CN105855540A - Liquid metal printing device - Google Patents

Liquid metal printing device Download PDF

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Publication number
CN105855540A
CN105855540A CN201610224283.7A CN201610224283A CN105855540A CN 105855540 A CN105855540 A CN 105855540A CN 201610224283 A CN201610224283 A CN 201610224283A CN 105855540 A CN105855540 A CN 105855540A
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CN
China
Prior art keywords
liquid metal
print cartridge
printing
ink
gallium
Prior art date
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Granted
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CN201610224283.7A
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Chinese (zh)
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CN105855540B (en
Inventor
王倩
于洋
陈柏炜
林聚
刘静
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Beijing Dream Ink Technology Co Ltd
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Beijing Dream Ink Technology Co Ltd
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Priority to CN201610224283.7A priority Critical patent/CN105855540B/en
Publication of CN105855540A publication Critical patent/CN105855540A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

The invention discloses a liquid metal printing device. The device comprises a liquid metal printing mechanism, a substrate movement mechanism connected with the liquid metal printing mechanism, a voltage pulse regulating and controlling mechanism connected with the liquid metal printing mechanism and the substrate movement mechanism, and a control device connected with the liquid metal printing mechanism, the substrate movement mechanism and the voltage pulse regulating and controlling mechanism. The liquid metal printing device is used for liquid metal ink which is low in viscosity and high in surface tension, and not only are the printing precision of liquid metal patterns and wettability between liquid metal and a base improved, but also plane printing and space 3D printing can be achieved.

Description

A kind of liquid metal printing device
Technical field
The present invention relates to printed circuit and printed electronic device fabrication arts, in particular it relates to A kind of liquid metal printing device.
Background technology
One key factor of restriction printed electronics development is sending out of printed electronic material Exhibition, traditional conductive ink has carbon series conductive material, conducting polymer and metal nano material. Liquid metal has metalline and fluid properties fusing point concurrently.Low-melting alloy less than 300 DEG C is equal Could be configured as electric ink.Compared with other conductive inks, the cost of liquid metal ink Relatively low, physicochemical properties are stable, and conductance is of a relatively high, and being formed without of conducting wire Post processing.
Being different from the taked processing method of conventional printed circuit, liquid metal ink can lead to Cross miniflow Dow process, mask method, marking method, micro-contact impact system, direct write method, 3D impact system Etc. mode direct quick Fabrication circuit.But, due to liquid metal ink be a kind of low viscosity, High capillary fluid, therefore, existing method which kind of all can be at printing precision, liquid Certain problem is there is in state metal with the aspect such as substrate wetting.Such as, miniflow Dow process is inapplicable In complicated circuit, and owing to surface tension is big, need when fluid channel injection liquid metal Apply the biggest injection pressure, thus determine the circuit limited precision that miniflow Dow process is printed;Cover Embrane method equally needs with miniflow Dow process to make mould, wastes time and energy, and the pattern made often goes out The existing problem such as edge blurry, circuit disconnection;The pattern accuracy that marking method makes is limited, and line is high Spend uneven;Micro-contact impact system speed is very slow, and equally exists the problem that pattern accuracy is limited; Existing liquid metal 3D impact system uses depositing them method, and speed is very slow, and formed Pattern accuracy is the lowest;Direct write method need not make template, and CN104118222A proposes one Liquid metal stylus printing equipment and Method of printing, realize circuit by direct writing means and fast beat Print, but the surface tension of the liquid metal ink owing to printing changes little, therefore circuit essence Spending limited, when pinhole aperture reduces, liquid metal ink easily blocks nib, it is impossible to print Submicron-scale pattern, and this equipment is not suitable for printing 3D pattern.
Summary of the invention
It is an object of the invention to provide a kind of liquid metal printing device.Described equipment is for low Viscosity, high capillary liquid metal ink, not only increase beating of liquid metal pattern Wetability between print precision and liquid metal and substrate, but also plane can be realized and print Print with space 3D.
To achieve these goals, the present invention provides a kind of liquid metal printing device.Described Equipment includes:
Liquid metal printing mechanism, substrate motion mechanism, voltage pulse regulating and controlling mechanism and control Device processed,
Described liquid metal printing mechanism, is used for liquid metal ink jet in printed substrates On print;
Described substrate motion mechanism, is connected with described liquid metal printing mechanism, is used for carrying Described printed substrates, and make accordingly according to the first control instruction of described control device transmission Motion, to adjust the locus of described printed substrates;
Described voltage pulse regulating and controlling mechanism, with described liquid metal printing mechanism and described substrate Motion connects, and is described for the second control instruction sent according to described control device Voltage pulse needed for liquid metal printing mechanism and the offer of described substrate motion mechanism;
Described control device, and described liquid metal printing mechanism, described substrate motion mechanism, And described voltage pulse regulating and controlling mechanism connects, control described liquid for the information according to input Metallic print mechanism, described substrate motion mechanism, and described voltage pulse regulating and controlling mechanism.
