CN105885676A - Damp-proof and mildew-resistant coating and preparation method thereof - Google Patents
Damp-proof and mildew-resistant coating and preparation method thereof Download PDFInfo
- Publication number
- CN105885676A CN105885676A CN201610457909.9A CN201610457909A CN105885676A CN 105885676 A CN105885676 A CN 105885676A CN 201610457909 A CN201610457909 A CN 201610457909A CN 105885676 A CN105885676 A CN 105885676A
- Authority
- CN
- China
- Prior art keywords
- solution
- epoxy resin
- polyamide
- toughener
- mixed solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/14—Paints containing biocides, e.g. fungicides, insecticides or pesticides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Plant Pathology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paints Or Removers (AREA)
Abstract
The invention provides a damp-proof and mildew-resistant coating and a preparation method thereof. Epoxy resin is modified by polyamide resin, problems of large viscosity, large brittleness after the epoxy resin is solidified, poor weather fastness, heating solidification and the like of the epoxy resin are solved, and meanwhile, excellent mechanical property, electrical insulation property and the like of the polyamide resin are maintained. The coating prepared by the invention is good in adhesion, good in toughness and good in weather fastness, and has excellent moisture proofing performance, after a mildew inhibitor is added, the mildew resistance of the coating is improved, and the practical value is quite high.
Description
Technical field
The invention belongs to technical field of chemical paint, be specifically related to a kind of moistureproof and mildewproof coating and compound method thereof.
Background technology
In order to strengthen product in the torrid zone, contour Humid Area, subtropical zone, marine climate and other adverse circumstances
Under resist the ability that moist and mycete corrodes, improve product electrical insulation capability, to ensure its reliability and to make
With the life-span, need complete machine inside and circuit board module are carried out protective treatment.Home and abroad is universal at present
The method used is that these coating are desirable that can be normal at one layer of resinae protective coating of product surface coating
Temperature solidification, kind is mainly based on polyurethanes, the protective coating of acrylic compounds, but these coating exist
During use not all roses, all there is certain defect: polyurethanes coating use isocyanates as firming agent,
Isocyanates belongs to extremely toxic substance, has stronger destruction to human respiratory, and discharge is unfavorable for
Environmental conservation；Acrylic coating uses thermoplastic resin, when using temperature to reach more than 50 DEG C,
Easily deliquescing is tacky, and barrier propterty declines.After-contraction amount is big, fragility big owing to solidifying for epoxylite,
Needing heating cure, be easily destroyed electronic devices and components, the especially destruction to sensitive components is bigger,
Therefore typically do not make internal and circuit board module the protective coating of complete machine to use.For existing problems, research
Develop new coating variety and seem the most necessary.
Summary of the invention
Present invention solves the technical problem that: a kind of moistureproof and mildewproof coating and compound method thereof are provided, use polyamides
Epoxy resin is modified by polyimide resin, improves that epoxy resin viscosity is big, fragility is big after solidification, weatherability
The problems such as difference, heating cure, maintain again the excellent mechanical property of polyamide and electrical insulating property simultaneously
The features such as energy, have the highest practical value.
The technical solution used in the present invention: moistureproof and mildewproof coating, is made up of the raw material of following weight parts: epoxy
Resin: 10～30 parts, polyamide 15～35 parts, toughener 0.5～3 parts, mixed solvent 35～
60 parts, antifungus agent 1～3 parts.
Further, described toughener is tetrabutyl titanate.
Further, described mixed solvent is benzene class and esters is mixed in 1:1 ratio.
Further, described antifungus agent is hydroquinone or 5.6 dichloro benzoxazolones.
Also provide for the compound method of a kind of moistureproof and mildewproof coating, comprise following step:
1) weigh appropriate epoxy resin to be placed in three-necked bottle, be then gradually added into mixed solvent, use electric mixing
Mixing device stirring makes the whole uniform dissolution of epoxy resin obtain epoxy resin solution；
2) weighing appropriate polyamide to be placed in beaker, be gradually added into mixed solvent, stirring makes polyamide
The whole uniform dissolution of resin obtains polyamide resin lipoprotein solution in mixed solvent；
3) polyamide resin lipoprotein solution is added drop-wise in epoxy resin solution, is sufficiently stirred for 15min, form polyamides
Amine-epoxy solution；
4) weighing appropriate toughener in beaker, be gradually added into mixed solvent, stirring makes toughener the most equal
Even dissolve to obtain toughener solution；
5) toughener solution is slowly added at twice polyamide-epoxy resin solution, adds toughness reinforcing for the first time
2/3rds of agent total amount, second time adds surplus, and stirring about 5min is uniform to solution, stand 20～
30min, to bubble collapse, forms the polyamide-epoxy resin solution containing toughener；
6) weighing appropriate antifungus agent in beaker, be gradually added into mixed solvent, stirring makes antifungus agent the most equal
Even dissolve to obtain antifungus agent solution；
7) antifungus agent solution is slowly added into the polyamide-epoxy resin solution containing toughener, stirs,
Stand 20～30min and i.e. form moistureproof and mildewproof coating finished product to bubble collapse.
