CN105879417A - Method for removing moisture in recycled silicon wafer cutting fluid through thin-layer multi-turn-surface evaporator - Google Patents

Method for removing moisture in recycled silicon wafer cutting fluid through thin-layer multi-turn-surface evaporator Download PDF

Info

Publication number
CN105879417A
CN105879417A CN201410820877.5A CN201410820877A CN105879417A CN 105879417 A CN105879417 A CN 105879417A CN 201410820877 A CN201410820877 A CN 201410820877A CN 105879417 A CN105879417 A CN 105879417A
Authority
CN
China
Prior art keywords
evaporating surface
vaporizer
moisture
cone
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410820877.5A
Other languages
Chinese (zh)
Inventor
孙余凭
白云翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangnan University
Original Assignee
Jiangnan University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangnan University filed Critical Jiangnan University
Priority to CN201410820877.5A priority Critical patent/CN105879417A/en
Publication of CN105879417A publication Critical patent/CN105879417A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a method for removing moisture in recycled silicon wafer cutting fluid through a thin-layer multi-turn-surface evaporator. According to the method, conical evaporation surfaces are adopted, the recycled cutting fluid flows downwards along the conical surfaces under the action of gravity, a thin-layer fluid film is formed, the fluid film is heated, and moisture and volatile components in the fluid are evaporated under the vacuum or normal-pressure heating state. Through multi-turn-surface evaporation, cutting fluid with a low moisture and volatile component content is obtained.

