its described TPI polyimide film layer is in the range of 0.02 ~ 0.03mm.
And the alkali cleaning described in its step 1, it is to use 25wt%NaOH aqueous solution alkali cleaning；Described pickling, is to use concentration
It is 380 ~ 420g/L HNO3Aqueous solution pickling；Described rust cleaning, is to use 100kg water for industrial use to add 30 ~ 50kgJF-201 type aluminum
The aqueous solution rust cleaning of rust remover.
And the cleaning described in its step 2, be to use city commons water to clean, after clean with deionized water again, and all adopt
Clean by spray mode.
And the drying and processing described in its step 3, it is to use tunnel cave drying and processing, dries temperature and control at 130 ~ 150 DEG C
In the range of, the time controls in the range of 2 ~ 5min.
And the hot-forming temperature described in its step 5 is in the range of 300 ~ 350 DEG C；Pressure is in 4.0 ~ 4.5MPa scope
In, the time is in the range of 50 ~ 70min, and implements hot-forming under vacuum conditions, and its vacuum is more than-40mm mercury column.
The three of detailed description of the invention, please join reading accompanying drawing 1.
A kind of can the aluminum-based copper-clad plate of bending, under conditions of described aluminum foil plate system hard aluminum foil plate, in step 1 and step
Between 2, also anodized step；Described anodized is that sulphuric acid anodizing processes.In addition, other is equal
Such as detailed description of the invention two.
The present invention of structure as described in one of detailed description of the invention, prepares the LED of radian curved surface variously-shaped, various with it
Illuminating lamp wiring board, it is possible to prepare other figuration electronic product wiring board.
Copper foil plate of the present invention, is that the city that surface cleaning and rust cleaning etc. process supplies product.
Wherein said rust remover is the product of sufacing company limited of Changzhou Tianrui.
The present invention of structure as described in one of detailed description of the invention, and use detailed description of the invention two and three made
The first sample of the standby present invention, by the doubling-over test of 5 ~ 10 times, find no aluminium foil and Copper Foil (circuit) be layered, ftracture and
The problem peeled off, achieves obvious technique effect, has obtained using the affirmative of unit, it is achieved that purpose expected from the present invention.
Claims (10)
1. can the aluminum-based copper-clad plate of bending, it includes aluminum foil plate (1) and copper foil plate (2), it is characterised in that at aluminum foil plate
And between copper foil plate (2), have TPI thermoplastic polyimide film layer (3) (1)；And described aluminum foil plate (1) and copper foil plate (2) pass through
TPI thermoplastic polyimide film layer (3) heat bonding is integral.
The most according to claim 1 can the aluminum-based copper-clad plate of bending, it is characterised in that: described TPI TPI
The thickness of thin layer (3) is in the range of 0.02 ~ 0.03mm.
3. as claimed in claim 1 can the aluminum-based copper-clad plate of bending, prepare radian curved surface variously-shaped, various with it
LED illumination lamp wiring board, or other figuration electronic product wiring board.
4. prepare as claimed in claim 1 or 2 can the method for aluminum-based copper-clad plate of bending, with aluminum foil plate, copper foil plate and
TPI thermoplastic polyimide film, for going out issuance of materials, is equipped for main process equipment with vacuum hot pressing formation, covers with bent aluminum base
Copper coin is target product, it is characterised in that its preparation process includes successively:
(1) aluminum foil plate surface cleaning processes；Described purified treatment includes alkali cleaning, pickling and 3 operations of rust cleaning；And described 3 works
Sequence is implemented the most respectively；
(2) cleaning treatment；Described cleaning treatment is the aluminum foil plate processed through step 1 surface cleaning to be implemented washing process；
(3) drying and processing；Described drying and processing, is to be dried by the aluminum foil plate processed through step 2 washing；
(4) overlapping；Described overlapping is by the aluminum foil plate dried through step 3 and TPI thermoplastic polyimide film and copper foil plate, logical
Cross overlapping equipment and be overlapped into 3 layers of composite insulating foil successively；
(5) pressing and forming；Described pressing and forming is the 3 layers of composite insulating foil that will overlap through step 4, is hot pressed into by vacuum hotpressing equipment
Target product.
Preparation method the most according to claim 4, it is characterised in that the thickness of described TPI thermoplastic polyimide film layer
Degree is in the range of 0.02 ~ 0.03mm.
