CN105881246A - Substrate treatment device - Google Patents
Substrate treatment device Download PDFInfo
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- CN105881246A CN105881246A CN201410796585.2A CN201410796585A CN105881246A CN 105881246 A CN105881246 A CN 105881246A CN 201410796585 A CN201410796585 A CN 201410796585A CN 105881246 A CN105881246 A CN 105881246A
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- groove
- substrate
- module
- board treatment
- height
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- Mechanical Treatment Of Semiconductor (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The invention relates to the technical field of touch displaying, in particular to a substrate treatment device. The substrate treatment device comprises a second module for treatment of a substrate. The second module at least comprises a body. The body at least comprises a second surface, a plurality of first grooves and a plurality of second grooves. The first grooves and the second grooves are formed in the body. The multiple first grooves are a series of concentric rings with the center of the first surface as the circle point. The multiple second grooves are connected with the multiple first grooves correspondingly.
Description
Technical field
The present invention relates to technical field of touch-control display, particularly relate to a kind of substrate board treatment.
Background technology
Applying capacitive touch screen to become the main trend of society on mobile phone, capacitive touch screen is made
For a kind of novel human-computer interaction interface, progressively it is widely used on various digital information system, from little
Type product such as mobile phone, PDA, digital product, e-Book, to medium-sized product such as automatic navigator, game machine,
Household electrical appliance, industry control instrument, then to large product such as POS system, common query and self-aid system, just
Take on touch PDP conventional in computer, Medical Instruments and TV news red-letter day it can be seen that electric capacity
Formula touch-screen product.Therefore, capacitive touch screen has market prospects widely.
Capacitive touch screen includes glass substrate and the functional layer being formed on glass substrate.At described glass
Before forming described functional layer on substrate, because of the plane that described glass baseplate surface is the most smooth and smooth, need
The surface of described glass substrate processed, to make the surface of described glass substrate become smooth and smooth.
Industry generally uses the mode of polishing to process glass substrate.Existing burnishing device generally includes upper cover
Plate and mill.Described upper cover plate is used for adsorbing glass substrate and described glass substrate being moved to described mill
Above and described glass substrate is withdrawn from described mill.Described mill (referring to Fig. 1) is for institute
Polishing in the surface stating glass substrate, its surface is provided with and a plurality of is mutually perpendicular in groined type the recessed of distribution
Groove, it is simple to described polishing fluid passes through.So, in existing burnishing device, in groined type, the groove of distribution is easy
Cause described polishing fluid to be assembled and be unfavorable for the discharge of described polishing fluid, the efficiency of extreme influence polishing and non-defective unit
Rate.
Summary of the invention
In view of this, it is necessary to a kind of processing substrate dress that can effectively promote yields and treatment effeciency is provided
Put.
A kind of substrate board treatment includes that the second module of a process substrate, described second module at least include
Body, described body at least includes a second surface with a plurality of first groove being arranged on described body with many
Bar the second groove, described a plurality of first groove be with described first surface center as round dot a series of with one heart
Ring, described a plurality of second groove is connected respectively at described a plurality of first groove.
In the described substrate board treatment that the present invention provides, described body also includes the 3rd surface and the 4th table
Face, described second surface is shaggy plane, and described 3rd surface and the 4th surface are respectively with described
Two surface contiguous, and it is described second surface and is formed to described body sunken inside;Described a plurality of first
Groove is formed by described 3rd surface, and described a plurality of second groove is formed by described 4th surface.
In the described substrate board treatment that the present invention provides, described substrate board treatment also includes one first mould
Block, described first module combines with described second module separably;Described first module is used for inhaling
Attached described substrate also fixing described substrate, and described substrate is moved carry out processing, by described to the second module
Described second module withdrawn by the substrate that second resume module is good;Described first module includes that one connects with described substrate
Smooth and the smooth first surface touched, mobile to described after described first module is adsorbed and fixed substrate
During the second module contact, described substrate surface will contact with described second surface, and the most described first surface
It is parallel to each other with described second surface.
The present invention provide described substrate board treatment in, have between any two first grooves identical between
A series of with same initial point as the center of circle away from, described a plurality of first groove being projected as on described second surface
Concentric ring;Having identical angle between any two second grooves, described a plurality of second groove is described second
On surface be projected as a series of through described first groove described second surface projection formed concentric ring
The center of circle and run through the rectangle of described second surface.
