CN105866049B - Etching solution acid concentration measuring equipment - Google Patents
Etching solution acid concentration measuring equipment Download PDFInfo
- Publication number
- CN105866049B CN105866049B CN201610338914.8A CN201610338914A CN105866049B CN 105866049 B CN105866049 B CN 105866049B CN 201610338914 A CN201610338914 A CN 201610338914A CN 105866049 B CN105866049 B CN 105866049B
- Authority
- CN
- China
- Prior art keywords
- etching
- etching solution
- reference cell
- solution
- acid concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Optical Measuring Cells (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention provides a kind of etching solution acid concentration measuring equipment comprising controller, spectrophotometer, etching groove, reference cell, detector and solution memory；Solution memory is connected to by first pipe with the etching groove, and solution memory is connected to by second pipe with reference cell；Solution memory is for accommodating etching solution；Reference cell is used for reference liquid, controller controls the spectrophotometer illumination etching groove and reference cell simultaneously, controller control etching solution enters the time of etching groove and reference cell, and there are acid concentration differences for the reference liquid in the etching solution and reference cell in controller control control etching groove；Etching groove and the equal communication with detection device of reference cell, detector to detect the etching groove by spectrophotometer illumination etching solution and reference cell the wavelength of light that is absorbed of reference liquid and be converted into the comparison of data-signal progress.
Description
Technical field
The present invention relates to display thin film transistor (TFT) manufacturing technology field, in particular to a kind of etching solution acid concentration measures dress
It sets.
Background technique
Wet etching is to be patterned with acid etching solution to metallic diaphragm in TFT manufacturing process, and then form grid
The core process of (Gate Mol Al), source-drain electrode (Source-Drain Cr) and pixel (ITO) electrode.Wherein, aluminium and molybdenum are normal
Grid and source-drain electrode are formed as conductive material, a variety of different acid can be used in etching solution, utilize strong acid mixture (nitre
Acid, phosphoric acid and glacial acetic acid) dissolution is carried out to it and oxidation-reduction process is widely applied.In existing etch process, base
In absorption photometry, the light issued by light source is after the reference cell for measuring pond and containing pure water for containing nitration mixture, certain wave
Long light is absorbed by particular functional group in nitration mixture system, after deducting pure water background according to the absorbance value of special groups in each acid
It is converted into the concentration of each acid.For not etched eo-acid, the not interference of impurity substances, concentration measurement measured value and reality
Border theoretical value is consistent.But for etched acid, wherein also containing in these etch products containing there are many etch products
The substance for thering is interference particular functional group to absorb, thus concentration measurement measured value is made to be greater than practical theoretical value.
With the increase and medical fluid life-time dilatation of etching quantity, nitric acid and acetic acid can be consumed constantly, sour concentration meeting
It gradually decreases, the absorbance deviation in the etch products constantly increased in etching groove and reference cell between constant pure water is increasingly
Greatly, acid concentration deviation caused by can be increasing, and it is up to standard and reduce the amount infused of mono-acid that system will mistakenly believe that acid concentration；And it etches
For source-drain electrode, acid concentration is excessively high to will cause overetch for the control of liquid nitration mixture concentration, so as to cause driving current deficiency and
It shows bad；Acid concentration is too low it will cause undercut, causes aperture opening ratio to reduce and then brightness and contrast is caused to reduce；Cause
This can seriously affect etching quality.
Summary of the invention
The purpose of the present invention is to provide a kind of Etaching devices for reducing etching solution acid concentration detection error.
The application provides a kind of etching solution acid concentration measuring equipment, and the etching solution acid concentration measuring equipment includes control
Device, spectrophotometer, etching groove, reference cell, detector and solution memory；The solution memory passes through first pipe and institute
Etching groove connection is stated, the solution memory is connected to by second pipe with the reference cell；The solution memory is for holding
Receive etching solution；The reference cell is used for reference liquid,
The controller controls etching groove and reference cell described in spectrophotometer illumination simultaneously, the controller control
The time that etching solution enters the etching groove and the reference cell is controlled, and the controller controls the erosion in the etching groove
Carving liquid, there are acid concentration differences with the reference liquid in the reference cell；
The etching groove is connected to the detector with reference cell, and the detector is to detect by spectrophotometric photometric
According to the wavelength of light that is absorbed of the etching solution of etching groove and the reference liquid of reference cell, and the acid for being converted into data-signal progress is dense
Degree comparison.