Description

The method of moisture in silicon chip cutting fluid is reclaimed in a kind of thin layer many folding faces vaporizer removing
Technical field
The invention belongs to the field such as separation process and environmental conservation.The present invention uses one to have cone-shaped evaporating surface, reclaims cutting liquid and flows downward along the bullet conical surface under gravity, forms thin layer liquid film, and to liquid film heating and under vacuum or normal heating state, moisture and volatile components in liquid are evaporated.Through too much folding face evaporation, obtain moisture and the lowest cutting of volatile components.
Technical background
The present invention processes liquid and reclaims silicon chip cutting fluid for removing, needs to remove most of moisture and volatile component in liquid, and the most conventional technique has vacuum still distillation method and film evaporation method.Film evaporation method can use continuous operation mode, but either falling film type still rises membrane type, all has that energy consumption is high, equipment complicated, and auxiliary equipment is more, takes up space relatively big, moisture content and low-boiling point material is difficult to purify to less than 0.5%.Vacuum still distillation method typically uses discontinuous operation pattern, uses jacket steam heating, agitator agitation material mode.The advantage of vacuum distillation method is that the intermittently operated time can control according to material degree of purification, it is possible to ensureing the water content of product, this technique is the most widely used method.The subject matter that this technique exists is, owing to unit heat transfer area, flat evaporator area are the least, to cause big power of agitator, high heat consumption;Owing to disengagement area is little, evaporation time is long, the reaction of generation oxidation reaction easy to cutting liquid, molecular chain rupture or condensation reaction etc., often has a strong impact on product quality;Additionally the operation in gap is also difficult in adapt to the requirement of large-scale continuous production, Stabilization Control.
Based on boundary layer theory, fluid, when wall flows, forms flow boundary layer along wall, and the mass transfer in laminar boundary layer near wall is molecular diffusivity mass transfer, and one of measure of strengthening molecular diffusion mass transfer speed is to increase perturbation flowing;The solute being positioned at liquid internal moves to liquid surface by the way of molecule transmits, and revaporization enters gas phase, and one of method strengthening this transmission is to speed up Surface Renewal speed, uses the technology that can accelerate Surface Renewal speed can increase solute volatilization speed;All can be effectively improved the present invention by these technology and process the evaporation rate of liquid.
Present invention flow principles based on high viscosity liquid, Mass and heat transfer theory, mass transfer surfaces renewal theory and distillation principle, use ultrathin fluid layer technology, gasification face Surface Renewal technology, thin layer many folding surface technologies and the device of high volume pneumatization are invented, thus realize ultrathin evaporation, augmentation of heat transfer, reduce the time of staying, it is greatly increased unit volume disengagement area ratio, improves product quality;Realizing continuous and steady operation and the product quality control accuracy of process, disposal ability is greatly improved.
Summary of the invention
It is an object of the invention to: reclaim, for existing removal, the problem that in silicon chip cutting fluid, the technology of moisture exists, the present invention provides a kind of method with thin layer many folding face evaporations.
Room temperature reclaims silicon chip cutting fluid material and is leached the mechanical admixtures such as bulky grain by pump 1 warp let-off filter 2, pass sequentially through and vaporizer heating vapour-condensing liquid or circulating heat conduction oil 3, top condenser 4, base of evaporator discharging cooler 5 heat exchange, reclaim material after major part takes heat out of and be stably raised to 50~80 DEG C, material adds from vaporizer 8 top, it is distributed through liquid distribution trough, it is distributed evenly in epicone bodily form evaporating surface, under gravity, liquid is dirty along the conical surface, it flow at nearly evaporator inner wall face entrance lower cone shape evaporating surface of turning back, under gravity, liquid is dirty along the conical surface, turn back to lower group of evaporating surface after flowing to the redistribution of central distribution manifold collection, carry out and so forth, until bottom cutting liquid is discharged and charging heat exchange 5, the most cooled device 6 is cooled to 20~40 DEG C, deliver to cutting liquid product storage tank.
The steam warp of vaporizer top evaporation and charging heat exchange 4, steam is condensed, more cooled device 7 is cooled to less than 40 DEG C, and lime set is sent to lime set processing system.
Heating uses the coil pipe combined heated mode that chuck is divided into evaporating surface, and adding thermal medium is steam or conduction oil.
Cooler 7 exports and is connected with vacuum system, vacuum system control operation pressure, and vacuum is 0~95kpa.It is passed through a small amount of inertia Portability gas, it is therefore intended that accelerate in effumability gas from liquid effusion and that heated material is protected from it is oxidized by vaporizer base.
A kind of thin layer many folding faces vaporizer removing is reclaimed liquid distribution trough feature described in the method for the method of moisture in cutting liquid and is: described heat exchanger is one or more in the tubular heat exchanger with metal material manufacture, plate type heat exchanger.
The method of moisture in cutting liquid is reclaimed in a kind of thin layer many folding faces vaporizer removing, and described liquid distribution trough is characterised by: the one in sawtooth pattern distributor, weir formula distributor or two kinds, and making material is metal material.
