CN105872880B - Head-wearing earphone - Google Patents

Head-wearing earphone Download PDF

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Publication number
CN105872880B
CN105872880B CN201610277833.1A CN201610277833A CN105872880B CN 105872880 B CN105872880 B CN 105872880B CN 201610277833 A CN201610277833 A CN 201610277833A CN 105872880 B CN105872880 B CN 105872880B
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Prior art keywords
channel
damping
headphone
section
filling piece
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CN201610277833.1A
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CN105872880A (en
Inventor
铁广朋
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Qingdao Goertek Technology Co Ltd
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Qingdao Goertek Technology Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1075Mountings of transducers in earphones or headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/105Manufacture of mono- or stereophonic headphone components

Abstract

The invention provides a headset, and relates to the field of earphones. This headphone includes that at least one installs the conch of baffle, installs speaker assembly on the baffle, and speaker assembly separates into antechamber and back chamber with the conch at place jointly with the baffle, and the baffle has an acoustic short circuit channel group at least, and every acoustic short circuit channel group includes: the first channel is communicated with the front cavity and the rear cavity; and the second channel is communicated with the first channel and the outside. This headphone has realized adjusting when the air flow between front chamber, back chamber, external, can change the low frequency tone quality effect of earphone more in a flexible way.

Description

Head-wearing earphone
Technical Field
The invention relates to the field of earphones, in particular to a headset.
Background
In the prior art, as shown in fig. 1, a closed type headphone generally has two shells, each of which has an acoustic short-circuit hole 10 communicating a front cavity and a rear cavity, and an acoustic transmission hole 20 communicating the rear cavity and the outside opened on the rear shell of the shell. The trompil size that changes sound short circuit hole 10, sound-transparent hole 20 and paste the different tuning paper of thickness on it can be so that the air flow condition changes in the earphone casing to adjust the earphone frequency response, change the low frequency tone quality effect of earphone.
The structure can only adjust the low-frequency tone quality effect of the earphone by adjusting the air flow between the front cavity and the rear cavity and between the rear cavity and the outside, so that the means for technical personnel to adjust the tone quality of the headset is limited before the earphone leaves a factory; and after the earphone leaves the factory, the user can not carry out the higher regulation of degree of freedom to the tone quality of earphone according to own preference and demand.
Disclosure of Invention
One object of the present invention is to provide a headphone capable of adjusting air flows among a front chamber, a rear chamber, and the outside at the same time, thereby enabling tuning to be performed more flexibly before shipment.
A further object of the present invention is to enable the user to adjust the sound quality according to his preferences and needs after the headset leaves the factory.
In order to achieve one or more of the above objects, the present invention provides a headphone including a shell having a partition mounted thereon, the partition having a speaker assembly mounted thereon, the speaker assembly and the partition dividing an inner space of the shell into a front cavity and a rear cavity, the partition having at least one acoustic short-circuit path group, each of the acoustic short-circuit path groups including: a first passage communicating the front chamber with the rear chamber; and the second channel is communicated with the first channel and the outside.
Optionally, the acoustic short-circuit channel set further includes a damping filler filled in the first channel and the second channel.
Optionally, the damping filler includes a first damping filler, and the first damping filler is detachably filled in the second channel.
Optionally, the middle section of the first channel bisects the first channel into a front-section channel and a rear-section channel; the damping filler further comprises: the second damping filling piece is filled in the front section channel; and the third damping filling piece is filled in the rear-section channel.
Optionally, the damping coefficients of the first damping filler, the second damping filler and the third damping filler are different from each other.
Optionally, the first channel is a cylindrical hole or a square hole, and the second channel is a cylindrical hole or a square hole.
Optionally, the axis of the first channel is perpendicular to the axis of the second channel, and the axis of the first channel is parallel to the axis of the baffle; the partition is bisected by a median cross-section of the first channel, and the second channel is bisected by a median cross-section of the first channel.
Optionally, the speaker assembly comprises a speaker and a bracket; the loudspeaker is fixed on the support, and the support is fixed on the partition board.
Optionally, the speaker assembly further comprises an ear cap fixed to the earshell, and the ear cap, the earshell, the partition plate and the speaker assembly jointly define the front cavity.
The invention has at least the following technical effects:
1. the first channel is communicated with the front cavity and the rear cavity, the second channel is communicated with the first channel and the outside, the communication structure of the front cavity and the rear cavity and the communication structure of the rear cavity and the outside are positioned at the closer positions, and the three-way structure of the front cavity, the rear cavity and the outside realizes the simultaneous adjustment of air flow among the front cavity, the rear cavity and the outside, thereby adjusting the frequency response of the earphone and changing the low-frequency tone quality effect of the earphone;