Wherein, the etching solution is the aqueous solution containing phosphoric acid, nitric acid and acetic acid.
Wherein, the reference liquid is pure water or etching solution.
Wherein, the etching solution acid concentration measuring equipment controls the reference cell content in original state, the controller
Receive pure water, the etching groove accommodates etching solution；It completes first time when the etching groove to etch, pure water and erosion in the reference cell
The etching solution of cutting excludes；The controller controls in the reference cell after introducing etching solution, then controls the solution memory
Interior etching solution enters the etching groove；It completes second when the etching groove to etch, the controller controls the reference cell
After interior introducing etching solution, then the etching solution controlled in the solution memory enters the etching groove；Wherein, in the reference cell
Etching solution acid concentration and etching solution in the etching groove acid concentration in acid concentration difference.
Wherein, the etching groove is connected to the reference cell by third connecting pipe, and the third connecting Guan Shangshe
Valve is set to be electrically connected with the controller.
Wherein, second communicating pipe is equipped with the valve being electrically connected with the controller, the controller control valve door
It opens and realizes that the etching solution in solution memory enters reference cell.
Wherein, the etching groove and the reference cell are equipped with delivery pipe, for excluding liquid waste.
Wherein, the etching solution of the etching groove discharge is temporarily stored into third connecting pipe, and the controller controls third connecting
Valve switch on pipe is to introduce the reference cell for the etching solution after the etching in etching groove.
Wherein, the etching solution acid concentration measuring equipment further includes the pure water container being electrically connected with the controller, described pure
Water container is connected to the reference cell by pipeline.
Etching solution acid concentration measuring equipment of the present invention will inject etching solution and the etching groove in the reference cell
The acid concentration of interior etching solution compares to control the etching solution acid concentration in etching groove, and making it have enough concentration can be with
Guarantee etching quality.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the schematic diagram of etching solution acid concentration measuring equipment of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the application provides a kind of etching solution acid concentration measuring equipment, the thin film transistor (TFT) for liquid crystal display panel
The patterned formation of metallic diaphragm.The etching solution acid concentration measuring equipment includes controller (not shown), spectrophotometer
11, etching groove 13, reference cell 15, detector 17 and solution memory 19, pure water container 21 and waste liquid accommodating groove.The solution
Memory 19 is connected to by first pipe 191 with the etching groove 13；The solution memory 19 passes through second pipe 192 and institute
State the connection of reference cell 15；The pure water container 21 is electrically connected with the controller, the pure water container 21 and the reference cell 15
It is connected to by pipeline 211, opening 21 valve of pure water container by controller is that the reference cell 15 injects pure water.
The solution memory 19 is for accommodating etching solution.The reference cell is used for reference liquid.Reference liquid in the present embodiment
For pure water and etching solution.Etching solution includes the etching solution in the etching solution that etching groove excludes or solution memory 19.
The controller controls etching groove 13 and reference cell 15 described in 11 illumination simultaneously of spectrophotometer.Wherein, institute
State the light that spectrophotometer 11 has specific different wavelength.Have when the specific light of spectrophotometer 11 irradiates simultaneously
The etching groove 13 and reference cell 15 of different acid concentration liquid, since etching groove 13 is different from the acid concentration of solution in reference cell 15,
The light absorbing wavelength of institute is different, and there are impurity in the etching solution after especially etching generates interference to light wave is absorbed.Therefore pass through
The reference liquid in etching solution and the reference cell 15 in the etching groove 13 of illumination absorbs the light for having different wave length.The erosion
Cutting 13 is connected to the detector 17 with reference cell 15, and the detector 17 is to detect the erosion by spectrophotometer illumination
The wavelength for the light that the etching solution of cutting 13 and the reference liquid of reference cell 15 are absorbed, and it is converted into the acid concentration of data-signal progress
Comparison, and then the acid concentration difference of the etching solution in etching groove 13 and the reference liquid in reference cell 15 can be told to determine erosion
Whether the etching solution in cutting 13 needs replacing or increases concentration, avoids influencing etch effect.
