CN105855123A - Adhesive dispensing device - Google Patents
Adhesive dispensing device Download PDFInfo
- Publication number
- CN105855123A CN105855123A CN201610353208.0A CN201610353208A CN105855123A CN 105855123 A CN105855123 A CN 105855123A CN 201610353208 A CN201610353208 A CN 201610353208A CN 105855123 A CN105855123 A CN 105855123A
- Authority
- CN
- China
- Prior art keywords
- glue
- heating member
- heating
- temperature
- discharging mouth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
Abstract
The invention discloses an adhesive dispensing device. The adhesive dispensing device comprises an adhesive dispensing cylinder, an adhesive dispensing needle, a first heating element and a second heating element, wherein the first heating element is used for heating adhesive inside the adhesive dispensing cylinder, the second heating element is used for heating adhesive inside the adhesive dispensing needle, and the heating temperature of the second heating element for the adhesive inside the adhesive dispensing needle is higher than that of the first heating element for the adhesive inside the adhesive dispensing cylinder. Therefore, the temperature of the adhesive inside the adhesive dispensing needle is made to be higher so as to decrease the area of the adhesive output surface of the adhesive dispensing needle on the one hand, and on the other hand, the temperature of the adhesive inside the adhesive dispensing cylinder is made to be lower so as to reduce the risk of adhesive tube burst and to reduce the occurrence possibility of chemical reaction of the adhesive inside the adhesive dispensing cylinder, and the property of the adhesive is maintained.
Description
Technical field
The present invention relates to dispensing technology field, particularly relate to a kind of point glue equipment.
Background technology
In the some glue program that point glue equipment is generally used between the frame to mobile phone and touch screen.At present, by
Requiring more and more higher in user to the screen accounting of mobile phone, mobile phone frame does narrower and narrower, the most also to mobile phone limit
Glue thickness between frame and touch screen proposes the highest requirement.At present, though mobile phone frame with
Glue thickness between touch screen has reached below 0.5mm, but user still desires to drop further
Low glue thickness.
But, due to the impact of glue self viscosity, if the plastic emitting of the dispensing needle head of point glue equipment is transversal
Face is too small, then can cause the dispensing needle head cannot plastic emitting.Therefore, the glue surface that goes out limiting dispensing needle head cannot
Reduce, and then the glue thickness between mobile phone frame and touch screen cannot be reduced.
Existing point glue equipment generally comprises some plastic pin cylinder and a dispensing needle head, and to a plastic pin cylinder, some glue
Glue in syringe needle carries out the heating arrangement heated.When carrying out glue, by heating arrangement to a mucilage binding
Put after interior glue is heated to the reasonable temperature that this glue is corresponding, control glue and flow out to enter from dispensing needle head
Row point glue.But, due to glue impact of its viscosity under reasonable temperature, its correspondence may be caused
The going out glue surface and still can not meet demand of dispensing needle head.
Therefore, in prior art, in order to by reducing the viscosity of glue further to reach to subtract further
The purpose going out glue surface of little dispensing needle head, typically can improve heating arrangement adding the glue in point glue equipment
Hot temperature.Such as, if reasonable temperature corresponding to glue may be 120 DEG C, i.e. at the some adhesive tape part of 120 DEG C
Under, this glue has preferably quasi-viscous effect.And the glue in actual point glue program, at possible 120 DEG C
It is the biggest that the minimum of required dispensing needle head goes out glue surface, still can not meet the demand of user, therefore,
For the purpose going out glue surface further up to reduction dispensing needle head, can control heating arrangement will a some plastic pin
Glue in cylinder and dispensing needle head is heated to 150 DEG C, to reduce the viscosity of glue, and then reduces some plastic pin
Head go out glue surface.
But there is following defect, owing to the glue constant temperature in a plastic pin cylinder is higher, it is understood that there may be glue
Pipe booster phenomenon, and glue persistently keeps higher temperature in whole some glue program, the highest
Temperature may also cause glue generation chemical reaction, and then affects the performance of glue.
Summary of the invention
Present invention is primarily targeted at a kind of point glue equipment of offer, it is intended to reduce the some plastic pin of point glue equipment
Head go out glue surface size, keep the performance of glue simultaneously.