Alternatively, described liquid metal printing mechanism includes:
Liquid metal print cartridge, is used for storing described liquid metal ink;
Printhead, is connected with the outlet at bottom of described liquid metal print cartridge;
Electrode assembly, is connected with the positive pole of described voltage pulse regulating and controlling mechanism, is used for so that institute State positive charge on the liquid metal ink ribbons in liquid metal print cartridge;
Pressue device, is arranged on described liquid metal print cartridge, for controlling dress according to described The 3rd control instruction putting transmission provides pressure so that the liquid in described liquid metal print cartridge Metallic ink moves downward, and from described printhead jet to described printed substrates.
Alternatively, described liquid metal printing mechanism also includes:
Heat-insulation layer, is arranged on the outer surface of described liquid metal print cartridge, is used for keeping described Temperature in liquid metal print cartridge.
Wherein, described liquid metal printing mechanism also includes:
Heating member, is arranged on described liquid metal print cartridge;
Temperature sensor, is arranged in described liquid metal print cartridge, is used for measuring described liquid The temperature value of metallic ink;
Controller, is connected with described heating member and described control device, for according to described control The 4th control instruction that device processed produces according to the temperature value of described liquid metal ink controls institute State heating member the liquid metal ink in described liquid metal print cartridge is heated so that institute The temperature stating liquid metal ink reaches preset temperature.
Alternatively, described heating member is resistance heating wire or solenoid,
Described resistance heating wire is arranged at inside described liquid metal print cartridge and described printhead, The bottom of described printhead is extended to by the top of described liquid metal print cartridge;
Described solenoid is wrapped in described liquid metal print cartridge and the appearance of described printhead Face, is extended to the bottom of described printhead by the top of described liquid metal print cartridge.
Alternatively, described electrode assembly is electrode catheter or metal electrode ring,
Described electrode catheter is arranged in described liquid metal print cartridge;
Described metal electrode ring is arranged on the sidewall of described printhead.
Alternatively, described substrate motion mechanism includes:
Metallic plate, is connected with the negative pole of described voltage pulse regulating and controlling mechanism, for fixing described Printed substrates;
Objective table, is used for carrying described metallic plate;
Three-axis moving mechanism, is connected with described control device, for according to described control device The first control instruction sent moves described in X-direction, Y direction and Z-direction Objective table, thus adjust described printed substrates and printhead in described liquid metal printing mechanism Relative space position.
Alternatively, described voltage pulse regulating and controlling mechanism includes:
Voltage source, for providing the voltage needed for described liquid metal printing device;
Voltage regulating device, is connected with described voltage source, for sending out according to described control device The second control instruction sent adjusts the voltage pulse of output;
Wherein, in the positive pole of described voltage regulating device and described liquid metal printing mechanism Electrode assembly connects, in the negative pole of described voltage regulating device and described substrate motion mechanism Metallic plate connects.
Alternatively, described liquid metal ink be following at least one:
Gallium, indium, tin, gallium-indium alloy, gallium-indium-tin alloy, gallium ashbury metal, gallium kirsite, Gallium indium kirsite, gallium red brass, gallium indium tin kirsite, gallium tin cadmium alloy, gallium zinc cadmium close Gold, bismuth indium alloy, bismuth ashbury metal, bismuth indium stannum alloy, bismuth indium kirsite, bismuth red brass, Bismuth indium red brass, leypewter, gun-metal, tin pltine, SAC, Bismuth terne metal, and metal or alloy and all kinds of electrical-conductive nanometers or the mixture of micron particles.
Alternatively, the material of described printed substrates include following at least one:
Polyethylene, polyvinyl chloride, polypropylene, polyimides, polystyrene, Merlon, Polyether-ether-ketone, polymethyl methacrylate, PET, epoxy resin, Acrylonitrile-butadiene-styrene copolymer, PLA, polyvinyl alcohol, dimethyl silicone polymer, Silica gel, rubber, paper, glass, pottery, cloth, timber, solid metal and alloy.
Alternatively, the printing type of described liquid metal printing device include following at least A kind of:
Plane prints, irregular substrate prints and space 3D prints.
