CN105897203A

CN105897203A - Radio-frequency power amplifiers driven by boost converter

Info

Publication number: CN105897203A
Application number: CN201510641587.9A
Authority: CN
Inventors: P·J·莱托拉
Original assignee: Conexant Systems LLC
Current assignee: Skyworks Solutions Inc; Conexant Systems LLC
Priority date: 2015-02-15
Filing date: 2015-09-30
Publication date: 2016-08-24
Anticipated expiration: 2035-09-30
Also published as: CN105897203B; CN109120233A; HK1226202B; CN109120233B

Abstract

Radio-frequency (RF) power amplifiers driven by boost converter is disclosed. In some embodiments, a power amplification system can include a supply system configured to provide a high-voltage (HV) supply signal based on a battery voltage, and a power amplifier (PA) configured to receive the HV supply signal and amplify an RF signal. The power amplification system can further include an output path configured to route the amplified RF signal to a filter. Such an output path can be substantially free of either or both of an impedance transformation circuit and a band selection switch.

Description

The radio-frequency power amplifier driven by boost converter

Cross-Reference to Related Applications

The application advocates the entitled " RADIO-FREQUENCY submitted on February 15th, 2015 POWER AMPLIFIERS DRIVEN BY BOOST CONVERTER " U.S. Provisional Application Entitled " the INTERLEAVED DUAL that No.62/116,452, on February 15th, 2015 submit to OUTPUT CHARGE PUMP " U.S. Provisional Application No.62/116,457 and 2015 9 Entitled " the INTERLEAVED DUAL OUTPUT CHARGE PUMP's " that the moon 22 was submitted to U. S. application No.14/861, the priority of 058, the disclosure of each of which is hereby by quoting clearly Ground entirety is herein incorporated.

Technical field

Present invention relates generally to the power amplifier applied for radio frequency (RF).

Background technology

In radio frequency (RF) is applied, armed RF signal is typically generated by transceiver.Then, this The RF signal of sample can be amplified by power amplifier (PA), and the RF signal after amplification can be routed to sky Line is for transmitting.

Summary of the invention

In some embodiments, the application relates to a kind of power amplifying system, and it includes being configured to Cell voltage provides the electric power system of high voltage (HV) power supply signal, and is configured to receive described HV Power supply signal and amplify the power amplifier (PA) of radio frequency (RF) signal.Described power amplification system System also includes that the RF signal being configured to after amplifying is routed to the outgoing route of wave filter.

In certain embodiments, described outgoing route can not have impedance inverter circuit substantially.Described power Amplification system can be configured to operate follows the tracks of (APT) system for mean power.Described electric power system can include It is configured to generate the boosting DC/DC transducer of described HV power supply signal based on described cell voltage.Institute State HV power supply signal and can be selected so that the impedance of described PA and described wave filter fully mates to permit Permitted described outgoing route and substantially be there is no impedance inverter circuit.The impedance of described PA has more than about 40 The value of ohm, the value of the most about 50 ohm.

In certain embodiments, described PA can include heterojunction bipolar transistor (HBT).Described HBT It can be GaAs (GaAs) device.Described HV power supply signal can be supplied to institute as VCC State the colelctor electrode of HBT.

In certain embodiments, described wave filter can be arranged to corresponding transmitting (Tx) frequency band The Tx wave filter of operation.Described Tx wave filter can be arranged to described Tx frequency band and correspondence Receive a part for the duplexer of (Rx) frequency band operation.

In certain embodiments, described power amplifying system may also include one or more additional PA, its Each being configured to receives described HV power supply signal and amplifies RF signal.Described power amplifying system is also Can include one or more additional outgoing route, each of which is configured to receive the amplification of corresponding additional PA RF signal and be routed to correspondence wave filter.Described additional outgoing route can the most not hinder Transformation circuit.

In certain embodiments, each wave filter can have corresponding PA associated there.Described merit Rate amplification system can not have band selection switches substantially between described PA and described wave filter.Described Power amplifying system can have than have similar frequency band disposal ability but wherein PA is with low voltage operating The lower loss of another power amplifier system.Described power amplifying system can be that mean power is followed the tracks of (APT) system, another power amplifier system described can be envelope-tracking (ET) system.Described APT system can have the higher overall efficiency of overall efficiency than described ET system.

According to numerous embodiments, the application relates to a kind of radio frequency (RF) module, and it includes being configured to hold Receive the package substrate of multiple parts and the power amplifying system that is implemented in described package substrate.Described power Amplification system includes that being configured to cell voltage provides the electric power system of high voltage (HV) power supply signal. Described power amplifying system also includes multiple power amplifier (PA), and it is described that each PA is configured to reception HV power supply signal and amplify radio frequency (RF) signal.Described power amplifying system also include being configured to by RF signal after amplification is routed to the outgoing route of the wave filter of correspondence from corresponding PA.

In certain embodiments, each can also configure in the plurality of PA is of about the defeated of driving correspondence Go out the characteristic load impedance of wave filter.Each outgoing route can not have impedance inverter circuit substantially in correspondence PA and output filter between.Described power amplifying system can not have band selection switches to exist substantially Between the output filter that the plurality of PA is corresponding with them.Described RF module can be such as front end Module (FEM).

In some are instructed, the application relates to a kind of wireless device, and it includes being configured to generate radio frequency (RF) The transceiver of signal and the front-end module (FEM) with described transceiver communication.Described FEM bag Include the package substrate being configured to accommodate multiple parts.Described FEM also includes being implemented in described package substrate On power amplifying system.Described power amplifying system includes that being configured to cell voltage provides high voltage (HV) electric power system of power supply signal.Described power amplifying system also includes multiple power amplifier PA, Each PA is configured to receive described HV power supply signal and amplify radio frequency (RF) signal, described power Amplification system also includes that be configured to the RF signal after amplifying is routed to the filtering of correspondence from corresponding PA The outgoing route of device.Described wireless device also includes the antenna communicated with described FEM, and described antenna is joined It is set to the RF signal after launching described amplification.

According to numerous embodiments, the application relates to a kind of power amplifying system, and it includes being configured to receive With amplify the power amplifier (PA) of radio frequency (RF) signal, and be couple to described PA and configure The wave filter of the RF signal after amplifying for regulation.Described PA is additionally configured to drive the most described wave filter Characteristic load impedance.

In certain embodiments, described PA can have than about 40 ohm of bigger impedances.Described PA Impedance may have about the value of 50 ohm.

In certain embodiments, described power amplifying system may also include and is configured to provide height to described PA The electric power system that voltage (HV) is powered.Described electric power system can include being configured to cell voltage Vbatt Generate the boosting DC/DC transducer that described HV powers.

In certain embodiments, described PA can include heterojunction bipolar transistor (HBT).Described HBT It can be such as GaAs (GaAs) device.Described HV powers and can be supplied to described HBT as VCC Colelctor electrode.

In certain embodiments, described wave filter can be by not having the outgoing route of impedance inverter circuit substantially It is couple to described PA.

In certain embodiments, described power amplifying system may also include one or more additional PA, its Each RF signal being configured for described HV powered operation and amplifying correspondence.Described power amplification system System may also include be couple in the one or more additional PA each and to be configured to regulation corresponding The wave filter of the RF signal after amplification.Each in the one or more additional PA may be additionally configured to Drive the characteristic load impedance corresponding approximately to wave filter.Each in the one or more additional filter By substantially not having the outgoing route of impedance inverter circuit to be couple to the PA of correspondence.

In certain embodiments, described PA and the one or more additional PA can form M PA. In certain embodiments, described M PA may be implemented on single semiconductor wafer.Described M PA Can be configured to single frequency band operation.Described system can not have band selection switches substantially at described M Between the wave filter that individual PA is corresponding with them.

In certain embodiments, described power amplifying system can be configured to operate as mean power tracking (APT) system.Described APT system can have than have similar frequency band disposal ability wherein PA With the loss that another power amplifier system of low voltage operating is lower.Another power amplifier system described It can be envelope-tracking (ET) system.It is overall that described APT system can have than described ET system Overall efficiency in hgher efficiency.

In some are instructed, the application relates to a kind of radio frequency (RF) module, and it is many that it includes being configured to receiving The package substrate of individual parts, and it is implemented in the power amplifying system in described package substrate.Described power Amplification system includes multiple power amplifier (PA), and each PA is configured to receive and amplify radio frequency (RF) Signal.Described power amplifying system also includes the wave filter being couple to each PA, and each PA is configured to Drive the characteristic load impedance of the most described wave filter.

In certain embodiments, each PA can be configured to operate with high voltage (HV) powering mode.Often Individual wave filter can be couple to the PA of correspondence by substantially not having the outgoing route of impedance inverter circuit.

In certain embodiments, described RF module can not have band selection switches substantially the plurality of Between the wave filter that PA is corresponding with them.Described RF module can be such as front-end module (FEM).

According to some embodiments, the application relates to a kind of wireless device, and it includes being configured to generate radio frequency (RF) signal transceiver and with the front-end module (FEM) of described transceiver communication.Described FEM Including being configured to the package substrate accommodating multiple parts and the power amplification being implemented in described package substrate System.Described power amplifying system includes multiple power amplifier (PA), and each PA is configured to receive With amplification radio frequency (RF) signal.Described power amplifying system also includes the wave filter being couple to each PA, Each PA is configured to drive the characteristic load impedance of the most described wave filter.Described wireless device also includes The antenna communicated with described FEM, described antenna configurations is to launch the RF signal after amplifying.

In some are instructed, the application relates to a kind of method processing radio frequency (RF) signal.Described method Described RF signal is amplified including with power amplifier (PA), and the RF signal route after amplifying To wave filter.Described method also includes that operating described PA makes described PA drive the most described wave filter Characteristic impedance.

In certain embodiments, described PA may have about the impedance of 50 ohm.In certain embodiments, Operate described PA can include powering to described PA with high voltage (HV).

According to multiple teaching, the application relates to a kind of power amplifying system, and it includes being configured to receive and put The power amplifier PA of big radio frequency (RF) signal.Described power amplifying system also includes by output road Footpath is couple to the output filter of described PA, and described outgoing route does not has impedance inverter circuit substantially.

In certain embodiments, described PA may be additionally configured to drive the feature of the most described output filter Load impedance.Described PA is configured to drive the characteristic load impedance of the most described output filter to lead to Cross and realize with PA described in high voltage (HV) powered operation.Described outgoing route does not has impedance to become substantially Change circuit to may result between described PA and described output filter loss and be reduced at least 0.5dB.

In certain embodiments, described PA can have than about 40 ohm of bigger impedances.Described PA Impedance may have about the value of 50 ohm.The impedance of described PA may result in the electricity reduced in described PA Stream consumes.In described PA reduce current consumption can allow PA be smaller in size than have more low-impedance Other PA.

In certain embodiments, described PA can include heterojunction bipolar transistor (HBT).Described HBT It can be GaAs (GaAs) device.Described HV powers and can be supplied to described HBT as VCC Colelctor electrode.

In certain embodiments, described output filter can be arranged to corresponding transmitting (Tx) frequently The Tx wave filter of rate band operation.Described Tx wave filter can be arranged to described Tx frequency band and right A part for the duplexer of reception (Rx) frequency band operation answered.

In certain embodiments, described power amplifying system may also include one or more additional PA, its Each RF signal being configured for described HV powered operation and amplifying correspondence.Described power amplification system System may also include by substantially not having the outgoing route of impedance inverter circuit to be couple to the one or more Each output filter in additional PA.Each in the one or more additional PA also can join It is set to drive the characteristic load impedance of the output filter corresponded approximately to.

In certain embodiments, described PA and the one or more additional PA can form M PA. Described M PA may be implemented on single semiconductor wafer.Described M PA can be configured to individually Frequency band operation.

In certain embodiments, described power amplifying system can not have band selection switches substantially at described M Between the output filter that individual PA is corresponding with them.Substantially the described power not having band selection switches is put Big system may result in the loss of at least 0.3dB between given PA and corresponding output filter and reduces.

According to some embodiments, the application relates to a kind of radio frequency (RF) module, and it includes being configured to hold Receive the package substrate of multiple parts, and be implemented in the power amplifying system in described package substrate.Described Power amplifying system includes multiple power amplifier (PA), and each PA is configured to receive and amplify radio frequency (RF) signal.Described power amplifying system also includes the output road by substantially not having impedance inverter circuit Footpath is couple to the output filter of each PA.

In certain embodiments, each PA can be configured to operate with high voltage (HV) powering mode.Often Individual PA may be additionally configured to drive the characteristic load impedance of the output filter corresponded approximately to.