therefore, the technical scheme overcomes the limitation that in the prior art, the air flow between the front cavity and the rear cavity and between the rear cavity and the outside can only be adjusted. On one hand, the low-frequency energy in the front cavity can be leaked outwards through the first channel and the second channel, and the turbidity of the low frequency is reduced; on one hand, the low frequency is adjusted simultaneously between the front and rear sound cavities and the outside, so that a better bass effect is obtained, and technicians can adjust the tone quality more conveniently and more freely before leaving a factory;
in addition, the technical scheme also produces unexpected technical effects:
a. the airflow of the front cavity is quickly guided to the outside through the first channel and the second channel, so that the deformation of a diaphragm of the loudspeaker due to pressure difference when the headset is worn is reduced, and the service life of the diaphragm of the loudspeaker is prolonged;
b. compared with the sound-transmitting hole formed in the rear shell of the earphone shell in the prior art, the length of the second channel is far larger than the thickness of the sound-transmitting hole, and according to a formula of resonance frequency, when the same low resonance frequency is obtained, the volume of the rear cavity of the earphone is smaller, so that the earphone shell of the earphone can be thinner than that of the earphone in the prior art.
2. Damping filling pieces are arranged in the first channel and the second channel, so that technicians can replace the damping filling pieces with different damping coefficients before leaving a factory, the adsorption effect of the damping filling pieces on low-frequency energy is changed, and the tone quality is further adjusted; and the damping filling piece is arranged, so that the loss of low frequency is reduced, the radial width of the channel is not excessively small due to the fact that the first channel and the second channel do not need to avoid the loss of low frequency, and the unsmooth frequency response curve caused by sharp peaks and valleys of low frequency cannot be caused.
3. The first damping filling piece is separably filled in the second channel communicated with the outside, so that after the earphone leaves a factory, a user can replace the first damping filling piece with different damping coefficients according to own preference and requirements, and the headset disclosed by the invention has different tone quality effects.
4. The second channel is filled with the first damping filling piece, the first channel is filled with the second damping filling piece and the third damping filling piece respectively, therefore, before the earphone leaves a factory, technicians can enable the headset to have different tone qualities by replacing the first damping filling piece, the second damping filling piece and the third damping filling piece with different damping coefficients respectively, and compared with the prior art that the sizes of the sound short circuit hole and the sound transmission hole are only changed or different pieces of tone tuning paper are pasted, the scheme of the invention has the advantages that the adjustment freedom degree is higher, the convenience is realized, and more tone quality debugging with better effect can be carried out by the technicians.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic view of a structure of a headphone of the related art;
fig. 2 is a schematic structural view of a headphone according to one embodiment of the present invention;
FIG. 3 is a schematic view of the distribution of the acoustic short-circuit channel groups on the partition of the headphone of FIG. 2;
fig. 4 is a schematic view of the structure of the acoustic short-circuit channel group of the headphone shown in fig. 2;
fig. 5 is a schematic structural view of an acoustic short-circuit channel group of a headphone according to another embodiment of the present invention.
Detailed Description
Fig. 2 is a schematic structural view of a headphone according to an embodiment of the present invention. In the embodiment shown in fig. 2, a headphone is shown, which comprises two ear shells 40 (or one ear shell in other embodiments of the present invention) with a partition 30, and a speaker assembly 50 is mounted on the partition 30, wherein the speaker assembly 50 and the partition 30 together divide the inner space of the ear shells 40 into a front cavity 71 and a rear cavity 72. The speaker unit 50 includes a speaker 52 and a bracket 51, and the speaker 52 is fixed to the bracket 51. The diaphragm 30 may be a ring-shaped plate with a through hole bored in the center, the bracket 51 of the speaker 52 being fixed to the inner side of the ring-shaped plate, the speaker 52 having a diaphragm 522, and the outer side of the ring-shaped plate being fixed to the ear shell 40. In the embodiment shown in fig. 2, the thickness of the separator 30 may be more than three times the thickness of the separator 30 of the prior art, but the thickness of the separator 30 is not particularly limited, and the separator 30 may have other thicknesses in other embodiments of the present invention.
In one embodiment of the present aspect, the headset may further include a headpiece, and two earshells 40 are mounted at both ends of the headpiece. The headset may further include an earmuff 60, the earmuff 60 being secured to the earshell 40, the earmuff 60, the earshell 40, the baffle 30 and the speaker assembly 50 together defining a front chamber 71. The rear shell of the earcup 40, the baffle 30 and the speaker assembly 50 collectively define a rear cavity 72.
As shown in fig. 2 and 3, the partition 30 has at least one acoustic short-circuit channel group 80 (4 in fig. 3, and other numbers are possible in other embodiments of the present invention). Each acoustic shorting channel group 80 includes: a first channel 81, a second channel 82. The first channel 81 communicates with the front chamber 71 and the rear chamber 72, and the second channel 82 communicates the first channel 81 with the outside, so that the end of the second channel 82 not connected to the first channel 81 is directly in contact with the air outside the headphone. The structure omits the traditional earphone sound-transmitting hole 20 arranged on the rear shell of the earphone, and increases the function of intercommunicating and adjusting the front cavity 71 and the outside, so that the front cavity 71 and the rear cavity 72 are communicated with the outside while being intercommunicated, and the low frequency can be adjusted more flexibly by flexibly adjusting the air flow.