Described epicone bodily form evaporating surface feature is, make of metal material, taper evaporating surface is 5 °~60 ° with the angle of horizontal direction, cone lower end and evaporator inner wall interplanar distance are 5mm~50mm, cone lower end and evaporator inner wall face set 3~8 fixing support racks along circumferential direction, with fixing upper conical evaporating surface.Taper evaporating surface offers 2~12 riseies along circumferential direction, with the passage providing boil-off gas to flow up;Riser is perpendicular to evaporating surface, and riser lower end is equal with taper evaporating surface, and upper end exceeds taper evaporating surface 5mm~60mm, to prevent liquid from causing leakage by riser.
Described lower cone shape evaporating surface feature is, make of metal material, the angle of taper evaporating surface and horizontal direction is 10 °~30 °, and cone upper end is connected with evaporator inner wall face, with fixing taper evaporating surface and make the liquid flowed down by upper cone evaporating surface fully flow into inferior pyramidal evaporating surface;Cone-shaped evaporating surface offers 2~12 riseies along circumferential direction, with the passage providing boil-off gas to flow up;Riser is perpendicular to evaporating surface, and riser lower end is equal with taper evaporating surface, and upper end exceeds taper evaporating surface 5mm~60mm, to prevent liquid from causing short circuit by riser.
Described upper/lower cone shape evaporating surface surface is provided with flow-disturbing thing, and flow-disturbing thing is the flow-disturbing thing of triangle, tongue shape, circular arc and the some improvement that can also make on the premise of without departing from the technology of the present invention principle as those skilled in the art and deformation.Flow-disturbing thing protrudes from evaporating surface 2mm~30mm, and flow-disturbing thing makes step ladder circular ring form, dispersed arrangement form according to its shape.When fluid flows through flow-disturbing thing, disturbed by it, occur flow direction to change, increasing turbulent flow, laminar boundary layer obtains thinning, and the particle of liquid internal more readily migrates into surface simultaneously, the particle on surface is accelerated to its internal delivery, accelerates Surface Renewal, improves evaporation rate.
Described distributor pipe is characterized in that, the cylinder that metal material makes, a diameter of φ 40mm~200mm, and height is 50~200mm, and its upper end is connected with lower cone evaporating surface lower end, so that fully flowing into distributor pipe along evaporating surface down-flowing liquid;Distributor pipe lower end is the one among zigzag, circle hole shape, and the vertex of a cone of the upper cone evaporating surface being attached thereto is positioned at distributor pipe, upper strata evaporating surface the liquid flowed down flows to lower floor's evaporating surface after being subdivided cloth.
Described being constituted an evaporation layer by epicone bodily form evaporating surface and lower cone shape evaporating surface, the evaporation layer of vaporizer of the present invention is 3~50 layers.
Described operation pressure is 0~95kpa.
Without the gas of any chemical reaction when described inertia Portability gas is to contact with material, there is the one in nitrogen, helium and several.The purpose added is to accelerate to escape in effumability gas from liquid, inertia Portability gas take out of.Inertia Portability gas adds and concentrated solution is discharged as sharing cannula assembly, its inner tube is inertia Portability gas access, a diameter of φ 10mm~50mm, and in inserter, the height of distance orlop evaporating surface is 50mm~100mm, outer tube is concentrated solution outlet, a diameter of φ 40mm~100mm.
Described heating agent is the one in steam and conduction oil, and heating-up temperature is 50 DEG C~300 DEG C.
Accompanying drawing explanation
Fig. 1 evaporation structure figure
Fig. 2 flow-disturbing thing shape and arrangement
Fig. 3 distributor pipe structure
Fig. 4 flow chart
Detailed description of the invention
Embodiment 1
The taper vaporizer made of stainless steel material, evaporating surface surface be densely covered with protrusion height be 5mm chord length be that the circle of 12mm lacks shape flow-disturbing thing, by the spacing staggered arrangement that centre-to-centre spacing is 16mm;Evaporating surface is 25 ° with the angle of horizontal direction, and cone lower end and evaporator inner wall interplanar distance are 15mm, and cone lower end and evaporator inner wall face set 4 fixing support racks along circumferential direction.Taper evaporating surface offers 4 riseies along circumferential direction, and draft tube diameter is φ 80mm, and riser upper end exceeds taper evaporating surface 40mm.The evaporation layer of vaporizer is 10 layers.Using described vacuum evaporation mode of operation, vacuum is 60Kpa, heats with steam, and heating-up temperature is 95 DEG C.The liquid reclaimed from solar silicon wafers cutting waste liquor that water content is 5.5%, temperature is 20 DEG C, reaches 65 DEG C through heat exchange and is continuously added to by top from vaporizer, base of evaporator the liquid water content being continuously available is 0.7%, and color and luster is unchanged.
Embodiment 2
The taper vaporizer made of stainless steel material, evaporating surface surface has been provided with protrusion height and has been, 5mm width is the triangle flow-disturbing annulus of 15mm, by echelon formation;Evaporating surface is 20 ° with the angle of horizontal direction, and cone lower end and evaporator inner wall interplanar distance are 15mm, and cone lower end and evaporator inner wall face set 4 fixing support racks along circumferential direction.Taper evaporating surface offers 4 riseies along circumferential direction, and draft tube diameter is φ 80mm, and riser upper end exceeds taper evaporating surface 40mm.The evaporation layer of vaporizer is 10 layers.Using described vacuum evaporation mode of operation, vacuum is 80Kpa, heats with steam, and heating-up temperature is 95 DEG C, and adding a small amount of nitrogen is Portability gas.The liquid reclaimed from solar silicon wafers cutting waste liquor that water content is 8.5%, temperature is 20 DEG C, reaches 62 DEG C through heat exchange and is continuously added to by top from vaporizer, base of evaporator the liquid water content being continuously available is 0.5%, and color and luster is unchanged.