In certain embodiments, described RF module can not have band selection switches substantially the plurality of Between the output filter that PA is corresponding with them.Described RF module can be such as front-end module (FEM).

In some embodiments, the application relates to a kind of wireless device, and it includes being configured to generate radio frequency (RF) signal transceiver and with the front-end module (FEM) of described transceiver communication.Described FEM Including being configured to the package substrate accommodating multiple parts and the power amplification being implemented in described package substrate System.Described power amplifying system includes multiple power amplifier (PA), and each PA is configured to receive With amplification radio frequency (RF) signal.Described power amplifying system also includes by substantially not having impedance transformation electricity The outgoing route on road is couple to the output filter of each PA.Described wireless device also includes with described The antenna of FEM communication, described antenna configurations is to launch the RF signal after amplifying.

In some are instructed, the application relates to a kind of method processing radio frequency (RF) signal.Described method Amplify described RF signal including with power amplifier (PA), and the RF signal after amplifying is basic No resistance is routed to output filter in conversion.Described method also includes with described output filter described RF signal after amplification is filtered.

In certain embodiments, amplify described RF signal and can include that operating described PA makes described PA drive The characteristic impedance of the most described dynamic output filter, thus allow the route that basic no resistance converts.Described PA may have about the impedance of 50 ohm.In certain embodiments, operate described PA can include with height Voltage (HV) is powered to described PA.

Instructing according to some, the application relates to a kind of power amplifying system, and it includes multiple power amplifier (PA), each PA is configured to radio frequency (RF) signal receiving and amplifying in a frequency band.Described merit Rate amplification system may also include the output filter being couple to each PA by single outgoing route, makes Obtain described power amplifying system substantially not have between the output filter that the plurality of PA is corresponding with them Band selection switches.

In certain embodiments, each PA may be additionally configured to drive the spy of the output filter corresponded approximately to Levy load impedance.Each PA is configured to drive the characteristic load impedance of the output filter corresponded approximately to can By realizing with PA described in high voltage (HV) powered operation.Substantially there is no the institute of band selection switches State power amplifying system and may result in the loss of at least 0.3dB between each PA and corresponding output filter Reduce.

In certain embodiments, each PA can have than about 40 ohm of bigger impedances.Each PA Impedance may have about the value of 50 ohm.The impedance of each PA causes the electric current reduced in described PA Consume.The current consumption reduced in each PA can allow being smaller in size than of described PA to have more Low ESR Other PA.

In certain embodiments, described power amplifying system may also include and is configured to provide height to each PA The electric power system that voltage (HV) is powered.Described electric power system can include being configured to cell voltage Vbatt Generate the boosting DC/DC transducer that described HV powers.

In certain embodiments, each PA can include heterojunction bipolar transistor (HBT).Described HBT It can be GaAs (GaAs) device.Described HV powers and can be supplied to described HBT as VCC Colelctor electrode.

In certain embodiments, each output filter can be arranged to corresponding transmitting (Tx) frequently The Tx wave filter of rate band operation.Described Tx wave filter can be arranged to described Tx frequency band and right A part for the duplexer of reception (Rx) frequency band operation answered.

In certain embodiments, each output filter can be by not having the output of impedance inverter circuit substantially Path is couple to the PA of correspondence.Each outgoing route does not has impedance inverter circuit to may result in correspondence substantially Between PA and output filter, the loss of at least 0.5dB reduces.

In certain embodiments, the plurality of PA may be implemented on single semiconductor wafer.Real at some Executing in example, described power amplifying system can be configured to operate follows the tracks of (APT) system for mean power.Institute State APT system and can have than have a similar frequency band disposal ability but wherein another with low voltage operating of PA The loss that one power amplifier system is lower.Another power amplifier system described can be envelope-tracking (ET) system.Described APT system can have more higher totally than the overall efficiency of described ET system Efficiency.

In some are instructed, the application relates to a kind of radio frequency (RF) module, its have be configured to accommodate many The package substrate of individual parts, and it is implemented in the power amplifying system in described package substrate.Described power Amplification system includes multiple power amplifier (PA), and each PA is configured to receive and amplify a frequency band Interior radio frequency (RF) signal.Described power amplifying system also includes being couple to often by independent outgoing route The output filter of individual PA so that described power amplifying system does not has band selection switches substantially described Between the output filter that multiple PA are corresponding with them.

In certain embodiments, each outgoing route can not have impedance inverter circuit substantially in correspondence Between PA and output filter.In certain embodiments, described RF module can be front-end module (FEM)。

According to multiple teaching, the application relates to a kind of wireless device, and it includes being configured to generate radio frequency (RF) The transceiver of signal and the front-end module (FEM) with described transceiver communication.Described FEM includes joining It is set to the package substrate accommodating multiple parts and the power amplifying system being implemented in described package substrate.Institute Stating power amplifying system and include multiple power amplifier (PA), each PA is configured to receive and amplify one Radio frequency (RF) signal in frequency band.Described power amplifying system also includes by independent outgoing route coupling Receive the output filter of each PA so that described power amplifying system does not has band selection switches substantially Between the output filter that the plurality of PA is corresponding with them.Described wireless device also includes with described The antenna of FEM communication, described antenna configurations is to launch the RF signal after amplifying.

In some are instructed, the application relates to a kind of method processing radio frequency (RF) signal.Described method Amplifying described RF signal including with one selected in multiple power amplifiers (PA), described RF believes Number it is in a frequency band.Described method also includes that the RF signal after amplifying is routed to output filter And substantially do not have band selection switches to operate.Described method also includes putting described with described output filter RF signal after great is filtered.

In certain embodiments, amplify described RF signal and can include that operating selected PA makes described PA Drive the characteristic impedance of the output filter corresponded approximately to, to allow the route substantially not having impedance transformation. Described PA may have about the impedance of 50 ohm.

In certain embodiments, operate described PA can include powering to described PA with high voltage (HV).

In some embodiments, the application relates to a kind of power amplifier wafer, and it includes that quasiconductor serves as a contrast The end and enforcement multiple power amplifiers (PA) on the semiconductor substrate.Each PA is configured to drive The characteristic load impedance of the dynamic components downstream approximately along independent frequency band signal path.The size of each PA Less than being configured to drive and the broadband of the more than one frequency band in the associated plurality of frequency band of multiple PA PA。

In certain embodiments, described components downstream can include output filter.Described independent frequency is taken a message Number path can be narrow-band signal path.Each PA is configured to drive the output filter corresponded approximately to Characteristic load impedance can be by realizing with PA described in high voltage (HV) powered operation.Each PA Can have than about 40 ohm of bigger impedances.The impedance of each PA may have about the value of 50 ohm. The impedance of each PA may result in the current consumption reduced in described PA.The electric current reduced in each PA Consumption can allow being smaller in size than of described PA to have another PA more low-impedance.

In certain embodiments, each PA can include the heterogeneous of such as GaAs (GaAs) device etc Knot bipolar transistor (HBT).Described HBT may be configured to its colelctor electrode and receives described HV confession Electricity is as VCC.

In certain embodiments, described PA can be configured to follow the tracks of the operation of (APT) pattern with mean power. Described APT pattern may result in than have similar frequency band disposal ability but wherein PA is with low voltage operating The loss that another wafer is lower.Another wafer described can be configured to operate with envelope-tracking (ET) pattern. Described APT pattern can produce than the higher overall efficiency of overall efficiency with described ET pattern association.

According to some embodiments, the application relates to a kind of radio frequency (RF) module, and it includes being configured to hold Receive the package substrate of multiple parts, and be implemented in the power amplifying system in described package substrate.Described Power amplifying system includes the multiple power amplifiers (PA) implemented on a semiconductor substrate.Each PA It is configured to drive the characteristic load impedance of the components downstream approximately along independent frequency band signal path.Each Being smaller in size than of PA is configured to drive and the more than one frequency in the associated plurality of frequency band of multiple PA Broadband p A of band.

In certain embodiments, each PA can be configured to operate with high voltage (HV) powering mode.? In some embodiments, described components downstream can include output filter.Described output filter can be by single Only outgoing route be couple to correspondence PA so that described power amplifying system the plurality of PA with Substantially band selection switches is not had between the output filter of they correspondences.Each outgoing route can not have substantially There is impedance inverter circuit between corresponding PA and output filter.Described RF module can be such as Front-end module (FEM).

In some are instructed, the application relates to a kind of wireless device, and it includes being configured to generate radio frequency (RF) The transceiver of signal and the front-end module (FEM) with described transceiver communication.Described FEM includes joining It is set to the package substrate accommodating multiple parts and the power amplifying system being implemented in described package substrate.Institute State multiple power amplifiers (PA) that power amplifying system includes implementing on a semiconductor substrate, each PA is configured to drive the characteristic load impedance of the components downstream approximately along independent frequency band signal path.Often It is more than one that being smaller in size than of individual PA is configured to drive in frequency band associated plurality of with multiple PA Broadband p A of frequency band.Described wireless device also includes the antenna communicated with described FEM, described antenna It is configured to launch the RF signal after amplifying.

In some embodiments, the application relates to a kind of method processing radio frequency (RF) signal.Described Method includes with a described RF signal of amplification selected in multiple power amplifiers (PA), described choosing Fixed PA drives the characteristic load impedance of the components downstream approximately along independent frequency band signal path.Described Being smaller in size than of selected PA is configured to drive being more than in frequency band associated plurality of with multiple PA Broadband p A of one frequency band.Described method also includes that the RF signal after amplifying is routed to described downstream Parts.

In certain embodiments, described components downstream can include output filter.Amplify described RF signal Can include powering to described selected PA with high voltage (HV).

Instructing according to some, the application relates to a kind of method manufacturing power amplifier wafer.Described method Including being formed or providing Semiconductor substrate, and implement multiple independent frequency band signal path.Described method Being additionally included in described Semiconductor substrate and form multiple power amplifier (PA), each PA is configured to drive The characteristic load impedance of the dynamic components downstream approximately along corresponding independent frequency band signal path.Each PA Be smaller in size than and be configured to drive and the more than one frequency band in multiple PA associated plurality of frequency band Broadband p A.

For general introduction the application purpose, be described herein certain aspects of the invention, advantage and Novel feature.It should be understood that according to any specific embodiment of the present invention, it is not necessary to realize all this A little advantages.Therefore, it is possible to according to realizing or optimizing such as an advantage here instructing or one group of advantage Mode is practiced or carried out the present invention, as excellent in other here can instructed or advise without realizing Point.

Accompanying drawing explanation

Fig. 1 illustrates wireless system or the framework with amplification system.

Fig. 2 illustrates that the amplification system of Fig. 1 can include having penetrating of one or more power amplifier (PA) Frequently (RF) amplifier block (assembly).

Fig. 3 A-3E illustrates how to configure the non-limiting example of each PA of Fig. 2.

Fig. 4 illustrates in certain embodiments, and the amplification system of Fig. 2 can be embodied as high voltage (HV) merit Rate amplification system.

Fig. 5 illustrates in certain embodiments, and the HV power amplifying system of Fig. 4 can be configured to average merit Rate follows the tracks of the operation of (APT) pattern.

Fig. 6 illustrates example envelope-tracking (ET) power amplifying system.

Fig. 7 illustrates the average merit of example high voltage (HV) with one or more feature described herein Rate follows the tracks of (APT) power amplifying system.

Fig. 8 illustrates the HV APT of the more specifically example of the HV APT power amplifying system that can be Fig. 7 Power amplifying system.

Fig. 9 illustrates with blood pressure lowering (Buck) ET configuration, blood pressure lowering APT configuration and boosting APT configuration behaviour Work rate amplifier, as the example efficiency curve diagram of function of output.

Figure 10 illustrates that the power amplifying system with one or more feature described herein can have and mark Collector efficiency that title situation is similar and power added efficiency (PAE) curve (profile).

Figure 11 illustrates that the power amplifying system with one or more feature described herein can have and mark The linearity performance that title situation is similar.

Figure 12 is shown as the exemplary graph of the power amplifier load electric current of the function of load voltage.

Figure 13 illustrates that the power amplifying system with one or more feature described herein can produce one Or the example of multiple favourable benefit.

Figure 14 illustrates that the power amplifying system with one or more feature described herein can produce one Or another example of multiple favourable benefit.

Figure 15 illustrates that the power amplifying system with one or more feature described herein can produce one Or the another example of multiple favourable benefit.