In the described substrate board treatment that the present invention provides, the closer to the first groove of described circle centre position in institute
The outside diameter stating the concentric ring formed on second surface is the least, and described first groove is by through the described center of circle
The figure that the plane of straight line is cut is in the rectangle towards described second surface one side opening, described a plurality of first
There is between groove identical height, the distance between bottom and the described second surface on the most described 3rd surface
Unanimously.
In the described substrate board treatment that the present invention provides, described second surface is rounded, described 4th table
The figure that face is cut by the plane through the straight line that is perpendicular to described second surface diameter is one towards described the
The rectangle of two surface one side openings, and described a plurality of second groove is highly consistent, the most described 4th surface
Bottom is consistent with the distance between described second surface.
In the described substrate board treatment that the present invention provides, have identical between described a plurality of first groove
Width, has identical width, and described a plurality of first groove and a plurality of between described a plurality of second groove
Also there is between two grooves identical width and height.
In the described substrate board treatment that the present invention provides, described body is overall in oblate cylinder, and described the
Two surfaces are rounded, the closer to being smaller than between any two first grooves of described second surface circle centre position
Further away from the spacing between any two first grooves of described second surface circle centre position, any two second grooves
Between there is different angles.
In the described substrate board treatment that the present invention provides, the closer to the first of described second surface circle centre position
The height of groove is the least, and the height further away from the first groove of described second surface circle centre position is the biggest;Described
Two grooves height further away from the described second surface center of circle on the direction along described second surface diameter is the biggest;
It is interconnected between described a plurality of first groove and described a plurality of second groove, forms one and be easy to process substrate
The network that material passes through, each described second groove respectively and has two between each described first groove
One junction, has identical height near the first groove of described first junction and the part of the second groove
Degree, or, the height of the part of the first groove near described first junction is more than near described first even
Connect the height of the part of described second groove at place.
In the described substrate board treatment that the present invention provides, described first groove connects further away from described first
The height of the part at place is the least, and the quantity of described first groove is less than, greater than or equal to described second groove
Quantity, has an identical or different width between described first groove and described second groove, and the most described first
The difference of the radius of inner circle and the cylindrical of the concentric ring that groove projection on described second surface is formed equal to or
It is not equal to the width of the rectangle that the projection on described second surface of described second groove is formed.
In the substrate board treatment that the present invention provides, by arranging a plurality of first groove and second recessed on body
Groove, in order to the material processing substrate passes through, and then is easy to process the surface of described substrate, promotes
The yields of processing substrate and efficiency.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
The partial schematic diagram of the substrate board treatment of the better embodiment that Fig. 1 provides for the present invention.
Fig. 2 is the schematic partial cross-sectional view of the substrate board treatment shown in Fig. 1.
Detailed description of the invention
The substrate board treatment provided for the explanation present invention, is described in detail below in conjunction with Figure of description.
Please refer to Fig. 1 and Fig. 2, the processing substrate dress of its better embodiment provided for the present invention
The partial schematic diagram put and schematic partial cross-sectional view.Described substrate board treatment 100 is used for processing substrate, as
Glass substrate, it includes the first module (not shown) and the second module 120, and described first module can
Combine with described second module 120 discretely.Described first module is used for adsorbing described substrate and consolidating
Fixed described substrate, and described substrate is moved carry out processing, by described second module to the second module 120
Described second module withdrawn by 120 substrates handled well.Described first module includes that one contacts with described substrate
First surface (not shown), described first surface is a smooth plane in the present embodiment, institute
State the first module overall in flat cylindrical in the present embodiment, in other embodiments, described first
Module can also be in the most flat cuboid of other shapes.
Described second module 120 includes body 121 and a plurality of first groove being arranged on described body 121
123 and a plurality of second groove 125.Described body 121 entirety is flat cylindrical, and it has one second table
Face 121a and one the 3rd surface 121b, the 4th surface 121c.Described second surface 121a is circular, its
It is that one is coarse but even curface.Move to described after described first module 110 is adsorbed and fixed substrate
When second module 120 contacts, described substrate surface will contact with described second surface 121a, and now institute
State first surface to be parallel to each other with described second surface 121a.