Claims (7)

1. the method for the method of moisture in cutting liquid is reclaimed in thin layer many folding faces vaporizer removing, it is characterised in that: described material is Cutting liquid and the purification of recovery cutting liquid.
The method of moisture in cutting liquid is reclaimed in a kind of thin layer many folding faces vaporizer removing, it is characterised in that: Vaporizer is provided with the circular cylinder body of heat-insulation layer by metal making, outside, interior by material feed pipe, liquid feed distributor, epicone Bodily form evaporating surface, lower cone shape evaporating surface, distributor pipe, heating jacket, heating coil, cannula assembly and gaseous phase outlet pipe structure Become.After the steam heat-exchanging evaporated that material goes out with base of evaporator discharge cutting liquid and vaporizer top row through removing moisture respectively Enter vaporizer.
The method of moisture in cutting liquid is reclaimed in a kind of thin layer many folding faces vaporizer removing, it is characterised in that: Epicone bodily form evaporating surface surface is provided with flow-disturbing thing, and evaporating surface is 10 °~30 ° with the angle of horizontal direction, cone lower end and vaporizer Internal face spacing is 5mm~50mm, and cone lower end and evaporator inner wall face set 3~8 fixing support racks along circumferential direction, with Fixing taper evaporating surface;Taper evaporating surface offers 2~12 riseies along circumferential direction, and riser is perpendicular to evaporating surface, rises gas Pipe lower end is equal with taper evaporating surface, and upper end exceeds taper evaporating surface 5mm~60mm;Described lower cone shape evaporating surface surface sets Having flow-disturbing thing, evaporating surface is 10 °~30 ° with the angle of horizontal direction, and cone upper end is connected with evaporator inner wall face, cone-shaped Evaporating surface offers 2~12 riseies along circumferential direction, and riser is perpendicular to evaporating surface, riser lower end and taper evaporating surface phase Flat, upper end exceeds taper evaporating surface 5mm~60mm;Described flow-disturbing thing is the one in triangle, tongue shape, circular arc and several Kind.Flow-disturbing thing protrudes from evaporating surface 2mm~30mm, and flow-disturbing thing makes step ladder circular ring form, dispersed arrangement according to its shape Form;Described dispersed arrangement form is to make the one in circle, rectangle or two kinds, by in-line arrangement or staggered arrangement according to flow-disturbing thing shape Mode be evenly spaced in evaporating surface surface.
The method of moisture in cutting liquid is reclaimed in a kind of thin layer many folding faces vaporizer removing, it is characterised in that: The a diameter of φ of described distributor pipe 40~200mm, height is 50~200mm, and upper end is connected with lower cone evaporating surface lower end, distribution Pipe lower end is the one among zigzag, circle hole shape, and the vertex of a cone of the upper cone evaporating surface being attached thereto is positioned at distributor pipe, by upper The liquid that layer evaporating surface flows down flows to lower floor's evaporating surface after being subdivided cloth.
5. reclaim the method for moisture, its feature in cutting liquid according to thin layer many folding faces vaporizer removing a kind of described in claim 4 and 5 It is: described liquid flow direction is to inferior pyramidal evacuator body face by epicone bodily form evaporating surface baffling, collects through distributor pipe and is distributed After again baffling to next evaporating surface, be so repeated.
The method of moisture in cutting liquid is reclaimed in a kind of thin layer many folding faces vaporizer removing, it is characterised in that: Constituted one layer of evaporation layer by epicone bodily form evaporating surface and lower cone shape evaporating surface, in vaporizer, have 3~50 layers of evaporation layer.
The method of moisture in cutting liquid is reclaimed in a kind of thin layer many folding faces vaporizer removing, it is characterised in that: Vaporizer base is passed through inertia Portability gas, has the one in nitrogen and helium and several.
CN201410820877.5A 2014-12-23 2014-12-23 Method for removing moisture in recycled silicon wafer cutting fluid through thin-layer multi-turn-surface evaporator Pending CN105879417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410820877.5A CN105879417A (en) 2014-12-23 2014-12-23 Method for removing moisture in recycled silicon wafer cutting fluid through thin-layer multi-turn-surface evaporator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410820877.5A CN105879417A (en) 2014-12-23 2014-12-23 Method for removing moisture in recycled silicon wafer cutting fluid through thin-layer multi-turn-surface evaporator

Publications (1)

Publication Number Publication Date
CN105879417A true CN105879417A (en) 2016-08-24