Figure 16 illustrates that the power amplifying system with one or more feature described herein can produce one Or another example of multiple favourable benefit.

Figure 17 illustrates the example voltages electric power system including boost converter and electric charge pump.

Figure 18 illustrates the more specifically example of the power voltage supply system of Figure 17.

Figure 19 illustrates the example of the electric charge pump of the electric charge pump that can be used as Figure 17.

Figure 20 illustrates the block diagram of the power amplification configuration with example controller, and described example controller has There are integrated power amplifier control parts and power control component.

Figure 21 illustrates have the block diagram including that the power amplification controlling the example controller of depositor configures.

Figure 22 illustrates how the power supply of Figure 21 can generate showing of various voltages for different operator schemes Example.

Figure 23 illustrates the block diagram of the power amplifying system including boost converter.

Figure 24 illustrates how to put by the removal of variable supply voltage or the substance from boost converter The example that pine colelctor electrode supply voltage limits.

Figure 25 illustrates in certain embodiments, has the HV APT of one or more feature described herein Some or all of power amplifying system may be implemented in module.

Figure 26 illustrates the example wireless device with one or more favorable characteristics described herein.

Detailed description of the invention

Subhead provided herein (if any) is merely to facilitate, and not necessarily affects required The scope of the invention of protection or implication.

Introduction

With reference to Fig. 1, one or more features of the application relate generally to have the wireless of amplification system 52 System or framework 50.In certain embodiments, amplification system 52 can be embodied as one or more device, Such a or multiple devices can be used in wireless system/framework 50.In certain embodiments, wireless System/framework 50 may be implemented in such as portable wireless device.The example of such wireless device describes In this.

Fig. 2 illustrates that the amplification system 52 of Fig. 1 can include having one or more power amplifier (PA) Radio frequency (RF) amplifier block 54.In the figure 2 example, three PA 60a-60c are shown as formation RF amplifier block 54.It will be appreciated that the PA of other quantity can also be implemented.It will also be understood that the application One or more features also may be implemented in the RF amplifier block with other kinds of RF amplifier In.

In certain embodiments, RF amplifier block 54 may be implemented in one or more semiconductor wafer (die), on, such wafer may be included in such as power amplifier module (PAM) or front-end module Etc (FEM) in package module.Such package module is generally configured to be arranged on and portable nothing On the circuit board that line apparatus is associated.

PA (such as 60a-60c) in amplification system 52 can typically be biased by bias system 56.Additionally, The supply voltage of PA can typically be provided by electric power system 58.In certain embodiments, bias system 56 With any one in electric power system 58 or both may be included in and there is the aforementioned envelope of RF amplifier block 54 In die-filling piece.

In certain embodiments, amplification system 52 can include matching network 62.Such matching network can It is configured to provide input coupling and/or output matching function to RF amplifier block 54.

In order to illustrate, it will be appreciated that each PA (60) of Fig. 2 can implement in many ways.Fig. 3 A-3E Illustrate how to configure the non-limiting example of such PA.Fig. 3 A illustrates have amplification transistor 64 Example PA, wherein input rf signal (RF_In) is provided to the base stage of transistor 64, after amplification RF signal (RF_Out) exported by the colelctor electrode of transistor 64.

Fig. 3 B illustrates example PA of multiple amplification transistors (such as 64a, 64b) with hierarchical arrangement. Input rf signal (RF_In) is shown as the base stage being provided to the first transistor 64a, from first crystal RF signal after the amplification of pipe 64a is exported by its colelctor electrode.Amplification from the first transistor 64a After RF signal be provided to the base stage of transistor seconds 64b, from the amplification of transistor seconds 64b After RF signal be shown as and exported by its colelctor electrode, thus produce output RF signal (RF_Out) of PA.

In certain embodiments, the aforementioned exemplary PA configuration of Fig. 3 B can be depicted as two shown in Fig. 3 C Level or more stages.First order 64a can be configured to such as driving stage, and second level 64b can be configured to the most defeated Go out level.

Fig. 3 D illustrates in certain embodiments, and PA can be configured to Doherty (Doherty) PA.So Doherty PA can include amplify transistor 64a, 64b, be configured to provide respectively input rf signal (RF_In) carrier wave amplifies and peak value amplifies to produce amplification output RF signal (RF_Out).Input RF signal can be separated into Carrier section and peak fractions by separator (splitter).Carrier wave after amplification and Peak signal can be combined to produce output RF signal by combiner (combiner).

Fig. 3 E illustrates in certain embodiments, and PA can implement with cascode (cascode) configuration. Input rf signal (RF_In) is provided to operation for common emitter (common emitter) device First amplification transistor 64a base stage.First output amplifying transistor 64a can pass through its colelctor electrode There is provided and may be provided to the second amplification transistor that operation is common base (common base) device The emitter stage of 64b.Second output amplifying transistor 64b can be provided by its colelctor electrode, thus produces Amplification output RF signal (RF_Out) of PA.

In the various examples of Fig. 3 A-3E, amplify transistor and be described as such as heterojunction bipolar transistor Etc (HBT) bipolar junction transistor (BJT).It will be appreciated that one or more features of the application are also May be implemented in other kinds of transistor such as field-effect transistor (FET) or use it to implement.

Fig. 4 illustrates in certain embodiments, and the amplification system 52 of Fig. 2 can be embodied as high voltage power and put Big system 100.Such system can include HV power amplifier component 54, and it is configured to include Or the HV amplifieroperation of whole PA (such as 60a-60c).As described herein, such PA Can biased system 56 bias.In certain embodiments, aforementioned HV amplifieroperation can be powered by HV System 58 is facilitated.In certain embodiments, interface system 72 can be implemented to provide HV power amplifier Assembly 54 and any one in bias system 56 and HV electric power system 58 or interface merit between the two Energy.

HV APT system associated exemplary

Many wireless devices of such as cellular handset etc are configured to support multiple frequency band, such Device is it is generally required to and/or be contaminated with multiple power amplifier architecture.But, this of power amplifier architecture Planting complexity (complexity) can cause emission effciency to increase with the number of frequency bands supported and decline.This The efficiency of sample decline be attributable to such as to combine multiple frequency band and maintain simultaneously competitive size and The loss that cost objective is caused increases.

In some radio frequencies (RF) are applied, portable launch scenario can include opening with blood pressure lowering (Buck) Close cell voltage (such as 3.8V) power amplifier (PA) that power supply combines.In such exemplary scenario In, maximum transmission power typically realizes at 3.8V cell voltage, and it is it is generally required to or use in PA 13:1 impedance transformer network is to support such as to be close to the peak power level of 1.5 watts.

In aforementioned exemplary, the improved efficiency at relatively low transmitting power level can by implement cell voltage with Under voltage at voltage dropping power supply supported.RF switch is used to select corresponding with expected frequency band Expect wave filter, Multiband-operation can be realized.Noting, voltage dropping power supply, impedance transformer network and RF open Some or all of the Central Shanxi Plain can have contribution to loss, which in turn reduces emission effciency.

Some wireless systems can include envelope-tracking (ET) feature, and it is implemented into during blood pressure lowering is powered to provide The system effectiveness increased.But, envelope-tracking can increase the cost that step-down switching is powered, and also can make System characterization and calibration process significantly complicate.

Described herein it is significantly reduced loss, maintains simultaneously or improve the competitive of size and/or cost The system of level, circuit, the example of apparatus and method.Fig. 5 illustrates in certain embodiments, Fig. 4's HV power amplifying system can be configured to follow the tracks of the operation of (APT) pattern with mean power.Showing at Fig. 5 In example, HV APT power amplifying system 100 can include power amplifier component 104, and it has configuration For amplifying one or more PA of one or more RF signals (RF_In).After this amplification one Or multiple RF signal can be routed to have by having the matching block 106 of one or more match circuit The duplexer assembly 108 of one or more duplexers.

Duplexer can allow launch (Tx) and receive the duplex that (Rx) operates.Such duplex operation Tx part is shown as the RF signal (RF_Out) after one or more amplification by from duplexer assembly 108 Export and launch for antenna (not shown).In the example of hgure 5, Rx part is not shown；But, Reception signal from antenna can be received and export such as low-noise amplifier by duplexer assembly 108 (LNA)。

Here various examples described in the context utilizing Tx and Rx of duplexer to operate, such double Multiplexer embodiment such as FDD (FDD) function.It will be appreciated that in certain embodiments, have one Individual or multiple feature described herein HV power amplifying system can also be implemented with other duplex configurations, bag Include such as time division duplex (TDD) configuration.

In the example of hgure 5, HV electric power system 102 is shown as provides one to power amplifier component 104 Individual or multiple HV power supply signals.Here will be described in further detail how such HV signal can provide The more specifically example of corresponding PA.

In certain embodiments, the HV APT power amplifying system 100 of Fig. 5 can be configured to APT Pattern operates and meets or exceed the performance that envelope-tracking (ET) embodiment is provided, and maintains simultaneously Or reduce cost and/or complexity.In certain embodiments, such HV APT power amplifying system can Utilize some PA of the most such as GaAs (GaAs) heterojunction bipolar transistor (HBT) PA etc High voltage capability.It will be appreciated that one or more features of the application can also use other kinds of PA Implement.Such as, utilization is bipolar with cmos device, the silicon of many cascode levels of LDMOS The amplification system of device and GaN/HEMT device may also benefit from the operation of high-voltage region.

This HV utilizing PA operates, and can eliminate one or more lossy portions from amplification system Part, and/or other favourable benefits can be realized.Such as, PA output matching network can be eliminated.At another In example, PA power supplying efficiency can increase.In another example, some passive components can be removed.This In be more fully described and aforementioned relevant example.

One or more wafer is may result in more to one or more in the HV relevant preceding feature of operation Little yardstick realizes, and thus allows the bigger motility of power amplifying system design.Such as, power amplification System can realize with greater number of less PA, thus allows to eliminate lossy parts, such as frequency band Switch.Here the example relevant to the elimination of this band switch it is more fully described.

In certain embodiments, the HV APT power amplifying system 100 of Fig. 5 can be configured to substantially eliminate Or reduce the complexity being associated with envelope-tracking characterization and/or calibration process.

In order to illustrate, it will be appreciated that high voltage (HV) can include than use in portable wireless device The higher magnitude of voltage of cell voltage.Such as, HV can be more than 3.7V or 4.2V.In some cases, HV can include more than the magnitude of voltage that operates of cell voltage and portable wireless device energy higher efficiency ground. In some cases, HV can include more than cell voltage and less than being associated with the PA of given type The magnitude of voltage of breakdown voltage.In the example context of GaAs HBT, such breakdown voltage is permissible Scope at 15V to 25V.Therefore, the HV of GaAs HBT PA can such as 3.7V to 25V, 4.2V the scope to 20V, 5V to 15V, 6V to 14V, 7V to 13V or 8V to 12V.

Fig. 6 and 7 illustrates envelope-tracking (ET) power amplifying system 110 (Fig. 6) and high voltage (HV) Mean power follows the tracks of the comparison between (APT) power amplifying system 100 (Fig. 7), with demonstration at HV How APT power amplifying system 100 can substantially eliminate some lossy parts.In order to compare, It will be assumed that each power amplifying system is configured to provide for the amplification of three frequency bands.It is to be understood, however, that it is permissible Use greater or lesser number of frequency band.

In the example of fig. 6, ET power amplifying system 110 is shown as and includes power amplifier component 114, It has can provide, for three frequency bands, the broadband amplification path 130 amplified.Amplification path 130 can Receiving input rf signal by public input node 126, such RF signal can pass through such as DC Isolation (DC-blocking) electric capacity 128 is routed to one or more amplifier stage.Amplifier stage can include such as Driving stage 132 and output stage 134.In certain embodiments, amplifier stage 132,134 can include such as HBT or CMOS amplifies transistor.

In the example of fig. 6, the colelctor electrode of output stage 134 is shown as and is provided with from envelope-tracking (ET) The supply voltage VCC by choke induction 124 of manipulator 122.ET manipulator 122 is shown as ET A part for modulating system 112.The supply voltage VCC provided by such ET manipulator is typically with dynamic State mode determines, and can have the value in the most about 1V to 3V scope.ET manipulator 122 shows For generating such dynamic VCC voltage based on cell voltage Vbatt.