The point glue equipment that the present invention provides, including some plastic pin cylinder and a dispensing needle head, described point glue equipment also wraps
Include the first heating member for the glue in described some plastic pin cylinder is heated and in described dispensing needle head
Glue heating the second heating member, the heating to the glue in described dispensing needle head of described second heating member
Temperature is more than described first heating member heating-up temperature to the glue in described some plastic pin cylinder.
Optionally, described point glue equipment also includes being connected to going out between described some plastic pin cylinder and dispensing needle head
Jiao Zui.
Optionally, the glue in described glue discharging mouth is heated by described first heating member the most simultaneously.
Optionally, it is provided with sealing coat between described first heating member and described glue discharging mouth.
Optionally, it is provided with thermal insulation layer between described first heating member and described second heating member.
Optionally, described point glue equipment also includes the Acanthopanan trifoliatus (L.) Merr. for heating the glue in described glue discharging mouth
Warmware.
Optionally, described 3rd heating member to the heating-up temperature of the glue in described glue discharging mouth less than described the
One heating member heating-up temperature to the glue in described some plastic pin cylinder.
Optionally, between described first heating member and described 3rd heating member, it is provided with thermal insulation layer, and/or described
It is provided with thermal insulation layer between second heating member and described 3rd heating member.
Optionally, described glue discharging mouth is made up of heat-barrier material, or is provided with thermal insulation layer outside described glue discharging mouth.
Optionally, it is provided with the guarantor for the glue in described glue discharging mouth is incubated outside described glue discharging mouth
Temperature layer.
The point glue equipment that the present invention provides, by being provided for heat the glue in a plastic pin cylinder first
Heating member and in dispensing needle head glue heat the second heating member, described second heating member is to institute
The heating-up temperature stating the glue in dispensing needle head is more than described first heating member to the glue in described some plastic pin cylinder
The heating-up temperature of water, thus on the one hand make the glue temperature in dispensing needle head higher, a glue can be reduced
Syringe needle go out glue surface area, on the other hand make the glue temperature in invocation point plastic pin cylinder relatively low, glue can be reduced
The risk of pipe booster, and glue can be reduced the probability of chemical reaction occurs in a plastic pin cylinder, protect
Hold the performance of glue.
Accompanying drawing explanation
Fig. 1 is the combination schematic diagram of point glue equipment midpoint of the present invention plastic pin cylinder and dispensing needle head；
Fig. 2 is the structural representation of an optional point glue equipment in each embodiment of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, do referring to the drawings further
Explanation.
Detailed description of the invention
Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not used to limit
Determine the present invention.
The present invention provides a kind of point glue equipment, and this point glue equipment can apply to mobile phone, flat board, photograph
In some glue program in the equipment such as machine, liquid crystal display screen.It is understood that the range of application of this point glue equipment
It is not limited to above-mentioned several equipment, be there is a need to carry out an equipment of glue program and all can use this point glue equipment
Carry out a glue.
The present embodiment proposes a kind of point glue equipment, and as depicted in figs. 1 and 2, Fig. 1 is some mucilage binding of the present invention
Put the combination schematic diagram of midpoint plastic pin cylinder and dispensing needle head, Fig. 2 be in each embodiment of the present invention one can
The structural representation of the point glue equipment of choosing, this point glue equipment includes a plastic pin cylinder 100 and dispensing needle head 200,
Described point glue equipment also includes the first heating member 300 for heating the glue in described some plastic pin cylinder 100
With the second heating member 400 for the glue in described dispensing needle head 200 is heated, described second heating member
The heating-up temperature of the glue in 400 pairs of described dispensing needle heads 200 is more than described first heating member 300 to described
The heating-up temperature of the glue in some plastic pin cylinder 100.
In the present embodiment, some plastic pin cylinder 100 is substantially arranged in tubular, and the inside is equipped with glue.Point glue
Syringe needle 200 is arranged in fine acicular, and it goes out glue surface can reach below 0.5mm.Point plastic pin cylinder 100 and point
Needle head 200 connection is arranged.When glue, the glue of some plastic pin cylinder 100 flows via dispensing needle head 200
Go out, to carry out a glue.
