CN105881648B - A kind of automatic scoreboard device and method of wiring board - Google Patents
A kind of automatic scoreboard device and method of wiring board Download PDFInfo
- Publication number
- CN105881648B CN105881648B CN201610217152.6A CN201610217152A CN105881648B CN 105881648 B CN105881648 B CN 105881648B CN 201610217152 A CN201610217152 A CN 201610217152A CN 105881648 B CN105881648 B CN 105881648B
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- China
- Prior art keywords
- mold
- wiring board
- lower mould
- mould
- feeding arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
- B26D7/0608—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by pushers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to the automatic scoreboard device and method of wiring board, equipment includes support, feed device and board separating device, board separating device includes mold, lower mould, fixed module and movable module, mold is in the vertical against or away from lower mould, machining area is formed between mold and lower mould, fixed module includes being separately positioned on mold and the upper fixed part on lower mould and lower fixed part, movable module includes being separately positioned on mold and the upper movable mold on lower mould and lower movable mold, mold is vertical to make movable module to form dislocation in the vertical with fixed module in the presence of an elastic device upwards against lower mould, overall wiring board is delivered on machining area and single wiring board is sent from into machining area by feed device by feed device.Its method uses the said equipment to carry out scoreboard to wiring board.The advantages of apparatus and method of the present invention, is the overall wiring board being made up of some uniline plates can be automatically separated into some single wiring boards automatically.
Description
(1) technical field
The present invention relates to a kind of automatic scoreboard device and method of wiring board.
(2) background technology
In the production technology of existing circuit board (wiring board), people are often by the less circuit board collection of polylith (such as the institute of accompanying drawing 1
Show) close into one piece of big circuit board (as shown in accompanying drawing 2 and accompanying drawing 3), to improve production efficiency, however, in erecting yard,
Need to take each small electric road plate in big circuit board apart (or cutting), i.e., scoreboard need to be carried out to wiring board (along indentation
Line separates).
In the prior art, scoreboard generally has manual scoreboard and machine scoreboard two ways, wherein, using the side of manual scoreboard
Formula, manually need to carry out scoreboard according to cutting line with vice, this manual operation wastes time and energy, and efficiency is very low, can not
Meet the needs of enterprise's production development；And for the latter, by the way of machine scoreboard, complex operation, and the milling of board separator
Knife easily hurts wiring board when cutting or damage line falls circuit and electronic component soldered on plate, influences the quality of product
And performance.
(3) content of the invention
The first object of the present invention is to provide a kind of wiring board automatic scoreboard equipment, so that realize automatically will be by some single
The overall wiring board of wiring board composition is automatically separated into some single wiring boards.
To achieve the above object, the present invention uses following technical scheme：
The automatic scoreboard equipment of a kind of wiring board, the overall wiring board being made up of some uniline plates to be divided automatically
Into some single wiring boards, automatic scoreboard equipment includes support, feed device and board separating device on support, scoreboard
Device includes mold, lower mould, fixed module and movable module, mold can in the vertical against or away from lower mould, on
A machining area is formed between mould and lower mould, fixed module includes the upper fixation being separately positioned on mold and lower mould
Portion and lower fixed part, movable module include being separately positioned on mold and the upper movable mold on lower mould and lower movable mold, upper mould
Tool is vertical to make the movable module to be formed in the vertical with fixed module in the presence of an elastic device upwards against lower mould
Dislocation, overall wiring board is delivered on machining area and be sent from single wiring board by feed device by the feed device to be added
Work area domain.
The present invention can be improved by following scheme：
A kind of automatic scoreboard equipment of described wiring board, the mold have top base and below top bases
Upper stent, the lower mould have bottom base and the lower stent above bottom base, upper stent and lower stent
Opposite face on respectively form fixed portion and lower fixed part；Upper stent and lower stent are longitudinally each provided with pilot hole
With lower pilot hole, upper movable mold and lower movable mold are fixed on top base and bottom base and pierce into pilot hole respectively respectively
With lower pilot hole；The elastic device includes upper device for ejecting and lower device for ejecting, and the upper device for ejecting is arranged on top base
When making mold in the vertical against or away from the lower mould between upper stent, upper movable mold is towards the end face of lower mould
The surface of fixed part or the flush with upper fixed part are higher by, the lower device for ejecting is arranged on bottom base and lower movable mold
Between make mold in the vertical against or away from the lower mould when, lower movable mold is less than lower fixation towards the end face of mold
The surface in portion or the flush with lower fixed part.