When amplification path 130 operates in the foregoing manner, relatively low (the most about 3 to 5 Europe of its impedance Z Nurse)；Therefore it is generally required to carry out the impedance that impedance transformation is associated with components downstream with coupling.At Fig. 6 Example in, the band switch 138 of output receiving amplification path 130 (is shown as band switch system The part of 118) it is generally configured to 50 ohm load.Therefore it is presumed that be given by amplification path 130 Impedance (Z) is of about 4 ohm, needs to implement the impedance transformation of about 13:1 (50:4).Fig. 6's In example, such impedance transformation is shown as to be implemented by output matching network (OMN) 136, output Matching network 136 is shown as a part for load change system 116.

In the example of fig. 6, band switch 138 is shown as that to have output from amplification path 130 (logical Cross OMN 136) single input and three outputs corresponding with three example frequency bands.Show pin Three duplexer 142a-142c are provided to such three frequency bands.

Each being shown as in three duplexer 142a-142c includes that (such as band leads to TX and RX wave filter Wave filter).Each TX wave filter is shown as after being couple to the band switch 138 amplification with reception correspondence And switch the RF signal of route for transmitting.Such RF signal is shown as and is filtered and route To antenna port (ANT) (144a, 144b or 144c).Each RX wave filter be shown as reception from The RX signal of corresponding antenna port (ANT) (144a, 144b or 144c).Such RX believes Number it is shown as and to be filtered and to be routed to RX parts (such as LNA) for processing further.

It typically would be desirable to given duplexer be in upstream (in the case of TX) or downstream (RX In the case of) parts between provide impedance matching.In the example of fig. 6, the TX for duplexer filters Ripple device, band switch 138 is such upstream components.Therefore, match circuit 140a-140c (is shown as If being the stem portion of such as PI network 120) it is shown as the output being implemented in band switch 138 with corresponding Between duplexer 142a-142c.In certain embodiments, each this match circuit 140a-140c can It is embodied as such as pi (π) match circuit.

Table 1 lists the insertion loss of the various parts of the ET power amplifying system 110 of Fig. 6 and efficiency Example value.It will be appreciated that listed various values are approximations.As it can be seen from table 1 the ET merit of Fig. 6 Rate amplification system 110 includes many loss contributors.Even if each parts of system 110 be assumed to Its efficiency upper limit operates, the aggregate efficiency of ET power amplifying system 110 be about 31% (0.83 × 0.75 × 0.89×0.93×0.93×0.63)。

Table 1

Parts	Insertion loss	Efficiency
			ET manipulator (112)	N/A	83%
Power amplifier component (114)	N/A	70% to 75% (PAE)
			Load change (116)	0.5dB to 0.7dB	85% to 89%
Band switch (118)	0.3dB to 0.5dB	89% to 93%
			PI(120)	0.3dB	93%
Duplexer (122)	2.0dB	63%

In the example in figure 7, HV APT power amplifying system 100 is shown configured to provide identical three The amplification of frequency band, as in the example ET power amplifying system 110 of Fig. 6.At power amplifier In assembly 104, three single amplification paths can be implemented so that each amplification path provides corresponding to it The amplification of frequency band.Such as, the first amplification path is shown as and includes PA 168a, and it receives from input joint The RF signal by DC isolation capacitance 164a of some 162a.RF after the amplification of PA 168a Signal is shown as and is routed to components downstream by electric capacity 170a.Similarly, the second amplification path is shown as bag Including PA 168b, it receives the RF signal by DC isolation capacitance 164b from input node 162b. It is shown as from the RF signal after the amplification of PA 168b and is routed to components downstream by electric capacity 170b.Class As, the 3rd amplification path is shown as and includes PA 168c, and it receives passing through from input node 162c The RF signal of DC isolation capacitance 164c.It is shown as from the RF signal after the amplification of PA 168c and passes through Electric capacity 170c is routed to components downstream.

In certain embodiments, some or all PA 168a-168c can include such as HBT PA.Will reason Solving, one or more features of the application can also be implemented with other kinds of PA.For example, it is possible to it is sharp Mate with components downstream or close impedance (is such as operated by HV and/or passes through with operating to produce Other operating parameters) PA produce in benefit described herein one or more.

In the example in figure 7, each PA (168a, 168b or 168c) is shown as and is provided with from liter The supply voltage by choke induction (166a, 166b or 166c) of pressure DC/DC transducer 160 VCC.Boosting DC/DC transducer 160 is shown as a part for HV system 102.Boosting DC/DC Transducer 160 can be configured to supply this VCC magnitude of voltage including HV scope described herein or value Scope (e.g., from about 1V to 10V).Boosting DC/DC transducer 160 is shown as based on cell voltage Vbatt Generate such high VCC voltage.

Describe the additional detail relevant to aforementioned boosting DC/DC transducer referring herein to Figure 17-24 and show Example.The one or more features being associated with such boosting DC/DC transducer can be used as this In the part of electric power system of HV system (in such as Fig. 7 102) that describes.Such power supply System may also include other power supply parts for generating such as low-voltage (such as below cell voltage) With the voltage of battery levels, apply for various PA.In certain embodiments, with reference to Figure 17-24 Some or all in the various power supply parts described, individually or with any combination, can be included in tool Have in the HV power amplifying system of one or more feature described herein.

As described herein, by various performance improvement can be realized by high voltage operation PA.Also As described herein, this high voltage operation of PA can be supported by boost converter.? In some embodiments, the use of this boost converter can provide additional expected performance to improve.Boosting The transducer this use in power amplifying system and how can control this boost converter Example is described also referring to Figure 17-24.

When PA 168a-168c operates in the foregoing manner with high VCC voltage (the most about 10V), The impedance Z of each PA is higher (the most about 40 ohm to 50 ohm), therefore need not impedance transformation Mate the impedance being associated with components downstream.In the example in figure 7, reception correspondence PA (168a, 168b or 168c) each duplexer 174a-174c of output (if being shown as duplexer assembly 108 Stem portion) it is generally configured to 50 ohm load.Therefore it is presumed that by PA (168a, 168b or 168c) The impedance (Z) be given is of about 50 ohm, then (load in such as Fig. 6 becomes to need not impedance transformation Change system 116).

It typically would be desirable to given duplexer be in upstream (in the case of TX) or downstream (RX In the case of) parts between provide impedance matching.In the example in figure 7, for duplexer (174a, 174b or 174c) TX wave filter, PA (168a, 168b or 168c) is such upstream components. Therefore, match circuit 172a-172c (if being shown as the stem portion of such as PI network 106) may be implemented in Between output and the corresponding duplexer 174a-174c of corresponding PA 168a-168c.In some embodiments In, each this match circuit 172a-172c can be embodied as such as pi match circuit.

In the example in figure 7, PA 168a-168c HV operation may result in each PA 168a-168c in Now similar with the impedance of corresponding duplexer impedance Z.Because need not impedance in such an arrangement become Change, so need not impedance transformer (in Fig. 6 116).

It shall yet further be noted that PA 168a-168c operation at more high impedance is low in may result in PA 168a-168c Levels of current much.Such much lower levels of current can allow PA 168a-168c to be substantially reduced Wafer size implement.

In certain embodiments, preceding feature (elimination of impedance transformer and the PA wafer size of reduction) In any one or both additional flexibility of power amplification architecture design can be provided.Such as, preceding feature The space provided and/or cost savings can allow for less PA (168a, 168b in Fig. 7 or 168c) for each frequency band, thus remove band switch system (in such as Fig. 6 118) Needs.Correspondingly, when compared with the ET power amplifying system 110 of Fig. 6, with the HV of Fig. 7 Size, cost and/or complexity that APT power amplifying system 100 is associated can be maintained or reduced, It is substantially reduced the overall loss of power amplifying system 100 simultaneously.

Insertion loss and the effect of the various parts of the HV APT power amplifying system 100 of Fig. 7 listed by table 2 The example value of rate.It will be appreciated that listed various values are approximations.

Table 2

Parts	Insertion loss	Efficiency
			HV(102)	N/A	93%
Power amplifier assembly (104)	N/A	80% to 82% (PAE)
			PI(106)	0.3dB	93%
Duplexer (108)	2.0dB	63%

From table 2 it can be seen that the HV APT power amplifying system 100 of Fig. 7 includes multiple loss contribution Person.But, when compared with the ET power amplifying system 110 and table 1 of Fig. 6, at the HV of Fig. 7 In APT power amplifying system 100 without two important loss contributors (load change (116) and Band switch (118)).Elimination to this loss contributor is shown as in the example and table 2 of Fig. 7 Transmission path eliminates about 1dB.

Referring also to table 2, if it is assumed that each parts of system 100 operate (such as table 1 with its efficiency upper limit Example in like that), the aggregate efficiency of HV APT power amplifying system 100 is of about 45% (0.93 × 0.82 ×0.93×0.63).Even if assuming that each parts are with its efficiency lower limit of operation, HV APT power amplification system The aggregate efficiency of system 100 is also of about 44% (0.93 × 0.80 × 0.93 × 0.63).It can be seen that it is in office In one situation, the aggregate efficiency of the HV APT power amplifying system 100 of Fig. 7 is significantly higher than the ET of Fig. 6 The aggregate efficiency (about 31%) of power amplifying system 110.

With reference to Fig. 6 and 7, it may be noted that multiple features.It should be noted that DC/DC boost converter (Fig. 7 In 160) use can allow to eliminate other power one or more that can use in PA system and turn Parallel operation.Such as, when operation is for producing HV supply voltage (such as 10V DC), there is no harmonic wave 1 watt ((10V) can be produced in the case of terminal (harmonic termination)²/ (2 × 50 Ω)) RF power.

It shall yet further be noted that the PA (such as Fig. 7) being driven to 50 ohm load causes ratio to be driven to 3 ohm Every ohmic loss that the PA (such as Fig. 6) of load is the lowest.Such as, when with 3 ohmic drive PA Time, the equivalent series resistance (ESR) of 0.1 ohm has an insertion loss of about 0.14dB, and for The PA of 50 ohmic drive, the ESR of 0.1 ohm have the insertion loss of about 0.008dB.Therefore, 3 The PA of ohm can have the total insertion loss (0.14dB × 30) of about 4.2dB, and the PA of 50 ohm can Having the total insertion loss (0.008dB × 500) of about 4.0dB, it is total still less than the PA's of 3 ohm Insertion loss.

It shall yet further be noted that 50 ohm of PA can have the gain more significantly higher for PA than 3 ohm.Such as, increase Benefit can be approximately G_M×R_LL；If for two kinds of situations G_MClose, then the much higher value of 50 ohm is produced Raw higher gain.

Fig. 8 illustrates the HV of the more specifically example of the HV APT power amplifying system 100 that can be Fig. 7 APT power amplifying system 100.In the example of fig. 8, power amplifier component can include low-frequency band (LB) Power amplifier component 190, midband (MB) power amplifier component 200 and high frequency band (HB) Power amplifier component 210, some or all PA in these assemblies can be with high voltage described herein Operation.Power amplifier component may also include not other PA with high voltage operation.Such as, 2G power Amplifier block 220 and power amplifier component 230,232 can be with low voltage operatings.

In the example of fig. 8, aforementioned high voltage can be from such as front-end power management integrated circuit (FE-PMIC) 160 are supplied to LB, MB and HB power amplifier component 190,200,210.In some embodiments In, this FE-PMIC can include DC/DC boost converter described herein (the 160 of such as Fig. 7).

FE-PMIC 160 can receive cell voltage Vbatt and generate high voltage output 182 as LB, The supply voltage (VCC) of MB and HB power amplifier component 190,200,210.Implement at some In example, such high voltage VCC can have the value of substantially 10V, along with the maximum of substantially 250mA Electric current.It will be appreciated that other values of this high voltage VCC and/or maximum current can also be used.

FE-PMIC 160 also can generate other output.Such as, output 184 can to LB, MB and PA that HB power amplifier component 190,200,210 is associated and to 2G power amplifier component 220 provide bias voltage signal.In certain embodiments, such bias voltage signal may have about the value of 4V, Maximum current along with about 50mA.It will be appreciated that this bias voltage signal and/or maximum can also be used Other values of electric current.

In the example of fig. 8, FE-PMIC 160 can be the HV system 102 described referring herein to Fig. 7 A part.FE-PMIC 160 can include one or more interface node 180.Such interface node Can be used for carrying out the control such as to FE-PMIC 160.

In the example of fig. 8, the supply voltage VCC for 2G power amplifier component 220 be shown as by Basic directly from cell voltage Vbatt offer (such as line 186).This Vbatt be also shown as provide for Operation with the various switches that LB, MB and HB power amplifier component 190,200,210 is associated Voltage.In certain embodiments, this Vbatt can have the value in moon 2.5V to 4.5V scope.Will Understand, it is also possible to use other values of this Vbatt.