First heating member 300 can use electrical heating.Such as, the first heating member 300 can include heating
Resistance and the calandria being connected with described heating resistor.Heating resistor is connected with power supply, is used for producing heat.
Heating resistor also contacts with calandria, conducts to calandria with the heat that will produce.Calandria can be by gold
Genus is made, and such as, calandria can be made of copper.First heating member 300 can substantially be arranged in tubular,
It is sheathed on outside a plastic pin cylinder 100, thus more rapid and more stable for the glue in a plastic pin cylinder 100
Heat.
Second heating member 400 can use electrical heating.Such as, the second heating member 400 can include heating
Resistance and the calandria being connected with described heating resistor.Heating resistor is connected with power supply, is used for producing heat.
Heating resistor also contacts with calandria, conducts to calandria with the heat that will produce.Calandria can be by gold
Genus is made, and such as, calandria can be made of copper.
Second heating member 400 can substantially be arranged in tubular, is sheathed on outside dispensing needle head 200, thus
More rapid and more stable heats for the glue in dispensing needle head 200.
Owing to the second heating member 400 is in order to effectively heat the glue in dispensing needle head 200, need
Outside dispensing needle head 200 to be sheathed on, if the second heating member 400 is thicker, it will cause dispensing needle head
200 go out relatively is held relatively slightly, therefore can affect a glue effect；Whereas if the second heating member 400 is relatively thin,
Then it is likely to result in heats bad.Therefore, thermal effect is added in order to improve the second heating member 400 further
Really, and do not affect dispensing needle head 200 go out the fineness relatively held, not affect a glue effect, second
Heating member 400 is arranged in cone shape, and the taper end of the second heating member 400 is near dispensing needle head 200
Glue-extruding end.Thus both ensure that the heats of the second heating member 400, it is not result in again dispensing needle head 200
Glue-extruding end the thickest, it is ensured that some glue effect.
The heating-up temperature of the glue in a plastic pin cylinder 100 is at the first heating member by the first heating member 300
The temperature that glue in 300 heating process midpoint plastic pin cylinders 100 is kept.Second heating member 400 is to a glue
The heating-up temperature of the glue in syringe needle 200 is in secondary heater heating process in dispensing needle head 200
The temperature that kept of glue.
Such as, if reasonable temperature corresponding to glue is 120 DEG C, this reasonable temperature can be that glue is when dispatching from the factory
The temperature of producer's definition, represents that this glue is put glue under conditions of 120 DEG C and can be obtained optimal viscosity effect
Really.And glue is under the conditions of 120 DEG C of some glue, due to the impact of himself viscosity, the some plastic pin of its correspondence
The minimum of 200 goes out the area of glue surface and is assumed to be S1.Assume that S1 can not meet user's request, existing skill
Generally by hoist point glue temperature in art, such as, a glue temperature is promoted to 150 DEG C, and then makes invocation point
The minimum of needle head 200 goes out the area of glue surface and is reduced to S2, it is clear that S2 is less than S1, and then makes to draw
The area of glue surface meets user's request.Owing to prior art being to a plastic pin cylinder 100 and dispensing needle head 200
Overall heating, the glue therefore during whole glue, in some plastic pin cylinder 100 and dispensing needle head 200
Remain at 150 DEG C, be likely to result in sebific duct booster phenomenon, and make glue generation chemical reaction,
And then affect the performance of glue.And in the present invention, can be only by the second heating member 400 to a glue
Glue in syringe needle 200 is heated to 150 DEG C, and for dispensing needle head 200, owing to plastic emitting temperature is
150 DEG C, therefore its minimum goes out the area of glue surface and can be reduced to S2, equally makes out the area of glue surface
Meet user's request.Owing to, in the present invention, the first heating member 300 is to the glue in a plastic pin cylinder 100
Heating-up temperature is less than second heating member 400 heating-up temperature to the glue in dispensing needle head 200, i.e. the
The heating-up temperature of the glue in one heating member 300 control point plastic pin cylinder 100 is less than 150 DEG C, relative to existing
For technology, on the premise of reaching the same area going out glue surface, also reduce in a plastic pin cylinder 100
The temperature of glue, the phenomenon that effectively prevent sebific duct booster produces.Simultaneously because glue is at a plastic pin
In cylinder 100, residence time is longer, and in dispensing needle head 200, residence time is shorter, it is to avoid glue
Keep higher temperature for a long time, thus decrease what the glue in a plastic pin cylinder 100 occurred as far as possible
Chemical reaction, improves the performance of glue.It is understood that the first heating member 300 is to a plastic pin cylinder
The heating-up temperature of the glue in 100 can be the reasonable temperature of glue.Such as, in the present embodiment, first adds
Warmware 300 can be 120 DEG C to the heating-up temperature of the glue in a plastic pin cylinder 100.So that point
Glue in plastic pin cylinder 100 remains at optimal quasi-viscous effect, only flows through dispensing needle head at glue
Higher temperature it is heated to, owing to glue time of staying in dispensing needle head 200 is shorter, in short-term when 200
Between high temperature the quasi-viscous effect of glue will not be influenced too much, the most effectively further reduce point
Needle head 200 go out glue surface area on the premise of, it is ensured that the performance of glue.