Family

ID=56700502

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410820877.5A Pending CN105879417A (en) 2014-12-23 2014-12-23 Method for removing moisture in recycled silicon wafer cutting fluid through thin-layer multi-turn-surface evaporator

Country Status (1)

Country Link
CN (1) CN105879417A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108434770A (en) * 2018-05-07 2018-08-24 扬州工业职业技术学院 A kind of device of removing volatile component
CN111099680A (en) * 2018-10-29 2020-05-05 山东大学 U-shaped structure evaporator

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295937A (en) * 1979-03-22 1981-10-20 Hoechst Aktiengesellschaft Rectifier
CN2063433U (en) * 1990-02-15 1990-10-10 李连群 Single-effect secondary evaporating falling film evaporator
CN101080438A (en) * 2004-12-16 2007-11-28 旭化成化学株式会社 Industrial evaporation apparatus
CN101234257A (en) * 2007-02-01 2008-08-06 发泰(天津)科技有限公司 Microwave rotating thin film concentrator
CN201719853U (en) * 2010-07-05 2011-01-26 萧于盛 Liquid wax dehydrator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295937A (en) * 1979-03-22 1981-10-20 Hoechst Aktiengesellschaft Rectifier
CN2063433U (en) * 1990-02-15 1990-10-10 李连群 Single-effect secondary evaporating falling film evaporator
CN101080438A (en) * 2004-12-16 2007-11-28 旭化成化学株式会社 Industrial evaporation apparatus
CN101234257A (en) * 2007-02-01 2008-08-06 发泰(天津)科技有限公司 Microwave rotating thin film concentrator
CN201719853U (en) * 2010-07-05 2011-01-26 萧于盛 Liquid wax dehydrator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108434770A (en) * 2018-05-07 2018-08-24 扬州工业职业技术学院 A kind of device of removing volatile component
CN108434770B (en) * 2018-05-07 2023-12-22 扬州工业职业技术学院 Device for removing volatile components
CN111099680A (en) * 2018-10-29 2020-05-05 山东大学 U-shaped structure evaporator
CN111099680B (en) * 2018-10-29 2021-05-25 山东大学 U-shaped structure evaporator

Similar Documents

Publication Publication Date Title
CN204502433U (en) Flash distillation scraper concentrator
CN205948388U (en) Flash distillation of tower tray formula heat transfer integration equipment
CN105879416A (en) Method for manufacturing thinning multi-folded-face evaporator with surface updating function
CN105879415A (en) Method for manufacturing thin-layer multi-turn-surface evaporator
CN203971422U (en) A kind of device that is applicable to the separation of emulsion internal solvent
CN107441753B (en) Falling film crystallizer
Kumar et al. Analysis of a jet-pump-assisted vacuum desalination system using power plant waste heat
CN105879417A (en) Method for removing moisture in recycled silicon wafer cutting fluid through thin-layer multi-turn-surface evaporator
CN103011083A (en) Gas-phase iodine crystallization method
CN203829691U (en) Liquid-gas linkage forced circulation hot pump low-temperature evaporation, concentration and crystallization device
CN201815128U (en) Tapered tube type falling film evaporator
CN106669208A (en) System and technology for utilizing low-temperature smoke to enhance concentration of brine wastewater
CN203436838U (en) Film distributor of vertical type falling-film evaporator
CN106621425B (en) A kind of vaporising device of higher boiling high viscosity heat sensitive material
CN208603941U (en) High-salt wastewater low-temperature evaporation device
CN208394816U (en) A kind of flash evaporation plate-type falling film evaporator
CN103553164B (en) High-salt wastewater treatment system for horizontal-vertical tube falling film multiple-effect evaporation
CN106370028A (en) Coking raw gas waste heat recovery method and apparatus
CN108467017A (en) A kind of sulfur dioxide gasification process for thionyl chloride production
CN108635893A (en) A kind of luwa evaporator
CN203790591U (en) Low-exergy heat-source driven type solution concentration-purification unit
CN107265540A (en) A kind of garbage leachate desiccation apparatus
CN102288051B (en) Vertical double-tube plate shell-and-tube heat exchanger for evaporating liquid with minimum constant boiling component
RU114864U1 (en) EVAPORATOR
RU183563U1 (en) IRRIGATED HEAT EXCHANGER

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160824

RJ01 Rejection of invention patent application after publication