In the example of fig. 8, the supply voltage VCC for power amplifier component 230,232 can be from DC/DC switching regulator (regulator) 234 provides.

With reference to Fig. 8, LB power amplifier component 190 be shown as include for eight example frequency band B27, The independent PA of B28A, B28B, B20, B8, B26, B17 and B13.Each PA is shown as it RF signal after amplification is supplied to the duplexer of correspondence.As described herein, these eight PA can It is couple to they corresponding duplexers and centre does not has band selection switches.

LB power amplifier component 190 is also shown as including and/or be couple to input switch 192 and output is opened Close 196.Input switch 192 is shown as and includes two input nodes 194a, 194b and corresponding with eight PA Eight output nodes.In input switch 192, two input nodes 194a, 194b are shown as and can cut Changing to common node, this common node is couple to for being switched to another of one of eight output nodes public Node.This coupling between these common nodes can include amplifier element.

Output switch 196 is shown as and includes eight input nodes corresponding with eight duplexers and two outputs Node 198a, 198b.Output switch 196 may also include for receiving 2G power amplifier component 220 Output and the input of output of power amplifier component 230.

It will be appreciated that LB power amplifier component 190 can include the various combination of frequency band.

With reference to Fig. 8, MB power amplifier component 200 be shown as include for four example frequency band B1, The independent PA of B25, B3 and B4.Each PA is shown as the RF signal after being amplified and is supplied to correspondence Duplexer.As described herein, these four PA can be couple to they corresponding duplexers and in Between there is no band selection switches.

MB power amplifier component 200 is also shown as including and/or be couple to input switch 202 and output is opened Close 206.Input switch 202 is shown as and includes input node 204 and export with four corresponding for PA four Node.In input switch 202, input node 204 is shown as and is couple to for being switched to four output joints The common node of one of point.Coupling between this node can include amplifier element.

Output switch 206 is shown as and includes four input nodes corresponding with four duplexers and output node 208.Output switch 206 may also include the input of the output for receiving 2G power amplifier component 220.

It will be appreciated that MB power amplifier component 200 can include the various combination of frequency band.

Be shown as with reference to Fig. 8, HB power amplifier component 210 include for two example frequency band B7 and The independent PA of B20.Each PA is shown as the RF signal after being amplified and is supplied to the duplexer of correspondence. As described herein, the two PA can be couple to they corresponding duplexers and centre does not has frequency band Select switch.

HB power amplifier component 210 is also shown as including and/or be couple to input switch 212 and output is opened Close 216.Input switch 212 is shown as and includes input node 214 and export with two corresponding for PA two Node.In input switch 212, input node 214 is shown as and is couple to for being switched to two output joints The common node of one of point.Coupling between this node can include amplifier element.

Output switch 216 is shown as and includes two input nodes corresponding with two duplexers and output node 218.Output switch 216 may also include the input of the output for receiving power amplifier component 232.

It will be appreciated that HB power amplifier component 210 can include the various combination of frequency band.

In the example of fig. 8, the PA of LB, MB and HB power amplifier component 190,200,210 One or more wafer can be embodied as.Such as, these PA may be implemented in single HBT (such as GaAs) On wafer, corresponding with LB, MB and HB power amplifier component 190,200,210 independent On HBT wafer, or its certain combination.

In the example of fig. 8, each can be configured in input switch 192,202,212 provides here The handoff functionality described, and implement bias function described herein.In certain embodiments, switch 192, 196,202,206,212,216 may be implemented on the most single silicon-on-insulator (SOI) wafer, Be on the independent wafer that various function group is corresponding, or its certain combination.

Fig. 9 illustrates with 78% blood pressure lowering ET, 97% blood pressure lowering APT and 87% boosting APT configuration behaviour's work Rate amplifier, as the example efficiency curve diagram of function of output.It should be noted that for up to The output of 15dBm, all three example arrangement produces similar efficient efficiency curve.Exceed so Output level, it can be seen that 87% boosting APT configuration has than 97% blood pressure lowering APT and 78% blood pressure lowering The efficiency value that ET configuration is the most significantly higher.Such boosting APT configuration may be implemented in Fig. 7 and 8 Example HV APT power amplifying system in any one or both in.

Figure 10 illustrates power amplifying system (the such as Fig. 8 with one or more features described herein HV APT power amplifying system 100) can have the collector efficiency similar with nominal case and power Added efficiency (PAE) curve.Such as, the collection being associated with the HV APT power amplifying system of Fig. 8 Electrode efficiency curve chart is shown as has the song essentially identical with the curve chart of corresponding nominal collector efficiency Line.The PAE curve chart that similarly, is associated with the HV APT power amplifying system of Fig. 8 (as The function of output) it is shown as there is the curve essentially identical with the curve chart of corresponding nominal PAE.

Figure 11 illustrates power amplifying system (the such as Fig. 8 with one or more features described herein HA APT power amplifying system 100) can have the linearity performance similar with nominal case (such as Adjacent channel leakage ratio (ACLR)).Such as, it is associated with the HV APT power amplifying system of Fig. 8 ACLR curve chart (as the function of output) be shown as (the highest at higher output power value In 29dBm) there is the curve essentially identical with the curve chart of corresponding nominal ACLR.

Figure 12 illustrates that the conduct of the power amplifier configuration being designated as " R99 " and " 50RB LTE " is born Carry the exemplary graph of the power amplifier load electric current of the function of voltage.Assume the reduced-current of 40mA Condition is desired for power amplifier configuration.Such as, this electric current of 40mA can be by from power supply Electric current (load current of Figure 12) deduction fixed-bias transistor circuit electric current and quiescent current (quiescent current) And obtain.For the 50RB LTE example in Figure 12, the load current of about 104mA can produce and be used for Such low current (40mA) condition of this power amplifier configuration.This load current of 104mA Corresponding to the load voltage (VCC) of about 9.5V, as indicated by point 250.It can therefore be seen that this In describe high voltage power amplifier operations condition can produce the reduced-current bar for power amplifier Part.

The example of favorable characteristics

Figure 13-16 is shown in the HV APT power amplification system with one or more feature described herein The example of obtainable favourable benefit in system.As described herein, Figure 13 is shown in some enforcements In example, power amplifying system 100 can include radio frequency (RF) letter being configured to receive at input node 260 The power amplifier (PA) of number (RF_in).Such PA can be provided that supply voltage Vcc, this The supply voltage of sample can include high voltage described herein (HV) value.RF signal after amplification can conduct RF_out exports, and is routed to wave filter, and wave filter is configured to the RF signal after regulation is amplified also And produce the filtering signal at output node 262.It is near that PA is operable as (such as in HV pattern) Drive like the characteristic load impedance with wave filter.This characteristic load impedance of wave filter can be the biggest About 50 ohm.

In certain embodiments, during aforementioned arrangements may be implemented in mean power tracking (APT) PA system To produce one or more favorable characteristics.Such as, the power supply configuration of more low-complexity can be realized, reduce and damage Consumption and the efficiency improved.In another example, aforementioned PA, there is aforementioned power amplification system 100 Wafer and/or there is the module of aforementioned power amplification system 100 can be embodied as subtracting undersized device. In certain embodiments, the output matching network of PA in power amplifying system it is at least partially attributed to (OMN) some or all of elimination, can realize this subtracting undersized device.

Figure 14 illustrates the example of power amplifying system 100, wherein substantially eliminates between PA and wave filter The output matching network being associated with PA (OMN) (also referred to as impedance inverter circuit).At figure In the example of 14, PA, its supply voltage Vcc and wave filter are configurable and operation is the example with Figure 13 Similar.This PA configuration can include HV operator scheme described herein.

In the example in figure 14, some or all of power amplifying system 100 may be implemented in such as PA crystalline substance On the device 270 of sheet or PA module etc.By the aforementioned elimination to OMN, with device 270 phase The yardstick (such as d1 × d2) of association can be reduced.Additionally, such as reduce loss and improve efficiency it Other favorable characteristics of class can realize with the elimination of OMN.

Figure 15 illustrates the example of the power amplifying system 100 of the RF signal being configured to process multiple frequency band. Such frequency band can be such as frequency band A and frequency band B.It will be appreciated that for power amplifying system 100, The frequency band of other quantity can be implemented.

In the example of fig. 15, each frequency band is shown as and has independent amplification path associated with it.Often In individual amplification path, its PA, supply voltage Vcc and wave filter be configurable and operation for the showing of Figure 14 Example is similar to.This PA configuration can include HV operator scheme described herein.

In the example of fig. 15, each frequency band with himself special amplification path can allow to eliminate frequency Tape-select switch.Therefore, there is the some or all of device 270 of power amplifying system 100 (such as PA wafer or PA module) can have the yardstick (such as d3 × d4) of reduction.Additionally, utilize frequency band to select Select the elimination of switch, it is also possible to realize such as reducing loss and improving other favorable characteristics of efficiency etc.

Figure 16 illustrates the power of the RF signal that be configured to process multiple frequency band similar with the example of Figure 15 The example of amplification system 100.In the example of Figure 16, similar with the example of Figure 14, multiple amplification paths Some or all in footpath each can there is no output matching network (OMN) (also referred to as Impedance inverter circuit).Therefore, the some or all of device 270 with power amplifying system 100 is (all Such as PA wafer or PA module) can have the yardstick (such as d5 × d6) of reduction.Additionally, utilize frequency band Select switch and the elimination of some or all OMN, it is also possible to realize such as reducing loss and improving effect Other favorable characteristics of rate etc.

In the example of Figure 15 and 16, it implements the device 270 of its corresponding power amplifying system 100 It can be the power amplifier wafer such as with Semiconductor substrate.Multiple PA can be the most parallel Implementing on a semiconductor substrate, each PA can be configured to drive independent narrow frequency band signals path.Therefore, The size of each PA be smaller than driving in frequency band associated plurality of with multiple PA more than one Individual broadband p A.As described herein, single band PA using this miniaturization can produce many Individual desired character.

The example relevant to the power supply of power amplifying system

In certain embodiments, including the one or more example arrangement being associated with Fig. 7-9 and 13-16 In, boosting DC/DC transducer may be embodied as a part for electric power system, and described electric power system is permissible For providing the high voltage (HV) of the operation for one or more power amplifiers (PA).With reference to figure 17-24 describes the example relevant to this electric power system.

Figure 17 illustrates the power voltage supply system 500 including boost converter and electric charge pump.Power voltage supply system Can include power supply device 502 (such as wafer (die) or module), it has reception input voltage (Vbatt) Input node 591 and the output node 592 of output voltage (Vcc) is provided.Input node can be via First capacitor 531 is coupled to ground voltage, and the first capacitor 531 shunts in (shunt) input voltage Change (variation).Output node 592 can be coupled to ground voltage via the second capacitor 532, and second Capacitor 532 shunts the change in output voltage, and realizes the capacitor of boost converter.

Power supply device 502 can include two switching nodes 593a, 593b, and it couples via inducer 521 To input voltage.Inducer 521 may be embodied as the inducer of boost converter.Power supply device 502 can Including two electric charges pump node 594a, 594b, it is coupled together via the 3rd capacitor 532, and the 3rd Capacitor 532 can be embodied as the capacitor of electric charge pump.

Power supply device 502 can include step-up converter circuit system 504, and it is controlled being more than to generate (boost function) or the output voltage equal to (bypass (bypass) function) input voltage.Output electricity Pressure can be supplied to such as high voltage (HV) power amplifier (PA) as supply voltage.Such HV PA can include that such as HV mean power follows the tracks of (APT) PA.Power voltage supply system 500 can include There is step-up converter circuit system 504, inducer 521 and the boost converter of the second capacitor 532.

Power supply device 502 may also include charge pump circuit system 508, and it is controlled to generate less than defeated Enter the output voltage of voltage.Charge pump circuit system 508 can be configured to generate low-voltage (LV) output, It is shown as and is supplied to output node 592 by bypass circuit 510.

In certain embodiments, charge pump circuit system 508 can with the 3rd capacitor 533 (such as, Fly across (flying) electric capacity) operate together to generate desired output, it can be more than input voltage (example The twice of input voltage in this way) or less than input voltage (the e.g. half of input voltage).Can be used as The example electric charge pump of electric charge pump 508 will be described with reference to Figure 19.