By technique scheme, the metallic plate below liquid metal ink and printed substrates Between apply voltage pulse so that liquid metal ink reduces surface under the effect of electric field force Tension force, flows out from printhead in the way of electrified jet, and forms figure in printed substrates Case.Printhead internal diameter is the least, and the liquid metal ink jet of outflow also can be the thinnest, Ke Yishi The existing other printing precision of submicron order, thus solve low viscosity, high capillary liquid Metallic ink cannot improve beating of liquid metal pattern from the problem of small-bore printhead ejection Print precision.Further, since liquid metal ink and metallic plate are with electrostatic charge, when liquid gold Genus ink jet is when printed substrates, due to the existence of electrostatic charge, improves liquid metal ink Wetability between water and printed substrates.
Additionally, the size of the voltage pulse exported by adjustment, make up printhead and printing Substrate vertical range changes the change brought, it is possible to achieve space 3D prints.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, under The accompanying drawing used required in embodiment or description of the prior art will be briefly described by face. It should be evident that the accompanying drawing in describing below is only some embodiments of the present invention, for From the point of view of those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to Other accompanying drawing is obtained according to these figures.
Fig. 1 is the structural representation of the liquid metal printing device that one embodiment of the invention provides;
Fig. 2 is that the liquid metal of the liquid metal printing device that one embodiment of the invention provides is beaten The structural representation of printing mechanism;
Fig. 3 is that the liquid metal of the liquid metal printing device that one embodiment of the invention provides is beaten The structural representation of printing mechanism;
Fig. 4 is that the print procedure of the liquid metal printing device that one embodiment of the invention provides shows It is intended to.
Description of reference numerals
1 liquid metal printing mechanism 2 substrate motion mechanism 3 voltage pulse regulating and controlling mechanism
4 control device 21 metallic plate 22 objective table 23 bindiny mechanism
24 three-axis moving mechanism 11 liquid metal print cartridge 12 heat-insulation layer 13 printheads
141 solenoid 142 electromagnetic controller 15 temperature sensor 16 pressue devices
17 electrode catheter 18 metal electrode rings
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, to the technical side in the embodiment of the present invention Case is clearly and completely described, it is clear that described embodiment is only the present invention one Divide embodiment rather than whole embodiments.Based on the embodiment in the present invention, this area is general The every other embodiment that logical technical staff is obtained under not making creative work premise, Broadly fall into the scope of protection of the invention.
Fig. 1 is the structural representation of the liquid metal printing device that one embodiment of the invention provides. As it is shown in figure 1, the liquid metal printing device that one embodiment of the invention provides includes: liquid Metallic print mechanism 1, substrate motion mechanism 2, voltage pulse regulating and controlling mechanism 3 and control dress Putting 4, described liquid metal printing mechanism 1, for printing base by liquid metal ink jet Print at the end;Described substrate motion mechanism 2, with described liquid metal printing mechanism 1 Connect, be used for carrying described printed substrates, and the first control sent according to described control device Corresponding motion is made in instruction processed, to adjust the locus of described printed substrates;Described electricity Pressure pulse regulating and controlling mechanism 3, with described liquid metal printing mechanism 1 and described substrate motion mechanism 2 connect, and are described liquid metal for the second control instruction sent according to described control device Voltage pulse needed for printing mechanism and the offer of described substrate motion mechanism;Described control device 4, with described liquid metal printing mechanism 1, described substrate motion mechanism 2, and described voltage Pulse regulating and controlling mechanism 3 connects, and controls described liquid metal for the information according to input and prints Mechanism, described substrate motion mechanism, and described voltage pulse regulating and controlling mechanism.
In a particular embodiment, described liquid metal mechanism 1 includes: liquid metal ink Box, is used for storing described liquid metal ink;Printhead, with described liquid metal print cartridge Outlet at bottom connects;Electrode assembly, is connected with the positive pole of described voltage pulse regulating and controlling mechanism, For making positive charge on the liquid metal ink ribbons in described liquid metal print cartridge;Add and press-fit Put, be arranged on described liquid metal print cartridge, for send according to described control device the Three control instructions provide pressure so that the liquid metal ink in described liquid metal print cartridge to Lower motion, and from described printhead jet to described printed substrates.
Wherein, described electrode assembly is electrode catheter or metal electrode ring.Fill at described electrode In the case of being set to described electrode catheter, described electrode catheter is arranged at described liquid metal ink In box.In the case of described electrode assembly is described metal electrode ring, described metal electrode Ring is arranged on the sidewall of described printhead.