The apparent surface of a kind of automatic scoreboard equipment of described wiring board, upper stent and lower stent has sunk area
And the accommodating cavity that can house wiring board is formed, fixed portion and lower fixed clan are in sunk area, and mold is in longitudinal direction
During the upper remote lower mould, the upper device for ejecting makes the distance between top base and upper stent be equal to or more than the appearance
Put the depth of chamber.
A kind of automatic scoreboard equipment of described wiring board, the top base are further separated into the seat of honour stacked on top of one another and above led
Seat, upper guide bracket correspond to the upper movable mold and are provided with mould pilot hole living, on the installation seat of honour of upper movable mold and through mould guiding living
Hole, the upper device for ejecting include at least two upper springs, and the upper guide bracket corresponds to the upper spring and is provided with for the upper bullet
The spring channels that spring passes through, the upper spring connect the top base, other end connection through the spring channels and its one end
Fixed mould.
A kind of automatic scoreboard equipment of described wiring board, the mold have longitudinally disposed guide pillar, led described in correspondence
Lower mould is provided with guide hole described in post, and the guide pillar interts into the guide hole, and resetting means is provided between mold and lower mould
And the mold is longitudinally away from the lower mould, the wiring board board separating device, which also includes one, can be interrupted upper mould described in punching press
The punching mechanism of tool, in mold described in punching mechanism punching press, the mold overcomes the resetting means along guide pillar
Active force and against the lower mould.
A kind of automatic scoreboard equipment of described wiring board, the feed device include mounting seat and driving on installation support
Device, mounting seat can do moving back and forth of advancing or step back on support under the driving of drive device, be set in mounting seat
The the first feeding arm and the second feeding arm for having switching mechanism and being arranged side by side, on the first feeding arm and the second feeding arm
Set to promote wiring board to the first pusher that machining area is processed to refer to and wiring board is sent from into machining area respectively
Second pusher refers to, and when the mounting seat is advanced, switching mechanism, which acts on the first feeding arm and the second feeding arm, makes first to push away
Material refers to refers to promotion wiring board with the second pusher, and when mounting seat retreats, switching mechanism acts on the first feeding arm and second
Feeding arm refers to the first pusher to refer to avoidance wiring board with the second pusher.
A kind of automatic scoreboard equipment of described wiring board, the guide pillar, guide hole and resetting means is unilateral is arranged at mold
On lower mould one side, the first described feeding arm and the second feeding arm pass through institute from the another side of mold and lower mould
State machining area.
A kind of automatic scoreboard equipment of described wiring board, there is the first pin joint seat and the second pin joint seat in the mounting seat,
The first end of the first feeding arm and the second feeding arm is articulated on the first pin joint seat and the second pin joint seat respectively, described
First pusher, which refers to refer to the second pusher, to be separately mounted on the second end of the first feeding arm and the second feeding arm.
A kind of automatic scoreboard equipment of described wiring board, the switching mechanism include being arranged on be hinged in the mounting seat
Seat, the eccentric block being fixedly mounted on the first feeding arm, and the cylinder being hinged on hinged seat, the cylinder body of cylinder are hinged on
On joint chair, the cylinder axis of cylinder are articulated with eccentric block, and the be hinged central shaft that cylinder axis are articulated with eccentric block is parallel and deviate from
The rotary middle spindle of the first feeding arm is set, and being provided between the first feeding arm and the second feeding arm makes second
The feeding arm link gear consistent with the first feeding arm action.
The advantages of wiring board of the present invention automatic scoreboard equipment, is to be made up of some uniline plates automatically
Overall wiring board is automatically separated into some single wiring boards.
The second object of the present invention is the method for providing a kind of automatic scoreboard of wiring board, automatically will be by some lists with realization
The overall wiring board of one wiring board composition is automatically separated into some single wiring boards.