Figure 18 illustrates the power voltage supply system 600 including multiple switch 611-613.Power voltage supply system 600 Can include power supply device 602 (such as wafer or module), it has reception input voltage (Vbatt) Input node 691 and the output node 692 of offer output voltage (Vcc).Input node 691 can be through Being coupled to ground by the first capacitor 631, the first capacitor 631 shunts the change in input voltage.Output Node 692 can be coupled to ground via the second capacitor 632, and the second capacitor 632 shunts in output voltage Change, and realize the capacitor of boost converter.

Power supply device 602 can include two switching nodes 693a, 693b, and it couples via inducer 621 To input voltage.Inducer 621 may be embodied as the inducer of boost converter.Boost converter also may be used Including the step-up converter circuit system 604 occupy on power supply device 602, it includes that being coupled in first opens Between articulare 693a and ground first switchs 611 and is coupled in second switch node 693b and output Second switch 612 between node 692.

First switch 611 and second switch 612 can be controlled (such as being controlled by controller 601) with In the energy that accumulation and transfer are associated with inducer 621 and capacitor 632, thus generate output node Output voltage at 692, it is more than the input voltage at input node 691.Therefore, controller 601 Can be configured to periodically to operate switch 611,612 to promote input voltage, thus produce output node Output voltage at 692.

First switch 611 and second switch 612 can also is that controlled (such as being controlled) by controller 601 With by disconnecting the first switch 611 and closing second switch 612 and provide bypass functionality so that output Output voltage at node 692 is approximately equal to the input voltage at input node 691.Therefore, controller 601 can be configured to operation switch 611-612 so that input voltage is delivered to output node as output voltage.

In some embodiments, power supply device 602 can include and step-up converter circuit system 604 points The bypass circuit (not shown) opened is to be delivered to output node input voltage as output voltage.Such as In certain embodiments, the first switch 611 and second switch 612 can be embodied as with higher switching loss State (while performing boost function) is changed hastily for cost.Therefore, power supply device 602 Can include that there is the side switching (being coupled in series between input node 691 and output node 692) more slowly Road circuit, it will not change state compared with second switch 612 hastily, but have lower switch Loss.

Power supply device 602 can include two electric charges pump node 694a, 694b, and it is via the 3rd capacitor 632 are coupled together, and the 3rd capacitor 632 realizes the capacitor of electric charge pump.Power supply device 602 can wrap Including charge pump circuit system 608, it is that controlled (such as being controlled by controller 601) is defeated to generate ratio Enter the output voltage that voltage is lower.In certain embodiments, charge pump circuit system 608 can be with the 3rd electricity Container 633 (such as striding capacitance) operates to generate desired output together, and it can e.g. input The twice of voltage, or the half of input voltage.The output of charge pump circuit system 608 can be by side Road circuit 610 provides to output node 692, and bypass circuit 610 includes can being controlled by controller 601 3rd switch 613.

Power supply device 602 can include that one or more control node 695 is for receiving one or more controls Signal processed.Controlling node 695 and can be couple to controller 601, controller 601 can receive and processing controls Signal.Therefore, power voltage supply system 600 can include that controlled (such as being controlled by controller 601) rises Pressure converter is to receive the input voltage at input node 691, and is more than (boosting merit at output voltage Can) or equal to generating output voltage during (bypass functionality) input voltage.Boost converter can include occuping Boost control circuit system 604 on power supply device 602 and one outside power supply device 602 or many Individual passive device (such as inducer 621 and the second capacitor 632).Power voltage supply system 600 can include Controlled (such as being controlled by controller 601) electric charge pump with receive input node 691 input voltage, And output voltage is generated when output voltage is less than input voltage.Electric charge pump can include occuping power supply device Charge pump circuit system 608 on 602 and the one or more passive devices outside power supply device 602 (the such as the 3rd capacitor 633).Power voltage supply system 600 can include controller 601, and it is configured to connect Receive control signal (such as via controlling node 695) and control boost converter or electric charge pump with based on control Signal processed generates the desired output voltage at output node 692.

In some embodiments, control signal may indicate that operator scheme.Control signal can be with multiple side Formula instruction operator scheme.In some embodiments, control signal can directly indicate one of various modes. In some embodiments, control signal may indicate that the target output corresponding with one of various modes. In some embodiments, control signal may indicate that the target supply voltage corresponding with one of various modes.

In response to instruction first mode (such as low voltage mode, decompression mode or voltage reduce pattern) Control signal, controller 601 can be configured to control electric charge pump (such as charge pump circuit system 608 or electricity One or more switches of lotus pump circuitry 608) to generate the output voltage less than input voltage.? In some embodiments, controller 601 can be configured to control electric charge pump and is about input voltage to generate The output voltage of half.In some embodiments, when control signal indicates described first mode, control Device 601 processed can be configured to control described electric charge pump bypass circuit 610 so that (output voltage is come self charge pump Output) it is transferred to output node 692.Such as, controller 601 can be configured in response to indicating the first mould The control signal of formula and connect the 3rd switch 613.

In response to indicate the second pattern (such as in voltage mode, bypass mode or etc. voltage mode) control Signal processed, controller 601 can be configured to control boost converter and is approximately equal to the defeated of input voltage to generate Go out voltage.In some embodiments, controller 601 can be configured to operate one of boost converter or Multiple switches are to be delivered to output node 692 by input voltage as output end voltage.Such as, controller 601 can be configured to disconnect the first switch 611 and connect second switch 612 using by input voltage as defeated Go out voltage and be delivered to output node 692.

As it has been described above, in some embodiments, power supply device 602 can include and step-up converter circuit System 604 separate bypass circuit (not shown).Therefore, in some embodiments, in response to finger Show that the control signal of the second pattern, controller 601 can be configured to control bypass circuit to be made by input voltage It is transferred to output node 692 for output voltage.

In response to instruction the 3rd pattern (such as high voltage mode, boost mode or voltage increase pattern) Control signal, controller can be configured to control boost converter to generate the output voltage more than input voltage. In addition to instruction the 3rd pattern, control signal may further indicate that target output voltage.Controller 601 is controlled Boost converter processed is to promote input voltage, thus obtains target output voltage.In some embodiments, Controller 601 can be configured to the one or more switches periodically operating boost converter to promote input Voltage thus produce the output voltage at output node 692.Such as, controller 601 can be configured to the cycle Property ground off and on first switch 611 and second switch 612 with promote input voltage thus produce output Output voltage at node 692.

As it has been described above, boost converter can include inducer 621 and one or more switch (such as coupling First be connected between inducer 621 and ground voltage switchs 611 and is coupled in inducer 621 and output Second switch 612 between node 692).In some embodiments, boost converter does not includes coupling Switch between inducer 621 and input node 691.Especially, power voltage supply system 600 is not wrapped Include the switch being coupled between inducer 621 and input node 691.

Electric charge pump can include one or more capacitor (the such as the 3rd capacitor 633).Electric charge pump also can wrap Include one or more switch (the such as switch of charge pump circuit system 608).But some embodiment party In formula, electric charge pump does not include inducer.

Table 3 includes the first switch 611 (S1), second switch in response to the control signal indicating a pattern The state table of 612 (S2) and the 3rd switch 613 (S3).Especially, in response to instruction first mode The control signal of (such as low voltage mode), the first switch 611 and second switch 612 can end (example As disconnected), the 3rd switch 613 can turn on (such as Guan Bi).In response to indicating the second pattern (in such as Voltage mode) control signal, the first switch 611 and the 3rd switch 613 can end, second switch 612 Can turn on.In response to the control signal of instruction the 3rd pattern (such as high voltage mode), the 3rd switch 613 Can end, the first switch 611 and second switch 612 can operate with switch mode.

Table 3

Pattern	S1	S2	S3
				Ground voltage (electric charge pump)	Cut-off	Cut-off	Conducting
Middle voltage (bypasses)	Cut-off	Conducting	Cut-off
				High voltage (boost converter)	Switch mode	Switch mode	Cut-off

Figure 19 illustrates that configurable and operation is offer times voltage (voltage-doubling) and half voltage (voltage-halving) example of the charge pump circuit system 700 of both functions.Although doubling and subtracting Various examples described in the context of half, it will be understood that, the voltage increase and decrease factor can not be 2.

With reference to Figure 19, charge pump circuit system 700 can be configured to receive input voltage V_in(such as battery Voltage V_batt), and generate a times voltage output (2 × V_in) and half voltage output (V_in/2).Particularly Ground, input voltage V_inBeing shown as providing input node 702, input node 702 is by the first switch S1 is couple to node 704.Second switch S2 is shown as and input node 702 is coupled by second switch S2 To node 706.Node 704 and 706 is shown as by flying capacitor (C_Fly) couple.Node 706 It is shown as and is coupled to ground by the 3rd switch S3.

Referring still to Figure 19, node 704 is shown as and is couple to the first output node 708 by the 4th switch S4, And it is couple to the second output node 710 by the 5th switch S5.Node 706 is shown as to be opened by the 6th Close S6 and be couple to the second output node 710.First output node 708 is shown as by the first holding capacitor Device (C_Hold1) be coupled to ground, the second output node 710 is shown as by the second holding capacitor device (C_Hold2) It is coupled to ground.

In certain embodiments, the charge pump circuit 700 of Figure 19 may operate in four-stage (Φ₁、 Φ_2、Φ_3、Φ₄In), with based on input voltage V_inNext life voltage (2 × V at double_in) and half voltage (V_in/2) Both output.Table 4 lists each switchgear distribution in this four-stage.

Table 4

Stage

S1

S2

S3

S4

S5

S6

Φ₁

Guan Bi

Disconnect

Guan Bi

Φ₂

Disconnect

Guan Bi

Disconnect

Guan Bi

Disconnect

Φ₃

Guan Bi

Disconnect

Guan Bi

Disconnect

Φ₄

Disconnect

Guan Bi

Disconnect

Guan Bi

Disconnect

Inter alia, relevant to the charge pump circuit system 700 of Figure 19 additional detail and example The U.S. being described in entitled " INTERLEAVED DUAL OUTPUT CHARGE PUMP " faces Time application No.62/116,457 and entitled " INTERLEAVED DUAL OUTPUT CHARGE PUMP " U. S. application No.14/861, in 058, disclosures of which is hereby by quoting clearly Ground entirety is herein incorporated.

Figure 20 illustrates the block diagram of the power amplification configuration 750 with example controller 758, controller 758 There is integrated power amplifier control and power control component 764,766.Power amplification configuration 750 Power amplifier 760 and power supply 754 can be included.In some embodiments, power supply 754 can include out Close mode power (SMPS), such as boost converter, step-down controller, type of voltage step-up/down converter, electric charge Pump etc..

Power supply 754 can receive input voltage (such as from battery or the Vbatt in other sources) and carry Power amplifier 760 is given for supply voltage (Vcc).Power amplifier 760 is shown as and is supplied by supply voltage Electricity.That the size of supply voltage can be provided by controller 758 and that power supply 754 receives power supply controls Signal is arranged.Especially, power control signal can be carried by the power control component 764 of controller 758 Supply.Power control component 764 can be based on the transceiver control received from transceiver 752 via interface 762 Signal processed or generate electricity based on the local control signal received from power amplifier control parts 766 Source control signal.Local control signal can be based on the situation of the power amplifier 760 such as sensed. As shown in figure 20, power control component 764 can include that being couple to interface 762 controls to receive transceiver Signal at least one of first input and be couple to power amplifier control parts 766 with receive from Second input of the local control signal of power amplifier control parts 766.

Power amplifier 760 can receive input signal (RFin) and produce as output signal (RFout) Input signal amplified version.Can be from the signal received via interface 762 from transceiver 752 (such as figure Shown in 20) power amplifier control parts 766 receive input signal, can be directly from transceiver 752 Receive input signal, or input signal can be received from other sources.Power amplifier 760 can be by The power amplifier control provided by power amplifier control parts 766 and received by power amplifier 760 Signal processed (such as, the offset signal of such as bias voltage or bias current etc) biases.Power amplification Device controls parts 766 can be based on the Transceiver control signals received from transceiver 752 via interface 762 Generate power amplifier control signal.Controller 758 and power amplifier 760 can be integrated into individual module On 756, referred to herein as PA main device (master).Especially, controller 758 and power amplifier 760 can integrated on a single wafer.In some embodiments, power supply 754 also can be integrated into module Or be integrated on wafer.

Therefore, the power amplification configuration 750 of Figure 20 can include the power amplification control with controller 758 System processed.Controller 758 can include being configured to receive the Transceiver control signals from transceiver 752 Interface 762.Controller 758 can include being configured to the Transceiver control signals based on from transceiver 752 Generate the power amplifier control parts 766 of power amplifier control signal and be configured to based on from transmitting-receiving The Transceiver control signals of machine 752 generates power control signal and based on from power amplifier control portion The local control signal of part 766 generates the power control component 764 of power control signal.