Preferably, described liquid metal printing mechanism 1 also includes: heat-insulation layer, is arranged at institute State on the outer surface of liquid metal print cartridge, the temperature within keeping described liquid metal print cartridge. Thereby, it is possible to slow down the speed that temperature declines in liquid metal box.
Preferably, described liquid metal printing mechanism 1 also includes: heating member, is arranged at institute State on liquid metal print cartridge;Temperature sensor, is arranged in described liquid metal print cartridge, uses In the temperature value measuring described liquid metal ink;Controller, with described heating member and described Control device to connect, for according to described control device according to the temperature of described liquid metal ink The 4th control instruction that angle value produces controls described heating member in described liquid metal print cartridge Liquid metal ink heats so that the temperature of described liquid metal ink reaches to preset temperature Degree.Thereby, it can be ensured that liquid metal ink is in liquid and temperature in print procedure all the time Spend constant.
Wherein, described heating member is resistance heating wire or solenoid.At described heating member it is In the case of resistance heating wire, described resistance heating wire be arranged at described liquid metal print cartridge and Inside described printhead, the top of described liquid metal print cartridge extend to described printhead Bottom.In the case of described heating member is solenoid, described solenoid is wrapped in institute State liquid metal print cartridge and the outer surface of described printhead, by the top of described liquid metal print cartridge Portion extends to the bottom of described printhead.
In a particular embodiment, described substrate motion mechanism 2 includes: metallic plate 21, It is connected with the negative pole of described voltage pulse regulating and controlling mechanism 3, is used for fixing described printed substrates; Objective table 22, is used for carrying described metallic plate;Three-axis moving mechanism 24, controls dress with described Put 4 connections, for according to described control device send the first control instruction X-direction, Y direction and Z-direction move described objective table, thus adjust described printed substrates with The relative space position of printhead in described liquid metal printing mechanism.
Wherein, described equipment also includes: bindiny mechanism 23, is used for connecting described liquid metal Printing mechanism 1 and described substrate motion mechanism 2.
In concrete application, described voltage pulse regulating and controlling mechanism 3 includes: voltage source, uses In providing the voltage needed for described liquid metal printing device;Voltage regulating device, with described Voltage source connects, and adjusts output for the second control instruction sent according to described control device Voltage pulse;Wherein, the positive pole of described voltage regulating device prints with described liquid metal Electrode assembly in mechanism connects, the negative pole of described voltage regulating device and described substrate motion Metallic plate in mechanism connects.
Preferably, the printing type of described liquid metal printing device include following at least A kind of: plane prints, irregular substrate prints and space 3D prints.Carrying out space When 3D prints, by the size of the voltage pulse that adjustment exports, make up printhead and printing Substrate vertical range changes the change brought.
Wherein, described liquid metal ink is fusing point low melting point gold below 300 degrees Celsius Belong to or alloy, low such as the low-melting-point metal element such as gallium, indium, tin, bismuth, lead, cadmium composition Melting point metals or alloy, as gallium, indium, tin, gallium-indium alloy, gallium-indium-tin alloy, gallium tin close Gold, gallium kirsite, gallium indium kirsite, gallium red brass, gallium indium tin kirsite, gallium tin cadmium Alloy, gallium Zn-Cd alloy, bismuth indium alloy, bismuth ashbury metal, bismuth indium stannum alloy, bismuth indium zinc close Gold, bismuth red brass, bismuth indium red brass, leypewter, gun-metal, tin zinc-copper close Gold, SAC, bismuth terne metal etc., also include that these metal or alloy are led with all kinds of One or more in the mixture of susceptance rice or micron particles.
Wherein, the material of printed substrates includes high molecular polymer, such as polyethylene (PE), gathers Vinyl chloride (PVC), polypropylene (PP), polyimides (PI), polystyrene (PS), Merlon (PC), polyether-ether-ketone (PEEK), polymethyl methacrylate (PMMA), PET (PET), epoxy resin (EP), acrylonitrile-butadiene-benzene second Alkene copolymer (ABS), PLA (PLA), polyvinyl alcohol (PVA), poly dimethyl silicon Oxygen alkane (PDMS) and all kinds of silica gel, rubber etc., also include paper, glass, pottery, cloth Material, timber or solid metal and alloy etc..