Present invention advantage compared with prior art:
1, use polyamide that epoxy resin is modified, improve that epoxy resin viscosity is big, after solidification
The problems such as fragility is big, weatherability is poor, heating cure, maintain again the mechanics that polyamide is excellent simultaneously
The feature such as performance and electrical insulation capability；
2, this paint adhesion is good, pliability is good, good weatherability, has the moisture proof performance of excellence, adds
The fungicidal properties of coating is improve again after entering antifungus agent；
3, environmental protection and temperature tolerance are good,
Accompanying drawing explanation
Fig. 1 is present invention process schematic flow sheet.
Detailed description of the invention
1 embodiments of the invention are described below in conjunction with the accompanying drawings.
Embodiment one: moistureproof and mildewproof coating, weighs epoxy resin: 10g, polyamide 15g, and metatitanic acid is just
The mixed solvent 35g that butyl ester 0.5g, benzene class and esters are mixed in 1:1 ratio, hydroquinone 1g.
The compound method of moistureproof and mildewproof coating, comprises following step:
1) weigh epoxy resin 10g to be placed in three-necked bottle, be then gradually added into mixed solvent 10g, with electronic
Agitator stirring makes the whole uniform dissolution of epoxy resin obtain epoxy resin solution；
2) weighing polyamide 15g to be placed in beaker, be gradually added into mixed solvent 10g, stirring makes polyamides
The whole uniform dissolution of polyimide resin obtains polyamide resin lipoprotein solution in mixed solvent；
3) polyamide resin lipoprotein solution is added drop-wise in epoxy resin solution, is sufficiently stirred for 15min, form polyamides
Amine-epoxy solution；
4) weighing tetrabutyl titanate 0.5g in beaker, be gradually added into mixed solvent 6g, stirring makes metatitanic acid just
The whole uniform dissolution of butyl ester obtains toughener solution；
5) toughener solution is slowly added at twice polyamide-epoxy resin solution, adds toughness reinforcing for the first time
2/3rds of agent total amount, second time adds surplus, and stirring about 5min is uniform to solution, stand 20～
30min, to bubble collapse, forms the polyamide-epoxy resin solution containing toughener；
6) weighing hydroquinone 1g in beaker, be gradually added into mixed solvent 9g, stirring makes hydroquinone complete
Portion's uniform dissolution obtains antifungus agent solution；
7) antifungus agent solution is slowly added into the polyamide-epoxy resin solution containing toughener, stirs,
Stand 20～30min and i.e. form moistureproof and mildewproof coating finished product to bubble collapse.
Embodiment two: moistureproof and mildewproof coating, weighs epoxy resin: 30g, polyamide 35g, and metatitanic acid is just
The mixed solvent 60g that butyl ester 3g, benzene class and esters are mixed in 1:1 ratio (weight ratio), 5.6 2
Chlorobenzene diozaiole ketone 3g.
The compound method of moistureproof and mildewproof coating, comprises following step:
1) weigh appropriate epoxy resin 30g to be placed in three-necked bottle, be then gradually added into mixed solvent 20g, use
Motor stirrer stirring makes the whole uniform dissolution of epoxy resin obtain epoxy resin solution；
2) weighing polyamide 35g to be placed in beaker, be gradually added into mixed solvent 20g, stirring makes polyamides
The whole uniform dissolution of polyimide resin obtains polyamide resin lipoprotein solution in mixed solvent；
3) polyamide resin lipoprotein solution is added drop-wise in epoxy resin solution, is sufficiently stirred for 15min, form polyamides
Amine-epoxy solution；
4) weighing tetrabutyl titanate 3g in beaker, be gradually added into mixed solvent 10g, stirring makes metatitanic acid just
The whole uniform dissolution of butyl ester obtains toughener solution；
5) toughener solution is slowly added at twice polyamide-epoxy resin solution, adds toughness reinforcing for the first time
2/3rds of agent total amount, second time adds surplus, and stirring about 5min is uniform to solution, stand 20～
30min, to bubble collapse, forms the polyamide-epoxy resin solution containing toughener；
6) weigh 5.6 dichloro benzoxazolone 3g in beaker, be gradually added into mixed solvent 10g, stirring
The whole uniform dissolution of hydroquinone is made to obtain antifungus agent solution；
7) antifungus agent solution is slowly added into the polyamide-epoxy resin solution containing toughener, stirs,
Stand 20～30min and i.e. form moistureproof and mildewproof coating finished product to bubble collapse.