To achieve the above object, the present invention uses following technical scheme：
A kind of automatic scoreboard method of wiring board, has used the automatic scoreboard equipment of wiring board described above, will be by some lists
The overall wiring board of one wiring board composition is automatically separated into some single wiring boards, comprises the steps of：
1), mold is in the state away from lower mould in the vertical, and overall wiring board is sent to by feed device to be added
On the domain of work area；
2), mold is in the state against lower mould, movable module and the mistake of fixed module in the vertical in the vertical
Position action makes fixed part and circuit of the circuit plate part clamped by with upper movable mold and lower movable mold clamped by lower fixed part
Plate part is separated, and overall wiring board is divided into some single wiring boards；
3), mold recovers to be in the state away from lower mould in the vertical, and feed device is some independent by what is formed
Wiring board be sent from machining area, realize a scoreboard process.
The present invention can be improved by following scheme：
Carrying out above-mentioned steps 3) when, some individually wiring boards 100 formed are sent from machining area by feed device 2
While, also the overall wiring board 200 being made up of some uniline plates is delivered on the machining area, to realize production
Not intermittently.
The advantages of wiring board automated process of the present invention, is the entirety that will can be made up of automatically some uniline plates
Wiring board is automatically separated into some single wiring boards.
(4) illustrate
Fig. 1 is the stereoscopic-state schematic diagram of uniline plate；
Fig. 2 is a stereoscopic-state schematic diagram of overall wiring board；
Fig. 3 is another stereoscopic-state schematic diagram of overall wiring board；
Fig. 4 is an a kind of stereoscopic-state structural representation of the automatic scoreboard equipment of wiring board in embodiment；
Fig. 5 is an a kind of cross section structure diagram of the automatic scoreboard equipment of wiring board in embodiment；
Fig. 6 is the stereoscopic-state structural representation of board separating device in embodiment；
Fig. 7 be in embodiment board separating device face status architecture schematic diagram (mold and lower mould longitudinal direction mutually from)；
Fig. 8 is the vertical view state structural representation of board separating device in embodiment；
Fig. 9 is the A-A schematic cross-sectional views in Fig. 7；
Figure 10 is the B-B schematic cross-sectional views in Fig. 8；
Figure 11 is the C-C schematic cross-sectional views in Fig. 8；
Figure 12 is the D-D schematic cross-sectional views in Fig. 8；
Figure 13 is that board separating device faces status architecture schematic diagram (mold longitudinal direction against lower mould) in embodiment；
Figure 14 is the E-E schematic cross-sectional views in Fig. 7；
Figure 15 is the F-F schematic cross-sectional views in Figure 13；
Figure 16 is that (mold longitudinal direction is against lower mould and activity for the status architecture schematic diagram of facing of board separating device in embodiment
Module forms dislocation in the vertical with fixed module)；
Figure 17 is the G-G schematic cross-sectional views (circuit board status is not shown) in Figure 16；
Figure 18 is the G-G schematic cross-sectional views (showing circuit board status) in Figure 16；
Figure 19 is a cross section structure diagram (situation for not avoiding groove) for board separating device；
Figure 20 is that (the first pusher refers to refers to avoidance with the second pusher for the stereoscopic-state structural representation of feed device in embodiment
During wiring board)；
Figure 21 is the vertical view state structural representation of feed device in embodiment；
Figure 22 is that (the first pusher refers to refers to promotion with the second pusher for the stereoscopic-state structural representation of feed device in embodiment
During wiring board).