The present embodiment is by executing between the metallic plate below liquid metal ink and printed substrates Making alive pulse so that liquid metal ink reduces surface tension under the effect of electric field force, Flow out in the way of electrified jet from printhead, and in printed substrates, form pattern.Beat Print head internal diameter is the least, and the liquid metal ink jet of outflow also can be the thinnest, it is possible to achieve sub-micro The other printing precision of meter level, thus solve low viscosity, high capillary liquid metal ink Water cannot improve the printing precision of liquid metal pattern from the problem of small-bore printhead ejection. Further, since liquid metal ink and metallic plate are with electrostatic charge, when liquid metal ink is penetrated Stream, when printed substrates, due to the existence of electrostatic charge, improves liquid metal ink and printing Wetability between substrate.Additionally, the size of the voltage pulse exported by adjustment, come more Mend printhead and change, with printed substrates vertical range, the change brought, it is possible to achieve space 3D Print.
Fig. 2 is that the liquid metal of the liquid metal printing device that one embodiment of the invention provides is beaten The structural representation of printing mechanism.As in figure 2 it is shown, liquid metal printing mechanism 1 includes liquid Metal print cartridge 11, for storing liquid metallic ink;Heat-insulation layer 12, is wrapped in liquid metal On the outer surface of print cartridge 11;Printhead 13, is used for forming liquid metal jet, for stainless steel Material, is connected with described liquid metal print cartridge 11 bottom end outlet;Solenoid 141 and electromagnetism Controller 142, wherein, solenoid 141 is wrapped in outside heat-insulation layer 12, is used for adding hydrothermal solution State metallic ink so that it is keep liquid;Temperature sensor 15, is placed in described liquid metal ink Box 11 is internal, for measuring the temperature of liquid metal ink;Pressue device 16, is used for promoting Liquid metal ink moves downward, and uses electromagnetic pump in the present embodiment.It addition, connection voltage The electrode catheter 17 of regulation device positive pole is placed in described liquid metal print cartridge 11, with liquid Metallic ink contacts.Wherein, the liquid metal ink that the present embodiment uses is that fusing point is at 15 DEG C Gallium-indium alloy, therefore, the liquid metal of liquid metal printing mechanism 1 in the present embodiment Print cartridge 11 need not heating.Wherein, the present embodiment uses base material to be polyvinyl chloride (PVC)。
During use, selecting plane printing type, the pattern that will print generates print command, It is transferred to control in device 4.Then, PVC substrate is fixed on metallic plate 21, opens Open voltage source switch.Start after ready to print, control device 4 and can first control pressurization Device 16 applies pressure to liquid metal ink so that printhead 13 has a small amount of liquid metal Ink flows out.When liquid metal contacts ink to printed substrates, control device 4 according to connecing The instruction received controls substrate motion mechanism 2 each parts motion and voltage pulse regulating and controlling mechanism The sequence of voltage pulses of 3 outputs.Fig. 4 is that the liquid metal that one embodiment of the invention provides prints The print procedure schematic diagram of equipment.As shown in Figure 4, under electrostatic interaction, liquid metal ink Water flows out from printhead 13, thus prints liquid metal line in printed substrates.
Fig. 3 is that the liquid metal of the liquid metal printing device that one embodiment of the invention provides is beaten The structural representation of printing mechanism.As it is shown on figure 3, liquid metal prints unlike Fig. 2 The structure of mechanism 1.Printhead 13 sidewall is a circle metal electrode ring 18, connects regulating and controlling voltage The positive pole of device, therefore flows to printhead when liquid metal ink under pressue device 16 acts on Time interior, liquid metal ink ribbons positive charge.
When liquid metal ink is bismuth indium stannum alloy, liquid metal print cartridge 11 needs heating. During printing, set the heating-up temperature of liquid metal ink according to the instruction controlling device, pass through The liquid metal ink of 11 in liquid metal print cartridge is heated by solenoid 141, passes through Temperature sensor 15 monitors temperature, and feedback temperature information, thus regulates and controls electromagnetic controller 142, it is ensured that liquid metal ink is in liquid and temperature constant in print procedure all the time.
In the case of heating member is resistance heating wire, resistance heating wire is by liquid metal print cartridge The top of cavity volume extends to the bottom of liquid metal print cartridge cavity volume, during extending, and resistance The flexible extension of heater strip, to increase the contact area with liquid metal ink.Thus, really Protect liquid metal ink in print procedure, be in liquid and temperature constant all the time.
In actual application, also relate to utilize liquid metal printing device to carry out pattern and beat The method of print, comprises the following steps:
(1) printing type is selected;
(2) material of printed substrates is selected;
(3) resolve print pattern, generate the instruction controlling printing device;
Control device and receive instruction, and control the pressure of described liquid metal printing mechanism accordingly With temperature, the motion of each parts of substrate motion mechanism, the voltage arteries and veins of voltage pulse regulating and controlling mechanism Rush sequence, it is achieved pattern prints.When printing initial, control device and can first control to add and press-fit Put and liquid metal ink applied pressure so that printhead has a small amount of liquid metal ink to flow out, When liquid metal contacts ink to printed substrates, under electrostatic interaction, can be along with substrate Lines are drawn in motion.
