CN105848071A - Loudspeaker of headset - Google Patents

Loudspeaker of headset Download PDF

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Publication number
CN105848071A
CN105848071A CN201610352897.3A CN201610352897A CN105848071A CN 105848071 A CN105848071 A CN 105848071A CN 201610352897 A CN201610352897 A CN 201610352897A CN 105848071 A CN105848071 A CN 105848071A
Authority
CN
China
Prior art keywords
vibrating diaphragm
ferrum
magnetic circuit
annular
earphone speaker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610352897.3A
Other languages
Chinese (zh)
Inventor
王书晓
张波
郭在康
张�杰
刘悦文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Goertek Co Ltd
Original Assignee
Qingdao Goertek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Goertek Co Ltd filed Critical Qingdao Goertek Co Ltd
Priority to CN201610352897.3A priority Critical patent/CN105848071A/en
Publication of CN105848071A publication Critical patent/CN105848071A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/025Magnetic circuit
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2209/00Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
    • H04R2209/022Aspects regarding the stray flux internal or external to the magnetic circuit, e.g. shielding, shape of magnetic circuit, flux compensation coils

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Headphones And Earphones (AREA)

Abstract

Disclosed in the invention is a loudspeaker of a headset. The loudspeaker comprises a support frame, a magnetic circuit system, and a vibrating system, wherein the magnetic circuit system and the vibrating system are accommodated into the support frame. The magnetic circuit system is a ring-shaped magnetic circuit formed by a T iron, an annular magnet and an annular washer; and the annular washer and the T iron form an annular magnetic circuit gap. The vibrating system consists of a vibration membrane, a voice coil, and a gasket; the voice coil is attached to the vibration membrane and is suspended in the annular magnetic circuit gap; and the gasket is arranged on the upper end surface of the T iron. The vibration membrane is arranged above the magnetic circuit system and the edge of the vibration membrane is fixed on the support; and the middle part of the vibration membrane is fixed on the gasket. According to the technical scheme, because the e middle part of the vibration membrane is fixed on the gasket above the T iron, the strength of the root part of the vibration membrane is enhanced, so that the upper limit of the high-frequency replaying and the width of the relaying frequency band of the loudspeaker of the headset are improved and distortion caused by segmentation vibration is reduced.