The controller also controls the time that etching solution enters the etching groove 13 and the reference cell 14, and the control
Device control processed controls the etching solution in the etching groove 13, and there are acid concentration differences with the reference liquid in the reference cell 15.Specifically
, etching solution enters the etching groove 13 and the time of the reference cell 14 refers in 13 moment first time heel row of etching groove except interior
14 etching solution of reference cell is being injected after the etching solution in portion.In etching solution and the reference cell 15 in the etching groove 13
There are acid concentration differences to refer to when the acid concentration of the reference liquid in the reference cell 14 is lower than and the etching groove 13 for reference liquid
The acid concentration of etching solution.
It is appreciated that the acid concentration value of the etching solution in the etching groove 13 and the acid of the reference liquid in the reference cell 15
Concentration value is set with the product volume to be etched entered in etching groove 13.For example, the acid concentration of the etching solution when the etching groove 13
It can etch 100 times, and the acid concentration of the reference liquid in the reference cell 14 can be the moment 50 times, it in the process can be at any time
Illumination detection.
In the present embodiment, the etching solution is the aqueous solution containing phosphoric acid, nitric acid and acetic acid, such as aluminium etching solution.
In the present embodiment, the reference liquid is pure water and etching solution, that is the reference liquid accommodated for the first time is pure water, after
The continuous reference liquid accommodated is that there are the etching solutions of acid concentration difference with the acid concentration of the etching solution of the etching groove 13.
In the present embodiment, it is equipped with the valve (not shown) being electrically connected with the controller, control second communicating pipe 192
Device control valve processed, which is opened, realizes that the etching solution in solution memory 19 enters reference cell 15.
Further, the etching groove 13 is equipped with delivery pipe (not shown) with the reference cell 15, discards for excluding
Liquid.The etching groove 13 and the delivery pipe of the reference cell 15 are all connected with the waste liquid accommodating groove 23.
In the present embodiment, the etching solution acid concentration measuring equipment controls the reference in original state, the controller
Pure water is accommodated in pond 15, the etching groove 13 accommodates etching solution；First time is completed when the etching solution in the etching groove 13 to etch,
The etching solution of pure water and etching groove 13 in the reference cell 15 excludes；The controller controls in the reference cell 15 and introduces erosion
After carving liquid, then the etching solution controlled in the solution memory 19 enters the etching groove 13；Erosion in the etching groove 13
It carves liquid and completes second of etching, after introducing etching solution in the controller control reference cell 15, then control the solution and deposit
Etching solution in reservoir 19 enters the etching groove 13；Wherein, the acid concentration of the etching solution in the reference cell 15 and the erosion
The acid concentration of etching solution is in acid concentration difference in cutting 13.
Specifically, when being etched using the etching solution acid concentration measuring equipment, to etch 100 film crystals every time
For pipe array substrate.The etching solution acid concentration measuring equipment controls pure water container 21 in original state, the controller
To the reference cell 15 for pure water, the solution memory 19 is that the etching groove 13 provides etching solution；In the etching groove 13
To etching solution illumination after setting light application time in interior etching solution etching process or etching, make in etching groove 13 and reference cell 15
Etching solution absorb light, then by detector 17 detect the reference cell 15 and the etching solution in etching groove 13 concentration and turn
Signal output is changed into compare.When the etching solution in the etching groove 13 completes first 100 etching, by the reference cell
The etching solution of pure water and etching groove 13 in 15 excludes；The controller controls the solution memory 19 and passed through for the second communicating pipe
192 introduce etching solution into the reference cell 15, or are excluding liquid waste simultaneously, and the solution memory 19 is by etching solution
Storage in the second communicating pipe is injected, enters etching solution in reference cell 15 wait exclude Open valve.And then control is described molten
Etching solution in liquid memory 19 enters the etching groove 13, then carries out illumination when the etching solution in the etching groove 13 is completed
Second of etching, the controller controls in the reference cell 15 after introducing etching solution, then controls in the solution memory 19
Etching solution enter the etching groove 13；And so on.