Described 3rd surface 121b is adjacent with described second surface 121a, and it is by described second surface 121a
Formed to described body 121 sunken inside.Described a plurality of first groove 123 is by described 3rd surface 121b shape
Become, and described a plurality of first groove 123 being projected as on described second surface 121a is a series of with described
The central point (center of circle) of second surface 121a is the concentric ring in the center of circle, and any two the first grooves 123
Between there is identical spacing, the closer to first groove 123 in the described second surface 121a center of circle described
The outside diameter of the concentric ring that the projection on second surface 121a is formed is the least.Described 3rd surface 121b quilt
The figure cut through the described diametric plane of second surface 121a be in the present embodiment one towards
The rectangle of described second surface 121a mono-side opening, described a plurality of first groove 123 highly consistent, i.e.
Distance between the bottom of described 3rd surface 121b and described second surface 121a is consistent.
In other embodiments, can have different height, as more leaned between described first groove 123
First groove 123 of nearly described second surface 121a circle centre position, it is the least, further away from described second
First groove 123 of surface 121a circle centre position, it is the biggest, in order to the material processing substrate passes through
Described first groove 123.Described 3rd surface 121b is by diametric through described second surface 121a
The figure that plane is cut can also be one towards the triangle of described second surface 121a mono-side opening, ellipse
Other shapes such as shape, circle.Also can have different spacing between described first groove 123, i.e. the closer to
Being smaller than further away from described between any two first grooves 123 of described second surface 121a circle centre position
Spacing between any two first grooves 123 of second surface 121a circle centre position.
Described 4th surface 121c is adjacent with described second surface 121a, and it is by described second surface 121a
Formed to described body 121 sunken inside.Described a plurality of second groove 125 is by described 4th surface 121c shape
Become, and described a plurality of second groove 125 being projected as on described second surface 121a is a series of through institute
State the central point (center of circle) of second surface 121a and run through the rectangle of described second surface 121a, and arbitrarily
Article two, having identical angle between the second groove 125, in the present embodiment, described body 121 has
Article 4, the second groove 125, and described body 121 is divided into 8 shapes and big by described second groove 125
Little identical secter pat.Described 4th surface 121c is by through being perpendicular to described second surface 121a diameter
The figure that the plane of straight line is cut is one towards the rectangle of described second surface 121a mono-side opening and described
A plurality of second groove 125 highly consistent, the bottom of the most described 4th surface 121c and described second surface
Distance between 121a is consistent.
In other embodiments, can have different height, as described between described second groove 125
Second groove 125 on the direction along described second surface 121a diameter further away from described second surface 121a
The center of circle, it is the biggest, in order to process the material of substrate by described second groove 125.Any two
Also different angles can be had between second groove 125.
Be interconnected between described a plurality of first groove 123 and described a plurality of second groove 125, formed once
In the network that the material processing substrate passes through, and in the present embodiment, each described second groove 125
Respectively and between each described first groove 123, there are two the first junctions 127, near described first even
First groove 123 at the place of connecing 127 and the part of the second groove 125 have identical height, or, close
The height of the part of the first groove 123 of described first junction 127 is more than near described first junction
The height of the part of described second groove 125 of 127, in order to the material processing substrate passes through.At other
In embodiment, described first groove 123 is the least further away from the height of the part of described first junction 127,
So that the material processing substrate passes through.
In the present embodiment, the quantity of described first groove 123 is less than the quantity of described second groove 125,
There is between described first groove 123 and described second groove 125 identical width, the most described first groove
The inner circle of the concentric ring that 123 projections on described second surface 121a are formed and the difference etc. of the radius of cylindrical
Width in the rectangle that the projection on described second surface 121a of described second groove 125 is formed.At it
In his embodiment, the quantity of described first groove 123 can equal to or more than described second groove 125
Quantity, the width of described first groove 123 is also smaller than the width of described second groove 125, i.e. described
The inner circle of the concentric ring that the projection on described second surface 121a of first groove 123 is formed and the half of cylindrical
The difference in footpath is less than the width of the rectangle that the projection on described second surface 121a of described second groove 125 is formed
Degree.