Preparation method the most according to claim 4, it is characterised in that the alkali cleaning described in its step 1, is to use 25wt%
NaOH aqueous solution alkali cleaning；Described pickling, be use concentration be 380 ~ 420g/L HNO3Aqueous solution pickling；Described rust cleaning, be
100kg water for industrial use is used to add 30 ~ rust cleaning of the aqueous solution of 50kgJF-201 type aluminum rust remover.
Preparation method the most according to claim 4, it is characterised in that the washing described in its step 2, is to use city public
With water clean, after again with deionized water clean, and all use spray mode clean.
Preparation method the most according to claim 4, it is characterised in that the drying and processing described in its step 3, is to use tunnel
Kiln drying processes, and dries temperature and controls in the range of 130 ~ 150 DEG C, and the time controls in the range of 2 ~ 5min.
Preparation method the most according to claim 4, it is characterised in that the hot-forming temperature described in its step 5 is 300
In the range of ~ 350 DEG C；Pressure is in the range of 4.0 ~ 4.5MPa, and the time is in the range of 50 ~ 70min, and implements heat under vacuum conditions
Molded, its vacuum is more than-40mm mercury column.
10. according to the preparation method one of claim 4 to 9 Suo Shu, it is characterised in that when described aluminum foil plate system hard aluminum foil plate
Under conditions of, between step 1 and step 2, also anodized step；Described anodized is sulphuric acid anodic oxygen
Change processes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610430748.4A CN105916292A (en) | 2016-06-16 | 2016-06-16 | Bendable aluminum-based copper-clad plate and purpose and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610430748.4A CN105916292A (en) | 2016-06-16 | 2016-06-16 | Bendable aluminum-based copper-clad plate and purpose and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105916292A true CN105916292A (en) | 2016-08-31 |
Family
ID=56750426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610430748.4A Pending CN105916292A (en) | 2016-06-16 | 2016-06-16 | Bendable aluminum-based copper-clad plate and purpose and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN105916292A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111417270A (en) * | 2020-03-30 | 2020-07-14 | 成都多吉昌新材料股份有限公司 | FPC bonding method, coverlay forming method and ultrathin FPC |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402760A (en) * | 1999-11-30 | 2003-03-12 | 大塚化学株式会社 | Resin composition and flexible printed circuit board |
| CN101652244A (en) * | 2007-04-18 | 2010-02-17 | 旭化成电子材料株式会社 | metal-resin laminate |
| CN102152539A (en) * | 2010-11-11 | 2011-08-17 | 广东生益科技股份有限公司 | Continuous production method for aluminum-based copper-clad plate and continuous production line thereof |
| CN202911225U (en) * | 2012-08-13 | 2013-05-01 | 广东生益科技股份有限公司 | Graphite composite heat conduction adhesive film and graphite composite metal-based copper-clad plate |
| CN103668386A (en) * | 2013-12-17 | 2014-03-26 | 广西理工职业技术学院 | Aluminum and aluminum alloy surface treatment method |
| CN204894663U (en) * | 2015-08-06 | 2015-12-23 | 汪仁贵 | Flexible aluminium base copper -clad plate |
| CN205812495U (en) * | 2016-06-16 | 2016-12-14 | 常州市超顺电子技术有限公司 | Can the aluminum-based copper-clad plate of bending |
-
2016
- 2016-06-16 CN CN201610430748.4A patent/CN105916292A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402760A (en) * | 1999-11-30 | 2003-03-12 | 大塚化学株式会社 | Resin composition and flexible printed circuit board |
| CN101652244A (en) * | 2007-04-18 | 2010-02-17 | 旭化成电子材料株式会社 | metal-resin laminate |
| CN102152539A (en) * | 2010-11-11 | 2011-08-17 | 广东生益科技股份有限公司 | Continuous production method for aluminum-based copper-clad plate and continuous production line thereof |
| CN202911225U (en) * | 2012-08-13 | 2013-05-01 | 广东生益科技股份有限公司 | Graphite composite heat conduction adhesive film and graphite composite metal-based copper-clad plate |
| CN103668386A (en) * | 2013-12-17 | 2014-03-26 | 广西理工职业技术学院 | Aluminum and aluminum alloy surface treatment method |
| CN204894663U (en) * | 2015-08-06 | 2015-12-23 | 汪仁贵 | Flexible aluminium base copper -clad plate |
| CN205812495U (en) * | 2016-06-16 | 2016-12-14 | 常州市超顺电子技术有限公司 | Can the aluminum-based copper-clad plate of bending |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111417270A (en) * | 2020-03-30 | 2020-07-14 | 成都多吉昌新材料股份有限公司 | FPC bonding method, coverlay forming method and ultrathin FPC |
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Application publication date: 20160831 |