The present invention is not limited to liquid metal ink, the suitableeest for other conductor fluid With.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, but, the present invention It is not limited to the detail in above-mentioned embodiment, in the technology concept of the present invention, Technical scheme can be carried out multiple simple variant, these simple variant belong to this The protection domain of invention.
It is further to note that each the concrete skill described in above-mentioned detailed description of the invention Art feature, in the case of reconcilable, can be combined by any suitable means, for Avoiding unnecessary repetition, various possible combinations illustrate by the present invention the most separately.
Additionally, can also be combined between the various different embodiment of the present invention, As long as it is without prejudice to the thought of the present invention, it should be considered as content disclosed in this invention equally.

Claims (10)

1. a liquid metal printing device, it is characterised in that described equipment includes:
Liquid metal printing mechanism, substrate motion mechanism, voltage pulse regulating and controlling mechanism and control Device processed,
Described liquid metal printing mechanism, is used for liquid metal ink jet in printed substrates On print;
Described substrate motion mechanism, is connected with described liquid metal printing mechanism, is used for carrying Described printed substrates, and make accordingly according to the first control instruction of described control device transmission Motion, to adjust the locus of described printed substrates;
Described voltage pulse regulating and controlling mechanism, with described liquid metal printing mechanism and described substrate Motion connects, and is described for the second control instruction sent according to described control device Voltage pulse needed for liquid metal printing mechanism and the offer of described substrate motion mechanism;
Described control device, and described liquid metal printing mechanism, described substrate motion mechanism, And described voltage pulse regulating and controlling mechanism connects, control described liquid for the information according to input Metallic print mechanism, described substrate motion mechanism, and described voltage pulse regulating and controlling mechanism.
Liquid metal printing device the most according to claim 1, it is characterised in that institute State liquid metal printing mechanism to include:
Liquid metal print cartridge, is used for storing described liquid metal ink;
Printhead, is connected with the outlet at bottom of described liquid metal print cartridge;
Electrode assembly, is connected with the positive pole of described voltage pulse regulating and controlling mechanism, is used for so that institute State positive charge on the liquid metal ink ribbons in liquid metal print cartridge;
Pressue device, is arranged on described liquid metal print cartridge, for controlling dress according to described The 3rd control instruction putting transmission provides pressure so that the liquid in described liquid metal print cartridge Metallic ink moves downward, and from described printhead jet to described printed substrates.
Liquid metal printing device the most according to claim 2, it is characterised in that institute State liquid metal printing mechanism also to include:
Heat-insulation layer, is arranged on the outer surface of described liquid metal print cartridge, is used for keeping described Temperature in liquid metal print cartridge.
Wherein, described liquid metal printing mechanism also includes:
Heating member, is arranged on described liquid metal print cartridge;
Temperature sensor, is arranged in described liquid metal print cartridge, is used for measuring described liquid The temperature value of metallic ink;
Controller, is connected with described heating member and described control device, for according to described control The 4th control instruction that device processed produces according to the temperature value of described liquid metal ink controls institute State heating member the liquid metal ink in described liquid metal print cartridge is heated so that institute The temperature stating liquid metal ink reaches preset temperature.
Liquid metal printing device the most according to claim 3, it is characterised in that institute Stating heating member is resistance heating wire or solenoid,
Described resistance heating wire is arranged at inside described liquid metal print cartridge and described printhead, The bottom of described printhead is extended to by the top of described liquid metal print cartridge;
Described solenoid is wrapped in described liquid metal print cartridge and the appearance of described printhead Face, is extended to the bottom of described printhead by the top of described liquid metal print cartridge.
Liquid metal printing device the most according to claim 2, it is characterised in that institute Stating electrode assembly is electrode catheter or metal electrode ring,
Described electrode catheter is arranged in described liquid metal print cartridge;
Described metal electrode ring is arranged on the sidewall of described printhead.
Liquid metal printing device the most according to claim 1, it is characterised in that institute State substrate motion mechanism to include:
Metallic plate, is connected with the negative pole of described voltage pulse regulating and controlling mechanism, for fixing described Printed substrates;
Objective table, is used for carrying described metallic plate;
Three-axis moving mechanism, is connected with described control device, for according to described control device The first control instruction sent moves described in X-direction, Y direction and Z-direction Objective table, thus adjust described printed substrates and printhead in described liquid metal printing mechanism Relative space position.