In addition, the rear cavity 72 resonates with an opening of the outside, thereby enhancing a low frequency effect. The resonance frequency f0 is k/(V × L) × 1/2, k is a constant coefficient, V is the volume of the rear sound cavity, L is the corresponding sound sensation at the opening, the longer the opening, the larger L, L is the thickness of the sound-transmitting hole on the rear shell in the prior art, and in the embodiment of the present invention, L is the length of the second channel 82, so that when the volume V of the rear cavity 72 in the embodiment of the present invention is smaller, a lower resonance frequency can still be obtained, that is, the earshell 40 of the headphone of the present invention can be made thinner.
In the embodiment shown in fig. 2 and 3, the axis of the first passage 81 is perpendicular to the axis of the second passage 82, and the axis of the first passage 81 is parallel to the axis of the partition plate 30; the baffle 30 is bisected by the median cross-section (the cross-section parallel to the bottom plane through the midpoint of the geometric height) of the first channel 81, and the second channel 82 is bisected by the median cross-section of the first channel 81. The middle section is a mathematical concept, and is a virtual surface, which is only used to illustrate the relative position relationship between the first channel 81 and the second channel 82, and is not a newly added solid structure.
In one embodiment of the present invention, the first passage 81 may be a cylindrical hole or a square hole, and the second passage 82 may be a cylindrical hole or a square hole. In other embodiments of the present invention, the first channel 81 and the second channel 82 may have other shapes, for example, they may be curved and extended in the partition board 30, which also achieves the effect of the present invention.
Fig. 4 is a schematic view of the structure of the acoustic short-circuit channel group of the headphone shown in fig. 2. In the embodiment shown in fig. 4, the acoustic short-circuit channel group 80 may include damping filler filled in the first channel 81 and the second channel 82, and the damping filler in the first channel 81 and the second channel 82 may be integrated or separated from each other. The damping filler may be an elastic material having sound absorbing properties, such as a sponge. Fig. 5 is a schematic structural diagram of an acoustic short-circuit channel group 80 of a headphone according to another embodiment of the present invention. In the embodiment shown in fig. 5, the mid-section of the first channel 81 bisects the first channel 81 into a front-section channel and a rear-section channel. The damping filler includes a first damping filler 821, a second damping filler 811, and a third damping filler 812. The first damping filler 821 is filled in the second channel 82, the second damping filler 811 is filled in the front channel, and the third damping filler 812 is filled in the rear channel. The flow of air and the adsorption of low-frequency energy can be flexibly controlled by replacing the first damping filler 821, the second damping filler 811 and the third damping filler 812.
The first damping filling member 821 is separable from the second passage 82, which is convenient for a user to replace after shipment. The second damping filling member 811 is fixed to the front section channel, and the third damping filling member 812 is fixed to the rear section channel, for example, the two can be respectively glued to the front section channel and the rear section channel by glue, and the two can be replaced before leaving the factory.
The damping coefficients of the first damping filler 821, the second damping filler 811 and the third damping filler 812 may be different from each other, and in other embodiments of the present invention, only two or all of them may be the same, which is determined according to the requirement of sound quality.
The process of adjusting the sound quality by replacing the damping filling members with different damping coefficients before and after the factory shipment will be briefly described below with reference to fig. 5. The damping coefficients of the second damping filler 811, the first damping filler 821 and the third damping filler 812 are assumed to be α 1, α 2 and α 3, respectively. The first damping filler 821 and the third damping filler 812 are communicated with the rear cavity 72 and the outside, the amount of low frequency is controlled, and before leaving a factory, when low frequency is lacked, the damping coefficients alpha 2 and alpha 3 of the first damping filler 821 and the third damping filler 812 are reduced, and the damping coefficient alpha 1 of the second damping filler 811 is increased. The first damping filling part 821 and the second damping filling part 811 can release the low-frequency energy of the front sound cavity, prevent the low-frequency sound from being too muddy, and reduce the damping coefficients alpha 2 and alpha 1 of the low-frequency sound and the front sound cavity when the low frequency is more muddy before leaving a factory. Therefore, in the tuning process before leaving the factory, when the low frequency is more and more turbid, the alpha 1 is more than the alpha 3 and more than the alpha 2; when the low frequency is less, alpha 3 is more than alpha 2 and less than alpha 1. The prior art structure can only adjust the thickness of the tuning paper at the acoustic short circuit hole 10 connecting the front cavity 71 and the rear cavity 72, therefore, the selection of different damping materials of the first damping filler 821, the second damping filler 811 and the third damping filler 812 is richer than the low frequency adjustment (or acoustic short circuit adjustment) of the prior art, and more easily meets some detailed requirements. After leaving the factory, since the second passage 82 is disposed at a position communicating with the outside and the first damping filler 821 in the second passage 82 is separable, the user can select and replace the damping material in the first damping filler 821 according to the preference of the user, the user who prefers a high frequency can select a low damping material, and the user who prefers a low frequency can select a high damping material.
In other embodiments of the invention, it is also possible to have the above-described structure in only one of the ear shells 40, and still have a prior art structure in the other ear shell 40, which still achieves the technical effects of the invention.
Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.