Accompanying drawing identifier declaration：
100th, single wiring board；101st, it is recessed；200th, overall wiring board；201st, line of weakness；
1st, support；2nd, feed device；3rd, board separating device；4th, mold；5th, lower mould；
21st, mounting seat；211st, the first pin joint seat；212nd, the second pin joint seat；
22nd, drive device；
23rd, switching mechanism；231st, hinged seat；232 eccentric blocks；233rd, cylinder
24th, the first feeding arm；241st, the first pusher refers to；；
25th, the second feeding arm；251st, the second pusher refers to；
26th, link gear；261st, gangbar；262nd, the first rotating disk；263rd, the second rotating disk；
401st, guide pillar；41st, top base；411st, the seat of honour；412nd, upper guide bracket；
42nd, upper stent；421st, accommodating cavity；422nd, upper pilot hole；
501st, guide hole；51st, bottom base；52nd, lower stent；521st, lower pilot hole；
61st, upper fixed part；62nd, lower fixed part；621st, passage is avoided；
71st, upper movable mold；72nd, lower movable mold；
81st, punching mechanism；82nd, resetting means；83rd, groove is avoided；841st, upper device for ejecting；842nd, lower device for ejecting；
(5) embodiment
The automatic scoreboard equipment of a kind of wiring board as shown in figures 4 and 5, to will be by some uniline plate groups
Into overall wiring board 200 (as shown in accompanying drawing 2 or accompanying drawing 3, it is some that overall wiring board sets some line of weakness 201 to be divided into
Uniline plate) some individually wiring boards 100 (as shown in Figure 1) are automatically separated into, it includes support 1, on support 1
Feed device 2 and board separating device 3.
As shown in accompanying drawing 6 to accompanying drawing 19, board separating device 3 includes mold 4, lower mould 5, fixed module, movable module, and
Punching mechanism 81.Mold 4 can be in longitudinal direction (Z-direction in accompanying drawing) against or away from lower mould 5, mold 4 and lower mould
A machining area is formed between tool 5.
The mold 4 has longitudinally disposed guide pillar 401, and lower mould 5 described in the corresponding guide pillar 401 is provided with guide hole
501, the guide pillar 401 interts into the guide hole 501, is provided with resetting means 82 between mold 4 and lower mould 5 and makes on described
Mould 4 is longitudinally away from the lower mould 5.Punching mechanism 81 can be interrupted mold 4 described in punching press, the punching press of punching mechanism 81 (or
Push) mold 4 when, the mold 4 overcomes the active force of the resetting means 82 and against described along guide pillar 401
Lower mould 5.When punching mechanism 81 stops punching press (or pushing) described mold 4, the mold 4 is along guide pillar 401 in institute
State the active force of resetting means 82 and the remote lower mould 5.The resetting means 82 can be provided in mold 4 and lower mould
The compression spring of tool 5.
Fixed module includes being separately positioned on mold 4 and the upper fixed part 61 on lower mould 5 and lower fixed part 62, activity
Module includes being separately positioned on mold 4 and the upper movable mold 71 on lower mould 5 and lower movable mold 72, and mold 4 supports on longitudinal direction
Mould 5 makes the movable module to form dislocation in the vertical with fixed module in the presence of an elastic device on the lower.
The mold 4 has top base 41 and the upper stent 42 installed in the lower section of top base 41.The top base 41
The seat of honour 411 stacked on top of one another and upper guide bracket 412 can be further separated into, the corresponding upper movable mold 71 of upper guide bracket 412 is provided with work
Mould pilot hole, on the installation seat of honour 411 of upper movable mold 71 and through mould pilot hole living.The lower mould 5 has the He of bottom base 51
Lower stent 52 above bottom base 51.
Fixed portion 61 and lower fixed part 62 are respectively formed on the opposite face of upper stent 42 and lower stent 52.It is upper solid
The apparent surface of cover half 42 and lower stent 52 has sunk area and forms the accommodating cavity 421 that can house wiring board, in this reality
Apply in example, the sunk area is arranged on the lower surface of stent 42.Fixed portion 61 and lower fixed part 62 fall
In sunk area, mold 4 in the vertical away from the lower mould 5 when, the upper device for ejecting 841 makes top base 41 and upper solid
The distance between cover half 42 (d marked such as accompanying drawing 9) is equal to or more than the depth of the accommodating cavity 421.