Liquid metal printing device the most according to claim 1, it is characterised in that institute State voltage pulse regulating and controlling mechanism to include:
Voltage source, for providing the voltage needed for described liquid metal printing device;
Voltage regulating device, is connected with described voltage source, for sending out according to described control device The second control instruction sent adjusts the voltage pulse of output;
Wherein, in the positive pole of described voltage regulating device and described liquid metal printing mechanism Electrode assembly connects, in the negative pole of described voltage regulating device and described substrate motion mechanism Metallic plate connects.
8. print according to the liquid metal described in any one claim in claim 1-7 Equipment, it is characterised in that described liquid metal ink be following at least one:
Gallium, indium, tin, gallium-indium alloy, gallium-indium-tin alloy, gallium ashbury metal, gallium kirsite, Gallium indium kirsite, gallium red brass, gallium indium tin kirsite, gallium tin cadmium alloy, gallium zinc cadmium close Gold, bismuth indium alloy, bismuth ashbury metal, bismuth indium stannum alloy, bismuth indium kirsite, bismuth red brass, Bismuth indium red brass, leypewter, gun-metal, tin pltine, SAC, Bismuth terne metal, and metal or alloy and all kinds of electrical-conductive nanometers or the mixture of micron particles.
9. print according to the liquid metal described in claim 1-7 any one claim and set Standby, it is characterised in that the material of described printed substrates include following at least one:
Polyethylene, polyvinyl chloride, polypropylene, polyimides, polystyrene, Merlon, Polyether-ether-ketone, polymethyl methacrylate, PET, epoxy resin, Acrylonitrile-butadiene-styrene copolymer, PLA, polyvinyl alcohol, dimethyl silicone polymer, Silica gel, rubber, paper, glass, pottery, cloth, timber, solid metal and alloy.
10. beat according to the liquid metal described in any one claim in claim 1-7 Printing apparatus, it is characterised in that the printing type of described liquid metal printing device includes following In at least one:
Plane prints, irregular substrate prints and space 3D prints.
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Cited By (22)

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CN107755697A (en) * 2017-09-27 2018-03-06 湖南华曙高科技有限责任公司 Ormolu product and its increasing material manufacturing forming method
CN107803504A (en) * 2016-09-09 2018-03-16 北京梦之墨科技有限公司 A kind of suspension printing-forming method of liquid metal three-dimensional macro structure
CN107938369A (en) * 2017-11-06 2018-04-20 北京梦之墨科技有限公司 A kind of conductive fabric and preparation method thereof
CN108326309A (en) * 2018-04-08 2018-07-27 北京梦之墨科技有限公司 Printer ink cartridge and printing equipment
CN108342614A (en) * 2018-05-17 2018-07-31 深圳市美信电子有限公司 A kind of 3D printing metal material and 3D printing metal device
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CN108511238A (en) * 2018-05-28 2018-09-07 北京梦之墨科技有限公司 A kind of thin film switch and its device and method for preparing thin film switch
CN108995204A (en) * 2018-07-09 2018-12-14 杨晓宏 A kind of melting inertia ejection assemblies and increasing material manufacturing system
CN109068495A (en) * 2018-09-21 2018-12-21 北京梦之墨科技有限公司 A kind of liquid metal printer
CN109089383A (en) * 2018-09-21 2018-12-25 北京梦之墨科技有限公司 A kind of liquid metal printer and its welding mechanism
CN109121314A (en) * 2018-09-21 2019-01-01 北京梦之墨科技有限公司 A kind of printing preparation method and device of printed circuit
CN109302807A (en) * 2018-09-21 2019-02-01 北京梦之墨科技有限公司 Pattern forming method and device, printer and Method of printing
CN110355370A (en) * 2019-08-09 2019-10-22 宝鸡高新智能制造技术有限公司 A kind of liquid metal 3D printing device
WO2019242743A1 (en) * 2018-06-22 2019-12-26 北京梦之墨科技有限公司 Printed circuit and preparation method therefor
CN110774771A (en) * 2018-07-31 2020-02-11 北京梦之墨科技有限公司 Oxide content testing assembly of liquid metal ink supply system