The point glue equipment that the present invention provides, by being provided for the glue heating in a plastic pin cylinder 100
First heating member 300 and in dispensing needle head 200 glue heat the second heating member 400, described
The heating-up temperature of the glue in described dispensing needle head 200 is heated by the second heating member 400 more than described first
The part 300 heating-up temperature to the glue in described some plastic pin cylinder 100, thus on the one hand make dispensing needle head
Glue temperature in 200 is higher, and can reduce dispensing needle head 200 goes out glue surface area, on the other hand makes
Glue temperature in some plastic pin cylinder 100 is relatively low, can reduce the risk of sebific duct booster, and can reduce
There is the probability of chemical reaction in glue in a plastic pin cylinder 100, maintains the performance of glue.
Further, first embodiment based on point glue equipment of the present invention, the invention allows for a mucilage binding
The second embodiment put, in the present embodiment, described point glue equipment also includes being connected to described some plastic pin cylinder
Glue discharging mouth 500 between 100 and dispensing needle head 200.
In the present embodiment, glue discharging mouth 500 one end connects with some plastic pin cylinder 100, the other end and some plastic pin
200 connections.Dispensing needle head 200 is installed on glue discharging mouth 500.By at dispensing needle head 200 and point
Glue discharging mouth 500 is set between plastic pin cylinder 100, due to the glue in dispensing needle head 200 and some plastic pin cylinder 100
Heating-up temperature different, glue discharging mouth 500 can effectively act as isolation effect so that some plastic pin cylinder
100 and dispensing needle head 200 in the temperature of glue will not interact, improve a glue effect further.
Glue in glue discharging mouth 500 can be heated, it is also possible to not to the glue in glue discharging mouth 500
Heat, specifically can be configured according to actual needs.The glue in glue discharging mouth 500 is carried out
During heating, can use single heating member that the glue in glue discharging mouth 500 is heated, it is also possible to adopt
With existing heating member (such as the first heating member 300 or the second heating member 400) to the glue in glue discharging mouth 500
Water heats.When the glue in glue discharging mouth 500 not being heated, glue discharging mouth 500 can be entered
Row isothermal holding, affects follow-up some glue effect to avoid the glue temperature in glue discharging mouth 500 too low.
Further, the second embodiment based on point glue equipment of the present invention, the invention allows for a mucilage binding
The 3rd embodiment put, in the present embodiment, described first heating member 300 is the most simultaneously to described glue discharging mouth
Glue heating in 500.First heating member 300 can directly contact with glue discharging mouth 500, with to glue discharging mouth
Glue in 500 heats.First heating member 300 glue in glue discharging mouth 500 can be heated to
The temperature that glue in plastic emitting syringe is identical.Optionally, the first heating member 300 can also be by glue discharging mouth 500
Interior glue temperature is heated to ratio glue lower temperature in plastic emitting syringe, thus prevents plastic emitting further
The glue of the high-temperature of syringe needle affects the temperature of the glue in plastic emitting syringe, further increases a glue effect.