In fact, in order to which the overall wiring board 200 that can be formed to multiple uniline plates is divided into some single wiring boards
100, upper stent 42 and the longitudinal direction of lower stent 52 respectively set at least one upper pilot hole 422 and lower pilot hole 521, upper pilot hole
422 and lower pilot hole 521 opposite face of fixed mould 42 and lower stent 52 is formed at least one upper fixed part respectively
61 and lower fixed part 62.Upper movable mold 71 and lower movable mold 72 are fixed on respectively on top base 41 and bottom base 51 and difference
Pierce into pilot hole 422 and lower pilot hole 521.The upper pilot hole 422 and upper fixed part 61 are in transverse direction (the X-axis side in accompanying drawing
To) on be alternately arranged, the lower pilot hole 521 and lower fixed part 62 are alternately arranged in the horizontal.Specific in the present embodiment, it is total to
Having four upper lower fixed parts 62, three of fixed part 61, four, above movable mold 71 and three lower movable molds 72, its arrangement mode can join
Read shown in accompanying drawing 9.
In a lateral direction, the both sides of each lower fixed part 62 and lower movable mold 72 possess have for the wiring board it
The avoidance passage 621 that pin passes through, the avoidance passage 621 extend along wiring board feedstock direction (Y direction in accompanying drawing)
Set.The opposite face and upper movable mold 71 of each fixed portion 61 and lower fixed part 62 and the opposite face of lower movable mold 72
On be provided with avoidance groove 83 for the component for avoiding the wiring board, the avoidance groove 83 is fed along wiring board
Direction is extended.It is that can not have to set the avoidance recessed in fact, if not for the component of wiring board to be avoided
Groove 83, as shown in Figure 19.
The elastic device includes upper device for ejecting 841 and lower device for ejecting 842.The upper device for ejecting 841 is arranged on
When making mold 4 in the vertical against or away from the lower mould 5 between top base 41 and upper stent 42, the upper court of movable mold 71
The end face of downward mould 5 is higher by the surface of fixed part 61 or the flush with upper fixed part 61.The lower device for ejecting 842
When making mold 4 in the vertical against or away from the lower mould 5 between bottom base 51 and lower movable mold 72, lower activity
Surface of the mould 72 towards the end face of mold 4 less than lower fixed part 62 or the flush with lower fixed part 62.Specifically, institute
Stating device for ejecting 841 includes at least two upper springs, and the corresponding upper spring of upper guide bracket 412 is provided with for the upper bullet
The spring channels that spring passes through, the upper spring connect the top base 41 through the spring channels and its one end, and the other end connects
Connect fixed mould 42.Lower device for ejecting 842 is corresponding to set a lower spring per pilot hole 521 once, and lower spring is placed in down
In pilot hole 521 and both ends are resisted against the bottom base 51 and lower movable mold 72 respectively.
Overall wiring board 200 is delivered on machining area and single wiring board 100 is passed through into feeding by the feed device 2
Device 2 is sent from machining area.As shown in accompanying drawing 20 to accompanying drawing 22, the feed device 2 includes the mounting seat 21 on installation support 1
With drive device 22, mounting seat 21 can do moving back and forth of advancing or step back under the driving of drive device 22 on support 1.
Specifically, the support 1 is equipped with guide rail, and the mounting seat 21 is provided with guide groove, and the guide groove is matched somebody with somebody with guide rail
Close connection；The drive device 22 includes motor, driving wheel, driven pulley and the feed belt fitted together in a familiar manner,
The mounting seat 21 is fixed on feed belt.
The the first feeding arm 24 and the second feeding arm 25 that switching mechanism 23 is provided with mounting seat 21 and is arranged side by side,
Promote wiring board to be processed to machining area is set respectively on first feeding arm 24 and the second feeding arm 25
One pusher, which refers to 241 and wiring board is sent to the second pusher of machining area, refers to 251, when the mounting seat 21 is advanced, switching mechanism
23 act on the first feeding arm 24 and the second feeding arm 25 make the first pusher refer to 241 and second pusher refer to 251 promotion circuits
Plate, and when mounting seat 21 retreats, switching mechanism 23, which acts on the first feeding arm 24 and the second feeding arm 25, makes first to push away
Material refer to 241 and second pusher refer to 251 avoidance wiring boards.