Described body 121 also includes the through hole 129 being arranged at described second surface 121a circle centre position, uses
Described a plurality of first groove 123 and a plurality of second recessed is flowed to by described through hole 129 in processing the material of substrate
Groove 125.
In the substrate board treatment that the present invention provides, by arranging a plurality of first groove 123 on body 121
With the second groove 125, in order to the material processing substrate passes through, and then is easy to enter the surface of described substrate
Row processes, and promotes yields and the efficiency of processing substrate.
The better embodiment of a kind of substrate board treatment provided for the present invention above, it is right to be interpreted as
The restriction of rights protection scope of the present invention, those skilled in the art should know, without departing from structure of the present invention
On the premise of think of, also can do multiple improvement or replacement, all of such improvement or replacement all should be in the present invention
Rights protection in the range of, i.e. the scope of the present invention should be as the criterion with claim.
Claims (10)
1. a substrate board treatment, it includes the second module of a process substrate, and described second module is extremely
Include less body, described body at least include a second surface and be arranged on described body a plurality of first recessed
Groove and a plurality of second groove, described a plurality of first groove is a series of with described first surface center as round dot
Concentric ring, described a plurality of second groove is connected respectively at described a plurality of first groove.
2. substrate board treatment as claimed in claim 1, it is characterised in that: described body also includes the
Three surfaces and the 4th surface, described second surface is shaggy plane, described 3rd surface and the 4th table
Face adjoins with described second surface respectively, and it is described second surface to described body sunken inside institute shape
Become;Described a plurality of first groove is formed by described 3rd surface, and described a plurality of second groove is by described 4th table
Face is formed.
3. substrate board treatment as claimed in claim 2, it is characterised in that: described substrate board treatment
Also including one first module, described first module combines with described second module separably;Described
First module is used for adsorbing described substrate fixing described substrate, and moves described substrate to the second module
Row processes, substrate good for described second resume module is withdrawn described second module;Described first module includes
The one smooth and smooth first surface contacted with described substrate, when described first module is adsorbed and fixes substrate
Rear movement is to during with described second module contact, and described substrate surface will contact with described second surface, and this
Shi Suoshu first surface is parallel to each other with described second surface.
4. substrate board treatment as claimed in claim 3, it is characterised in that: any two first grooves it
Between there is identical spacing, described a plurality of first groove being projected as on described second surface a series of with
One initial point is the concentric ring in the center of circle;There is between any two second grooves identical angle, described a plurality of second
Groove being projected as on described second surface is a series of throws at described second surface through described first groove
The center of circle of the concentric ring that shadow is formed and run through the rectangle of described second surface.
5. substrate board treatment as claimed in claim 4, it is characterised in that: the closer to described circle centre position
The outside diameter of concentric ring that formed on described second surface of the first groove the least, described first groove quilt
The figure cut through the plane of the straight line in the described center of circle is in the square towards described second surface one side opening
Shape, has an identical height between described a plurality of first groove, the bottom on the most described 3rd surface and described the
Distance between two surfaces is consistent.
6. substrate board treatment as claimed in claim 5, it is characterised in that: described second surface is circle
Shape, the figure that described 4th surface is cut by the plane of the straight line through being perpendicular to described second surface diameter is
One towards the rectangle of described second surface one side opening, and highly consistent, i.e. with described a plurality of second groove
Distance between bottom and the described second surface on described 4th surface is consistent.
7. substrate board treatment as claimed in claim 6, it is characterised in that: described a plurality of first groove
Between there is identical width, there is between described a plurality of second groove identical width, and described a plurality of
Also there is between one groove and a plurality of second groove identical width and height.
8. substrate board treatment as claimed in claim 3, it is characterised in that: described body is overall in flat
Cylinder, described second surface is rounded, the closer to any two first grooves of described second surface circle centre position
Between be smaller than further away from any two first grooves of described second surface circle centre position between spacing,
Between any two second grooves, there is different angles.
9. substrate board treatment as claimed in claim 8, it is characterised in that: the closer to described second table
The height of the first groove of face circle centre position is the least, further away from the height of the first groove of described second surface circle centre position
Spend the biggest;Described second groove is round further away from described second surface on the direction along described second surface diameter
The height of the heart is the biggest;It is interconnected between described a plurality of first groove and described a plurality of second groove, forms one
Be easy to process the network that passes through of material of substrate, each described second groove respectively with each described first groove
Between there are two the first junctions, near the first groove of described first junction and the part of the second groove
There is identical height, or, the height of the part of the first groove near described first junction is more than leaning on
The height of the part of described second groove of the most described first junction.