In other embodiments, the etching groove 13 is connected to the reference cell 15 by 131 pipe of third connecting, and described
Valve (not shown) is arranged on third connecting pipe 131 to be electrically connected with the controller；The etching solution that the etching groove 13 is discharged is temporary
It is stored in third connecting pipe 131.Wherein, the etching solution that the etching groove 13 is discharged is temporarily stored into third connecting pipe 131, the control
Valve switch on device control third connecting pipe 131 processed is to introduce the reference cell for the etching solution after the etching in etching groove
15, as long as can determine that the acid concentration of the etching solution in reference cell 15 is used as reference, and making for etching solution can be saved
With reduction production capacity and environmental protection.
Etching solution acid concentration measuring equipment of the present invention will inject etching solution and the etching groove in the reference cell
The acid concentration of interior etching solution compares to control the etching solution acid concentration in etching groove 13, and making it have enough concentration can
To guarantee etching quality.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and wants according to right of the present invention
Made equivalent variations is sought, is still belonged to the scope covered by the invention.
Claims (8)
1. a kind of etching solution acid concentration measuring equipment, which is characterized in that the etching solution acid concentration measuring equipment include controller,
Spectrophotometer, etching groove, reference cell, detector and solution memory；The solution memory by first pipe with it is described
Etching groove connection, the solution memory are connected to by second pipe with the reference cell；The solution memory is for accommodating
Etching solution；The reference cell is used for reference liquid,
The controller controls etching groove and reference cell described in spectrophotometer illumination simultaneously, the etching solution acid concentration amount
Device is surveyed in original state, the controller controls and accommodates pure water in the reference cell, and the etching groove accommodates etching solution；Work as institute
It states the etching solution in etching groove to complete to etch for the first time, the etching solution of the pure water in the reference cell and etching groove is excluded；Institute
It states after controller controls to etching solution is introduced in the reference cell, then controls described in etching solution in the solution memory enters
Etching groove；It completes second when the etching solution in the etching groove to etch, the controller, which controls, introduces erosion in the reference cell
After carving liquid, then the etching solution controlled in the solution memory enters the etching groove；Wherein, the etching solution in the reference cell
Acid concentration and the etching groove in the acid concentration of etching solution there are acid concentration differences；
The etching groove is connected to the detector with reference cell, and the detector is to detect by spectrophotometer illumination
The wavelength for the light that the etching solution of etching groove and the reference liquid of reference cell are absorbed, and be converted into data-signal and compare.
2. etching solution acid concentration measuring equipment as described in claim 1, which is characterized in that the etching solution be containing phosphoric acid,
The aqueous solution of nitric acid and acetic acid.
3. etching solution acid concentration measuring equipment as claimed in claim 2, which is characterized in that the reference cell accommodated for the first time
Reference liquid is pure water, and the reference liquid of subsequent receiving is that there are the erosions of acid concentration difference with the acid concentration of the etching solution of the etching groove
Carve liquid.
4. etching solution acid concentration measuring equipment as claimed in claim 3, which is characterized in that the etching groove and the reference cell
It is connected to by third connecting pipe, and valve is set on the third connecting pipe and is electrically connected with the controller.
5. etching solution acid concentration measuring equipment as claimed in claim 1 or 3, which is characterized in that the second pipe is equipped with
The valve being electrically connected with the controller, the controller control valve door switch are opened the etching solution realized in solution memory and are entered
Reference cell.
6. etching solution acid concentration measuring equipment as claimed in claim 3, which is characterized in that the etching groove and the reference cell
It is equipped with delivery pipe, for excluding liquid waste.
7. etching solution acid concentration measuring equipment as claimed in claim 4, which is characterized in that the etching solution of the etching groove discharge
It is temporarily stored into third connecting pipe, the valve switch on controller control third connecting pipe is with will be after the etching in etching groove
Etching solution introduces the reference cell.