In addition, the wiring board for being prepared to enter into machining area is the overall wiring board 200 being made up of some uniline plates, often
The front/rear end of one uniline plate is provided with depression 101, and first pusher refers to 241 by least two correspondence overall wires
Depression setting, the stick pusher being in the form of a column are formed on road, and second pusher refers to 251 by corresponding each uniline plate group fovea superior
The stick pusher for fall into setting, being in the form of a column is formed.
The guide pillar 401, guide hole 501 and resetting means 82 is unilateral is arranged on mold 4 and lower one side of mould 5, it is described
The first feeding arm 24 and the second feeding arm 25 can be passed unopposed through from the another side of mold 4 and lower mould 5 it is described
Machining area.
There is the first pin joint seat 211 and the second pin joint seat 212, the first feeding arm 24 and in the mounting seat 21
The first end of two feeding arms 25 is articulated on the first pin joint seat 211 and the second pin joint seat 212 respectively, and first pusher refers to
241 and second pusher refer to 251 and be separately mounted on the second end of the first feeding arm 24 and the second feeding arm 25.
The switching mechanism 23 include be arranged on the mounting seat 21 on hinged seat 231, be fixedly mounted on the first feeding
Eccentric block 232 on arm 24, and the cylinder 233 being hinged on hinged seat 231, the cylinder body of cylinder are hinged on hinged seat 231,
The cylinder axis of cylinder are articulated with eccentric block 232, and the be hinged central shaft that cylinder axis are articulated with eccentric block 232 is parallel and deviate from institute
The rotary middle spindle for stating the first feeding arm 24 is set, and being provided between the first feeding arm 24 and the second feeding arm 25 makes
The link gear 26 that second feeding arm 25 and the first feeding arm 24 are kept strokes.
Specifically, the link gear 26 includes gangbar 261 and is separately positioned on the first feeding arm 24 and second
The first rotating disk 262 and the second rotating disk 263 of feeding arm 25, the central shaft difference of the rotating disk 263 of the first rotating disk 262 and second
Coaxial with the rotary middle spindle of the first feeding arm 24 and the second feeding arm 25, the both ends of the gangbar 261 are respectively articulated with
On the first rotating disk 262 and the second rotating disk 263, the be hinged central point at the both ends of the gangbar 261 deviates first rotating disk
262 and second rotating disk 263 center.
Using the above-mentioned automatic scoreboard equipment of wiring board with to the overall wiring board 200 being made up of some uniline plates from
It is dynamic to be divided into some individually wiring boards 100 and comprise the following steps.
1), mold 4 is in the state away from lower mould 5 in the vertical, and overall wiring board 200 passes through the quilt of feed device 2
Deliver on machining area；
2), mold 4 is in the state against lower mould 5 in the vertical, and movable module and fixed module are in the vertical
Dislocation motion makes fixed part 61 and the circuit plate part clamped by lower fixed part 62 and upper movable mold 71 and the lower institute of movable mold 72
The circuit plate part of clamping is separated, and overall wiring board 200 is divided into some individually wiring boards 100；
3), mold 4 recovers to be in the state away from lower mould 5, some lists that feed device 2 will be formed in the vertical
Only wiring board 100 is sent from machining area, realizes a scoreboard process.
Carrying out above-mentioned steps 3) when, some individually wiring boards 100 formed are sent from machining area by feed device 2
While, also the overall wiring board 200 being made up of some uniline plates is delivered on the machining area, to realize production
Not intermittently.
Above-described embodiment is better embodiment of the invention, but the implementation of the present invention is not limited to this, and other are any
Without departing from the present invention Spirit Essence with made under principle change, modification, replacement, combine, simplification, be equivalent displacement side
Formula, it is included within protection scope of the present invention.