In certain embodiments, power amplifier control parts 766 it is supplied to power amplifier 760 Power amplifier control signal can include the bias voltage for current offset power amplifier 760.Real at some Executing in mode, power amplifier control signal can include for enabling (or forbidding) power amplifier 760 Enable signal.

In certain embodiments, power control component 764 power control signal of power supply 754 it is supplied to Can include that instruction will be supplied to the reference voltage of the size of the supply voltage of power amplifier 760.One In a little embodiments, power control signal can include the enable letter for enabling (or forbidding) power supply 754 Number.

In certain embodiments, power amplifier control parts 766 it is supplied to power control component 764 Local control signal may indicate that supply voltage will increase.In some embodiments, local control is believed Number may indicate that supply voltage will reduce.In some embodiments, local control signal may indicate that power supply 754 will be prohibited.

In certain embodiments, local control signal can be based on the situation of the power amplifier 760 sensed. Sensing situation can be saturated situation or safe condition.Such as, power amplifier control parts 766 can be examined Measure power amplifier 760 (or one or more transistors of power amplifier 760) saturated.Make For response, power amplifier control parts 766 can provide local control signal to power control component 764 Will increase with instruction supply voltage.As another example, power amplifier control parts 766 can detect Operating under (or approach operation exist) unsafe condition to power amplifier 760, it is right that it may cause The damage of power amplifier 760.As response, power amplifier control parts 766 can be to power supply control Parts 764 provide local control signal will reduce with instruction supply voltage or power supply 754 will be prohibited.

Figure 21 illustrates have the power amplification configuration including controlling the example controller 806 of depositor 810 800.Power amplification configuration 800 is shown as and includes power amplifier 808 and switched-mode power supply (SMPS) 802.Switched-mode power supply can include boost converter, step-down controller, type of voltage step-up/down converter, electric charge Pump etc..Power amplifier 808 can be high voltage power amplifier.

SMPS 802 be shown as reception input voltage (such as from battery or from other originate) and At output, offer supplies voltage to power amplifier 808.Power amplifier 808 can be by this supply voltage Power supply.The power control signal that the power supply 802 that the big I of supply voltage is provided by controller 806 receives Arrange.Especially, power control signal can be controlled parts 812 by the SMPS of controller 806 provides. Power control signal can be converted into analog voltage reference (Vref) by digital to analog converter 816 from digital signal. SMPS controls parts 812 and can connect from modem/transceiver (not shown) based on via interface 810 The Transceiver control signals that receives or control the basis that parts 814 receive based on from power amplifier bias Ground control signal and generate power control signal.Local control signal can be such as based on the power sensed The situation of amplifier 808.As shown in figure 21, SMPS control parts 812 can include being couple to interface 810 to receive at least one of first input of Transceiver control signals and to be couple to power amplifier inclined Put and control parts 814 to receive the local control signal from power amplifier bias control parts 814 Second input.

SMPS control parts 812 be also based on from for the external control that receives of PA module 818 Signal generates power control signal, includes being supplied by the supply voltage of SMPS 802 for by PA module 818 The power amplifier of electricity.Especially, external control signal can be received from for the power using PA module 818 Amplifier controls parts (such as, power amplifier bias controls parts).

Power amplifier 808 can receive input signal (RFin) and provide as output signal (RFout) Input signal amplified version.Can be from receiving the signal from transceiver via interface 810 (such as Figure 21 Shown in) power amplifier bias control parts 814 receive input signal, can be directly from transceiver Input signal, or input can be received from other sources (such as another power amplifier control parts) Signal.Power amplifier 808 can be provided and by merit by being controlled parts 814 by power amplifier bias Power amplifier control signal (such as, the such as bias voltage or bias current that rate amplifier 808 receives Etc offset signal) biasing.Power amplifier bias controls parts 814 can be based on via interface 810 From transceiver to Transceiver control signals generate power amplifier control signal.Controller 806 He Power amplifier 808 can be integrated on individual module 804, referred to herein as PA main device.Especially, Controller 806 and power amplifier 808 can integrated on a single wafer.In some embodiments, Power supply 802 also can be integrated into module or be integrated on wafer.

The interface 810 of controller 806 can include one or more control depositor.Control depositor permissible It is that such as MIPI controls depositor.Especially, as shown in figure 21, interface 810 can include one or many Individual power amplifier control depositor and one or more power supply control depositor.Interface 810 also can wrap Include One Time Programmable (OTP) memorizer.

Power amplifier bias controls parts 814 and can be configured to based on being written to one or more power amplification Device controls a part for the Transceiver control signals of depositor and generates power amplifier control signal, SMPS Control parts 812 to can be configured to based on the transceiver control being written to one or more power supply control depositor A part for signal generates power control signal.In certain embodiments, power amplifier bias control portion Part 814 can be configured to control to deposit with local control signal overriding (overwrite) one or more power supply Device.Therefore, in certain embodiments, parts 812 can be controlled via interface 810 to SMPS to provide Local control signal.

Interface 810 can include input/output voltage (VIO) pin, clock (CLK) pin, (GND) Pin and data pin.Transceiver control signals can send through data pin from modem/transceiver (and being written to control depositor).

Therefore, the power amplification configuration 800 of Figure 21 can include the power amplification control with controller 806 System processed.Controller 806 can include the interface being configured to receive the Transceiver control signals from transceiver 810.Controller 806 can include that the Transceiver control signals being configured to based on from transceiver generates power Power amplifier control parts (the such as power amplifier of amplifier control signal (such as bias voltage) Bias control component) and be configured to generate power supply control letter based on the Transceiver control signals from transceiver Number (such as reference voltage) and generate based on the local control signal from power amplifier control parts The power control component (such as SMPS controls parts 812) of power control signal.

Table 5 list can by SMPS control parts 812 by use 3 bit signals (its writable to SMPS controls one of depositor) produce various Vref value and the example of control signal that generates.Table 5 shows Go out and can implement multiple modes of operation, including prohibited mode with the Vref value of change.In " boosting " pattern In, it is possible to use another the value being written in SMPS control depositor indicates concrete Vref defeated Go out.

Table 5

Control B2	Control B1	Control bit B0	Pattern	Vref exports
					0	0	0	Forbid	0
0	1	0	Force bypass	0.6
					0	1	1	Boosting	>0.8
1	0	0	2G biases	<0.3

1	0	1	Retain	NA
					1	1	0	Retain	NA
1	1	1	Retain	NA

Figure 22 illustrates that how the SMPS 802 of Figure 21 can be carried out in various inputs to reference voltage V ref The example of response, some in the various inputs of reference voltage V ref are listed in Table 5 below.Mould is biased at 2G In formula (such as Vref < 0.3V), the exportable voltage being suitable to 2G biasing of SMPS.In decompression mode (such as Vref is between 0.3V and 0.4V), the half of the exportable e.g. cell voltage of SMPS Voltage.In bypass mode (such as Vref is between 0.4V and 0.8V), SMPS is exportable The voltage of substantially equal with cell voltage.In boost mode (such as Vref > 0.8V), SMPS can be defeated Go out the booster tension proportional to Vref.This output can be used as such as with HV pattern operation one or The supply voltage of multiple PA.

Figure 23 illustrates the block diagram of the power amplifying system 850 including boost converter 860.Real at some Executing in example, this power amplifying system can include high voltage (HV) amplifying power.Power amplifying system Power amplifier 862 can be included and be configured to provide to power amplifier 862 electric power system of supply voltage 858.Power amplifier 862 can be configured to receive input radio frequency signal, and produces as output radio frequency The amplified version of the input radio frequency signal of signal.Electric power system 858 can be configured to receive cell voltage (Vbatt) and export supply voltage (Vcc) to power to power amplifier 862.Electric power system 858 Such as switched-mode power supply (SMPS) can be included.Electric power system 858 includes boost converter 860, its Can be used for generating the supply voltage than cell voltage bigger (or equal).In some embodiments, supply Electricity system 858 may also include the miscellaneous part that can be used for such as generating the supply voltage less than cell voltage.

Electric power system 858 and power amplifier 862 can be by including control of power supply system parts 854 and power Amplifier controls the control system 852 of parts 856 and controls.Control system 852 (such as electric power system control Parts 854 processed) can be configured to provide to electric power system based on the parameter being associated with power amplifier 862 Control of power supply system signal is to regulate supply voltage.Especially, control system 852 can be configured to based on The parameter that power amplifier 860 is associated to boost converter 860 provide boost converter control signal with Regulation supply voltage.

Boost converter control signal can be reference voltage, Delta (delta) signal, enable signal, Or any other numeral or analogue signal.Such as, boost converter control signal can be reference voltage. In response to the reference voltage increased, boost converter 860 may be configured to increase supply voltage and regulates Supply voltage.Increasing supply voltage can be that power amplifier 862 provides additional headroom (headroom). Similarly, in response to the reference voltage reduced, boost converter 860 may be configured to reduce power supply electricity Pressure regulates supply voltage.Reduce supply voltage and can improve the power added efficiency of power amplifier 862 (PAE)。

As another example, boost converter control signal can be delta signal.In response to Delta Signal, boost converter 860 may be configured to supply voltage increase predetermined amount to regulate supply voltage.

In some embodiments, the parameter being associated with power amplifier 862 can include sensed merit The situation of rate amplifier 862.In some embodiments, power amplifier control parts 856 (and then, Control system 852) can be configured to detect the sensing situation of power amplifier.In some embodiments, Control system 854 can be configured to receive the signal of the sensing situation of indicated horsepower amplifier 862.Such as, Control of power supply system parts 854 can receive indicated horsepower amplifier from power amplifier control parts 856 The signal of sensing situation.As another example, control system 852 can be put from transceiver indicated horsepower The signal of the sensing situation of big device.In some embodiments, control system 852 can be configured to receive base Signal in the sensing situation of power amplifier 862.

The sensing situation of power amplifier can be the saturated situation of such as power amplifier 862.Power is put Big device 862 (or one or more transistors of power amplifier 862) can be saturated, reduces The linearity of power amplifier.

In some embodiments, the parameter being associated with power amplifier 862 includes power amplifier The operator scheme of 862, boost converter control signal is provided to boost converter 860 to support to be somebody's turn to do Operator scheme.Such as, operator scheme can be to increase linearity pattern.Bigger linearity pattern can be High voltage mode or high-output power pattern.

Control system 852 (such as, power amplifier control parts 856) can be configured to power amplification Device 862 provides power amplifier control signal.Power amplifier control signal could be for bias power The offset signal of amplifier 862 (or one or more transistors of power amplifier 862) is (such as Bias voltage or bias current), enable signal or any other numeral or analogue signal.

There is the power amplification system of the ability of lifting input voltage (cell voltage such as provided by battery) In terms of system (power amplifying system 850 of such as Figure 23) can provide and how can utilize this boosting power supply Motility.In certain embodiments, the supply voltage of this lifting can be according to such as reference voltage (Vref) Etc control input but variable (such as, as shown in figure 22).Therefore, it can in many ways Utilize this variable attribute of the supply voltage promoted, including the enforcement of supply voltage able to programme.

There is the aforementioned ability that wide scope supply voltage is provided from boost converter, it is possible to use this ability Obtain favourable power amplifier properties to improve.The linearity is the example of this power amplifier properties. Although describing various example here in the context of the linearity, it will be understood that, it is possible to use power supply Other performances that the variable attribute regulation power amplifier of voltage is correlated with.

Noting, power amplifier non-linearity is generally by the usable level powered by collector/drain voltage The restriction of amplitude modulation compression (compression) determined.The compression of this amplitude modulation can affect other Error vector magnitude (EVM) and spectral re-growth phase in frequency band needed for parameter, such as radio concordance Side channel reveals ratio (ACLR) linearity performance, and if duplex gap is sufficiently small even may be used Affect receiver susceptiveness.

Figure 24 illustrates how to remove or essence with the variable supply voltage from boost converter 870 Property loosen aforementioned colelctor electrode supply voltage limit example.This boost converter is shown as generation supply voltage Vcc and it is supplied to power amplifier, thus allows power amplifier with the linearity operation improved.

Such as, boost converter 870, nominal optimal value Vcc are utilized_nomIt is provided to power amplifier To realize the linearity of given level.But, when expectation additional line is spent (such as big envelope (872) amplitude), higher supply voltage level is set more headroom, and then the more preferably linearity are provided. This headroom increases the deterioration that may result in DC consumption with efficiency performance；But, this sacrifice is only relating to Just can be perplexed under the operational scenario of higher levels of transmitting (emission) and linearity performance.