Above-mentioned moistureproof and mildewproof coating is used for complete machine inside and the circuit board module of product, by GJB150.9 warp
Crossing the damp heat test of 240h, by GJB150.11 through the salt spray test of 96h, surface is good, and product is exhausted
The electrical properties such as edge are good, and by GJB150.10 through the mould test of 28d, mildew-resistant grade is less than
Equal to 2 grades, meet product requirement.
Above-described embodiment, simply presently preferred embodiments of the present invention, be not used for limiting the scope of the present invention,
Therefore all with content described in the claims in the present invention done equivalence change, all should be included in right of the present invention want
Within the scope of asking.
Claims (5)
1. moistureproof and mildewproof coating, it is characterised in that be made up of the raw material of following weight parts: epoxy resin: 10～
30 parts, polyamide 15～35 parts, toughener 0.5～3 parts, mixed solvent 35～60 parts, mildew-resistant
Agent 1～3 parts.
Moistureproof and mildewproof coating the most according to claim 1, it is characterised in that: described toughener is titanium
Acid N-butyl.
Moistureproof and mildewproof coating the most according to claim 1, it is characterised in that: described mixed solvent is
Benzene class and esters are mixed in 1:1 ratio.
Moistureproof and mildewproof coating the most according to claim 1, it is characterised in that: described antifungus agent is right
Benzodiazepines or 5.6 dichloro benzoxazolones.
The compound method of moistureproof and mildewproof coating the most as claimed in claim 1 or 2 or 3 or 4, its feature
It is to comprise following step:
1) weigh appropriate epoxy resin to be placed in three-necked bottle, be then gradually added into mixed solvent, use electric mixing
Mixing device stirring makes the whole uniform dissolution of epoxy resin obtain epoxy resin solution；
2) weighing appropriate polyamide to be placed in beaker, be gradually added into mixed solvent, stirring makes polyamide
The whole uniform dissolution of resin obtains polyamide resin lipoprotein solution in mixed solvent；
3) polyamide resin lipoprotein solution is added drop-wise in epoxy resin solution, is sufficiently stirred for 15min, form polyamides
Amine-epoxy solution；
4) weighing appropriate toughener in beaker, be gradually added into mixed solvent, stirring makes toughener the most equal
Even dissolve to obtain toughener solution；
5) toughener solution is slowly added at twice polyamide-epoxy resin solution, adds toughness reinforcing for the first time
2/3rds of agent total amount, second time adds surplus, and stirring about 5min is uniform to solution, stand 20～
30min, to bubble collapse, forms the polyamide-epoxy resin solution containing toughener；
6) weighing appropriate antifungus agent in beaker, be gradually added into mixed solvent, stirring makes antifungus agent the most equal
Even dissolve to obtain antifungus agent solution；
7) antifungus agent solution is slowly added into the polyamide-epoxy resin solution containing toughener, stirs,
Standing 20～30min, to bubble collapse, i.e. forms moistureproof and mildewproof coating finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457909.9A CN105885676A (en) | 2016-06-22 | 2016-06-22 | Damp-proof and mildew-resistant coating and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457909.9A CN105885676A (en) | 2016-06-22 | 2016-06-22 | Damp-proof and mildew-resistant coating and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105885676A true CN105885676A (en) | 2016-08-24 |
Family
ID=56718773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610457909.9A Pending CN105885676A (en) | 2016-06-22 | 2016-06-22 | Damp-proof and mildew-resistant coating and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105885676A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998168A (en) * | 1982-11-26 | 1984-06-06 | Dainippon Toryo Co Ltd | Coating composition |
| CN101654585A (en) * | 2009-09-21 | 2010-02-24 | 哈尔滨化工研究所 | High-temperature-resistant high-frequency conformal coating |
| CN102504670A (en) * | 2011-10-27 | 2012-06-20 | 北京东方雨虹防水技术股份有限公司 | Permeable epoxy resin waterproof coating for concrete |