Claims (9)
- A kind of 1. automatic scoreboard equipment of wiring board, the overall wiring board being made up of some uniline plates to be automatically separated into Some single wiring boards, automatic scoreboard equipment include support, feed device and board separating device on support, scoreboard dress Put including mold, lower mould, fixed module and movable module, mold can be in the vertical against or away from lower mould, upper mould A machining area is formed between tool and lower mould, fixed module includes the upper fixed part being separately positioned on mold and lower mould With lower fixed part, movable module includes being separately positioned on mold and the upper movable mold on lower mould and lower movable mold, mold It is vertical the movable module is formed mistake in the vertical with fixed module in the presence of an elastic device upwards against lower mould Overall wiring board is delivered on machining area and is sent from processing by single wiring board by feed device by position, the feed device Region；The mold has top base and the upper stent below top base, and the lower mould has bottom base and peace Fixed portion and lower solid is respectively formed on the opposite face of lower stent above bottom base, upper stent and lower stent Determine portion；Upper stent and lower stent are longitudinally each provided with pilot hole and lower pilot hole, upper movable mold and lower movable mold difference It is fixed on top base and bottom base and pierces into pilot hole respectively and lower pilot hole；The elastic device includes upper ejection Device and lower device for ejecting, the upper device for ejecting be arranged on make between top base and upper stent mold in the vertical against Or during away from the lower mould, upper movable mold is higher by the surface of upper fixed part or table with upper fixed part towards the end face of lower mould Face is concordant, and the lower device for ejecting, which is arranged on, makes mold in the vertical against or away from described between bottom base and lower movable mold During lower mould, surface of the lower movable mold towards the end face of mold less than lower fixed part or the flush with lower fixed part.
- A kind of 2. automatic scoreboard equipment of wiring board according to claim 1, it is characterised in that：Upper stent and lower fixation The apparent surface of mould has sunk area and forms the accommodating cavity that can house wiring board, and fixed portion and lower fixed clan exist In sunk area, mold in the vertical away from the lower mould when, the upper device for ejecting make top base and upper stent it Between distance be equal to or more than the accommodating cavity depth.
- A kind of 3. automatic scoreboard equipment of wiring board according to claim 2, it is characterised in that：The top base is further It is divided into the seat of honour stacked on top of one another and upper guide bracket, upper guide bracket corresponds to the upper movable mold and is provided with mould pilot hole living, upper movable mold Install on the seat of honour and through mould pilot hole living, the upper device for ejecting includes at least two upper springs, and the upper guide bracket corresponds to institute State spring and be provided with the spring channels passed through for the upper spring, the upper spring connects through the spring channels and its one end The top base is connect, the other end connects fixed mould.
- A kind of 4. automatic scoreboard equipment of wiring board according to claim 3, it is characterised in that：The mold has vertical To the guide pillar of setting, lower mould described in the corresponding guide pillar is provided with guide hole, and the guide pillar interts into the guide hole, mold with It is provided with resetting means between lower mould and the mold is longitudinally away from the lower mould, the wiring board board separating device also wraps The punching mechanism of mold described in punching press can be interrupted by including one, in mold described in punching mechanism punching press, the mold along Guide pillar overcomes the active force of the resetting means and against the lower mould.
- A kind of 5. automatic scoreboard equipment of wiring board according to any one of claims 1 to 4, it is characterised in that：The feeding Device includes the mounting seat and drive device on installation support, before mounting seat can be done under the driving of drive device on support Enter or that steps back moves back and forth, the first feeding arm and the second feeding hand that switching mechanism is provided with mounting seat and is arranged side by side Promote wiring board to be processed to machining area first is set respectively on arm, the first feeding arm and the second feeding arm The second pusher that pusher refers to and be sent from wiring board machining area refers to, and when the mounting seat is advanced, switching mechanism acts on first Feeding arm and the second feeding arm refer to the first pusher to refer to promotion wiring board with the second pusher, and when mounting seat retreats, turn over Rotation mechanism acts on the first feeding arm and the second feeding arm refers to the first pusher to refer to avoidance wiring board with the second pusher.
- A kind of 6. automatic scoreboard equipment of wiring board according to claim 5, it is characterised in that：The guide pillar, guide hole and Resetting means is unilateral to be arranged on mold and lower mould one side, and the first described feeding arm and the second feeding arm are from upper mould The another side of tool and lower mould passes through the machining area.