Optionally, it is provided with sealing coat between described first heating member 300 and described glue discharging mouth 500 (figure not to be marked
Show).The material of sealing coat can be configured according to actual needs.By arranging sealing coat, can reduce
First heating member 300 heats to the glue in glue discharging mouth 500 so that use same first to add
Warmware 300 can complete the heating to the glue in dispensing needle head 200 and glue discharging mouth 500, and makes to draw
The temperature of the glue in glue mouth 500 is less than the temperature of the glue in a plastic pin cylinder 100.
Optionally, thermal insulation layer (figure it is provided with between described first heating member 300 and described second heating member 400
In do not indicate).The material of thermal insulation layer can be configured according to actual needs, as long as having effect of heat insulation i.e.
Can.By arranging thermal insulation layer, reduce the temperature between the first heating member 300 and the second heating member 400
Conduction.
Further, the second embodiment based on point glue equipment of the present invention, the invention allows for a mucilage binding
The 4th embodiment put, in the present embodiment, described point glue equipment also includes for described glue discharging mouth 500
3rd heating member 600 of interior glue heating.By the 3rd heating member 600 to the glue in glue discharging mouth 500
Individually heat.
3rd heating member 600 can use electrical heating.Such as, the 3rd heating member 600 can include heating
Resistance and the calandria being connected with described heating resistor.Heating resistor is connected with power supply, is used for producing heat.
Heating resistor also contacts with calandria, conducts to calandria with the heat that will produce.Calandria can be by gold
Genus is made, and such as, calandria can be made of copper.3rd heating member 600 can substantially be arranged in tubular,
It is sheathed on outside glue discharging mouth 500, thus more rapid and more stable carrying out for the glue in glue discharging mouth 500
Heating.
Optionally, described 3rd heating member 600 is little to the heating-up temperature of the glue in described glue discharging mouth 500
In described first heating member 300 heating-up temperature to the glue in described some plastic pin cylinder 100 so that plastic emitting
The temperature of the glue in mouth 500 is less than the temperature of the glue in a plastic pin cylinder 100, thus prevents further
The glue of the high-temperature going out needle head affects the temperature of the glue in plastic emitting syringe, further increases a glue
Effect.
Optionally, thermal insulation layer (figure it is provided with between described first heating member 300 and described 3rd heating member 600
In do not indicate), and/or be provided with thermal insulation layer between described second heating member 400 and described 3rd heating member 600
(figure does not indicates).The material of thermal insulation layer can be configured according to actual needs, as long as having heat insulation effect
Fruit.By arranging thermal insulation layer between the first heating member 300 and the 3rd heating member 600, reduce
Temperature conduction between first heating member 300 and the 3rd heating member 600.By at the second heating member 400
And between the 3rd heating member 600, thermal insulation layer is set, reduces the second heating member 400 and the 3rd heating member 600
Between temperature conduction.
Further, the second embodiment based on point glue equipment of the present invention, the invention allows for a mucilage binding
The 5th embodiment put, in the present embodiment, described glue discharging mouth 500 is made up of heat-barrier material, or institute
State and outside glue discharging mouth 500, be provided with thermal insulation layer (not indicating in figure).In the present embodiment, at glue discharging mouth 500
Outside can be not provided with heating member.Can be preferably by some plastic pin cylinder by the heat-blocking action of glue discharging mouth 500
100 and dispensing needle head 200 isolate, prevent out the glue of the high-temperature of needle head to affect the glue in plastic emitting syringe
The temperature of water, further increases a glue effect.
Further, based on point glue equipment of the present invention second or the 5th embodiment, the invention allows for
The sixth embodiment of point glue equipment, in the present embodiment, is provided with for institute outside described glue discharging mouth 500
State the heat-insulation layer (not indicating in figure) that the glue in glue discharging mouth 500 carries out being incubated.In the present embodiment, exist
Heating member can be not provided with outside glue discharging mouth 500.When being combined with above-mentioned 5th embodiment, heat-insulation layer can
To be arranged at outside glue discharging mouth 500, thermal insulation layer can be arranged at outside heat-insulation layer.By arranging heat-insulation layer,
The temperature of the glue can being effectively maintained to flow through in glue discharging mouth 500.
It should be noted that in this article, term " include ", " comprising " or its any other variant
Be intended to comprising of nonexcludability so that include the process of a series of key element, method, article or
Person's device not only includes those key elements, but also includes other key elements being not expressly set out, or also
Including the key element intrinsic for this process, method, article or device.In the feelings not having more restriction
Under condition, statement " including ... " key element limited, it is not excluded that include this key element process,
Method, article or device there is also other identical element.