CN110774766A (en) * 2018-07-31 2020-02-11 北京梦之墨科技有限公司 Reduction ink path of liquid metal ink supply system
CN111069606A (en) * 2019-12-06 2020-04-28 北京航空航天大学 Continuous forming method of low-melting-point metal
CN111376608A (en) * 2018-12-29 2020-07-07 北京梦之墨科技有限公司 Ink box and ink box system
CN112191853A (en) * 2020-03-31 2021-01-08 北京航空航天大学 Rapid forming method of liquid metal gallium at room temperature
CN112333928A (en) * 2020-11-25 2021-02-05 青岛理工大学 Flexible circuit integrated printing and packaging method based on liquid metal
CN114945249A (en) * 2022-05-30 2022-08-26 华中科技大学 Multilayer functional circuit structure based on electrowetting and electrofluid jet printing method thereof

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CN107803504A (en) * 2016-09-09 2018-03-16 北京梦之墨科技有限公司 A kind of suspension printing-forming method of liquid metal three-dimensional macro structure
CN107803504B (en) * 2016-09-09 2018-10-16 北京梦之墨科技有限公司 A kind of suspension printing-forming method of liquid metal three-dimensional macro structure
CN107234804A (en) * 2017-06-23 2017-10-10 大连理工大学 The electric jet Method of printing that a kind of nanometer of point infiltration is focused on
CN107755697A (en) * 2017-09-27 2018-03-06 湖南华曙高科技有限责任公司 Ormolu product and its increasing material manufacturing forming method
CN107938369A (en) * 2017-11-06 2018-04-20 北京梦之墨科技有限公司 A kind of conductive fabric and preparation method thereof
CN108513446A (en) * 2018-03-23 2018-09-07 北京梦之墨科技有限公司 A kind of transfer template and transfer method
CN108326309A (en) * 2018-04-08 2018-07-27 北京梦之墨科技有限公司 Printer ink cartridge and printing equipment
CN108342614A (en) * 2018-05-17 2018-07-31 深圳市美信电子有限公司 A kind of 3D printing metal material and 3D printing metal device
CN108511238A (en) * 2018-05-28 2018-09-07 北京梦之墨科技有限公司 A kind of thin film switch and its device and method for preparing thin film switch
CN108511238B (en) * 2018-05-28 2023-09-26 北京梦之墨科技有限公司 Membrane switch and method for preparing membrane switch
WO2019242743A1 (en) * 2018-06-22 2019-12-26 北京梦之墨科技有限公司 Printed circuit and preparation method therefor
CN108995204A (en) * 2018-07-09 2018-12-14 杨晓宏 A kind of melting inertia ejection assemblies and increasing material manufacturing system
CN110774771A (en) * 2018-07-31 2020-02-11 北京梦之墨科技有限公司 Oxide content testing assembly of liquid metal ink supply system
CN110774766A (en) * 2018-07-31 2020-02-11 北京梦之墨科技有限公司 Reduction ink path of liquid metal ink supply system
CN109089383A (en) * 2018-09-21 2018-12-25 北京梦之墨科技有限公司 A kind of liquid metal printer and its welding mechanism
CN109121314A (en) * 2018-09-21 2019-01-01 北京梦之墨科技有限公司 A kind of printing preparation method and device of printed circuit
CN109302807A (en) * 2018-09-21 2019-02-01 北京梦之墨科技有限公司 Pattern forming method and device, printer and Method of printing
CN109068495A (en) * 2018-09-21 2018-12-21 北京梦之墨科技有限公司 A kind of liquid metal printer
CN109089383B (en) * 2018-09-21 2023-12-26 北京梦之墨科技有限公司 Liquid metal printer and welding mechanism thereof
CN109068495B (en) * 2018-09-21 2023-11-21 北京梦之墨科技有限公司 Liquid metal printer
CN111376608A (en) * 2018-12-29 2020-07-07 北京梦之墨科技有限公司 Ink box and ink box system
CN110355370A (en) * 2019-08-09 2019-10-22 宝鸡高新智能制造技术有限公司 A kind of liquid metal 3D printing device
CN111069606B (en) * 2019-12-06 2022-02-22 北京航空航天大学 Continuous forming method of low-melting-point metal
CN111069606A (en) * 2019-12-06 2020-04-28 北京航空航天大学 Continuous forming method of low-melting-point metal
CN112191853A (en) * 2020-03-31 2021-01-08 北京航空航天大学 Rapid forming method of liquid metal gallium at room temperature
CN112333928A (en) * 2020-11-25 2021-02-05 青岛理工大学 Flexible circuit integrated printing and packaging method based on liquid metal
CN114945249A (en) * 2022-05-30 2022-08-26 华中科技大学 Multilayer functional circuit structure based on electrowetting and electrofluid jet printing method thereof
CN114945249B (en) * 2022-05-30 2024-05-14 华中科技大学 Multi-layer functional circuit structure based on electrowetting and electrofluidic jet printing method thereof

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