- A kind of 7. automatic scoreboard equipment of wiring board according to claim 6 claim, it is characterised in that：The installation There is the first pin joint seat and the second pin joint seat, the first end of the first feeding arm and the second feeding arm is pivotally connected respectively on seat The first feeding hand is separately mounted on the first pin joint seat and the second pin joint seat, first pusher refers to refer to the second pusher On second end of arm and the second feeding arm.
- A kind of 8. automatic scoreboard equipment of wiring board according to claim 7, it is characterised in that：The switching mechanism includes Hinged seat in the mounting seat, the eccentric block being fixedly mounted on the first feeding arm, and be hinged on hinged seat Cylinder, the cylinder body of cylinder is hinged on hinged seat, and the cylinder axis of cylinder are articulated with eccentric block, and cylinder axis are articulated with eccentric block Be hinged central shaft it is parallel and deviate from the rotary middle spindle of the first feeding arm and set, the first feeding arm and the The link gear for making the second feeding arm consistent with the first feeding arm action is provided between two feeding arms.
- A kind of 9. automatic scoreboard method of wiring board, it is characterised in that the method use claim 1 to 8 any claim The automatic scoreboard equipment of described wiring board, the overall wiring board being made up of some uniline plates is automatically separated into some independent Wiring board, comprise the steps of：1), mold is in the state away from lower mould in the vertical, and overall wiring board is sent to processing district by feed device On domain；2), mold is in the state against lower mould in the vertical, and dislocation of the movable module with fixed module in the vertical is moved Make to make fixed part and circuit plate portion of the circuit plate part clamped by with upper movable mold and lower movable mold clamped by lower fixed part Split-phase separates, and overall wiring board is divided into some single wiring boards；3), mold recovers to be in the state away from lower mould, some single lines that feed device will be formed in the vertical Road plate is sent from machining area, realizes a scoreboard process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610217152.6A CN105881648B (en) | 2016-04-09 | 2016-04-09 | A kind of automatic scoreboard device and method of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610217152.6A CN105881648B (en) | 2016-04-09 | 2016-04-09 | A kind of automatic scoreboard device and method of wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105881648A CN105881648A (en) | 2016-08-24 |
| CN105881648B true CN105881648B (en) | 2018-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610217152.6A Expired - Fee Related CN105881648B (en) | 2016-04-09 | 2016-04-09 | A kind of automatic scoreboard device and method of wiring board |
Country Status (1)
| Country | Link |
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| CN (1) | CN105881648B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114179164B (en) * | 2022-02-15 | 2022-04-22 | 四川英创力电子科技股份有限公司 | Gong machine for printed board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201789688U (en) * | 2010-08-19 | 2011-04-06 | 西迪斯(中山)科技有限公司 | PCB (printed circuit board) separator |
| CN202964785U (en) * | 2012-10-26 | 2013-06-05 | 恒诺微电子(嘉兴)有限公司 | Plate-seperating stamping die |
| CN104960035A (en) * | 2015-05-15 | 2015-10-07 | 深圳市泉峰精密机械有限公司 | Board-splitting and edge-removing machine for circuit board and method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10277997A (en) * | 1997-03-31 | 1998-10-20 | Ibiden Co Ltd | Punch die |
| JPH11245199A (en) * | 1998-02-27 | 1999-09-14 | Daitekkusu:Kk | Blanking device for mounting board |
| JP2011025383A (en) * | 2009-07-28 | 2011-02-10 | Panasonic Corp | Die for dividing multilayer substrate |
| KR101613267B1 (en) * | 2014-11-04 | 2016-04-18 | (주)디디피테크 | punching apparatus for flexible printed circuit board and punching method using thereof |
-
2016
- 2016-04-09 CN CN201610217152.6A patent/CN105881648B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201789688U (en) * | 2010-08-19 | 2011-04-06 | 西迪斯(中山)科技有限公司 | PCB (printed circuit board) separator |
| CN202964785U (en) * | 2012-10-26 | 2013-06-05 | 恒诺微电子(嘉兴)有限公司 | Plate-seperating stamping die |
| CN104960035A (en) * | 2015-05-15 | 2015-10-07 | 深圳市泉峰精密机械有限公司 | Board-splitting and edge-removing machine for circuit board and method |
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| CN105881648A (en) | 2016-08-24 |
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