In the example of Figure 24, the headroom of aforementioned increase can by by Vcc from nominal value Vcc_nomIncrease Δ V amount is to produce the supply voltage Vcc increased_nom+ Δ V realizes.Increase Δ V can be chosen so as to fit Answer the high emission level shown in example envelope 872.In certain embodiments, raw with boost converter 870 Become relevant for Vcc operation can about with Vcc_nomCompiled with any one in Δ V or value that both are associated Journey.

The aforementioned exemplary that Vcc can be increased by the programming operation of boost converter is described herein more one As the example of concept, in more typically concept described here, the output of boost converter can be based on power Certain parameter that amplifier is relevant and be conditioned.

Product example

Figure 25 illustrates in certain embodiments, has the HV APT of one or more feature described herein Some or all of power amplifying system may be implemented in module.Such module can be such as front end mould Block (FEM).In the example of Figure 25, module 300 can include package substrate 302, and multiple parts can It is arranged in this package substrate.Such as, FE-PMIC parts 102, power amplifier component 104, Matching block 106 and duplexer assembly 108 can be installed and/or be implemented in package substrate 302 and/or interior. The miscellaneous part of the most multiple SMT devices 304 and antenna switch module (ASM) 306 etc also may be used To be arranged in package substrate 302.Although whole various parts are shown as layout in package substrate 302, It will be understood that, some parts may be implemented in above or below miscellaneous part.

In some embodiments, the power amplifying system having one or more feature described herein can It is included in the RF device of such as wireless device etc.This power amplifying system can be in a wireless device It is embodied as one or more circuit, one or more wafer, one or more package module or it is any Combination.In certain embodiments, this wireless device can include such as cell phone, smart phone, tool It is with or without the wireless handheld device of telephony feature, wireless flat etc..

Figure 26 illustrates the example wireless device 400 with one or more favorable characteristics described herein.? In the context of the module with one or more feature described herein, such module can usually by Dotted line frame 300 illustrates, and can be embodied as such as front-end module (FEM).

With reference to Figure 26, power amplifier (PA) 420 can receive its corresponding RF letter from transceiver 410 Number, transceiver 410 is configurable and operation is to generate RF signal that is to be amplified and that launch, and processes institute The signal received.Transceiver 410 is shown as and interacts with baseband subsystems 408, and baseband subsystems 408 is joined It is set to provide between data and/or voice signal and the RF signal being suitable to transceiver 410 being suitable to user Conversion.Transceiver 410 can also communicate with power management components 406, and power management components 406 configures The power of the operation of wireless device 400 it is used for for management.Such power management also can control base band subsystem System 408 and the operation of module 300.

Baseband subsystems 408 is shown as connected to user interface 402 and is supplied to facilitate and is received from user's Speech and/or the various inputs of data and output.Baseband subsystems 408 is also connected to memorizer 404, Memorizer 404 is configured to store data and/or the instruction of the operation for facilitating wireless device, and/or is User provides information to store.

In example wireless device 400, the output of PA 420 is shown as and is matched (via mating electricity accordingly Road 422) and it is routed to they corresponding duplexers 424.In certain embodiments, match circuit 422 The example match circuit 172a-172c described referring herein to Fig. 7 can be similar to.Also as referring herein to Fig. 7 As description, when PA 420 powers with HV and to operate with HV pattern, the output of PA 420 can quilt It is routed to they corresponding duplexers 424 and there is no impedance transformation (such as with the load change in Fig. 6 116).This amplification and filtered signal can be routed to antenna 416 for sending out by duplexer 414 Penetrate.In certain embodiments, duplexer 424 can allow to utilize community antenna (such as 416) to enter simultaneously Row is launched and receives operation.In fig. 26, reception signal is shown as and is routed to " Rx " by duplexer 424 Path, " Rx " path can include the most one or more low-noise amplifier (LNA).

In the example of Figure 26, the HV being previously used for PA 420 powers and can be provided by HV parts 102. This HV parts can include boosting DC/DC transducer the most described herein.

The available one or more features described herein of other wireless devices multiple configuration.Such as, wireless Device needs not be multi-band device.In another example, wireless device can include such as diversity antenna etc Additional antenna and the additional connection features of such as Wi-Fi, bluetooth and GPS etc.

As described herein, all such as relating to the system of wireless device etc of Figure 26 when being implemented in Time in system, one or more features of the application can provide many advantages.Such as, by eliminating or subtracting Little output loss, can realize significant current consumption and reduce.In another example, can be for power amplification System and/or wireless device realize lower BOM quantity.In another example, owing to the most single Only PA is for their corresponding frequencies band, it is possible to achieve the impedance optimization of each supported frequency band Or expectation configuration.In another example, can be realized maximum or more by such as boosting supply voltage system The optimization of big output or expectation configuration.In another example, it is possible to use multiple different battery skill Art, because maximum or greater power need not be limited by cell voltage.

One or more features of the application can be implemented, as described herein together with various honeycomb frequency bands Like that.The example of this frequency band is shown in Table 6.It will be appreciated that at least some frequency band is divided into multiple subband. It will also be understood that one or more features of the application can be with the appointment of the example not having such as table 6 etc (designation) frequency range is implemented together.

Table 6

In description herein, it is referred to various impedance manner.Such as, PA is sometimes referred to as driving such as The load impedance of the components downstream of wave filter etc.In another example, PA is sometimes referred to as having impedance Value.In order to illustrate, it will be appreciated that this impedance to PA is relevant quotes and can be used interchangeably.Additionally, The impedance of PA may be included in its output impedance that the outlet side of PA is seen.Therefore, such PA is joined PA has the load impedance approximation phase with components downstream to be set to drive the load impedance of components downstream to include Same output impedance.

Unless context clearly requires otherwise, otherwise run through specification and claims, according to The meaning of the adversative inclusive of exclusiveness or exhaustive, say, that according to " including but do not limit In " meaning explain term " include (comprise) ", " comprising (comprising) " etc..As Here the term generally used " couples " that refer to be directly connected to or by means of one or more Two or more elements that intermediary element connects.It addition, when used in this application, term is " at this In ", " above ", " below " should not refer to as overall the application with the term of similar implication, and not It it is any concrete part of the application.When context allows, use odd number or the description above of plural number In term can also include plural number or odd number respectively.Mention the term during list of two or more projects "or", this term contains the whole explained below of this term: in any project in list, list All items and list in any combination of project.

The embodiment of the present invention discussed in detail above that be not intended to be exhaustive, or on limiting the invention to Precise forms disclosed in face.Although the most illustratively describing being embodied as of the present invention Example and the example for the present invention, but as the skilled person will recognize, in the scope of the invention Interior various equivalent modifications are possible.Such as, present process or block while in accordance with to definite sequence, but It is that the embodiment replaced can perform the process with the step of different order, or uses there is different order The system of block, and some process or block can be deleted, move, add, deduct, combine and/ Or amendment.Each in these process or block can be realized in various ways.Similarly, Despite time be shown as performing serially by process or block, but on the contrary, these process or block can also It is performed in parallel, or can perform at different time.

The teachings of the present invention here provided can be applied to other system, without being above-mentioned to be System.The element of each above-mentioned embodiment and action can be combined, further implement to provide Example.

Although it have been described that some embodiments of the present invention, but present simply by means of example These embodiments, and described embodiment is not intended to limit scope of the present application.In fact, can be according to many Plant other form and be implemented in novel method described herein and system；Here retouch furthermore, it is possible to be made at The pro forma various omissions, substitutions and changes of the method and system stated, and without departing from the essence of the application God.Accompanying drawing and their equivalent are intended to as fallen into this shape in the scope of the present disclosure and spirit Formula or amendment.

Claims

1. a power amplifying system, including:

Electric power system, is configured to cell voltage and provides high voltage HV power supply signal；

Power amplifier PA, is configured to receive described HV power supply signal and amplify radio frequency rf signal； And

Outgoing route, is configured to the RF signal after amplifying and is routed to wave filter.

2. power amplifying system as claimed in claim 1, wherein, described outgoing route does not the most hinder Transformation circuit.

3. power amplifying system as claimed in claim 2, wherein, described power amplifying system is configured to Operate and follow the tracks of APT system for mean power.

4. power amplifying system as claimed in claim 3, wherein, described electric power system includes being configured to The boosting DC/DC transducer of described HV power supply signal is generated based on described cell voltage.

5. power amplifying system as claimed in claim 3, wherein, described HV power supply signal is chosen Described outgoing route is allowed substantially not have for making the impedance of described PA and described wave filter fully mate Impedance inverter circuit.

6. power amplifying system as claimed in claim 5, wherein, the impedance of described PA has and is more than The value of about 40 ohm.

7. power amplifying system as claimed in claim 6, wherein, the impedance of described PA has about The value of 50 ohm.

8. power amplifying system as claimed in claim 3, wherein, described PA includes heterogenous dual-pole Transistor HBT.

9. power amplifying system as claimed in claim 8, wherein, described HBT is GaAs GaAs Device.

10. power amplifying system as claimed in claim 8, wherein, described HV power supply signal is made The colelctor electrode of described HBT it is supplied to for VCC.

11. power amplifying systems as claimed in claim 3, wherein, described wave filter be arranged to The Tx wave filter of corresponding transmitting Tx frequency band operation.

12. power amplifying systems as claimed in claim 11, wherein, described Tx wave filter is configuration For with described Tx frequency band and a part for the duplexer of corresponding reception Rx frequency band operation.

13. power amplifying systems as claimed in claim 3, also include one or more additional PA, its Each being configured to receives described HV power supply signal and amplifies RF signal.

14. power amplifying systems as claimed in claim 13, also include one or more additional output road Footpath, each of which is configured to receive the amplification RF signal of corresponding additional PA and be routed to correspondence Wave filter, described additional outgoing route does not has impedance inverter circuit substantially.

15. power amplifying systems as claimed in claim 14, wherein, each wave filter has and its phase The corresponding PA of association.

16. power amplifying systems as claimed in claim 15, wherein, described power amplifying system is basic There is no band selection switches between described PA and described wave filter.

17. power amplifying systems as claimed in claim 16, wherein, described power amplifying system has Ratio has similar frequency band disposal ability wherein PA with another power amplifier system of low voltage operating Lower loss.

18. power amplifying systems as claimed in claim 17, wherein, described power amplifying system includes Mean power follows the tracks of APT system, and another power amplifier system described includes envelope-tracking ET system.

19. power amplifying systems as claimed in claim 18, wherein, described APT system has ratio The higher overall efficiency of overall efficiency of described ET system.

20. 1 kinds of radio frequency modules, including:

Package substrate, is configured to accommodate multiple parts；And

Power amplifying system, is implemented in described package substrate, and described power amplifying system includes being configured to There is provided the electric power system of high voltage HV power supply signal based on cell voltage, described power amplifying system also wraps Including multiple power amplifier PA, each PA is configured to receive described HV power supply signal and amplify radio frequency RF signal, described power amplifying system also includes being configured to the RF signal after amplifying from corresponding PA It is routed to the outgoing route of the wave filter of correspondence.

21. RF modules as claimed in claim 20, wherein, each in the plurality of PA also joins It is set to about drive the characteristic load impedance of the output filter of correspondence.

22. RF modules as claimed in claim 21, wherein, each outgoing route does not has impedance substantially Translation circuit is between corresponding PA and output filter.

23. RF modules as claimed in claim 21, wherein, described power amplifying system does not has substantially Band selection switches is between the output filter that the plurality of PA is corresponding with them.

24. RF modules as claimed in claim 21, wherein, described RF module is front-end module FEM.

25. 1 kinds of wireless devices, including:

Transceiver, is configured to generate radio frequency rf signal；

Front-end module FEM, with described transceiver communication, described FEM includes being configured to accommodate multiple portion The package substrate of part, described FEM also includes the power amplifying system being implemented in described package substrate, Described power amplifying system includes that being configured to cell voltage provides the power supply of high voltage HV power supply signal System, described power amplifying system also includes that multiple power amplifier PA, each PA are configured to receive Described HV power supply signal and amplify radio frequency rf signal, described power amplifying system also includes being configured to RF signal after amplifying is routed to the outgoing route of the wave filter of correspondence from corresponding PA；And

Antenna, communicates with described FEM, and described antenna configurations is the RF signal after launching described amplification.