| CN103045058A (en) * | 2011-10-11 | 2013-04-17 | 攀钢集团攀枝花钢铁研究院有限公司 | Insulation coating and electrical steel material, and preparation method thereof |
| CN103342935A (en) * | 2013-06-27 | 2013-10-09 | 虞城县非凡涂料有限公司 | Epoxy modified water-soluble tape coating and preparation method thereof |
| CN103450773A (en) * | 2012-05-30 | 2013-12-18 | 湖南博弈飞装备新材料研究所 | Epoxy acrylate modified high anticorrosion heat insulation paint containing porous ceramic addictive and production method thereof |
| CN103642366A (en) * | 2013-11-21 | 2014-03-19 | 江苏博思源防火材料科技有限公司 | Ageing and heat resistant wall coating and preparation method thereof |
-
2016
- 2016-06-22 CN CN201610457909.9A patent/CN105885676A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998168A (en) * | 1982-11-26 | 1984-06-06 | Dainippon Toryo Co Ltd | Coating composition |
| CN101654585A (en) * | 2009-09-21 | 2010-02-24 | 哈尔滨化工研究所 | High-temperature-resistant high-frequency conformal coating |
| CN103045058A (en) * | 2011-10-11 | 2013-04-17 | 攀钢集团攀枝花钢铁研究院有限公司 | Insulation coating and electrical steel material, and preparation method thereof |
| CN102504670A (en) * | 2011-10-27 | 2012-06-20 | 北京东方雨虹防水技术股份有限公司 | Permeable epoxy resin waterproof coating for concrete |
| CN103450773A (en) * | 2012-05-30 | 2013-12-18 | 湖南博弈飞装备新材料研究所 | Epoxy acrylate modified high anticorrosion heat insulation paint containing porous ceramic addictive and production method thereof |
| CN103342935A (en) * | 2013-06-27 | 2013-10-09 | 虞城县非凡涂料有限公司 | Epoxy modified water-soluble tape coating and preparation method thereof |
| CN103642366A (en) * | 2013-11-21 | 2014-03-19 | 江苏博思源防火材料科技有限公司 | Ageing and heat resistant wall coating and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103342877B (en) | Resin combination, steep body, plywood and wiring plate in advance | |
| CN104559064A (en) | High-toughness high-Tg-value epoxy resin and preparation method | |
| BRPI0406889B1 (en) | Wood composite | |
| CN104987784A (en) | Novel thermal insulation coating, preparation method therefor and application thereof | |
| CN103773209A (en) | Waterproof asphalt-polyurethane paint | |
| CN102936477B (en) | Heat transfer printing adhesive for glass matrix, heat transfer printing film, preparation method and application | |
| CN102424737B (en) | Pinewood water-based oil-proof transparent primer as well as preparation method and application thereof | |
| CN105199660A (en) | Preparation method of high-performance neutral adhesive glue | |
| CN105885676A (en) | Damp-proof and mildew-resistant coating and preparation method thereof | |
| CN104845549B (en) | Wood adhesive, wood adhesion method using same and wood joint structure | |
| KR101714506B1 (en) | Composition of natural adhesion for natural leather of vehicle and method thereof | |
| CN104312471A (en) | Anisotropic conductive film containing benzoxazine and preparation method of anisotropic conductive film | |
| US20150174877A1 (en) | Method of Connecting Elements made of Foamed Ethylene Copolymer and Vinyl Acetate EVA with Polyurethane | |
| CN101362931A (en) | Water system adhesive | |
| CN104449326B (en) | High flame retardance spraying coating and preparation method thereof | |
| CN104152030A (en) | Hot steam corrosion resisting tri-proof paint for printed circuit boards | |
| CN107163553A (en) | The dulcet PU films of one kind tool and preparation method | |
| CN103820006A (en) | Coating for TPO surface treatment and preparing method thereof | |
| TW294704B (en) | ||
| CN108690544A (en) | Protective release adhesive for hot pressing and application thereof | |
| CN106811058A (en) | Coatings and its preparation method and application | |
| CN108690476A (en) | Acrylate paint and preparation method thereof | |
| CN110256667A (en) | A kind of aramid fiber adhesive and its preparation method and application | |
| CN105593707A (en) | Optical film | |
| CN106700764A (en) | Double-component water-soluble spraying glue and preparation method of double-component water-soluble spraying glue |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160824 |
|
| RJ01 | Rejection of invention patent application after publication |