Claims (9)

1. A headphone, comprising at least one earshell provided with a partition board, the partition board being provided with a speaker assembly, the speaker assembly and the partition board jointly dividing an inner space of the earshell into a front cavity and a rear cavity, characterized in that,
the separator plate has at least one acoustic short circuit channel group, each acoustic short circuit channel group comprising:
a first passage communicating the front chamber with the rear chamber;
the second channel is communicated with the first channel and the outside;
the axis of the first channel is perpendicular to the axis of the second channel, and the axis of the first channel is parallel to the axis of the partition plate.
2. The headphone of claim 1,
the acoustic short circuit channel group further comprises:
and the damping filling piece is filled in the first channel and the second channel.
3. The headphone of claim 2,
the damping filling part comprises a first damping filling part which is detachably filled in the second channel.
4. The headphone of claim 3,
the middle section of the first channel bisects the first channel into a front section channel and a rear section channel;
the damping filler further comprises:
the second damping filling piece is filled in the front section channel;
and the third damping filling piece is filled in the rear-section channel.
5. The headphone of claim 4,
the damping coefficients of the first damping filling piece, the second damping filling piece and the third damping filling piece are different from each other.
6. A headset according to any of claims 1-5,
the first channel is a cylindrical hole or a square hole, and the second channel is a cylindrical hole or a square hole.
7. The headphone of claim 6,
the partition is bisected by a median cross-section of the first channel, and the second channel is bisected by a median cross-section of the first channel.
8. The headphone of claim 7,
the loudspeaker assembly comprises a loudspeaker and a bracket;
the loudspeaker is fixed on the support, and the support is fixed on the partition board.
9. The headphone of claim 8,
still include the earmuff, the earmuff is fixed in the earmuff, the earmuff, the baffle reaches the speaker subassembly is injectd jointly the front chamber.
CN201610277833.1A 2016-04-28 2016-04-28 Head-wearing earphone Active CN105872880B (en)

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CN105872880B true CN105872880B (en) 2022-03-15

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11671745B2 (en) 2020-09-16 2023-06-06 Apple Inc. Headphone earcup with adsorptive material
CN113993042A (en) * 2021-09-29 2022-01-28 歌尔光学科技有限公司 Sound production device, control method thereof, and control device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204795520U (en) * 2015-07-07 2015-11-18 中山市天键电声有限公司 In -ear earphone
CN105208486A (en) * 2015-11-10 2015-12-30 魅族科技(中国)有限公司 Earphone structure
CN205179290U (en) * 2015-11-10 2016-04-20 魅族科技(中国)有限公司 Earphone structure
CN205726279U (en) * 2016-04-28 2016-11-23 青岛歌尔声学科技有限公司 A kind of headphone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204795520U (en) * 2015-07-07 2015-11-18 中山市天键电声有限公司 In -ear earphone
CN105208486A (en) * 2015-11-10 2015-12-30 魅族科技(中国)有限公司 Earphone structure
CN205179290U (en) * 2015-11-10 2016-04-20 魅族科技(中国)有限公司 Earphone structure
CN205726279U (en) * 2016-04-28 2016-11-23 青岛歌尔声学科技有限公司 A kind of headphone

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