Description

A kind of earphone speaker
Technical field
The present invention relates to loudspeaker techniques field, particularly to a kind of earphone speaker.
Background technology
The structure of common earphone speaker is as shown in Figure 1, the whole system of support 2 ' support speaker, annular magnet 5 ', annular washer 3 ' and T ferrum 6 ' form a toroid, and voice coil loudspeaker voice coil 4 ' is pasted onto on vibrating diaphragm 1 ', hang in the magnetic gap that annular washer 3 ' and T ferrum 6 ' are formed.After energising, voice coil loudspeaker voice coil 4 ' is stress in magnetic field, drives vibrating diaphragm 1 ' vibration, produces sound.
Earphone speaker structure described in Fig. 1 at least there is problems in that
(1) easily there is diaphagras, the problem easily causing distortion at high band in the diaphragm of loudspeaker;
(2) limited width of speaker playback frequency band.
Summary of the invention
In view of the above problems, the invention provides a kind of earphone speaker, at high band, diaphagras easily occurs solving the existing diaphragm of loudspeaker, easily cause distortion, and the problem that speaker playback bandwidth is limited.
For reaching above-mentioned purpose, the technical scheme is that and be achieved in that:
The invention provides a kind of earphone speaker, including support 2 be housed in the magnetic circuit system within support 2 and vibrational system, magnetic circuit system is the toroid that T ferrum 6, annular magnet 5 and annular washer 3 are formed, wherein annular washer 3 and T ferrum 6 constitutes the magnetic circuit gap of annular, vibrational system includes vibrating diaphragm 1 and voice coil loudspeaker voice coil 4, voice coil loudspeaker voice coil 4 is bonded on vibrating diaphragm 1, and is suspended in the magnetic circuit gap of annular
Vibrating diaphragm 1 is positioned at the top of magnetic circuit system, and the edge of vibrating diaphragm 1 is fixed on support 2, and the mid portion of vibrating diaphragm 1 is fixed on T ferrum 6.
Preferably, vibrational system also includes: pad 7;
Pad 7 is arranged on the upper surface of T ferrum 6, and the mid portion of vibrating diaphragm 1 is fixed on T ferrum 6 by pad 7.
Preferably, the mid portion of T ferrum 6 is provided through hole 61;
Pad 7 is annular gasket, and the internal diameter of annular gasket is suitable with the diameter of through hole 61, and the just position to through hole 61 is not provided with vibrating diaphragm 1.
Preferably, earphone speaker also includes: phase plug 8, and the bottom of phase plug 8 is fixed on the arc support 9 above vibrating diaphragm 1 radiating surface, top just through hole 61 to T ferrum 6, and has setpoint distance with pad 7.
Preferably, phase plug 8 is diffusion type structure, including bullet-type phase plug and mushroom hair style phase plug.
Preferably, earphone speaker is applied to In-Ear Headphones.
The embodiment of the present invention provides the benefit that: the present invention is by being fixed on the mid portion of vibrating diaphragm on the pad above T ferrum, increase the stiffness of vibrating diaphragm root, improve the upper limit and the width of earphone speaker playback frequency band that earphone speaker high frequency is reset, thus decrease the distortion that diaphagras produces.
In a preferred approach, the present invention is by arranging through hole at the mid portion of T ferrum, and is not provided with vibrating diaphragm in just position to through hole, reduces air damping, and the sound making earphone speaker is the softest;And by setting up phase plug on the support above diaphragm radiation face, change propagation path and the phase place of vibrating diaphragm surrounding sound wave, to improve the sound field directivity of earphone speaker, reduce distortion further.
Accompanying drawing explanation
Fig. 1 is the profile of earphone speaker of the prior art;
The profile of the earphone speaker that Fig. 2 provides for the present invention;
In figure, 1 ', vibrating diaphragm;2 ', support;3 ', annular washer;4 ', voice coil loudspeaker voice coil;5 ', annular magnet;6 ', T ferrum;
1, vibrating diaphragm;2, support;3, annular washer;4, voice coil loudspeaker voice coil;5, annular magnet;6, T ferrum;61, through hole;7, pad;8, phase plug;9, arc support.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
The profile of the earphone speaker that Fig. 2 provides for the embodiment of the present invention, the earphone speaker of the present embodiment is particularly suited for In-Ear Headphones.
As shown in Figure 2, earphone speaker in Fig. 2 includes: support 2 and be housed in the magnetic circuit system within support 2 and vibrational system, magnetic circuit system is the toroid that T ferrum 6, annular magnet 5 and annular washer 3 are formed, and wherein annular washer 3 and T ferrum 6 constitutes the magnetic circuit gap of annular;
Concrete, with reference to shown in Fig. 2, T ferrum 6 includes circular bottom plate and the post core vertical with circular bottom plate center, annular magnet 5 and annular washer 3 concentric are around post core, and annular magnet 5 is arranged in circular bottom plate, and having gap with post core sidewall, annular washer 3 is arranged on annular magnet 5, annular washer 3 and post core sidewall constitute the magnetic circuit gap of annular, i.e. T ferrum 6, annular magnet 5 and annular washer 3 form a toroid.
Vibrational system in Fig. 2 includes vibrating diaphragm 1, voice coil loudspeaker voice coil 4, and voice coil loudspeaker voice coil 4 is bonded on vibrating diaphragm 1, and is suspended in the magnetic circuit gap of annular;Vibrating diaphragm 1 is positioned at the top of magnetic circuit system, and the edge of vibrating diaphragm 1 is fixed on support 2, and the mid portion of vibrating diaphragm 1 is fixed on T ferrum 6.
It should be noted that, in order to be fixed on T ferrum 6 by vibrating diaphragm mid portion, in the design process, the height of T iron prop core should be increased so that vibrating diaphragm core is pasted onto on post core, and other of magnetic circuit system are also sized to change therewith, to ensure the symmetry of magnetic circuit system.
Preferably, above-mentioned vibrational system also includes that pad 7, pad 7 are arranged on the upper surface of T ferrum 6 to the present embodiment, and the mid portion of vibrating diaphragm 1 is fixed on T ferrum 6 by pad 7.As in figure 2 it is shown, when vibrational system includes pad 7, pad 7 is arranged on the upper surface of the post core of T ferrum 6, the mid portion of vibrating diaphragm 1 is pasted onto on pad 7.
It should be noted that in this preferred version, owing to vibrational system with the addition of again pad 7, fix vibrating diaphragm by pad 7, thus this preferred version be without increasing the height of T iron prop core, it is not required that change other sizes of magnetic circuit system.In the design process of speaker, can choose whether to add pad according to application demand.
The present embodiment, by being fixed on the pad above T ferrum by the mid portion of vibrating diaphragm, increases the stiffness of vibrating diaphragm root, thus improves the upper limit and the width of playback frequency band that earphone speaker high frequency is reset, reduce the distortion that diaphagras produces, improve earphone speaker.
Owing to traditional In-Ear Headphones speaker leaves small holes the most overleaf, air can not get fully revealing, and affects tonequality.For this problem, one implementation of the present embodiment, mid portion at T ferrum 6 arranges through hole 61, pad 7 is set to annular gasket, and it is not provided with vibrating diaphragm 1 in just position to through hole 61, to reduce air damping, increase pliable, make the vibrational state of vibrating diaphragm more free, and then make the sound of earphone speaker the softest.
Wherein, the internal diameter of annular gasket is suitable with the diameter of through hole 61, as shown in Figure 2, the external diameter of annular gasket is less than the diameter of T iron prop core, to ensure the effective area of diaphragm oscillations, the internal diameter of annular gasket is slightly less than the diameter of through hole, to ensure the degree of stability that vibrating diaphragm mid portion is pasted, does not the most affect the circulation of air.
The implementation of the present embodiment provides a kind of novel leakage mode for earphone speaker, by arranging through hole at the mid portion of T ferrum, and just the position of through hole is being not provided with vibrating diaphragm, reduce air damping, increase pliable, diaphragm oscillations state is freer, it is thus possible to the sound making earphone speaker is the softest, decreases the difficulty of later stage tuning work.
In another implementation of the present embodiment, earphone speaker also includes: phase plug 8, and the bottom of phase plug 8 is fixed on the support 2 above vibrating diaphragm 1 radiating surface, top just through hole 61 to T ferrum 6, and has setpoint distance with pad 7.
Phase plug 8 in this implementation is diffusion type structure, including bullet-type phase plug and mushroom hair style phase plug.As in figure 2 it is shown, in Fig. 2 as a example by bullet-type phase plug, be fixed on the arc support 9 above diaphragm radiation face by inverted bullet-type phase plug, to change propagation path and the phase place of vibrating diaphragm surrounding sound wave, improve the sound field directivity of speaker, reduce distortion.
Wherein, in the design phase, can the individually designed arc support part for stationary phase plug, the arc support 9 in the most individually designed Fig. 2, this arc support 9 is fixedly installed on support 2, to simplify the difficulty of processing of support.Certainly, can also one-body molded arc support 9 and support 2 in the design phase.
In sum, the invention provides a kind of earphone speaker, the present invention is by being fixed on the mid portion of vibrating diaphragm on the pad above T ferrum, increase the stiffness of vibrating diaphragm root, improve the upper limit and the width of earphone speaker playback frequency band that earphone speaker high frequency is reset, thus decrease the distortion that diaphagras produces.And in a preferred approach, the present invention is by arranging through hole at the mid portion of T ferrum, and just the position of through hole is being not provided with vibrating diaphragm, and to reduce air damping, the sound making earphone speaker is the softest;And by setting up phase plug on the support above diaphragm radiation face, change propagation path and the phase place of vibrating diaphragm surrounding sound wave, to improve the sound field directivity of earphone speaker, reduce distortion further.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit protection scope of the present invention.All any modification, equivalent substitution and improvement etc. made within the spirit and principles in the present invention, are all contained in protection scope of the present invention.

Claims (6)

1. an earphone speaker, including: support (2) be housed in the magnetic that described support (2) is internal Road system and vibrational system, described magnetic circuit system is T ferrum (6), annular magnet (5) and annular washer (3) toroid formed, wherein annular washer (3) and T ferrum (6) are constituted between the magnetic circuit of annular Gap, described vibrational system includes vibrating diaphragm (1) and voice coil loudspeaker voice coil (4), described voice coil loudspeaker voice coil (4) be bonded in described in shake On film (1), and it is suspended in the magnetic circuit gap of described annular, it is characterised in that
Described vibrating diaphragm (1) is positioned at the top of described magnetic circuit system, and the edge of described vibrating diaphragm (1) is fixed On described support (2), the mid portion of described vibrating diaphragm (1) is fixed on described T ferrum (6).
Earphone speaker the most according to claim 1, it is characterised in that described vibrational system is also wrapped Include: pad (7);
Described pad (7) is arranged on the upper surface of described T ferrum (6), the centre of described vibrating diaphragm (1) Part is fixed on described T ferrum (6) by described pad (7).
Earphone speaker the most according to claim 2, it is characterised in that described T ferrum (6) Mid portion is provided through hole (61);
Described pad (7) is annular gasket, the internal diameter of described annular gasket and described through hole (61) Diameter is suitable, and the just position to described through hole (61) is not provided with vibrating diaphragm (1).
Earphone speaker the most according to claim 2, it is characterised in that described earphone speaker is also Including: phase plug (8), the bottom of described phase plug (8) is fixed on above vibrating diaphragm (1) radiating surface On arc support (9), top just through hole (61) to described T ferrum (6), and with described pad (7) there is setpoint distance.
Earphone speaker the most according to claim 4, it is characterised in that described phase plug (8) For diffusion type structure, including bullet-type phase plug and mushroom hair style phase plug.
6. according to the earphone speaker described in any one of claim 1 to 5, it is characterised in that described ear Machine loudspeaker applications is in In-Ear Headphones.
CN201610352897.3A 2016-05-24 2016-05-24 Loudspeaker of headset Pending CN105848071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610352897.3A CN105848071A (en) 2016-05-24 2016-05-24 Loudspeaker of headset

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610352897.3A CN105848071A (en) 2016-05-24 2016-05-24 Loudspeaker of headset

Publications (1)

Publication Number Publication Date
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106375915A (en) * 2016-10-31 2017-02-01 深圳市冠旭电子股份有限公司 Loudspeaker and headset
WO2018132996A1 (en) * 2017-01-19 2018-07-26 声电电子科技(惠州)有限公司 Miniature loudspeaker
EP3432601A1 (en) * 2017-07-20 2019-01-23 Premium Loudspeakers (Hui Zhou) Co., Ltd. Treble loudspeaker with improved mounting structure for phase plug
CN109309887A (en) * 2017-10-23 2019-02-05 杭州赛泫科技有限公司 Diaphragm-vibrating type loudspeaker and the earphone that can produce three-dimensional stereo effect
WO2019200691A1 (en) * 2018-04-20 2019-10-24 深圳市蓝禾技术有限公司 Movable coil structure and earphone
WO2024000667A1 (en) * 2022-06-28 2024-01-04 张永春 Vibration system and loudspeaker

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366443A (en) * 2001-01-17 2002-08-28 叶建国 Loudspeaker
CN2622976Y (en) * 2003-05-29 2004-06-30 郝晋青 High pitch loudspeaker
CN2744109Y (en) * 2004-09-30 2005-11-30 太原师范学院 Tenor-bass loudspeaker
CN2746694Y (en) * 2004-09-30 2005-12-14 郝晋青 High pitch loudspeaker
CN201118968Y (en) * 2007-10-23 2008-09-17 深圳祥晖电子有限公司 Common-magnetic channel back high-voice coaxial speaker
CN203968372U (en) * 2014-07-31 2014-11-26 郑树城 A kind of high pitch loudspeaker that phase plug is set
CN204598311U (en) * 2015-05-15 2015-08-26 湖南音品电子有限公司 The loud speaker that a kind of dorsal part is spoken
CN205812382U (en) * 2016-05-24 2016-12-14 青岛歌尔声学科技有限公司 A kind of earphone speaker

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366443A (en) * 2001-01-17 2002-08-28 叶建国 Loudspeaker
CN2622976Y (en) * 2003-05-29 2004-06-30 郝晋青 High pitch loudspeaker
CN2744109Y (en) * 2004-09-30 2005-11-30 太原师范学院 Tenor-bass loudspeaker
CN2746694Y (en) * 2004-09-30 2005-12-14 郝晋青 High pitch loudspeaker
CN201118968Y (en) * 2007-10-23 2008-09-17 深圳祥晖电子有限公司 Common-magnetic channel back high-voice coaxial speaker
CN203968372U (en) * 2014-07-31 2014-11-26 郑树城 A kind of high pitch loudspeaker that phase plug is set
CN204598311U (en) * 2015-05-15 2015-08-26 湖南音品电子有限公司 The loud speaker that a kind of dorsal part is spoken
CN205812382U (en) * 2016-05-24 2016-12-14 青岛歌尔声学科技有限公司 A kind of earphone speaker

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106375915A (en) * 2016-10-31 2017-02-01 深圳市冠旭电子股份有限公司 Loudspeaker and headset
CN106375915B (en) * 2016-10-31 2024-04-16 深圳市冠旭电子股份有限公司 Speaker and earphone
WO2018132996A1 (en) * 2017-01-19 2018-07-26 声电电子科技(惠州)有限公司 Miniature loudspeaker
EP3432601A1 (en) * 2017-07-20 2019-01-23 Premium Loudspeakers (Hui Zhou) Co., Ltd. Treble loudspeaker with improved mounting structure for phase plug
CN109309887A (en) * 2017-10-23 2019-02-05 杭州赛泫科技有限公司 Diaphragm-vibrating type loudspeaker and the earphone that can produce three-dimensional stereo effect
WO2019200691A1 (en) * 2018-04-20 2019-10-24 深圳市蓝禾技术有限公司 Movable coil structure and earphone
WO2024000667A1 (en) * 2022-06-28 2024-01-04 张永春 Vibration system and loudspeaker

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Application publication date: 20160810