The invention described above embodiment sequence number, just to describing, does not represent the quality of embodiment.
These are only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every
Utilize equivalent structure or equivalence flow process conversion that description of the invention and accompanying drawing content made, or directly or
Connect and be used in other relevant technical fields, be the most in like manner included in the scope of patent protection of the present invention.
Claims (10)
1. a point glue equipment, including some plastic pin cylinder and a dispensing needle head, it is characterised in that described some mucilage binding
Put the first heating member also included for the glue in described some plastic pin cylinder is heated and for described glue
Second heating member of the glue heating in syringe needle, described second heating member is to the glue in described dispensing needle head
Heating-up temperature more than described first heating member heating-up temperature to the glue in described some plastic pin cylinder.
2. point glue equipment as claimed in claim 1, it is characterised in that described point glue equipment also includes even
It is connected to the glue discharging mouth between described some plastic pin cylinder and dispensing needle head.
3. point glue equipment as claimed in claim 2, it is characterised in that described first heating member is also simultaneously
Glue in described glue discharging mouth is heated.
4. point glue equipment as claimed in claim 3, it is characterised in that described first heating member is with described
Sealing coat it is provided with between glue discharging mouth.
5. point glue equipment as claimed in claim 3, it is characterised in that described first heating member is with described
It is provided with thermal insulation layer between second heating member.
6. point glue equipment as claimed in claim 2, it is characterised in that described point glue equipment also includes using
In the 3rd heating member that the glue in described glue discharging mouth is heated.
7. point glue equipment as claimed in claim 6, it is characterised in that described 3rd heating member is to described
The heating-up temperature of the glue in glue discharging mouth is less than described first heating member to the glue in described some plastic pin cylinder
Heating-up temperature.
Point glue equipment the most as claimed in claims 6 or 7, it is characterised in that described first heating member with
Be provided with thermal insulation layer between described 3rd heating member, and/or described second heating member and described 3rd heating member it
Between be provided with thermal insulation layer.
9. point glue equipment as claimed in claim 2, it is characterised in that described glue discharging mouth is by heat-barrier material
Make, or be provided with thermal insulation layer outside described glue discharging mouth.
10. point glue equipment as claimed in claim 2, it is characterised in that be provided with outside described glue discharging mouth
For the heat-insulation layer that the glue in described glue discharging mouth is incubated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610353208.0A CN105855123B (en) | 2016-05-24 | 2016-05-24 | Point glue equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610353208.0A CN105855123B (en) | 2016-05-24 | 2016-05-24 | Point glue equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105855123A true CN105855123A (en) | 2016-08-17 |
| CN105855123B CN105855123B (en) | 2019-06-25 |
Family
ID=56634765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610353208.0A Active CN105855123B (en) | 2016-05-24 | 2016-05-24 | Point glue equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105855123B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914375A (en) * | 2017-05-15 | 2017-07-04 | 惠州市忠邦电子有限公司 | Intelligent bull dispenser system |
| CN107899882A (en) * | 2017-12-19 | 2018-04-13 | 努比亚技术有限公司 | Hot melt adhesive glue dispensing valve and dispenser |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3034963A1 (en) * | 2003-07-14 | 2016-06-22 | Nordson Corporation | Method for dispensing droplets of a viscous material |
| US8753713B2 (en) * | 2010-06-05 | 2014-06-17 | Nordson Corporation | Jetting dispenser and method of jetting highly cohesive adhesives |
| CN102688831A (en) * | 2012-05-31 | 2012-09-26 | 中天宽带技术有限公司 | Constant temperature heating device for automatic gelatine grouter |
-
2016
- 2016-05-24 CN CN201610353208.0A patent/CN105855123B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914375A (en) * | 2017-05-15 | 2017-07-04 | 惠州市忠邦电子有限公司 | Intelligent bull dispenser system |
| CN107899882A (en) * | 2017-12-19 | 2018-04-13 | 努比亚技术有限公司 | Hot melt adhesive glue dispensing valve and dispenser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105855123B (en) | 2019-06-25 |
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