8. etching solution acid concentration measuring equipment as described in claim 1, which is characterized in that the etching solution acid concentration measures dress
Setting further includes the pure water container being electrically connected with the controller, and the pure water container is connected to the reference cell by pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610338914.8A CN105866049B (en) | 2016-05-20 | 2016-05-20 | Etching solution acid concentration measuring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610338914.8A CN105866049B (en) | 2016-05-20 | 2016-05-20 | Etching solution acid concentration measuring equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105866049A CN105866049A (en) | 2016-08-17 |
| CN105866049B true CN105866049B (en) | 2019-04-26 |
Family
ID=56635475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610338914.8A Active CN105866049B (en) | 2016-05-20 | 2016-05-20 | Etching solution acid concentration measuring equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105866049B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109406433A (en) * | 2019-01-10 | 2019-03-01 | 惠科股份有限公司 | Method for detecting nitric acid content in aluminum etching solution |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379288A (en) * | 2001-04-03 | 2002-11-13 | 三菱化学株式会社 | Etching method and quantitative analysis method of etching liquid |
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
| CN101667040A (en) * | 2008-09-02 | 2010-03-10 | 浩硕科技股份有限公司 | Method for controlling etching solution concentration |
| CN103868866A (en) * | 2014-03-12 | 2014-06-18 | 深圳市华星光电技术有限公司 | Etching solution concentration measurement device and etching solution concentration measurement method |
-
2016
- 2016-05-20 CN CN201610338914.8A patent/CN105866049B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379288A (en) * | 2001-04-03 | 2002-11-13 | 三菱化学株式会社 | Etching method and quantitative analysis method of etching liquid |
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
| CN101667040A (en) * | 2008-09-02 | 2010-03-10 | 浩硕科技股份有限公司 | Method for controlling etching solution concentration |
| CN103868866A (en) * | 2014-03-12 | 2014-06-18 | 深圳市华星光电技术有限公司 | Etching solution concentration measurement device and etching solution concentration measurement method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105866049A (en) | 2016-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1504744A (en) | Liquid crystal cells and their manufacture | |
| CN105866049B (en) | Etching solution acid concentration measuring equipment | |
| CN105259683A (en) | Preparation method for COA-type array substrate and COA-type array substrate | |
| CN103439258B (en) | A kind of water nutrition in situ detection instrument based on integrated valve terminal device and detection method | |
| CN105845604B (en) | The monitoring method and system of acid concentration in a kind of etching process | |
| CN105717674B (en) | Liquid crystal layer is measured to the method for the liquid crystal efficiency of incident light | |
| CN104111255B (en) | PH on-line measuring device based on acid-base indicator absorption spectrum and detection method | |
| CN106053537B (en) | The density monitoring system and method for developer solution | |
| CN102778383B (en) | Automatic solution diluting equipment | |
| CN108803258A (en) | Development control system and developing control methods | |
| KR100696747B1 (en) | Monitoring the variation of dye solution in the process of a polarizer | |
| CN205941343U (en) | That is applied to online water quality testing appearance inhales photometric detection device | |
| CN105651739A (en) | Nanometer optical detection device and nanometer optical detection method on basis of stripping voltammetry for diversified heavy metal ions | |
| Al-Abachi et al. | Batch and flow injection spectrophotometric determination of doxycycline hyclate in pharmaceutical preparations | |
| CN109030468A (en) | A kind of electricity enhancing liquid phase chemiluminescence detecting and detection method | |
| JPS6325629A (en) | Liquid crystal display element | |
| CN103969195A (en) | A novel pH detection instrument based on optical method | |
| CN201148383Y (en) | Full-automatic total phosphorus on-line monitoring dosing system | |
| CN111142301B (en) | High-performance electrochromic device and preparation method thereof | |
| CN101311704B (en) | Multi-point calibration photoelectric detector for automatically diluting titrating solution and method of use thereof | |
| CN106645113B (en) | Method for identifying sodium carbonate and sodium bicarbonate solution by thymol blue-alcohol solution | |
| CN106290343A (en) | Total surplus line oxide real-time detection apparatus and detection method | |
| KR20000033348A (en) | Method and apparatus of coagulant injection in a water purification plant | |
| CN204656517U (en) | A kind of sour pond automatic control system | |
| CN205879839U (en) | Full -automatic on -line measuring system that is used for detecting recirculated cooling water stabilization of water quality nature |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |