CN105880865A - Low-melting-point aluminum-based soldering material and preparation method thereof - Google Patents
Low-melting-point aluminum-based soldering material and preparation method thereof Download PDFInfo
- Publication number
- CN105880865A CN105880865A CN201410857197.0A CN201410857197A CN105880865A CN 105880865 A CN105880865 A CN 105880865A CN 201410857197 A CN201410857197 A CN 201410857197A CN 105880865 A CN105880865 A CN 105880865A
- Authority
- CN
- China
- Prior art keywords
- pure
- solder
- melting point
- liquid
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a low-melting-point aluminum-based soldering material and a preparation method thereof. An active element Mg is added on the basis of Zn-Al binary eutectic, and therefore a low-melting-point Zn-Al-Mg system ternary active soldering material capable of improving interface reaction uniformity can be formed, wherein alloy elements include, by mass fraction, 5-12% of Al, 5-9% of Mg and the balance Zn. A reaction between the low-melting-point Zn-Al-Mg system ternary active soldering material and an Al base body can be performed in advance, the reaction is uniform in distribution, the reaction degree is sufficient, continuity of an oxidization film on the surface of the aluminum base body can be fast and effectively broken, and therefore wettability for an aluminum alloy and aluminum-based composite materials is good.
Description
Technical field
The present invention relates to the soldering processes of a kind of aluminum matrix composite, join particularly to a kind of Zn-Al-Mg system ternary active solder
Side and soldering processes thereof.
Background technology
It is known that the matter of utmost importance that the soldering of aluminum matrix composite and aluminium alloy is both needed to solve is the most effectively to remove aluminum substrate table
The oxide-film in face.The method of the oxide-film abolishing aluminium alloy or aluminum matrix composite matrix surface at present has three kinds: (1) chemical method,
Such as brazing flux, add the methods such as active element with in chemical reagent cleaning, solder before welding；(2) physical method, as vacuum environment,
Utilize the principle that liquefies under film, plate surface modified；(3) mechanical means, as utilized machinery scraping method, wire brush, Yi Jichao
The cavitation etc. of sound wave.These methods are each has something to recommend him, wherein commonly use brazing flux striping soldering, vacuum brazing, liquid-phase diffusion welding (attached
Add or not attached supersonic vibration), after difficulty or ease, alloying need to being dissolved according to composite mother metal, the activity of brazing filler metal alloy system, mother metal
The combined factors such as liquid phase viscosity and mobility quality, brazing temperature select.
In view of reducing the impact of mother metal tissue in welding process as far as possible, this is accomplished by researching and developing low melting point solder, and to the greatest extent may be used
Weld at a temperature of energy is low.In low temperature brazing field, current multiplex Zn base low-melting solder, such as the Zn-5Al reported
It is respectively 360 DEG C～430 DEG C and 385 DEG C～400 DEG C, simultaneously when low temperature brazing, for smoothly with the fusing point of Zn-5Al-3Cu
Striping also improves wetability, and the use report of the use of brazing flux, particularly ultrasonic activation is more.
Comparatively speaking, although active element (Ti) has and can accelerate in aluminum matrix composite high temperature active liquid-phase diffusion welding (610 DEG C)
The effect abolishing aluminum substrate surface film oxide is not applied the confirmation of person place seminar, but can active element suitable in low temperature brazing
Profit realizes going film reaction to be still a research blank spot, and its potentiality need to be studied.Binary especially for conventional Zn-Al class
Solder, applicant has proven to when not using brazing flux not import ultrasonic activation in early-stage Study, Zn-5Al binary eutectic
Mother metal is dissolved and is difficult to homogeneous carrying out by solder, causes liquefy under film insufficient, uneven (only corrosion occur at pole respective location)；
Though Zn can penetrate into matrices of composite material but interfacial gap is eliminated not yet when solder is enough, interface wet ability is very poor.Based on above-mentioned
Analyze, it is intended to by adding active element (Mg) in low melting point Zn-Al brazing filler metal with newly-increased reaction striping (chemical mechanism) strong
The double mechanism changing the striping (physical mechanism) that liquefies under film obtains the wetability ideal to aluminum substrate.
Summary of the invention
For solving above-mentioned technical problem, the invention provides a kind of low melting point aluminium base brazing material and preparation method thereof, to reach to change
Kind low melting point Zn-Al solder is reactionless with Al basal body interface and Presence of an interface gap, or react uneven and cause crystal grain this
Body surface film oxide is abolished that effect is bad, is seen wetability is the poorest on a large scale, the purpose of drawback in cavity occurs in interface.
For reaching above-mentioned purpose, technical scheme is as follows:
A kind of low melting point aluminium base brazing material, adds active element Mg on the basis of Zn-Al binary eutectic, thus constitutes low
Fusing point, Zn-Al-Mg system ternary active solder that interfacial reaction homogeneity can be improved, the mass fraction of the most each alloying element
Content is: 5～12%Al, 5～9%Mg, and remaining is Zn.
Preferably, the fusion range of described low melting point Zn-Al-Mg system ternary active solder is 330 DEG C～440 DEG C, Qi Zhongdian
The fusion range of type active solder composition Zn-5Al-4Mg is 335.5～355.5 DEG C.
A kind of preparation method of low melting point aluminium base brazing material, operation is:
1) select materials: selection raw material are: pure Al block, pure Zn block, pure Mg block；
2) dispensing: be 5 by pure Al, pure Zn, pure Mg according to mass percent～the Mg of the Al of 12%, 5～9%, remaining be
Zn carries out dispensing；
3) charging: tri-kinds of original materials of above-mentioned Al, Mg, Zn are positioned in closed crucible, wherein fusing point is low, density
Greatly, the pure Zn that inertia is strong is placed in top of mixture to protect active Mg with Zn liquid；
4) melting: be first passed through pure Ar in the crucible closed, get rid of air；Continue under Ar protects, high-frequency heating melting,
Dissolve；For preventing Zn liquid from evaporating, aluminium alloy continues to be heated to 490 DEG C, is then incubated 35min, continue melting, dissolving,
Liquid phase ingredient is made to homogenize；Then, continuing to stand cooled and solidified under the protection of Ar is brazing filler metal alloy block；
5) shaping: for preventing Al, Mg light metal alloy atom from occurring gravity segregation in Zn, uses chilling by brazing filler metal alloy block
Belt-rejecting technology is prepared as foil；Or it is prepared as solder sheet or solder rod so that preset by insulation, hot rolling technology.
Further in technical scheme,
1), mid-term first in melting, utilize Zn liquid to prevent the further oxidation of Mg, i.e. melt the most rapidly as the pure Zn that fusing point is minimum
After, partially liq is protected pure Mg and makes rapidly Mg be dissolved in Zn liquid；
2) subsequently in the fusion process of pure Al, make fusing point of a relatively high Al to being formed in advance also with dissolving thinking
Zn-Mg aluminium alloy dissolves and liquefies, thus smelting temperature can be reduced, to prevent the evaporation of Zn liquid；
3) continuing insulation makes liquid phase ingredient homogenize；
4) have benefited from determined by composition range tapability can be good and the most cataclasm, use chilling belt-rejecting technology to be prepared as composition uniform
Paper tinsel strip brazing material.
By technique scheme, the low melting point aluminium base brazing material that the present invention provides, at solder composition design aspect, adds activity
Element M g, can increase solder activity, improve interfacial reaction homogeneity and reduce solder fusing point further；In terms of welding process,
, Zn aluminium alloy viscosity low in view of welding temperature is big, poor fluidity, when solder will melt, i.e. executes along weld interface direction
Add the low-frequency low-amplitude friction of low cost, in order to abolish the oxide-film of solder and Al and surface by machinery gimmick, promote fresh liquid
The contact of solder and solid-state Al matrix larger area (the particularly surface of crystal grain itself, and be not only the surface of crystal boundary), thus enter
One step is for create favorable conditions by above-mentioned metallurgy route striping, so, can improve interface wet ability further, improve joint
Intensity.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below.
The invention provides a kind of low melting point aluminium base brazing material and preparation method thereof, interface wet ability can be improved further, improve
Strength of joint.
Embodiment one:
The preparation test of Zn-5Al-4Mg ternary active solder:
As a example by preparation 30g low melting point Zn-5Al-4Mg ternary active solder, the concrete steps of preparation method:
1) select materials: selection raw material are: pure Al block, pure Zn block, pure Mg block；
2) dispensing: according to the Al block that quality is 2g, the Mg of 1.5g, remaining is Zn；Wherein pure Zn is placed on mixture
Mixture is also positioned in closed crucible by top；
3) melting: be first passed through the pure Ar of 3.5L/mind in the crucible closed, get rid of air；Then, under Ar protects,
Under high-frequency heating, when, after pure Zn the most rapidly fusing, partially liq is protected pure Mg and makes rapidly Mg be dissolved in Zn liquid, with
Rear pure Al is also quickly soluble in Zn-Mg aluminium alloy；Then, aluminium alloy melting at 500 DEG C when continuation is heated, insulation
Heating is stopped after 30min；Then, continuing to stand cooled and solidified under the protection of Ar is brazing filler metal alloy block.
4) (copper roller diameter 105mm, copper roller thickness 10mm, linear velocity is to use chilling belt-rejecting technology to be prepared as foil
12.65m/min)。
Wetability contrast test: test as a comparison, for the Zn-5Al solder foil without Mg, wettability evaluation condition is
520 DEG C × 20min (for a long time)；For the Zn-5Al-4Mg solder foil of present invention exploitation, wettability evaluation condition is 520
DEG C × 1min, 520 DEG C × 3min, 520 DEG C × 5min (short time).Aluminum matrix composite mother metal used is 10Vol.%
SiCp/ZL101 aluminum matrix composite；Atmospheric condition protects environment for flowing Ar.
Band, gained Zn-5Al-4Mg solder foil is got rid of by the homemade belting chilling under the linear velocity of 12.65m/min that gets rid of
Outward appearance is more smooth；And solder foil very periphery is neat, its tapability is fine.But this solder foil is the most crisp, frangibility.
Summary is described, and wetability qualification test all shows with soldering test, the low melting point Zn-Al-Mg system ternary active of the present invention
Solder and Al matrix react can carry out ahead of time, reaction profile is uniform, the extent of reaction is abundant, can fast and effeciently crushing aluminum matrix
The continuity of surface film oxide, thus good to aluminium alloy and aluminum matrix composite wetability.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention.To these
The multiple amendment of embodiment will be apparent from for those skilled in the art, generic principles defined herein
Can realize in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention will not be by
It is limited to the embodiments shown herein, and is to fit to consistent with principles disclosed herein and features of novelty the widest
Scope.
Claims (4)
1. a low melting point aluminium base brazing material, it is characterised in that add active element on the basis of Zn-Al binary eutectic
Mg, thus constitute low melting point, Zn-Al-Mg system ternary active solder that interfacial reaction homogeneity can be improved, the most each alloy
The mass fraction content of element is: 5～12%Al, 5～9%Mg, and remaining is Zn.
Low melting point aluminium base brazing material the most according to claim 1, it is characterised in that described low melting point Zn-Al-Mg
Be the fusion range of ternary active solder be 330 DEG C～440 DEG C, the wherein fusing of typical activity solder composition Zn-5Al-4Mg
Scope is 335.5～355.5 DEG C.
The preparation method of low melting point aluminium base brazing material the most according to claim 1 and 2, it is characterised in that operation is:
1) select materials: selection raw material are: pure Al block, pure Zn block, pure Mg block；
2) dispensing: be 5 by pure Al, pure Zn, pure Mg according to mass percent～the Mg of the Al of 12%, 5～9%, remaining be
Zn carries out dispensing；
3) charging: tri-kinds of original materials of above-mentioned Al, Mg, Zn are positioned in closed crucible, wherein fusing point is low, density
Greatly, the pure Zn that inertia is strong is placed in top of mixture to protect active Mg with Zn liquid；
4) melting: be first passed through pure Ar in the crucible closed, get rid of air；Continue under Ar protects, high-frequency heating melting,
Dissolve；For preventing Zn liquid from evaporating, aluminium alloy continues to be heated to 490 DEG C, is then incubated 35min, continue melting, dissolving,
Liquid phase ingredient is made to homogenize；Then, continuing to stand cooled and solidified under the protection of Ar is brazing filler metal alloy block；
5) shaping: for preventing Al, Mg light metal alloy atom from occurring gravity segregation in Zn, uses chilling by brazing filler metal alloy block
Belt-rejecting technology is prepared as foil；Or it is prepared as solder sheet or solder rod so that preset by insulation, hot rolling technology.
The preparation method of low melting point aluminium base brazing material the most according to claim 3, it is characterised in that
1), mid-term first in melting, utilize Zn liquid to prevent the further oxidation of Mg, i.e. melt the most rapidly as the pure Zn that fusing point is minimum
After, partially liq is protected pure Mg and makes rapidly Mg be dissolved in Zn liquid；
2) subsequently in the fusion process of pure Al, make fusing point of a relatively high Al to being formed in advance also with dissolving thinking
Zn-Mg aluminium alloy dissolves and liquefies, thus smelting temperature can be reduced, to prevent the evaporation of Zn liquid；
3) continuing insulation makes liquid phase ingredient homogenize；
4) have benefited from determined by composition range tapability can be good and the most cataclasm, use chilling belt-rejecting technology to be prepared as composition uniform
Paper tinsel strip brazing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857197.0A CN105880865A (en) | 2014-12-24 | 2014-12-24 | Low-melting-point aluminum-based soldering material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857197.0A CN105880865A (en) | 2014-12-24 | 2014-12-24 | Low-melting-point aluminum-based soldering material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105880865A true CN105880865A (en) | 2016-08-24 |
Family
ID=56700778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410857197.0A Pending CN105880865A (en) | 2014-12-24 | 2014-12-24 | Low-melting-point aluminum-based soldering material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105880865A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106736011A (en) * | 2016-12-06 | 2017-05-31 | 河南理工大学 | A kind of SiCp/Al composites powdered filler metal preparation and application |
| CN108115305A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of low melting point brazing material |
| CN108115311A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of preparation method of low melting point brazing material |
| CN109365990A (en) * | 2018-12-14 | 2019-02-22 | 东莞市新玛博创超声波科技有限公司 | The ultrasonic wave added aluminum alloy piping welding method of full solid solution connector is obtained in a kind of short time |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101323060A (en) * | 2008-07-11 | 2008-12-17 | 北京工业大学 | Magnesium alloy middle temperature brazing material |
| CN101722380A (en) * | 2009-11-30 | 2010-06-09 | 哈尔滨工业大学 | High volume fraction grain enhanced aluminum-base compound material brazing filler metal and preparation method thereof |
| CN102029480A (en) * | 2010-12-28 | 2011-04-27 | 西安交通大学 | Al-Si-Ti ternary active solder for aluminum-based composite material and preparation method thereof |
| CN102632347A (en) * | 2012-01-09 | 2012-08-15 | 西安交通大学 | Aluminium matrix composite, brazing filler metal for aluminium alloy and brazing method |
| CN103722261A (en) * | 2012-01-09 | 2014-04-16 | 西安交通大学 | Low frequency and amplitude reciprocating friction assisted low-temperature active soft soldering method |
-
2014
- 2014-12-24 CN CN201410857197.0A patent/CN105880865A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101323060A (en) * | 2008-07-11 | 2008-12-17 | 北京工业大学 | Magnesium alloy middle temperature brazing material |
| CN101722380A (en) * | 2009-11-30 | 2010-06-09 | 哈尔滨工业大学 | High volume fraction grain enhanced aluminum-base compound material brazing filler metal and preparation method thereof |
| CN102029480A (en) * | 2010-12-28 | 2011-04-27 | 西安交通大学 | Al-Si-Ti ternary active solder for aluminum-based composite material and preparation method thereof |
| CN102632347A (en) * | 2012-01-09 | 2012-08-15 | 西安交通大学 | Aluminium matrix composite, brazing filler metal for aluminium alloy and brazing method |
| CN103722261A (en) * | 2012-01-09 | 2014-04-16 | 西安交通大学 | Low frequency and amplitude reciprocating friction assisted low-temperature active soft soldering method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106736011A (en) * | 2016-12-06 | 2017-05-31 | 河南理工大学 | A kind of SiCp/Al composites powdered filler metal preparation and application |
| CN108115305A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of low melting point brazing material |
| CN108115311A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of preparation method of low melting point brazing material |
| CN109365990A (en) * | 2018-12-14 | 2019-02-22 | 东莞市新玛博创超声波科技有限公司 | The ultrasonic wave added aluminum alloy piping welding method of full solid solution connector is obtained in a kind of short time |
| CN109365990B (en) * | 2018-12-14 | 2020-10-27 | 东莞市新玛博创超声波科技有限公司 | Ultrasonic-assisted aluminum alloy welding method for obtaining full solid solution joint in short time |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Pouranvari et al. | Dissimilar gas tungsten arc weld-brazing of Al/steel using Al-Si filler metal: Microstructure and strengthening mechanisms | |
| Aonuma et al. | Dissimilar metal joining of ZK60 magnesium alloy and titanium by friction stir welding | |
| CN100427261C (en) | Aluminum alloy intermediate temperature solder for braze welding | |
| Shao et al. | Effect of joining parameters on microstructure of dissimilar metal joints between aluminum and galvanized steel | |
| Ren et al. | Interface microstructure and mechanical properties of arc spot welding Mg–steel dissimilar joint with Cu interlayer | |
| TWI262954B (en) | Sputtering target, and method for manufacturing the same | |
| Zhou et al. | Wetting of galvanized steel by Al 4043 alloys in the first cycle of CMT process | |
| CN104227263B (en) | A kind of low melting point high-strength aluminum alloy powder brazing alloy and preparation method thereof | |
| WO2009091049A1 (en) | Method of bonding different metals and bonded structure | |
| CN105880865A (en) | Low-melting-point aluminum-based soldering material and preparation method thereof | |
| CN102632347B (en) | Aluminium matrix composite, brazing filler metal for aluminium alloy and brazing method | |
| Tan et al. | Influence of laser power on microstructure and mechanical properties of fiber laser-tungsten inert gas hybrid welded Mg/Cu dissimilar joints | |
| US3081534A (en) | Aluminum base brazing alloy | |
| CN102773630B (en) | Medium-temperature high-strength aluminum alloy powder solder and preparation method thereof | |
| CN102513721A (en) | High-strength aluminum alloy solder for brazing at medium temperature and preparation method thereof | |
| JP2016537201A5 (en) | ||
| CN106392368A (en) | High-temperature Zn-based soft solder for soldering aluminum and copper and welding method | |
| Kai et al. | Influence of wire feeding speed on laser brazing zinc-coated steel with Cu-based filler metal | |
| CN103231180A (en) | Aluminum alloy low-temperature brazing solder and production method thereof | |
| Yang et al. | Development of novel CsF–RbF–AlF3 flux for brazing aluminum to stainless steel with Zn–Al filler metal | |
| CN105364335A (en) | Al-Ag-Cu-Mg aluminium base alloy-state brazing filler metal and preparation method thereof | |
| Huiwen et al. | Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering | |
| Niu et al. | Effects of brazing temperature and post weld heat treatment on 7075 alloy brazed joints | |
| JP6018781B2 (en) | Method for producing aluminum clad material | |
| CN103143854B (en) | Welding material for connection of magnesium/aluminum heterogeneous metal and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160824 |
|
| WD01 | Invention patent application deemed withdrawn after publication |