10. substrate board treatment as claimed in claim 9, it is characterised in that: described first groove is more
Height away from the part of described first junction is the least, and the quantity of described first groove is less than, is equal to or big
Have identical or different between the quantity of described second groove, described first groove and described second groove
Width, the inner circle of the concentric ring that the projection on described second surface of the most described first groove is formed and cylindrical
The rectangle that the difference of radius is formed equal or different to described second groove projecting on described second surface
Width.
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CN201410796585.2A CN105881246B (en) | 2014-12-19 | 2014-12-19 | Substrate board treatment |
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CN201410796585.2A CN105881246B (en) | 2014-12-19 | 2014-12-19 | Substrate board treatment |
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CN105881246A true CN105881246A (en) | 2016-08-24 |
CN105881246B CN105881246B (en) | 2018-06-08 |
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CN201410796585.2A Active CN105881246B (en) | 2014-12-19 | 2014-12-19 | Substrate board treatment |
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Citations (8)
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CN201856158U (en) * | 2010-07-20 | 2011-06-08 | 中芯国际集成电路制造(上海)有限公司 | Wafer polishing locating ring and chemical mechanical polishing device |
JP2011177884A (en) * | 2010-02-05 | 2011-09-15 | Kuraray Co Ltd | Polishing pad |
CN103079767A (en) * | 2010-08-18 | 2013-05-01 | Lg化学株式会社 | Polishing pad for a polishing system |
CN203228105U (en) * | 2013-04-28 | 2013-10-09 | 合肥宏光研磨科技有限公司 | Polyurethane polishing pad with surface grooves |
CN203542340U (en) * | 2013-10-21 | 2014-04-16 | 中芯国际集成电路制造(北京)有限公司 | Chemical mechanical polishing pad |
CN203611120U (en) * | 2013-12-12 | 2014-05-28 | 中芯国际集成电路制造(北京)有限公司 | Chemical-mechanical grinding pad |
CN203738615U (en) * | 2014-02-28 | 2014-07-30 | 自贡硬质合金有限责任公司 | Grinding wheel for parallel surface grinding machine |
CN204471219U (en) * | 2014-12-19 | 2015-07-15 | 浙江金徕镀膜有限公司 | A kind of substrate board treatment |
-
2014
- 2014-12-19 CN CN201410796585.2A patent/CN105881246B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011177884A (en) * | 2010-02-05 | 2011-09-15 | Kuraray Co Ltd | Polishing pad |
CN201856158U (en) * | 2010-07-20 | 2011-06-08 | 中芯国际集成电路制造(上海)有限公司 | Wafer polishing locating ring and chemical mechanical polishing device |
CN103079767A (en) * | 2010-08-18 | 2013-05-01 | Lg化学株式会社 | Polishing pad for a polishing system |
CN203228105U (en) * | 2013-04-28 | 2013-10-09 | 合肥宏光研磨科技有限公司 | Polyurethane polishing pad with surface grooves |
CN203542340U (en) * | 2013-10-21 | 2014-04-16 | 中芯国际集成电路制造(北京)有限公司 | Chemical mechanical polishing pad |
CN203611120U (en) * | 2013-12-12 | 2014-05-28 | 中芯国际集成电路制造(北京)有限公司 | Chemical-mechanical grinding pad |
CN203738615U (en) * | 2014-02-28 | 2014-07-30 | 自贡硬质合金有限责任公司 | Grinding wheel for parallel surface grinding machine |
CN204471219U (en) * | 2014-12-19 | 2015-07-15 | 浙江金徕镀膜有限公司 | A kind of substrate board treatment |
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CN105881246B (en) | 2018-06-08 |
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Address after: 321016 No. 333, Chung Xue street, Jinhua, Zhejiang. Patentee after: Zhejiang Lai Bao Technology Co., Ltd. Address before: 321016 No. 333, Chung Xue street, Jinhua, Zhejiang. Patentee before: Zhejiang Jinley Coating Co., Ltd. |
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